EATON BUSSMANN FP1007R1-R14-R

Effective October 2015 Technical Data 4341 Supersedes September 2010 FP1007 High frequency, high current power inductors Applications • Servers • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Desktop VRMs and EVRDs • Data networking and storage systems • Graphics cards and battery power systems • Point-of-Load modules • DCR Sensing circuits Product description Environmental data • • High current carrying capacity Storage temperature range (Component): -40°C to +125°C • Low core loss • Operating temperature range: -40°C to +125°C • Frequency range up to 2MHz (ambient + self-temperature rise) • Inductance Range from 115 nH to 300nH • Solder reflow temperature: • Current range from 32 to 94 amps J-STD-020D compliant • 10.4 x 8.0mm footprint surface mount package HALOGEN in 6.5, 7.5 or 7.5mm height HF Pb • Ferrite core material FREE • Halogen free, lead free, RoHS compliant FP1007 Technical Data 4341 Effective October 2015 High frequency, high current power inductors Product specifications 1 2 3 4 5 OCL FLL I I 1 I 2 DCR (mΩ) rms sat sat 7 8 Part Number (nH)±10% (nH) minimum (amps) (amps) (amps) @ 20°C ±5% K-factor R1 version FP1007R1-R12-R 120 86 60 81 65 0.29 ± 10% 371 FP1007R1-R14-R 140 100 60 72 56 0.29 ± 10% 371 FP1007R1-R17-R 170 122 60 58 46 0.29 ± 10% 371 FP1007R1-R22-R 215 155 60 50 36 0.29 ± 10% 371 FP1007R1-R30-R 300 216 60 32 26 0.29 ± 10% 371 R2 version FP1007R2-R12-R 120 86 51 81 65 0.48 ± 8% 368 FP1007R2-R14-R 140 100 51 72 56 0.48 ± 8% 368 FP1007R2-R17-R 170 122 51 58 46 0.48 ± 8% 368 FP1007R2-R22-R 215 155 51 50 36 0.48 ± 8% 368 FP1007R2-R30-R 300 216 51 32 26 0.48 ± 8% 368 R3 version FP1007R3-R12-R 115 83 61 94 86 0.29 ± 5% 354 FP1007R3-R15-R 150 108 61 76 70 0.29 ± 5% 354 FP1007R3-R17-R 175 126 61 66 60 0.29 ± 5% 354 FP1007R3-R22-R 215 155 61 50 43 0.29 ± 5% 354 FP1007R3-R23-R 230 165 61 48 40 0.29 ± 5% 354 FP1007R3-R27-R 270 194 61 40 34 0.29 ± 5% 354 FP1007R3-R30-R 300 216 61 35 30 0.29 ± 5% 354 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc, +25°C 6. K-factor: Used to determine B for core loss (see graph). p-p -3 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, I 1, +25°C B = K * L * ∆I * 10 . B :(Gauss), K: (K-factor from table), sat p-p p-p 3. I : Irms: DC current for an approximate temperature rise of 40ºC without core loss. Derating is L: (Inductance in nH), ∆I (Peak-to-peak ripple current in Amps). rms necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other 7. Part Number Definition: FP1007Rx-Rxx-R heat generating components will affect the temperature rise. It is recommended that the FP1007R= Product code and size temperature of the part not exceed 125°C under worst case operating conditions verified in the x = DCR indicator end application. Rxx = Inductance value in μH, R= decimal point 4. I 1: Peak current for approximately 20% rolloff @ +25°C -R suffix = RoHS compliant sat 5. I 2: Peak current for approximately 20% rolloff @ +125°C sat Dimensions (mm) Recommended Pad Layout Schematic Part marking: FP1007Rx (x = DCR indicator), Rxx (xx = inductance value in uH, R = decimal point, wwllyy = date code, R = revision level Tolerances are ±0.25 millimeters unless stated otherwise. PCB tolerances are ±0.1 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeter DCR measured from point “a” to point “b” Do not route traces or vias underneath the inductor www.eaton.com/elx 2 FP1007 Technical Data 4341 Effective October 2015 High frequency, high current power inductors Packaging information (mm) Supplied in tape and reel packaging, FP1007R1 700 parts per 13 ” diameter reel FP1007R2 750 parts per 13 ” diameter reel FP1007R3 650 parts per 13 ” diameter reel User direction of feed Temperature rise vs. total loss www.eaton.com/elx 3 FP1007 Technical Data 4341 Effective October 2015 High frequency, high current power inductors Core loss vs. B p-p Inductance characteristics www.eaton.com/elx 4 FP1007 Technical Data 4341 Effective October 2015 High frequency, high current power inductors Solder reflow profile T P Table 1 - Standard SnPb Solder (T ) c TC -5°C tP Volume Volume Max. Ramp Up Rate = 3°C/s Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A T smax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4341 BU-10927 All other trademarks are property October 2015 of their respective owners. Temperature