EATON BUSSMANN HCP0805-1R5-R

Effective January 2016 Technical Data 4349 Supersedes November 2008 HCP0805 High current power inductors Applications • Multi-phase regulators • Voltage Regulator Modules (VRMs) • Distributed power systems DC-DC converters • Desktop and server VRMs and EVRDs • Point-of-Load (POL) modules • Field Programmable Gate Array (FPGA) DC-DC converters • Battery power systems • High current power supplies • Data networking and storage systems Product description • High current carrying capacity Environmental data • Magnetically shielded, low EMI • Storage temperature range (Component): -40°C to +125°C • Frequency range up to 2MHz • Operating temperature range: -40°C to +125°C • Inductance range from 0.40uH to 2.2uH (ambient plus self-temperature rise) • Current range from 10 to 32 amps • Solder reflow temperature: J-STD-020D • 7.9 x 7.6 mm footprint surface mount package compliant in a 5.0mm height HALOGEN • Iron powder core material HF Pb • Halogen free, lead free, RoHS compliant FREE HCP0805 Technical Data 4349 Effective January 2016 High current power inductors Product specifications 1 2 3 4 OCL FLL I I DCR (mΩ) rms sat 6 5 Part Number (uH) ±20% (uH) minimum (amps) (amps) ±6.0% @ 20°C K-factor HCP0805-R40-R 0.40 0.26 20 32 3.1 376 HCP0805-R68-R 0.68 0.44 17.5 25 4.5 292 HCP0805-1R0-R 1.0 0.64 14.5 22 5.8 239 HCP0805-1R5-R 1.5 0.96 13.3 18 6.8 202 HCP0805-2R2-R 2.2 1.41 10 14 11.2 175 1. Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.1Vrms, 0.0Adc @ +25°C 5. K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆I, B p-p:(Gauss), 2. Full Load Inductance (FLL) Test Parameters: 100kHz, 0.10Vrms, @ Isat, @ +25°C K: (K factor from table), L: (Inductance in μH), ∆I (Peak to peak ripple current in Amps). 3. I : DC current for an approximate temperature rise of 40°C without core loss. Derating is neces- 6. Part number definition: HCP0805-xxx-R rms sary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat HCP0805 = Product code and size generating components will affect the temperature rise. It is recommended that the temperature XXX = Inductance value in uH, R = decimal point, of the part not exceed 125°C under worst case operating conditions verified in the end application. If no R is present then last character equals number of zeroes 4. I : Peak current for approximately 20% rolloff @ +25°C -R suffix indicates RoHS compliant sat Dimensions (mm) Dimensions Part marking:HCP0805, XXX= Inductance value in uH, R=decimal point, Part Number A (mm) B (mm) If no R is present then last character equals number of zeros HCP0805-R40-R 1.3 ±0.2 1.70 wwllyy = date code, R = revision level HCP0805-R68-R 1.1 ±0.2 1.50 Tolerances are ±0.25 millimeters unless stated otherwise HCP0805-1R0-R 1.1 ±0.2 1.50 PCB tolerances are ±0.1 millimeters unless stated otherwise DCR measured from point “a” to point “b” HCP0805-1R5-R 1.1 ±0.2 1.50 Do not route traces or vias underneath the inductor HCP0805-2R2-R 0.8 ±0.2 1.20 www.eaton.com/elx 2 HCP0805 Technical Data 4349 Effective January 2016 High current power inductors Packaging information (mm) Supplied in tape and reel packaging, 700 parts per 13” diameter reel. Temperature rise vs. total loss 60 50 40 30 20 10 0 00.2 0.40.6 0.81 1.2 Total Loss (W) www.eaton.com/elx 3 Temperature Rise (°C) HCP0805 Technical Data 4349 Effective January 2016 High current power inductors Core loss vs B p-p 100 1MHz 10 500kHz 300kHz 200kHz 1 100kHz 0.1 0.01 0.001 100100010000 B (Gauss) p-p Inductance characteristics % of OCL vs. % of Isat 110% 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 0% 20%40% 60% 80% 100% 120% 140% 160% 180% 200% % of Isat www.eaton.com/elx 4 % of OCL Core Loss (W) HCP0805 Technical Data 4349 Effective January 2016 High current power inductors Solder reflow profile T P Table 1 - Standard SnPb Solder (T ) c TC -5°C tP Volume Volume Max. Ramp Up Rate = 3°C/s Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 TL <2.5mm) 235°C 220°C Preheat t ≥2.5mm 220°C 220°C A T smax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2016 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication 4349 BU-MC16003 All other trademarks are property January 2016 of their respective owners. Temperature