EATON BUSSMANN HC2-R68TR-R

Effective October 2015 Technical Data 4109 Supersedes August 2006 HC2 High current power inductors Applications • Distributed power systems DC-DC converters • General-purpose low voltage supplies • Computer systems • Servers • Point of Load (POL) converters • Industrial Equipment • Networking/Telecom power supplies Environmental data • Storage temperature range (component): - Product description 40°C to +125°C • • Compact footprint Operating temperature range: -40°C to +125°C (ambient + self-temperature rise). • Designed for high density, high current/low • voltage applications Solder reflow temperature: J-STD-020D compliant • Foil technology that adds higher reliability factor over the traditional magnet wire used for higher frequency circuit designs Pb • Frequency Range up to 1MHz HC2 Technical Data 4109 Effective October 2015 High current power inductors Product specifications 4 5 Part number DCR (Ω) Volt-μsec 1 2 3 Part number (Tape and reel) OCL (μH) ±20% l amps l amps maximum @ 20°C (V-μs) rms sat HC2-R47-R HC2-R47TR-R .52 52.9 63.75 .0006 6.87 HC2-R68-R HC2-R68TR-R .63 52.9 50.00 .0006 6.87 HC2-1R0-R HC2-1R0TR-R 1.15 33.0 42.50 .0013 10.31 HC2-2R2-R HC2-2R2TR-R 2.00 24.3 31.90 .0023 13.75 HC2-4R7-R HC2-4R7TR-R 4.55 17.0 21.25 .0046 20.62 HC2-6R0-R HC2-6R0TR-R 6.00 17.0 16.50 .0046 20.62 3. Peak current for approximately 30% rolloff. 1. Open Circuit Inductance Test Parameters: 300kHz, 0.250 Vrms, 0.0 Adc 4. Values @ 20°C 2. DC current for an approximate temperature change of 40°C without core loss. Derating is necessary 5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat 300KHz neccessary to generate a core loss equal to 10% of the total losses for 40°C temperature rise. generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. Dimensions–mm RECOMMENDED PCB PAD LAYOUT TOP VIEW 10.00 HC2 - XXX 19.0 19.00 2 1 max wwllyy R 9.5 typ 5.50 5.50 19.2 max FRONT VIEW SCHEMATIC 1 12.7 max 2 3.5 2.3 typ typ Packaging information (mm) Bulk packaging: 45 parts per tray Tape and reel packaging: 110 parts per 13” diameter reel 4.0 2.0Dia 1.5Dia +0.10 min -0.00 2.0 1.75 R0.5 ref 20.2 Ao= 19.3mm HC2-xxx Bo= 19.3mm 44.0 Bo B 40.4 wwllyy R +/-0.3 0 Ko= 12.9mm +/-0.1 0 Ko Ao 32 SECTION A-A User direction of feed www.eaton.com/elx 2 A A HC2 Technical Data 4109 Effective October 2015 High current power inductors Rolloff INDUCTANCE VERSUS SATURATION CURRENT 100 90 80 70 60 50 40 30 20 10 0 020406080100 120140 160180 200 % of ISAT Core loss IRMS DERATING WITH CORE LOSS 0 20 40 50 60 70 80 90 92 94 95 96 97 98 99 10 20 30 40 50 60 80 100 200 300 400 500 600 800 1000 % of Applied Volt-μ-Seconds www.eaton.com/elx 3 100KHz 1MHz 500KHz 300KHz 200KHz % of Losses from Irms (maximum) % of OCL HC2 Technical Data 4109 Effective October 2015 High current power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (T ) c T -5°C C t P Volume Volume Max. Ramp Up Rate = 3°C/s Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 T <2.5mm) 235°C 220°C L Preheat t ≥2.5mm 220°C 220°C A Tsmax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4109 All other trademarks are property October 2015 of their respective owners. Temperature