EATON BUSSMANN FP1505R1-R12-R

Effective July 2017 Technical Data 4365 Supersedes April 2009 FP1505 High frequency, high current power inductors Applications • Multi-phase regulators • Voltage Regulator Module (VRM) • Desktop and server VRMs and EVRDs • Data networking and storage systems • Notebook regulators • Graphics cards and battery power systems • Point of load modules • DCR current sensing Environmental data SMD Device • Storage temperature range (component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • 7.0 x 15.0 x 5.0mm surface mount package (ambient plus self-temperature rise) • Ferrite core material • Solder reflow temperature: • High current handling capability, low core loss J-STD-020 (latest revision) compliant • Designed for high speed, high current switch HALOGEN mode applications Pb HF • Tight DCR tolerance for sensing circuits FREE • Inductance range from 100 nH to 400 nH • Current range from 24 A to 105 A • Frequency range up to 1 MHz FP1505 Technical Data 4365 Effective July 2017 High frequency, high current power inductors Product specifications 1 2 3 4 5 Part OCL FLL I I 1 I 2 DCR (mΩ) rms sat sat 7 6 Number ± 10% (nH) Min. (nH) (A) (A) @+25 °C (Amps) @+125 °C @+20 °C K-factor FP1505R1-R10-R 100 72 105 90 356.3 FP1505R1-R12-R 120 86 87 75 356.3 FP1505R1-R15-R 150 108 72 60 356.3 53 0.47 ± 7% FP1505R1-R25-R 250 180 42 32 356.3 FP1505R1-R30-R 300 217 35 26 356.3 FP1505R1-R40-R 400 288 24 19.5 356.3 1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 1.0 V , 0.0 Adc 5 I 2: Peak current for approximately 20% rolloff at +125 °C. rms sat -3 2 Full Load Inductance (FLL) Test Parameters: 100 kHz, 1.0 V , I 1 6 K-factor: Used to determine B for core loss (see graph). B = K * L * ΔI * 10 . B :(Gauss), K: rms sat p-p p-p p-p 3 I : DC current for an approximate temperature rise of 40 °C without core loss. Derating is (K-factor from table), L: (Inductance in nH), ΔI (Peak-to-peak ripple current in amps). rms necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other 7 Part Number Definition: FP1505Rx-Rxx-R heat generating components will affect the temperature rise. It is recommended that the FP1505 = Product code and size temperature of the part not exceed +125 °C under worst case operating conditions verified in the Rx= DCR indicator end application. Rxx= Inductance value in uH, R = decimal point 4 I 1: Peak current for approximately 20% rolloff at +25 °C. -R suffix = RoHS compliant sat Dimensions- mm Front View Recommended Pad Layout Top View Side View Schematic a 1 2.0 1 ref 5.00 M ax 14.7 ± 0.3 15 1505R x R xx 1.9 ref. 2.8 ref. ww llyy R (2x) 2.50 (2x) 2 4.50 (2x) 2 b 6.7 ± 0.3 The nominal DCR is measured between points “a” and “b” Part Marking: 1505Rx Rx = DCR indicator Rxx = Inductance value in μH. (R = Decimal point). wwllyy = Date code R = Revision level Do not route traces or vias underneath the inductor Packaging information - mm 1.5 dia 4.0 1.75 A 2.0 1.5 dia 11.5 24.0 1505Rx ± 0.3 15.4 Rxx wwllyy R 7.4 User direction of feed 5.4 16.0 A Section A-A Supplied in tape-and-reel packaging, 744 parts per reel, 13” diameter reel. www.eaton.com/electronics 2 FP1505 Technical Data 4365 Effective July 2017 High frequency, high current power inductor Temperature rise vs total loss 50 45 40 35 30 25 20 15 10 5 0 0 0.4 0.8 1.2 1.6 2 T otal Loss (W) Core loss vs Bp-p 200 100 1 500 300 kHz kHz kHz M Hz kHz 10 1 0.1 0.01 0.001 0.0001 100 1000 10000 B (Gauss) p-p Inductance characteristics % of O C L vs. % of I 1 sat 100% 80% -40°C +25°C 60% +125°C 40% 20% 0% 0% 20% 40% 60% 80% 100% 120% 140% % of I 1 sa t 3 www.eaton.com/electronics Tem perature R ise (°C ) % of O CL Core Loss (W ) FP1505 Technical Data 4365 High frequency, high current power inductor Effective July 2017 Solder Reflow Profile TP Table 1 - Standard SnPb Solder (T ) Table 1 - Standard SnPb Solder (T ) T -5°C c c C t Max. Ramp Up Rate = 3°C/s P Volume Volume Max. Ramp Down Rate = 6°C/s 3 3 Package mm mm _ Thickness <350 >350 T L <2.5mm 235°C 220°C Preheat t A _ >2.5mm 220°C 220°C T smax T Taabbllee 2 2 - - L Leeaadd ((P Pbb)) F Fr reeee S So ollddeer r ((T T )) c c Volume Volume Volume T smin 3 3 3 t s Package mm mm mm Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T ) 100°C 150°C smin T emperature max. (T ) 150°C 200°C smax Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (TL) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. 4365 BU-SB09350 of their respective owners. July 2017 Temperature