EATON BUSSMANN HCP0605-R10-R

Effective May 2017 Technical Data 4368 Supersedes June 2009 HCP0605 High current power inductors Applications • Voltage Regulator Module (VRM) • Multi-phase regulators • Desktop and server VRMs and EVRDs • Point-of-load (POL) modules • Notebook regulators • Data networking and storage systems • Graphics cards • Battery power systems Environmental data Surface Mount Device • Storage temperature range (component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • High current carrying capacity, high permeability (ambient plus self-temperature rise) • Magnetically shielded, low EMI • Solder reflow temperature: • Frequency range up to 1 MHz J-STD-020 (latest revision) compliant • 5.3 mm x 6.1 mm footprint surface mount package in a 4.95 mm height HALOGEN • Iron powder core material Pb HF FREE • Halogen free, lead free, RoHS compliant HCP0605 Technical Data 4368 Effective May 2017 High current power inductors Product Specifications 1 2 OCL FLL I 3 I 4 DCR mΩ@ 20 °C rms sat 5 4 Part Number µH ± 15% µH Minimum (A) (A) @25 °C Maximum K-factor HCP0605-R10-R 0.095 0.06 53 20 0.40 120.5 1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.10 V , 0.0 Adc 4 I : Peak current for approximately 30% rolloff at +25 °C. rms sat 2 Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.1 V , I 5 K-factor: Used to determine B for core loss (see graph). B = K L ΔI B : (Gauss), * * rms sat p-p p-p , p-p 3 I : DC current for an approximate ΔT rise of 40 °C without core loss. Derating is rms K: (K-factor from table), L: (inductance in μH), ΔI (peak-to-peak ripple current in amps). necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other 6 Part Number Definition: HCP0605-xxx-R heat generating components will affect the temperature rise. It is recommended the part HCP0605 = Product code and size temperature not exceed +125 °C under worst case operating conditions verified in the end xxx= Inductance value in μH, R = decimal point. application. “-R” suffix = RoHS compliant Dimensions - mm Front View Top View Bottom View Recomm ended Pad Layout Schem atic 1.0 min 1 1 4.73 5.85 6.5 ± 0.22 HCP0605 ± 0.25 xxx wwllyy R 2 1.60 (2x) 2 1.80 5.10 ± 0.25 2.40 (2x) ± 0.20 (2x) Part Marking: HCP0605 xxx = Inductance value . in uH, (R = Decimal point) wwllyy = Date code R = Revision level Packaging information - mm 1.5 dia 1.5 dia 4.0 2.0 1.75 A 7.5 16.0 HCP0605 ± 0.3 6.2 xxx wwllyy R A 5.35 12.0 5.0 Section A-A User direction of feed Supplied in tape-and-reel packaging, 1000 parts per reel, 13” diameter reel. www.eaton.com/electronics 2 HCP0605 High current power Technical Data 4368 Effective May 2017 inductors Temperature rise vs. total loss 80 70 60 50 40 30 20 10 0 0 0.3 0.6 0.9 1.2 1.5 1.8 T otal Loss (W ) Core loss vs Bp-p 1000 1M Hz 500kHz 100 300kHz 200kHz 10 100kHz 1 0.1 0.01 0.001 0.0001 0.00001 10 100 1000 10000 B (G auss) p-p Inductance characteristics % of OCL vs I DC 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 0 5 10 15 20 25 30 35 I (Am ps) DC 3 www.eaton.com/electronics C ore Loss (W ) % of O C L Tem perature Rise (°C) HCP0605 Technical Data 4368 Effective May 2017 High current power inductors Solder Reflow Profile TP Table 1 - Standard SnPb Solder (T ) Table 1 - Standard SnPb Solder (T ) T -5°C c c C t Max. Ramp Up Rate = 3°C/s P Volume Volume Max. Ramp Down Rate = 6°C/s 3 3 Package mm mm _ Thickness <350 >350 T L <2.5mm 235°C 220°C Preheat t A _ >2.5mm 220°C 220°C T smax T Taabbllee 2 2 - - L Leeaadd ((P Pbb)) F Fr reeee S So ollddeer r ((T T )) c c Volume Volume Volume T smin 3 3 3 t s Package mm mm mm Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T ) 100°C 150°C smin T emperature max. (T ) 150°C 200°C smax Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (TL) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. 4368 EE-PCN16018 of their respective owners. May 2017 Temperature