EATON BUSSMANN FP1308R3-R32-R

Effective June 2017 Technical Data 4355 Supersedes March 2012 FP1308R High frequency, high current power inductors Applications • Multi-phase regulators • Voltage Regulator Module (VRM) • Desktop and server VRMs and EVRDs • Data networking and storage systems • Graphics cards and battery power systems • Point-of-load modules • DCR sensing Environmental data SMD Device • Storage temperature range (component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • 13.4 x 12.7 x 8.0mm surface mount package (ambient plus self-temperature rise) • Ferrite core material • Solder reflow temperature: • High current carrying capacity, Low core losses J-STD-020 (latest revision) compliant • Controlled DCR tolerance for sensing circuits HALOGEN • Inductance range from 110nH to 440nH Pb HF • Current range from 37 to 120 Amps FREE • Frequency range up to 2MHz FP1308R Technical Data 4355 Effective June 2017 High frequency, high current power inductors Product Specifications 1 2 3 4 5 Part OCL FLL I I 1 I 2 DCR (mΩ) rms sat sat 7 6 Number ± 10% (nH) (nH) (Amps) @ 25°C (Amps) @ 125°C (Amps) @ 20°C K-factor R1 Version FP1308R1-R11-R 110 79 120 105 233 FP1308R1-R21-R 210 152 80 68 233 FP1308R1-R26-R 260 187 57 64 52 0.32 ± 9.4% 233 FP1308R1-R32-R 320 230 52 40 233 FP1308R1-R44-R 440 317 37 28 233 R2 Version FP1308R2-R11-R 110 79 120 105 233 FP1308R2-R21-R 210 152 80 68 233 FP1308R2-R26-R 260 187 45 64 52 0.53 ± 10% 233 FP1308R2-R32-R 320 230 52 40 233 FP1308R2-R44-R 440 317 37 28 233 R3 Version FP1308R3-R11-R 110 79 120 105 233 FP1308R3-R21-R 210 152 80 68 233 FP1308R3-R26-R 260 187 68 64 52 0.18 ± 20% 233 FP1308R3-R32-R 320 230 52 40 233 FP1308R3-R44-R 440 317 37 28 233 1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0V , 0.0Adc 5 I 2: Peak current for approximately 20% rolloff at +125°C. rms sat -3 2 Full Load Inductance (FLL) Test Parameters: 100kHz, 1.0V , I 1. 6 K-factor: Used to determine B for core loss (see graph). B = K L ΔI 10 . B (Gauss), rms sat * * * p-p p-p p-p K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps). 3 I : DC current for an approximate temperature rise of 40°C without core loss. Derating is rms 7 Part Number Definition: FP1308Rx-Rxx-R necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of other heat FP1308 = Product code and size generating components will affect the temperature rise. It is recommended the part temperature not exceed Rx = DCR indicator 125°C under worst case operating conditions verified in the end application. Rxx = Inductance value in μH, R = decimal point. 4 I : Peak current for approximately 20% rolloff at +25°C.“-R” suffix = RoHS compliant sat Dimensions- mm Side View Top View Bottom View Recom m ended Pad Layout Schem atic 5.08 8.0 ±0.15 12.7 m ax 7.62 m ax b 1 1 1 3.18 2.54 ±0.3 7.2 7.5 13.4 2 typ. 1308Rx m ax Rxx wwllyy R 2 2 a The nominal DCR is measured from point “a” to point “b” All soldering surfaces to be coplanar within 0.1016mm. Part Marking: FP1308R (Rx = DRC indicator) Rxx = Inductance value in μH. (R = Decimal point). wwllyy = Date code R = Revision level Packaging information - mm 4.0 1.5 dia 2.0 1.5 dia min A 1.75 Section A-A 1 11.5 24.0 ±0.3 13.9 1308Rx Rxx wwllyy R 2 13.2 A 8.2 User direction of feed 20.0 Supplied in tape-and-reel packaging, 400 parts per reel, 13” diameter reel. www.eaton.com/electronics 2 FP1308R Technical Data 4355 Effective June 2017 High frequency, high current power inductor Temperature rise vs total loss 60 50 F P1308R2 F P1308R1 40 30 F P1308R3 20 10 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 T otal Loss (W) Core loss vs Bp-p 1M H z 500kH z 300kH z 200kH z 10 100kH z 1 0.1 0.01 100 1000 10000 B (Gauss) p-p Inductance characteristics % of OCL vs % of I 1 sat 100% 80% -40 °C 60% 40% +25 °C 20% +125 °C 0% 0% 20% 40% 60% 80% 100% 120% 140% 1 % of I sat 3 www.eaton.com/electronics % of OCL Core Loss(W ) Tem perature R ise (°C ) FP1308R Technical Data 4355 High frequency, high current power inductor Effective June 2017 Solder Reflow Profile TP Table 1 - Standard SnPb Solder (T ) Table 1 - Standard SnPb Solder (T ) T -5°C c c C t Max. Ramp Up Rate = 3°C/s P Volume Volume Max. Ramp Down Rate = 6°C/s 3 3 Package mm mm _ Thickness <350 >350 T L <2.5mm 235°C 220°C Preheat t A _ >2.5mm 220°C 220°C T smax T Taabbllee 2 2 - - L Leeaadd ((P Pbb)) F Fr reeee S So ollddeer r ((T T )) c c Volume Volume Volume T smin 3 3 3 t s Package mm mm mm Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T ) 100°C 150°C smin T emperature max. (T ) 150°C 200°C smax Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (TL) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. 4355 BU-SB12178 of their respective owners. June 2017 Temperature