EATON BUSSMANN FP0708R1-R12-R

Effective January 2016 Technical Data 4334 Supersedes January 2010 FP0708 High frequency, high current power inductors Applications • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Server and desktop • Central processing unit (CPU) • Graphics processing unit (GPU) • Application specific integrated circuit (ASIC) • High power density • Data networking and storage systems • Graphics cards and battery power systems • Portable electronics • Point-of-Load modules Product description Environmental data • High current carrying capacity • • Low core loss Storage temperature range (Component): -40 °C to +125 °C • Frequency range up to 2 MHz • Operating temperature range: -40 °C to +125 °C • Inductance Range from 72 nH to 200 nH (ambient plus self-temperature rise) • Current range from 36 A to 90 A • Solder reflow temperature: • 7.0 mm x 8.5 mm footprint surface mount J-STD-020D compliant package in a 7.2 mm height HALOGEN • Ferrite core material HF Pb • Halogen free, lead free, RoHS compliant FREE FP0708 Technical Data 4334 Effective January 2016 High frequency, high current power inductors Product specifications 1 2 3 4 5 OCL FLL I I 1 I 2 DCR (mΩ) rms sat sat 7 6 Part Number (nH) ±10% (nH) minimum (A) (A) (A) ± 8.6% @ 20°C K-factor FP0708R1-R07-R 72 52 44 90 72 0.35 557 FP0708R1-R09-R 90 64 44 75 60 0.35 557 FP0708R1-R10-R 105 75 44 68 54 0.35 557 FP0708R1-R12-R 120 86 44 59 47 0.35 557 FP0708R1-R15-R 150 108 44 47 37 0.35 557 FP0708R1-R19-R 190 135 44 37 29 0.35 557 FP0708R1-R20-R 200 144 44 36 27 0.35 557 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0. 1Vrms, 0.0 Adc, +25 °C 6. K-factor: Used to determine B for core loss (see graph). p-p -3 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, I 1, +25 °C B = K * L * ∆I * 10 . B :(Gauss), K: (K-factor from table), sat p-p p-p 3. I : DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary L: (Inductance in nH), ∆I (Peak to peak ripple current in Amps). rms for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generat- 7. Part Number Definition: FP0708Rx-Rxx-R ing components will affect the temperature rise. It is recommended that the temperature of the part FP0708= Product code and size not exceed 125 °C under worst case operating conditions verified in the end application. Rx= Version indicator 4. I 1: Peak current for approximately 20% rolloff @ +25 °C -Rxx= Inductance value in μH, R= decimal point sat 5. I 2: Peak current for approximately 20% rolloff @ +125 °C -R suffix = RoHS compliant sat Dimensions (mm) Part marking: 0708Rx (Rx = version indicator), Rxx = Inductance value in uH, R = decimal point, wwllyy = date code, R = revision level Tolerances are ±0.15 millimeters unless stated otherwise PCB tolerances are ±0.1 millimeters unless stated otherwise All soldering surface to be coplanar within 0.1016 millimeters DCR measured between point “a” and point “b” Do not route traces or vias underneath the inductor Packaging information (mm) Supplied in tape and reel packaging , 640 parts per 13” diameter reel www.eaton.com/elx 2 FP0708 Technical Data 4334 Effective January 2016 High frequency, high current power inductors Temperature rise vs. total loss Core loss vs. B p-p www.eaton.com/elx 3 FP0708 Technical Data 4334 Effective January 2016 High frequency, high current power inductors Inductance characteristics www.eaton.com/elx 4 FP0708 Technical Data 4334 Effective January 2016 High frequency, high current power inductors Solder reflow profile T P Table 1 - Standard SnPb Solder (T ) c TC -5°C tP Volume Volume Max. Ramp Up Rate = 3°C/s Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A T smax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2016 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4334 BU-SB10004 All other trademarks are property January 2016 of their respective owners. Temperature