EATON BUSSMANN HC8LP-4R5-R

Effective October 2015 Technical Data 4126 Supersedes March 2007 HC8LP Low profile, high current power inductors Applications • Multi-phase regulators • Voltage Regulator Modules (VRMs) • Distributed power systems DC-DC converters • Notebook and laptop regulators • Desktop and server VRMs and EVRDs • Point-of-Load (POL) modules • Battery power systems • High current power supplies • Data networking and storage systems Environmental data Product description • Storage temperature range (component): • Low profile surface mount inductors designed -40°C to +155°C for higher speed switch mode applications • Operating temperature range: -40°C to +155°C requiring low voltage, and high current (ambient plus self-temperature rise) • Design utilizes high temperature powder iron • Solder reflow temperature: J-STD-020D material with a non-organic binder to eliminate compliant thermal aging • Inductance range from 0.17 uH to 47.9 uH • Current range from 1.7 to 56 Amps • Frequency range 1kHz to 500kHz Pb HC8LP Technical Data 4126 Effective October 2015 Low profile, high current power inductors Product specifications 3 4 5 l (amps) l (amps) DCR (mΩ) Volt-μSec sat sat 6 1 2 Part number OCL (μH) ±20% l (amps) 15% 30% maximum @ 20°C (V-μs) rolloff rolloff rms HC8LP-R15-R 0.170 29.0 31 56 1.40 7.8 HC8LP-R39-R 0.430 20.2 19 34 2.80 4.7 HC8LP-R75-R 0.830 15.6 13.5 24 4.70 3.4 HC8LP-1R2-R 1.35 12.4 10.1 18.7 7.50 2.6 HC8LP-1R9-R 1.92 10.1 8.7 15.5 11.5 4.1 HC8LP-2R6-R 2.67 8.3 7.4 13.1 17.1 4.8 HC8LP-3R5-R 3.56 6.9 6.4 11.4 24.5 5.6 HC8LP-4R5-R 4.57 6.5 5.6 10.0 27.6 6.3 HC8LP-5R6-R 5.71 5.5 5.1 9.0 38.9 7.1 HC8LP-6R9-R 6.98 5.2 4.6 8.1 42.8 7.8 HC8LP-8R2-R 8.37 4.5 4.2 7.4 58.0 8.6 HC8LP-100-R 9.90 4.3 6.8 3.8 62.9 9.3 HC8LP-150-R 15.2 3.4 3.1 5.5 99.4 11.6 HC8LP-220-R 21.7 2.8 2.6 4.6 149 13.7 HC8LP-330-R 32.1 2.3 2.1 3.8 224 16.8 HC8LP-470-R 47.9 1.8 1.7 3.1 344 20.3 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 1.0Vrms, 0.0Adc, @ +25°C 6. Part number definition: HC8LP-XXX-R 2. Irms: DC current for an approximate DT of 40°C without core loss. Derating is necessary for AC currents. HC8LP = Product code and size PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components XXX = Inductance value in uH. R = Decimal point. If no R is present then last character equals will affect the temperature rise. It is recommended that the temperature of the part not exceed 155°C number of zeros under worst case operating conditions verified in the end application. -R suffix indicates RoHS compliant 3. Peak current for approximately 15% rolloff @+20°C 4. Peak current for approximately 30% rolloff @+20°C 5. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at operating frequency necessary to generate additional core loss which contributes to the 40°C temperature rise. De-rating of the I is required to prevent excessive temperature rise. The 100% V-us rating is rms equivalent to a ripple current Ip-p of 20% of Isat (30% rolloff option). Dimensions–mm TOP VIEW SIDE VIEW RECOMMENDED PAD LAYOUT 2.70 ±0 .55 3.5 typ (2 x) 2plcs 10.9 HC8LP-XXX 10.4 Max Max 3.0 typ wwllyy R 2plcs 4.0 typ 10.4 Max FRONT VIEW Dimesional Table SCHEMATIC A B FRONT VIEW PN C ref max L 1 mm mm R15 2.1 3.5 B R39 2.1 3.5 Max R75 2.1 3.5 1R23 2.1 .3 1R9 2 Aref thru 2.7 3.5 3.95 470 2plcs ref Part marking: HC8LP= (Product code and size)-xxx=(inductance value in uH, R= decimal point. If no R is present then last character equals number of zeros. wwlyly=date code, R=revision level Tolerances are ±0.2 millimeters unless stated otherwise All soldering surfaces to be coplanar within 0.1 millimeters Do not route traces or vias underneath the inductor www.eaton.com/elx 2 HC8LP Technical Data 4126 Effective October 2015 Low profile, high current power inductors Packaging information–mm Supplied in tape and reel packaging, 800 parts per reel 4.0 1.5 dia +0.1/-0.0 2.0 1.5 dia min A 1.75 Ao=10.4 mm 11.5 Bo=11.2 mm 24.0 HC8LP-XXX Bo +/-0.3 11.2 Ko=4.3 mm wwlly y R Ko A SECTION A-A 16.0 Ao User direction of feed Core loss Irms DERATING WITH CORE LOSS %Applied Volt-u Seconds 10 30 50 70 90 110 130 150170 190 92 93 94 100kHz 95 200kHz 96 300kHz 400kHz 97 500kHz 98 99 100 Rolloff OCL vs Isat 100 90 80 70 60 50 40 30 20 10 0 0102030405060708090 100 110120 130140 150160 170 180190 200 210220 %of Isat www.eaton.com/elx 3 %of Irmsspecifiedfrom zero ripple application (Maximum) %of OCL HC8LP Technical Data 4126 Effective October 2015 Low profile, high current power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (T ) c T -5°C C t P Volume Volume Max. Ramp Up Rate = 3°C/s Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 T <2.5mm) 235°C 220°C L Preheat t ≥2.5mm 220°C 220°C A Tsmax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4120 All other trademarks are property October 2015 of their respective owners. Temperature