EATON BUSSMANN MP2A-101-R

Effective July 2017 Technical Data 4112 Supersedes March 2007 MP2A MICRO-PAC PLUS™ Low profile toroid power inductors Applications • Mobile phones • Tablets and e-readers • GPS systems • Battery power devices • Notebook and laptop power • Hand held devices • Media players Environmental data SMD Device • Storage temperature range (component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • High performance, low profile, surface (ambient plus self-temperature rise) mount power inductors • Solder reflow temperature: • Small footprint and closed magnetic field J-STD-020 (latest revision) compliant construction ensure low EMI • Low DCR and high efficiency Pb • Frequency range up to 500 kHz • Molybdenum permalloy (MPP) core material MP2A Technical Data 4112 MICRO-PAC PLUS™ Low profile toroid power inductors Effective July 2017 Product specifications (1) (2) (3) (4) (5) Part Inductance OCL DCR I RMS I SAT Volt Number µH µH±20% typ. (A) (A) µsec (rated) Ω MP2A-R47-R 0.47 0.47 0.024 3.52 5.80 1.20 MP2A-R68-R 0.68 0.68 0.027 3.31 4.83 1.27 MP2A-1R0-R 1.00 1.21 0.067 2.11 3.63 2.00 MP2A-1R5-R 1.50 1.54 0.073 2.02 3.22 2.09 MP2A-2R2-R 2.20 2.30 0.086 1.87 2.64 2.26 MP2A-3R3-R 3.30 3.21 0.098 1.75 2.23 2.42 MP2A-4R7-R 4.70 4.86 0.117 1.60 1.81 2.64 MP2A-6R8-R 6.80 6.85 0.136 1.49 1.53 2.84 MP2A-8R2-R 8.20 8.54 0.167 1.34 1.54 3.15 MP2A-100-R 10.00 10.02 0.179 1.29 1.42 3.26 MP2A-150-R 15.00 15.18 0.217 1.18 1.16 3.59 MP2A-220-R 22.00 21.40 0.311 0.98 0.97 4.30 MP2A-330-R 33.00 32.74 0.476 0.79 0.79 5.32 MP2A-470-R 47.00 46.48 0.727 0.64 0.66 6.57 MP2A-680-R 68.00 68.53 1.108 0.52 0.54 8.11 MP2A-820-R 82.00 81.15 1.463 0.45 0.50 9.32 MP2A-101-R 100.00 99.65 2.015 0.39 0.45 10.94 Notes: (1) Open Circuit Inductance Test Parameters: 100 kHz, .25 Vrms, 0.0 Adc. (4) Peak current for approximately 30% rolloff at +20 °C. (5) Applied Volt-Time product (V-µs) across the inductor. This value (2) DCR limits +20 °C. (3) RMS current for an approximate ΔT of 40 °C without core loss. It is represents the applied V-µs at 300 kHz necessary to generate a core loss equal to 10% of the total losses for 40 °C temperature rise. recommended that the temperature of the part not exceed +125 °C. Dimensions- mm TOP VIEW 1 PCB PAD LAYOUT SIDE VIEW SCHEMATIC 1.05 1 5.2 7.5 YWW MAX 5.40 7.50 5.88 MAX 1.8 XXX MAX 2 2.00 2 yww = Date Code xxx = Inductance value per family chart Do not route traces or vias underneath the inductor Packaging information- mm Parts packaged on 13" Diameter reel, 3,900 parts per reel. ACTUAL SIZE MICRO-PAC PLUS Ao=5.6mm A1=2.3mm Bo=8.5mm B1=6.3mm Ko=2.1mm www.eaton.com/electronics 2 MP2A Technical Data 4112 Effective July 2017 MICRO-PAC PLUS™ Low profile toroid power inductors Core loss IRMS DERATING WITH CORE LOSS 0 20 40 50 60 70 80 90 92 94 95 96 97 98 99 10 20 30 40 50 60 80 100 200 300 400 500 600 800 1000 % of Applied Volt-µ-seconds Inductance characteristics OCL vs. Isat 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 120% 130% 140% 150% 160% % of I sat 3 www.eaton.com/electronics 100KHz 500K Hz 400KHz 300KHz 200KHz % of Losses from Irms (maximum) % of OCL MP2A Technical Data 4112 MICRO-PAC PLUS™ Low profile toroid power inductors Effective July 2017 Solder Reflow Profile TP Table 1 - Standard SnPb Solder (T ) Table 1 - Standard SnPb Solder (T ) T -5°C c c C t Max. Ramp Up Rate = 3°C/s P Volume Volume Max. Ramp Down Rate = 6°C/s 3 3 Package mm mm _ Thickness <350 >350 T L <2.5mm 235°C 220°C Preheat t A _ >2.5mm 220°C 220°C T smax T Taabbllee 2 2 - - L Leeaadd ((P Pbb)) F Fr reeee S So ollddeer r ((T T )) c c Volume Volume Volume T smin 3 3 3 t s Package mm mm mm Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T ) 100°C 150°C smin T emperature max. (T ) 150°C 200°C smax Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (TL) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. 4112 of their respective owners. July 2017 Temperature