EATON BUSSMANN FP1005R1-R12-R

Effective April 2016 Technical Data 4337 Supersedes December 2008 FP1005R High frequency, high current power inductors Applications • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Server and desktop • Central processing unit (CPU) • Graphics processing unit (GPU) • Application specific integrated circuit (ASIC) • High power density • Data networking and storage systems • Graphics cards and battery power systems • Portable electronics • Point-of-Load modules Description • High current carrying capacity Environmental Data • Low core loss • Storage temperature range (Component): • Magnetically shielded -40 °C to +125 °C • Frequency range up to 2 MHz • Operating temperature range: -40 °C to +125 °C • Inductance range 85 nH to 220 nH (ambient plus self-temperature rise) • Current range 33 A to 90 A • Solder reflow temperature: J-STD-020D compliant • 10.2 mm x 7.0 mm footprint surface mount package in a 4.95 mm height HALOGEN • Ferrite core material HF Pb FREE • Halogen free, lead free, RoHS compliant FP1005R Technical Data 4337 Effective April 2016 High frequency, high current power inductors Product Specifications 1 2 3 4 5 OCL FLL I I I DCR (mΩ) rms sat1 sat2 7 6 Part Number (nH) ±10% (nH) minimum (A) (A) (A) @ 20°C K-factor R1 Version FP1005R1-R08-R 85 61 53 90 64 0.39 ±7.7% 536 FP1005R1-R10-R 100 72 53 73 57 0.39 ±7.7% 536 FP1005R1-R12-R 120 86 53 60 48 0.39 ±7.7% 536 FP1005R1-R15-R 150 108 53 47 37 0.39 ±7.7% 536 FP1005R1-R22-R 220 158 53 33 26 0.39 ±7.7% 536 R2 Version FP1005R2-R08-R 85 61 50 90 64 0.47 ±6.7% 536 FP1005R2-R10-R 100 72 50 73 57 0.47 ±6.7% 536 FP1005R2-R12-R 120 86 50 60 48 0.47 ±6.7% 536 FP1005R2-R15-R 150 108 50 47 37 0.47 ±6.7% 536 FP1005R2-R22-R 220 158 50 33 26 0.47 ±6.7% 536 R3 Version FP1005R3-R08-R 85 61 45 90 64 0.55 ±5.4% 536 FP1005R3-R10-R 100 72 45 73 57 0.55 ±5.4% 536 FP1005R3-R12-R 120 86 45 60 48 0.55 ±5.4% 536 FP1005R3-R15-R 150 108 45 47 37 0.55 ±5.4% 536 FP1005R3-R22-R 220 158 45 33 26 0.55 ±5.4% 536 R4 Version FP1005R4-R12-R 120 86 45 60 48 0.70 ±10% 536 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc, +25 °C 4. I 1 : Peak current for approximately 20% rolloff @ +25 °C sat 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 Vrms, Isat1, +25 °C 5. I 2 : Peak current for approximately 20% rolloff @ +125 °C sat -3 6. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10 . Bp-p:(Gauss), K: (K-factor from 3. I : DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. rms table), L: (Inductance in nH), Symbol I (Peak to peak ripple current in Amps). PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the 7. Part Number Definition: FP1005Rx-Rxx-R temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating FP1005R= Product code and size conditions verified in the end application. x= Version indicator -Rxx= Inductance value in μH, R= decimal point -R suffix = RoHS compliant Dimensions (mm) Part marking: FPT1005Rx = (x=version indicator), Rxx=inductance value in uH, (R=decimal point) wwllyy=date code, R=revision level. Tolerances are ±0.25 millimeters unless stated otherwise. All soldering surfaces must be coplanar within 0.1016 millimeters. PCB tolerances are ±0.1 millimeters unless stated otherwise. DCR is measured from point “a” to point “b.” Do not route traces or vias underneath the inductor. www.eaton.com/elx 2 FP1005R Technical Data 4337 Effective April 2016 High frequency, high current power inductors Packaging information (mm) Supplied in tape and reel packaging , 950 parts per 13” diameter reel Temperature rise vs. total loss 60 50 40 30 20 10 0 00.2 0.40.6 0.81 1.21.4 1.61.8 2 Total Loss (W) www.eaton.com/elx 3 Temperature Rise ( ) FP1005R Technical Data 4337 Effective April 2016 High frequency, high current power inductors Core loss vs. B p-p 1 MHz 10 500 kHz 300 kHz 200 kHz 1 100 kHz 0.1 0.01 0.001 0.0001 0.00001 100 1000 10000 B (Gauss) p-p Inductance characteristics % of OCL vs. % of I 1 sat 100% -40 °C 80% +25 °C 60% 40% 20% +125 °C 0% 0% 20%40% 60%80% 100% 120% % of I 1 sat www.eaton.com/elx 4 % of OCL Core Loss (W) FP1005R Technical Data 4337 Effective April 2016 High frequency, high current power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (T ) c T -5°C C t P Volume Volume Max. Ramp Up Rate = 3°C/s 3 3 Package mm mm Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 T <2.5mm) 235°C 220°C L Preheat t ≥2.5mm 220°C 220°C A Tsmax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2016 Eaton Eaton is a registered trademark. All Rights Reserved Publication No. 4337 BU-SB08860 All other trademarks are property April 2016 of their respective owners. Temperature