EATON BUSSMANN FP2-S082-R

Effective December 2015 Technical Data 4110 Supersedes July 2014 FP2 Low profile, high current power inductors Applications • Servers • Multi-phase and Vcore regulators • Voltage Regulator Modules (VRMs) • Server and desktop • Central processing unit (CPU) • Graphics processing unit (GPU) • Application specific integrated circuit (ASIC) • High power density • Notebook regulators • Battery power systems • Product description Graphics cards • High current carrying capacity • Dual conductors allow for low inductance Environmental data and high current or high inductance and • Storage temperature range (component): lower current -40°C to +125°C • Inductance range from 0.047uH to 0.480uH • Operating temperature range: -40°C to +125°C • Current range 9.0 to 42 Amps (Ambient plus self temperature rise) • 7.2 x 6.7mm footprint surface mount package • Solder reflow temperature: J-STD-020D in a 3.0 or 5.0mm heights compliant • Ferrite core material HALOGEN • Halogen free, lead free, RoHS compliant HF Pb FREE FP2 Technical Data 4110 Effective December 2015 Low profile, high current power inductors Product specifications 1 2 3 OCL l l DCR (Ω) typical Height rms sat 5 4 Part number (μH) ±15% (amps) (amps) @ 20°C maximum Volt-μsec (V-μs) Single conductor FP2-S047-R 0.047 39 42 0.00024 3 0.75 FP2-S068-R 0.068 39 32 0.00024 3 0.75 FP2-S082-R 0.082 39 26 0.00024 3 0.75 FP2-S100-R 0.100 39 22 0.00024 3 0.75 FP2-S120-R 0.120 39 18 0.00024 3 0.75 FP2-S200-R 0.200 37 19 0.00028 5 0.99 FP2-V050-R 0.050 37 70 0.00028 5 0.99 FP2-V100-R 0.100 37 40 0.00028 5 0.99 FP2-V120-R 0.120 37 33 0.00028 5 0.99 FP2-V150-R 0.150 37 25.5 0.00028 5 0.99 Double conductor FP2-D047-R 0.047 37 42 0.00026 3 0.75 FP2-D068-R 0.068 37 32 0.00026 3 0.75 FP2-D082-R 0.082 37 26 0.00026 3 0.75 FP2-D100-R 0.100 37 22 0.00026 3 0.75 FP2-D120-R 0.120 37 18 0.00026 3 0.75 Series mode 1 2 3 OCL l l DCR (Ω) typical Height rms sat 5 4 Part number (μH) ±15% (amps) (amps) @ 20°C maximum Volt-μsec (V-μs) Double conductor FP2-D047-R 0.188 16 21 0.0013 3 1.5 FP2-D068-R 0.272 16 16 0.0013 3 1.5 FP2-D082-R 0.328 16 13 0.0013 3 1.5 FP2-D100-R 0.400 16 11 0.0013 3 1.5 FP2-D120-R 0.480 16 9 0.0013 3 1.5 1. Open Circuit Inductance (OCL) Test parameters: 1.0MHz, 0.25Vrms, ).0Adc, +25°C 4. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 2. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary 500kHz necessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise. for AC currents. PCB layout, trace thickness and width, airflow, and proximity of other heat generating 5. Part Number Definition: FP2-xyyy-R components will affect the temperature rise. It is recommended that the temperature of the part FP2 = Product code and size not exceed 125°C under worst case operating conditions verified in the end application. x = Version indicator, S = single conductor, V = single conductor, D = dual conductor 3. Isat : Peak current for approximately 30% rolloff @ +20°C. yyy = Inductance value in uH, R = decimal point -R suffix = RoHS compliant www.eaton.com/elx 2 FP2 Technical Data 4110 Effective December 2015 Low profile, high current power inductors Dimensions–mm Single conductor Dual conductor Part marking: FPS, V or D (S= single conductor, V= single conductor, D= dual conductor), xxx (xxx= inductance value in uH, R= decimal point) yww= date code Tolerances are ±0.2 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.15 millimeters Do not route traces or vias underneath the inductor Packaging information Supplied in tape and reel packaging. FP2-S,FP2-D: 1,700 parts per 13” diameter reel. FP2-S200, FP2-V: 950 parts per 13” diameter reel. 4.0 min. +0.1/-0.0 2.0 1.75 A 1 Ao=6.6mm 7.5 Bo=7.1mm Bo +/-0.3 Ko=3.2mm 2 (FP2-S,FP2-D) Ko=5.2mm A (FP2-S200,FP2-V) Ao Ko Direction of Feed 12.0 www.eaton.com/elx 3 FP2 Technical Data 4110 Effective December 2015 Low profile, high current power inductors Inductance characteristics Core loss IRMS DERATING WITH CORE LOSS 0 20 40 50 60 70 80 90 92 94 95 96 97 98 99 10 20 30 40 50 60 80 100 200 300 400 500 600 800 1000 % of Applied Volt-μ-Seconds www.eaton.com/elx 4 100KHz 1MHz 500KHz 300KHz 200KHz % of Losses from Irms (maximum) FP2 Technical Data 4110 Effective December 2015 Low profile, high current power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (T ) c T -5°C C t P Volume Volume Max. Ramp Up Rate = 3°C/s Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 T <2.5mm) 235°C 220°C L Preheat t ≥2.5mm 220°C 220°C A Tsmax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4110- BU-MC15058 All other trademarks are property December 2015 of their respective owners. Temperature