EATON BUSSMANN HC8-R75-R
Specifications
Manufacturer
Eaton Bussmann
Manufacturers Part #
HC8-R75-R
Industry Aliases
HC8-R75-R
Sub-Category
Surface Mount Inductors
Selling Alternatives
HC8-R75
Factory Pack Quantity
800
Datasheet
Extracted Text
Effective October 2015 Technical Data 4120 Supersedes March 2007 HC8 High current power inductors Applications • Multi-phase regulators • Voltage Regulator Modules (VRMs) • Distributed power systems DC-DC converters • Desktop and server VRMs and EVRDs • Point-of-Load (POL) modules • Field Programmable Gate Array (FPGA) DC-DC converters • Battery power systems • High current power supplies • Data networking and storage systems Product description Environmental data • Surface mount inductors, 4.0mm height, • Storage temperature range (component): designed for higher speed switch mode applica- -40°C to +155°C tions requiring low voltage and high current • Operating temperature range: -40°C to +155°C • Design utilizes high temperature powder iron (ambient plus self-temperature rise) material with a non-organic binder to eliminate • Solder reflow temperature: thermal aging J-STD-020D compliant • Inductance Range from 0.175 uH to 47.3 uH • Current Range from 2.2 to 76 Amps • Frequency Range 1kHz to 500kHz Pb HC8 Technical Data 4120 Effective October 2015 High current power inductors Product specifications 3 4 5 l (amps) l (amps) DCR (mΩ) Volt-μsec sat sat 6 1 2 Part number OCL (μH) ±20% l (amps) 15% 30% maximum @ 20°C (V-μs) rolloff rolloff rms HC8-R15-R 0.175 39.0 43 76 0.80 1.5 HC8-R39-R 0.390 28.3 26 45 1.55 2.5 HC8-R75-R 0.766 18.8 18.5 32.7 3.40 3.5 HC8-1R2-R 1.32 16.0 14.4 25.5 4.70 4.5 HC8-1R9-R 1.90 12.4 11.8 20.9 7.7 5.5 HC8-2R6-R 2.65 10.2 10.0 17.7 11.4 6.5 HC8-3R5-R 3.52 8.5 8.7 15.3 16.5 7.5 HC8-4R5-R 4.52 8.0 7.7 13.5 18.6 8.5 HC8-5R6-R 5.65 6.7 6.9 12.1 26.3 9.5 HC8-6R9-R 6.90 6.4 6.2 10.9 28.9 10.5 HC8-8R2-R 8.27 5.5 5.7 10.0 39.6 11.5 HC8-100-R 9.77 5.2 5.2 9.2 43.6 12.5 HC8-150-R 15.02 4.1 4.2 7.4 68.6 15.5 HC8-220-R 21.40 3.4 3.5 6.2 99.5 18.6 HC8-330-R 31.65 2.7 2.9 5.1 154 22.6 HC8-470-R 47.28 2.2 2.4 4.2 237 27.6 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C 5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 2. Irms: DC current for an approximately ΔT of 40°C without core loss. Derating is necessary for operating frequency necessary to generate additional core loss which contributes to the 40°C AC currents. Pad layout, trace thickness and width, airflow, and proximity of other heat generating temperature rise. De-rating of the Irms is required to prevent excessive temperature rise. The 100% components will affect the temperature rise. It is recommended that the temperature of the part V-μs rating is equivalent to a ripple current I of 20% of Isat (30% rolloff option). p-p not exceed 155°C under worst case conditions verified in the end application. 6. Part number definition: HC8-XXX-R 3. Peak current for approximately 15% rolloff @+20°C HC8 = Product code and size 4. Peak current for approximately 30% rolloff @+20°C XXX = Inductance value in uH. R = Decimal point. If no R is present then last character equals number of zeros -R suffix indicates RoHS compliant Dimensions–mm FRONT VIEW FRONTVIEW TOP VIEW TABLE RECOMMENDED PAD LAYOUT C SIDE VIEW L A SCHEMATIC PN mm 3.5 typ 1 2plcs R15 2.1 2.70 ± 0.55 10.9 HC8-XXX 10.4 4.0 (2x) Max Max R39 2.1 Max wwllyy R 3.0 typ R75 2.1 2plcs 1R 2.1 Aref 1R9 3.95 2 10.4 thru 2.7 2 plcs 4.0 typ Max 470 ref Part marking: HC8= (Product code and size)-xxx=(inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros. wwlyly=date code, R=revision level Tolerances are ±0.2 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeters Do not route traces or vias underneath the inductor Packaging information–mm Supplied in tape and reel packaging, 800 parts per reel 4.0 1.5 dia 2.0 +0.1/-0.0 1.5 dia min A 1.75 11.5 Ao=10.4 mm Bo=11.2 mm 24.0 HC8-XXX +/-0.3 11.2 Bo Ko=4.3 mm wwllyyR Ko A SECTION A-A 16.0 Ao User direction of feed www.eaton.com/elx 2 HC8 Technical Data 4120 Effective October 2015 High current power inductors Inductance characteristics OCL vs Isat 100 90 80 70 60 50 40 30 02 10 0 0102030405060708090100 110120 130140 150160 170180 190200 %ofIsat Core loss Irms DERATING WITH CORE LOSS %Applied Volt-u Seconds 10 30 50 70 90 110130 150170 190 84 86 88 100kHz 90 200kHz 300kHz 92 400kHz 94 500kHz 96 98 100 www.eaton.com/elx 3 %ofIrmsspecified from zero ripple application %ofOCL HC8 Technical Data 4120 Effective October 2015 High current power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (T ) c T -5°C C t P Volume Volume Max. Ramp Up Rate = 3°C/s Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 T <2.5mm) 235°C 220°C L Preheat t ≥2.5mm 220°C 220°C A Tsmax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4120 All other trademarks are property October 2015 of their respective owners. Temperature
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