EATON BUSSMANN LDS0705-101M-R
Specifications
Manufacturer
Eaton Bussmann
Manufacturers Part #
LDS0705-101M-R
Sub-Category
Surface Mount Inductors
Factory Pack Quantity
1000
Datasheet
Extracted Text
Effective July 2017 Technical Data 4142 Supersedes March 2007 LDS0705 Shielded metalized drum core power inductors Applications • Buck or Boost Inductor • Noise filtering and output filter chokes • Battery Power, DC-DC converters • Notebook and laptop power • Hand held devices • Media players Environmental data SMD Device • Storage temperature range (component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • 7.8 mm x 7.0 mm x 5.0 mm shielded drum (ambient plus self-temperature rise) core • Solder reflow temperature: • Ferrite core material J-STD-020 (latest revision) compliant • Metalized core mounting utilizes board space HALOGEN • Inductance range from 0.82 µH to 470 µH Pb HF • Current range from 0.368 A to 8.57 A FREE • Frequency range up to 1 MHz LDS0705 Technical Data 4142 Effective July 2017 Shielded metalized drum core power inductors Product specifications Part Number Rated OCL (1) Irms(2) Isat (3) DCR (Ω) K-factor Inductance μH (A) (A) @+20 °C (4) (μH) (Typical) LDS0705-R82M-R 0.82 0.861±20% 7.68 8.57 0.0040 24.8 LDS0705-1R5M-R 1.5 1.42±20% 6.17 6.67 0.0061 19.3 LDS0705-2R2M-R 2.2 2.13±20% 5.06 5.45 0.009 15.8 LDS0705-3R3M-R 3.3 2.97±20% 4.19 4.62 0.013 13.4 LDS0705-4R7M-R 4.7 5.08±20% 3.32 3.53 0.021 10.2 LDS0705-6R8M-R 6.8 6.34±20% 3.11 3.16 0.024 9.2 LDS0705-8R2M-R 8.2 7.75±20% 2.67 2.86 0.033 8.3 LDS0705-100M-R 10.0 9.30±20% 2.54 2.61 0.036 7.6 LDS0705-150M-R 15.0 14.78±20% 2.04 2.07 0.056 6.0 LDS0705-220M-R 22.0 21.53±20% 1.66 1.71 0.084 5.0 LDS0705-330M-R 33.0 32.50±20% 1.48 1.40 0.107 4.0 LDS0705-470M-R 47.0 45.71±20% 1.21 1.18 0.158 3.4 LDS0705-680M-R 68.0 69.76±20% 0.985 0.952 0.240 2.8 LDS0705-820M-R 82.0 83.67±20% 0.850 0.870 0.323 2.5 LDS0705-101M-R 100.0 98.9±20% 0.808 0.800 0.357 2.3 LDS0705-151M-R 150.0 152.0±20% 0.649 0.645 0.554 1.9 LDS0705-221M-R 220.0 216.5±20% 0.584 0.541 0.68 1.6 LDS0705-331M-R 330.0 329.9±20% 0.470 0.438 1.06 1.3 LDS0705-471M-R 470.0 467.0±20% 0.387 0.368 1.56 1.1 (1) Open Circuit Inductance Test Parameters: 100 kHz, 0.1 V, 0.0 Adc. (4) K-factor: Used to determine B p-p for core loss (see graph). (2) Irms: DC current for an approximate ΔT of 30 °C without core loss. Derating is B p-p = K*L*ΔI, B p-p(mT), K: (K factor from table), L: (Inductance in μH), necessary for AC currents. PCB layout, trace thickness and width, air-flow, and Δ(Peak to peak ripple current in Amps). proximity of other heat generating components will affect the temperature rise. It (5) Part Number Definition: LDS0705-xxx-R is recommended that the temperature of the part not exceed +125 °C under LDS0705 = Product code and size; -xxx = Inductance value in uH; worst case operating conditions verified in the end application. R = decimal point; If no R is present, last character equals number of zeros. (3) Isat Amperes peak for approximately 15% rolloff (@+25 °C) M = Inductance tolerance +/- 20% -R suffix = RoHS compliant Dimensions- mm SCHEMATIC SIDE VIEW RECOMMENDED PCB LAYOUT BOTTOM VIEW TOP VIEW 2.0 1 2.0 Typ. XXX 7.0 5.0 Max. 7.0±0.2 wwllyy R 2 3.0 7.8±0.2 Marking: xxx = Inductance in uH. R = decimal point. If no R is present last character equals number of zeros. wwllyy = Date code, R = Revision level. Do not route traces or vias underneath the inductor Packaging information- mm Parts packaged on 13" Diameter reel, 1,000 parts per reel. www.eaton.com/electronics 2 LDS0705 Technical Data 4142 Effective July 2017 Shielded metalized drum core power inductors Temperature rise vs. total loss 90 80 70 60 50 40 30 20 10 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 Tot al Loss (W) Core loss vs Bp-p 100 1 MHz 10 500 kHz 300 kHz 200 kHz 1 100 kHz 50 kHz 0.1 0.01 0.001 0.0001 1 10 100 1000 Bp-p (mT) Inductance characteristics OCL vs. Isat 120% 110% 100% 90% 80% -40 70% 60% 25 50% 40% 85 30% 20% 10% 0% 0% 20% 40% 60% 80% 100% 120% 140% 160% 180% 200% % of Isat 3 www.eaton.com/electronics Core Loss (W) % of OCL Temperature Rise (°C) LDS0705 Technical Data 4142 Shielded metalized drum core power inductors Effective July 2017 Solder Reflow Profile TP Table 1 - Standard SnPb Solder (T ) Table 1 - Standard SnPb Solder (T ) T -5°C c c C t Max. Ramp Up Rate = 3°C/s P Volume Volume Max. Ramp Down Rate = 6°C/s 3 3 Package mm mm _ Thickness <350 >350 T L <2.5mm 235°C 220°C Preheat t A _ >2.5mm 220°C 220°C T smax T Taabbllee 2 2 - - L Leeaadd ((P Pbb)) F Fr reeee S So ollddeer r ((T T )) c c Volume Volume Volume T smin 3 3 3 t s Package mm mm mm Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T ) 100°C 150°C smin T emperature max. (T ) 150°C 200°C smax Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (TL) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. 4142 of their respective owners. July 2017 Temperature
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