EATON BUSSMANN FP1308-R32-R
Specifications
Manufacturer
Eaton Bussmann
Manufacturers Part #
FP1308-R32-R
Industry Aliases
FP1308-R32-R
Sub-Category
Surface Mount Inductors
Factory Pack Quantity
400
Datasheet
Extracted Text
Effective June 2017 Technical Data DS4313 Supersedes Sepetember 2011 FP1308 High frequency, high current power inductors Applications • Voltage regulator modules (VRMs) for servers and microprocessors • Multi-phase buck inductors • High frequency, high current switching power supplies SMD Device Environmental data • Storage temperature range (component): Product features -40 °C to +125 °C • 13.7 x 12.9 x 8.0mm surface mount package • Operating temperature range: -40 °C to +125 °C • High current handling capability, compact (ambient plus self-temperature rise) footprint • Solder reflow temperature: • Ferrite core material J-STD-020 (latest revision) compliant • Inductance range from 0.110µH to 0.440µH • Current range from 32 to 120 amps HALOGEN • Frequency range up to 2MHz Pb HF • Halogen free, lead free, RoHS compliant FREE Product Specifications 1 2 3 4 Part Rated OCL I I DCR (mΩ) @ DCR (mΩ) @ K-factor rms sat 5 Number Inductance (μH) ± 10% (μH) (Amps) (Amps) 25°C Typical 25°C Max FP1308-R11-R 0.110 0.110 68 120 0.20 0.24 21.330 FP1308-R21-R 0.210 0.210 68 72 0.20 0.24 21.333 FP1308-R26-R 0.260 0.260 68 60 0.20 0.24 21.335 FP1308-R32-R 0.320 0.320 68 45 0.20 0.24 21.340 FP1308-R44-R 0.440 0.440 68 32 0.20 0.24 21.366 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0V , 0.0Adc 4 K-factor: Used to determine B for core loss (see graph). B = K L ΔI. B (mT): (Gauss), K: * * rms p-p p-p p-p 2I : DC current for an approximate temperature rise of 40°C without core loss. Derating is (K-factor from table), L: (inductance in μH),ΔI (peak-to-peak ripple current in amps). rms 5 Part Number Definition: FP1308-xxx-R necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of FP1308 = Product code and size other heat generating components will affect the temperature rise. It is recommended the part xxx= Inductance value in μH, R = decimal point. If no “R” is present, then temperature not exceed 125°C under worst case operating conditions verified in the end third character = # of zeros. application. “-R” suffix = RoHS compliant 3I : Peak current for approximately 20% rolloff at +25°C. sat FP1308R3-R RECOMMENDED FOR NEW DESIGNS FP1308 Technical Data DS4313 High frequency, high current power inductors Effective June 2017 D Diim me en ns siio on ns s - - m mm m Recommended Pad Layout Schematic Front View Bottom View Top View 7.62 1 2.54 (2plcs) 12.95 max. 1 3.18 5.4 7.2 8.0 13.70 max. 2 FP1308- XXX Left View wwllyy R 2 8.0 max. Part Marking: FP1308 xxx = Inductance value in μH. (R = Decimal point). If no “R” is present, then last character is # 0f zeros wwllyy = Date code R = Revision level Packaging Information - mm 1.5 dia. +0.1/-0.0 4.0 A 1.5 diia. min 2.0 1.75 Section A-A 11.5 24.0 ±0.3 13.9 FP1308-XXX wwllyy R A 13.2 8.2 User direction of feed Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel. Temperature Rise vs. Total Loss 100 80 60 40 20 0 0 0.5 1 1.5 2 2.5 3 Total Loss (W) www.eaton.com/electronics 2 FP1308R3-R RECOMMENDED FOR NEW DESIGNS Temperature Rise (°C) FP1308 Technical Data DS4313 Effective June 2017 High frequency, high current power inductors Core Loss 500kHz 100kHz Core Loss vs B p-p 300kHz 50kHz 1MHz 10 1 0.1 0.01 0.001 0.0001 1 10 100 1000 B (mT) p-p Inductance Characteristics OCL vs I sat 120% 100% 80% 60% -40 °C 40% +25 °C 20% +125 °C 0% 0% 20% 40% 60% 80% 100% 120% 140% 160% %of I sat 3 www.eaton.com/electronics FP1308R3-R RECOMMENDED FOR NEW DESIGNS Core L oss (W) %of OCL FP1308 Technical Data DS4313 High frequency, high current power inductors Effective June 2017 Solder Reflow Profile TP Table 1 - Standard SnPb Solder (T ) Table 1 - Standard SnPb Solder (T ) T -5°C c c C t Max. Ramp Up Rate = 3°C/s P Volume Volume Max. Ramp Down Rate = 6°C/s 3 3 Package mm mm _ Thickness <350 >350 T L <2.5mm 235°C 220°C Preheat t A _ >2.5mm 220°C 220°C T smax T Taabbllee 2 2 - - L Leeaadd ((P Pbb)) F Fr reeee S So ollddeer r ((T T )) c c Volume Volume Volume T smin 3 3 3 t s Package mm mm mm Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T ) 100°C 150°C smin T emperature max. (T ) 150°C 200°C smax Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (TL) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. DS4313 BU-SB111090 of their respective owners. June 2017 FP1308R3-R RECOMMENDED FOR NEW DESIGNS Temperature
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