EATON BUSSMANN DR124-150-R
Specifications
Manufacturer
Eaton Bussmann
Manufacturers Part #
DR124-150-R
Industry Aliases
DR124-150-R
Sub-Category
Surface Mount Inductors
Packaging
Tape and Reel
Factory Pack Quantity
750
Datasheet
Extracted Text
Effective September 2017 Technical Data 4141 Supersedes April 2014 DR124 High power density, high efficiency, low profile shielded drum core power inductors Applications • Notebook power • LCD panels • Desktop and servers • DVD players and portable power devices • DC-DC Converters • Buck, boost, forward, and resonant converters • Noise filtering and filter chokes Environmental Data • Storage temperature range (Component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • Low profile surface mount inductor (ambient plus self-temperature rise) • 12.5 mm x 12.5 mm x 4.5 mm shielded • Solder reflow temperature: drum core J-STD-020 (latest revision) compliant • Inductance range from 0.47 µH to 1000 µH • Current range from 0.44 A to 24.4 A HALOGEN • Frequency range up to 1 MHz HF Pb • Ferrite core material FREE Technical Data 4141 DR124 Effective September 2017 High power density, high efficiency, low profile shielded drum core power inductors Product specifications Rated DCR DCR 1 2 3 Inductance OCL I I mΩ @20°C mΩ @ +20°C rms sat 4 Part Number (μH) μH±20% (A) (A) Typ Max K-factor DR124-R47-R 0.47 0.42 16.0 24.40 2.2 2.7 17.51 DR124-1R0-R 1.0 0.83 13.9 18.00 3.00 3.6 12.50 DR124-1R5-R 1.5 1.37 11.1 14.00 4.75 5.7 9.73 DR124-2R2-R 2.2 2.04 9.1 11.45 5.92 7.1 7.96 DR124-3R9-R 3.9 3.80 7.0 8.40 12.50 15.0 5.84 DR124-4R7-R 4.7 4.88 6.5 7.65 13.50 16.2 5.15 DR124-6R8-R 6.8 6.10 5.6 6.47 18.06 21.7 4.61 DR124-8R2-R 8.2 7.45 5.2 6.22 21.67 26.0 4.17 DR124-100-R 10 8.94 4.5 5.80 23.33 28.0 3.81 DR124-120-R 12 11.5 4.1 4.96 31.67 38.0 3.50 DR124-150-R 15 14.2 3.6 4.62 37.30 44.8 3.02 DR124-180-R 18 16.2 3.4 4.32 46.97 56.4 2.82 DR124-220-R 22 20.7 3.2 3.83 53.99 64.8 2.50 DR124-270-R 27 25.7 2.8 3.44 66.67 80.0 2.24 DR124-330-R 33 31.2 2.6 3.12 80.83 97.0 2.04 DR124-390-R 39 37.3 2.3 2.85 110.00 132.0 1.86 DR124-470-R 47 44.0 2.2 2.63 124.66 149.6 1.72 DR124-560-R 56 54.9 2.0 2.35 144.32 173.2 1.54 DR124-680-R 68 67.1 1.8 2.13 183.33 220.0 1.39 DR124-820-R 82 80.5 1.7 1.94 212.72 255.3 1.27 DR124-101-R 100 95.1 1.5 1.79 256.67 308.0 1.17 DR124-121-R 120 111 1.3 1.65 311.18 373.4 1.08 DR124-151-R 150 146 1.3 1.44 371.02 445.2 0.94 DR124-181-R 180 179 1.1 1.30 501.66 602.0 0.87 DR124-221-R 220 216 1.0 1.15 558.00 669.6 0.77 DR124-271-R 270 256 0.88 1.09 725.00 870.0 0.71 DR124-331-R 330 327 0.83 0.92 825.00 990.0 0.63 DR124-471-R 470 460 0.68 0.74 1242.50 1491.0 0.53 DR124-681-R 680 669 0.56 0.65 1845.83 2215.0 0.45 DR124-821-R 820 825 0.53 0.62 2109.17 2351.0 0.40 DR124-102-R 1000 998 0.44 0.53 2898.00 3477.00 0.37 1. Open Circuit Inductance Test Parameters: 100 kHz, 0.25 V, 0.0 Adc. 4. K-factor: Used to determine B for core loss (see graph). p-p 2. I : DC current for an approximate ∆T of 40 °C without core loss. Derating is B = K*L*∆I, B (mT), K: (K factor from table), L: (Inductance in μH), rms p-p p-p necessary for AC currents. PCB layout, trace thickness and width, air-flow, ∆I (Peak to peak ripple current in Amps). and proximity of other heat generating components will affect the 5. Part Number Definition: DR124-xxx-R temperature rise. It is recommended that the temperature of the part not - DR124 = Product code and size; -xxx = Inductance value in uH; exceed +125 °C under worst case operating conditions verified in the end - R = decimal point; If no R is present, third character = # of zeros. application. - “-R” suffix = RoHS compliant 3. I Amps peak for approximately 25% rolloff (@ +25 °C). sat www.eaton.com/electronics 2 DR124-### wwllyy R DR124 Technical Data 4141 High power density, high efficiency, low profile shielded drum Effective September 2017 core power inductors Dimensions- mm SCHEMATIC BOTTOM VIEW FRONT VIEW TOP VIEW RECOMMENDED PCB LAYOUT 2.05 Typ. 13.8 4.5 1 5.00 12.50 1 2 Max Typ DR124-### Max 1 2 wwllyy R 5.50 12.50 2 Max 10 3.85 Dimensions are in millimeters. wwlly = Date code, R = Revision level. Packaging- mm 1.5 dia 1.5 dia +0.1/-0.0 min A 1.75 4.0 11 24.0 Ao=13.2 mm 12.6 Bo B1 Bo=13.2 mm A1=10mm B1=10 mm Ko=5.2 mm A1 Ko 16.0 A Ao SECTION A-A User direction of feed Parts packaged on 13" Diameter reel, 750 parts per reel. Temperature rise vs. total loss 120 100 80 60 40 20 0 0 0.4 0.8 1.2 1.6 2 Total Power Loss (W) www.eaton.com/electronics 3 Temperature Rise (°C) Technical Data 4141 DR124 Effective September 2017 High power density, high efficiency, low profile shielded drum core power inductors Core loss vs. Bp-p 100 500 kHz 1 MHz 300 kHz 10 200 kHz 100 kHz 1 0.1 0.01 0.001 0.0001 1 10 100 1000 B (mT) p-p Inductance characteristics OCL vs. I sat 120.0 100.0 +85 °C 80.0 +25 °C 60.0 40.0 -40 °C 20.0 0.0 0.0 20.0 40.0 60.0 80.0 100.0 120.0 % I sat www.eaton.com/electronics 4 Core Loss (W) % OCL DR124 Technical Data 4141 High power density, high efficiency, low profile shielded drum Effective September 2017 core power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (T ) c T -5°C C t P Volume Volume Max. Ramp Up Rate = 3°C/s Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 T <2.5mm) 235°C 220°C L Preheat t ≥2.5mm 220°C 220°C A Tsmax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. 4141 BU-SB14114 of their respective owners. September 2017 Temperature
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