Effective April 2016 Technical Data 4132 Supersedes March 2007 DR1030 Shielded power inductors Applications • LED/LCD backlighting • High definition televisions (HDTV) • Server and desktop power supplies • Portable electronics • Notebook and laptop regulators • Graphics cards and battery powered systems • Point-of-load (POL) modules • Printers and peripherals Environmental Data • Storage temperature range (Component): -40 °C to +125 °C Description • Operating temperature range: -40 °C to +125 °C • Shielded drum core (ambient plus self-temperature rise) • • Inductance range from 1.1 μH to 155 μH Solder reflow temperature: J-STD-020D compliant • Current range from 0.68 A to 9.5 A HALOGEN • 10.5 mm x 10.3 mm footprint surface mount HF package in a 3.0 mm height Pb FREE • Ferrite core material • Halogen free, lead free, RoHS compliant DR1030 Technical Data 4132 Effective April 2016 Shielded power inductors Product Specifications DCR (mΩ) DCR (mΩ) 1 2 3 OCL I I typical maximum rms sat 5 4 Part Number (μH) ±30% (A) (A) @ 20°C @ 20°C K-factor DR1030-1R1-R 1.1 7.0 9.5 6.5 7.9 22 DR1030-1R8-R 1.9 5.9 7.4 9.1 11.0 17 DR1030-2R8-R 2.8 5.1 6.08 12.1 14.5 14 DR1030-3R9-R 4.0 4.3 5.1 16.4 20.0 12 DR1030-5R2-R 5.2 3.7 4.75 22.9 27.5 10 DR1030-6R8-R 6.8 3.5 3.9 24.9 30.0 9 DR1030-8R2-R 8.4 3.3 3.54 28.4 34.1 8 DR1030-100-R 10.4 2.8 3.18 40.2 48.0 7 DR1030-150-R 14.8 2.3 2.66 57.3 68.8 6 DR1030-220-R 22.8 1.8 2.19 95.5 115 5 DR1030-330-R 32.4 1.6 1.81 114 136 4 DR1030-470-R 47.9 1.3 1.52 167 200 3.4 DR1030-680-R 67 1.1 1.24 253 304 2.9 DR1030-820-R 82 1.0 1.14 332 382 2.6 DR1030-101-R 100 0.86 1.05 375 450 2.4 DR1030-121-R 119 0.80 0.95 523 602 1.9 DR1030-151-R 155 0.68 0.86 590 700 1.4 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 4. K-factor: K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p: (mT), K: 2. I : DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. (K-factor from table), L: (Inductance in μH), ΔI (Peak to peak ripple current in Amps).. rms PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the 5. Part Number Definition: DR1030-xxx-R temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating DR1030 = Product code and size conditions verified in the end application. -xxx= inductance value in μH, R= decimal point, 3. I : Peak current for approximately 35% rolloff @ +25 °C If no R is present then last character equals number of zeros sat -R suffix = RoHS compliant Dimensions (mm) Part marking: inductance value in uH. R = decimal point. If no R is present then last character equals number of zeroes. wwlly = date code, R = revision level Do not route traces or vias underneath the inductor www.eaton.com/elx 2 DR1030 Technical Data 4132 Effective April 2016 Shielded power inductors Packaging information (mm) Supplied in tape and reel packaging , 1000 parts per 13” diameter reel Temperature rise vs. total loss 160 140 120 100 80 60 40 20 0 0.00 0.20 0.40 0.60 0.80 1.00 1.20 Total Loss (W) www.eaton.com/elx 3 Temperature Rise (°C) DR1030 Technical Data 4132 Effective April 2016 Shielded power inductors Core loss vs. B p-p    N N+] +]  N+ N+]] 0 0+] +] N N+] +]  N N+] +]              Bp-p (mT) Bp-p (mT) Inductance characteristics % of OCL vs. % of I sat 120% 100% 80% 60% -40 °C 40% +25 °C +85 °C 20% 0% 0% 20% 40% 60% 80% 100% 120% % of I sat www.eaton.com/elx 4 Core Loss (W Core Loss (W) ) % of OCL DR1030 Technical Data 4132 Effective April 2016 Shielded power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (T ) c T -5°C C t P Volume Volume Max. Ramp Up Rate = 3°C/s Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 T <2.5mm) 235°C 220°C L Preheat t ≥2.5mm 220°C 220°C A Tsmax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2016 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4132 All other trademarks are property April 2016 of their respective owners. Temperature