EATON BUSSMANN FP1109-R23-R

Effective June 2017 Technical Data 4350 Supersedes June 2011 FP1109 High frequency, high current power inductors Applications • Multi-phase regulators • Voltage Regulator Module (VRM) • Desktop and server VRMs and EVRDs • Data networking and storage systems • Graphics cards and battery power systems • Point-of-load modules • DCR sensing Environmental data SMD Device • Storage temperature range (component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • 11.2 x 11.2 x 9.0mm maximum surface mount (ambient plus self-temperature rise) package • Solder reflow temperature: • Ferrite core material J-STD-020 (latest revision) compliant • High current carrying capacity, low core losses HALOGEN • Controlled DCR tolerance for sensing circuits Pb HF • Inductance range from 205nH to 950nH FREE • Current range from 11.5 to 69 amps • Frequency range up to 2MHz FP1109-xxx wwllyy R FP1109 Technical Data 4350 Effective June 2017 High frequency, high current power inductors Product Specifications 7 1 2 3 4 5 6 Part Number OCL ± 20% (nH) FLL Min. (nH) I (Amps) I 1 @ 25°C (Amps) I 2 @ 125°C (Amps) DCR (mΩ) @ 20°C K-factor rms sat sat FP1109-R20-R 205 122 69 52 233 FP1109-R23-R 247 147 55 41 233 FP1109-R27-R 270 160 51 38 233 FP1109-R33-R 311 185 35 44 33 0.42 ±10% 233 FP1109-R47-R 463 275 27 20 233 FP1109-R58-R 548 325 22.5 17 233 FP1109-1R0-R 950 565 11.5 8.5 233 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10V , 0.0Adc 4I 1: Peak current for approximately 30% rolloff at +25°C. rms sat 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1V ,I 1 5I 2: Peak current for approximately 30% rolloff at +125°C. rms sat sat 3I : DC current for an approximate temperature rise of 40°C without core loss. Derating is -3 rms 6 K-factor: Used to determine B for core loss (see graph). B = K L ΔI 10 ,B : (Gauss), * * * p-p p-p p-p necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of K: (K-factor from table), L: (inductance in nH),ΔI (peak-to-peak ripple current in amps). other heat generating components will affect the temperature rise. It is recommended the part 7 Part Number Definition: FP1109-xxx-R temperature not exceed 125°C under worst case operating conditions verified in the end FP1109 = Product code and size application. xxx= Inductance value in μH, R = decimal point. If no “R” is present, then third character = # of zeros “-R” suffix = RoHS compliant Dimensions- mm Front View Top View Side View Recommended Pad Layout Schematic 2 1 2.5 nom. 3.0 (2x) 9.0 11.2 (2X) 11.4 max max 2 4.10 ref 2.03 ref (2X) 1 3.0 11.2 max (2X) Part Marking: FP1109 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # of zeros wwllyy = Date code R = Revision level Packaging information - mm 4.00 1.5 dia. +0.1/-0.0 2.00 1.5 dia. min 1.75 Section A-A 1 11.50 24.0 ±0.3 17.5 11.4 2 11.4 9.3 2.0 User direction of feed 20.00 16.4 Supplied in tape-and-reel packaging, 350 parts per reel, 13” diameter reel. www.eaton.com/electronics 2 FP1109-xxx wwllyy R FP1109 Technical Data 4350 Effective June 2017 High frequency, high current power inductor Temperature rise vs total loss 50 40 30 20 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 T otal Loss (W ) Core loss vs Bp-p 1MHz 100 500kHz 300kHz 10 200kHz 100kHz 1 0.1 0.01 0.001 0.0001 0.00001 100 1000 10000 B (Gauss) p-p Inductance characteristics % o f OC L v s . % o f I 1 s at 120% 100% 80% - 40° C 60% 40% +25 C ° +125° C 20% 0% 0% 20% 40% 60% 80% 100% 120% % o f I 1 s at 3 www.eaton.com/electronics Core Loss (W) Tem perature Rise (°C) % of OCL FP1109 Technical Data 4350 High frequency, high current power inductor Effective June 2017 Solder Reflow Profile TP Table 1 - Standard SnPb Solder (T ) Table 1 - Standard SnPb Solder (T ) T -5°C c c C t Max. Ramp Up Rate = 3°C/s P Volume Volume Max. Ramp Down Rate = 6°C/s 3 3 Package mm mm _ Thickness <350 >350 T L <2.5mm 235°C 220°C Preheat t A _ >2.5mm 220°C 220°C T smax T Taabbllee 2 2 - - L Leeaadd ((P Pbb)) F Fr reeee S So ollddeer r ((T T )) c c Volume Volume Volume T smin 3 3 3 t s Package mm mm mm Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T ) 100°C 150°C smin T emperature max. (T ) 150°C 200°C smax Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (TL) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. 4350 BU-SB11642 of their respective owners. June 2017 Temperature