EATON BUSSMANN FP0404R1-R065-R

Effective September 2017 Technical Data 4373 Supersedes March 2015 FP0404 High frequency, high current power inductors Applications • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Server and desktop VRMs and EVRDs • Laptop and notebook regulators • Data networking and storage systems • Graphics cards and battery power systems • Point-of-Load modules Environmental Data • Description Storage temperature range (component): -40 °C to +125 °C • High current carrying capacity • Operating temperature range: -40 °C to +125 °C • Low core loss (ambient plus self-temperature rise) • Frequency range up to 2 MHz • Solder reflow temperature: • Inductance Range from 22 nH to 110 nH J-STD-020 (latest revision) compliant • Current range from 14 A to 40 A HALOGEN • 4.0 mm x 4.0 mm footprint surface mount pack- HF Pb FREE age in 3.0 mm and 4.0 mm heights • Ferrite core material FP0404 Technical Data 4373 Effective September 2017 High frequency, high current power inductors Product Specifications DCR (mΩ) 3 4 5 6 1 2 I I I I OCL FLL 1 2 3 @ +20 °C rms sat sat sat 5 7 Part Number (nH) ±15% (nH) minimum (A) (A) (A) (A) ±25% K-factor FP0404R1-R022-R 22 ±20% 15 19 40 34 32 0.32 ± 15% 2351 FP0404R1-R065-R 65 44 19 24 22 20 0.32 2248 FP0404R1-R080-R 80 54 19 20 18 16 0.32 2248 FP0404R1-R100-R 100 68 19 16 14 13 0.32 2248 FP0404R1-R110-R 110 74 19 14 13 12 0.32 2248 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz (1 MHz for R022), 0.1 Vrms, 0.0 Adc, +25 °C 4. I 1 : Peak current for approximately 20% rolloff @ +25 °C sat 2. Full Load Inductance (FLL) Test Parameters: 100 kHz (1 MHz for R022), 0.1 Vrms, I 1, +25 °C 5. I 2 : Peak current for approximately 20% rolloff @ +100 °C sat sat 3. I : DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. 6. I 3 : Peak current for approximately 20% rolloff @ +125 °C rms sat -3 PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the 7. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I * 10 . Bp-p:(Gauss), K: (K-factor from temperature rise. It is recommended that the temperature of the part not exceed +125 °C underworst case operating table), L: (Inductance in nH), ∆I (Peak to peak ripple current in Amps). conditions verified in the end application. 8. Part Number Definition: FP0404-Rxxx-R FP0404 = Product code and size Rx= DCR indicator Rxxx=Inductance value in μH, R=decimal point -R suffix = RoHS compliant Dimensions (mm) 4.0 max 1 Part Number C max R022-R 3.0 4.0 max R065-R 4.0 R080-R 4.0 2 R100-R 4.0 (R065, R080, R100, R110) (R022) Recommended Pad Layout R110-R 4.0 4.3 1.7 4.2 1.7 0.9 1.9 Schematic 1.2 1.2 1.4 1.4 ±0.20 ±0.20 1 ±0.20 ±0.20 1.4 1.4 ±0.30 ±0.30 2 Part marking: Rxxx xxx=inductance value in uH, R=decimal point, wly= date code All soldering surfaces to be coplanar within 0.1 millimeters DCR is measured from paoint “a” to point “b” Do not route traces or vias underneath the inductor www.eaton.com/electronics 2 FP0404 Technical Data 4373 Effective September 2017 High frequency, high current power inductors Packaging information (mm) FP0404R1-R022-R Supplied in tape and reel packaging, 1,800 parts per 13” diameter reel 4.0 1.5 dia 1.5 dia 2.0 1.75 5.5 12.0 ±0.3 4.0 8 3.0 3.9 Direction of feed Packaging information (mm) FP0404R1-R065-R, R080-R, R100-R, R110-R Supplied in tape and reel packaging, 1,800 parts per 13” diameter reel 4.0 1.5 dia 1.5 dia 2.0 1.75 7.5 16.0 ±0.3 4.2 8 4.0 4.1 Direction of feed Temperature rise vs. total loss FP0404R1-R022-R FP0404R1-R065-R, R080, R100-R, R110-R 70 70 60 60 50 50 40 40 30 30 20 20 10 10 0 0 0.0. 0.2 0.4. 0 6 0.8 1 0 0.0. 00 2 .4 00 .6 .8 1.0 Total Loss (W) Total Loss (W) www.eaton.com/electronics 3 Temperature Rise (°C) Temperature Rise (°C) FP0404 Technical Data 4373 Effective September 2017 High frequency, high current power inductors Core loss FP0404R1-R022-R Core Loss vs. B p-p 10 1MHz 1 500KHz 300KHz 200KHz 0.1 100KHz 0.01 0.001 0.0001 100 1000 10000 B (Gauss) p-p FP0404R1-R065-R, R080-R, R100-R, R110-R Core Loss vs. B p-p 10 1MHz 500KHz 1 300KHz 200KHz 0.1 100KHz 0.01 0.001 0.0001 1000 10 0 10000 B (Gauss) p-p www.eaton.com/electronics 4 Core Loss (W) Core Loss (W) FP0404 Technical Data 4373 Effective September 2017 High frequency, high current power inductors Inductance characteristics FP0404R1-R022-R FP0404R1-R065-R 120% 120% 100% 100% -40°C 80% 80% +25°C -40°C 60% 60% +100°C +25°C 40% 40% +125°C 20% 20% +125°C +100°C 0% 0% 05 10 15 20 25 30 35 40 00 10 20 30 4500 60 70 80 90 1 0 I (Amps) I (Amps) dc dc FP0404R1-R080-R FP0404R1-R100-R 120% 120% 100% 100% 80% 80% -40°C -40°C 60% 60% +25°C +100°C 40% 40% +25°C +125°C +125°C 20% 20% +100°C 0% 0% 05 10 15 20 25 30 01 5 01520253035 I (Amps) I (Amps) dc dc FP0404R1-R110-R 120% 100% 80% -40°C 60% +25°C 40% +100°C 20% +125°C 0% 0246 8102 14 16 18 10 22 24 2 I (Amps) dc www.eaton.com/electronics 5 % of OCL % of OCL % of OCL % of OCL % of OCL FP0404 Technical Data 4373 Effective September 2017 High frequency, high current power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (T ) c T -5°C C t P Volume Volume Max. Ramp Up Rate = 3°C/s 3 3 Package mm mm Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 T <2.5mm) 235°C 220°C L Preheat t ≥2.5mm 220°C 220°C A Tsmax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. 4373-BU-SB15123 of their respective owners. September 2017 Temperature