EATON BUSSMANN SD3114-331-R

Effective August 2017 Technical Data 4128 Supersedes March 2007 SD3114 Low profile metalized shielded drum core power inductors Applications • Mobile phones, • Digital cameras • Media players • Small LCD displays • LED driver and LED flash circuits • Hard disk drives • LCD Backlighting Environmental data SMD Device • Storage temperature range (component): -40 °C to +125 °C Product features • Operating temperature range: -40 °C to +125 °C • 3.1 mm x 3.1 mm x 1.4 mm shielded drum core (ambient plus self-temperature rise) • Ferrite core material • Solder reflow temperature: • Inductance range from 1.0 uH to 330 uH J-STD-020 (latest revision) compliant • Current range from 2.59 A to 0.106 A HALOGEN • Frequency range up to 4 MHz Pb HF FREE SD3114 Technical Data 4128 Effective August 2017 Low profile metalized shielded drum core power inductors Product specifications Part Number Rated OCL (1) Part Irms (2) Isat (3) DCR (Ω) K-factor Inductance (μH) Marking (A) (A) typ. @ (4) (μH) Designator +20 °C SD3114-1R0-R 1.0 1.16+/-30% A 1.60 2.35 0.058 98 SD3114-1R5-R 1.5 1.44+/-30% B 1.39 2.11 0.077 79 SD3114-2R2-R 2.2 2.12+/-30% C 1.17 1.74 0.110 67 SD3114-3R3-R 3.3 3.36+/-30% D 0.95 1.38 0.167 54 SD3114-4R7-R 4.7 4.90+/-30% E 0.77 1.14 0.251 45 SD3114-6R8-R 6.8 6.72+/-30% F 0.71 0.98 0.296 37 SD3114-8R2-R 8.2 8.10+/-30% G 0.68 0.89 0.329 34 SD3114-100-R 10.0 10.4+/-30% H 0.57 0.78 0.458 30 SD3114-150-R 15.0 14.9+/-20% I 0.48 0.66 0.650 25 SD3114-220-R 22.0 22.5+/-20% J 0.43 0.53 0.821 21 SD3114-330-R 33.0 33.1+/-20% K 0.35 0.44 1.23 17 SD3114-470-R 47.0 47.5+/-20% L 0.280 0.37 1.86 14 SD3114-680-R 68.0 68.6+/-20% M 0.239 0.305 2.62 12 SD3114-820-R 82.0 81.8+/-20% N 0.227 0.280 2.91 11 SD3114-101-R 100.0 101.1+/-20% O 0.213 0.252 3.30 10 SD3114-151-R 150.0 149.0+/-20% P 0.172 0.207 5.07 8 SD3114-221-R 220.0 220.9+/-20% Q 0.140 0.170 7.67 6 SD3114-331-R 330.0 329.5+/-20% R 0.113 0.139 11.78 5 (1) Open Circuit Inductance Test Parameters: 100 kHz, 0.1V rms , 0.0 Adc. (3) Isat Amperes peak for approximately 30% rolloff (@ +20 °C) (2) Irms: DC current for an approximate DT of 40 °C without core loss. Derating is (4) K-factor: Used to determine B p-p for core loss (see graph). necessary for AC currents. PCB layout, trace thickness and width, air-flow, and B p-p = K*L*ΔI, B p-p(mT), K: (K factor from table), L: (Inductance in uH), proximity of other heat generating components will affect the temperature rise. It Δ(Peak to peak ripple current in Amps). is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. Dimensions- mm BOTTOM VIEW RECOMMENDED PCB LAYOUT TOP VIEW 2.40 Pin #1 indicator 3.1 max. 1.40 Marking 3.7 max 0.70 XXX 3.1 max. 1.2 typical SCHEMATI C 1 SIDE VIEW 1.4 max 2 Part Marking: 3 Digit Marking: (1st digit: Indicates inductance value per letter in Part Marking Designator); (2nd digit: Bi-weekly production date code); (3rd digit: Last digit of the year produced). Do not route traces or vias underneath the inductor Packaging information- mm Parts packaged on 13" Diameter reel, 1.2 Dia 4,100 parts per reel. 1.5 Dia. min. +0.1/-0.0 2.00 ¡À 1.75 A Bo 1 B1 12.0 10.25 +/-0.3 5.50 2 3.2 3.2 A1 A Ao 8.0 Ao = 3.9 mm A1 = 0.93 mm Bo = 3.60 mm B1 = 1.25 mm Direction of feed Ko = 1.60 mm www.eaton.com/electronics 2 SD3114 Technical Data 4128 Effective August 2017 Low profile metalized shielded drum core power inductors Temperature rise vs total loss loss 90 80 70 60 50 40 30 20 10 0 0 0. 05 0. 1 0. 15 0. 2 0. 25 0. 3 0. 35 0. 4 0. 45 Total Loss (W) Core loss vs Bp-p 10 1MHz 1 500kHz 300kHz 0.1 200kHz 100kHz 50kHz 0.01 0.001 0.0001 0.00001 0.000001 1 10 100 1000 B p -p (mT) Inductance characteristics OCL vs. Isat 120% 110% 100% 90% 80% 70% -40°C 60% 50% 25°C 40% 30% 85°C 20% 10% 0% 0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% 120% 130% 3 www.eaton.com/electronics Temp. Rise (° C) Core Loss(W) % of L initial SD3114 Technical Data 4128 Low profile metalized shielded drum core power inductors Effective August 2017 Solder Reflow Profile TP Table 1 - Standard SnPb Solder (T ) Table 1 - Standard SnPb Solder (T ) T -5°C c c C t Max. Ramp Up Rate = 3°C/s P Volume Volume Max. Ramp Down Rate = 6°C/s 3 3 Package mm mm _ Thickness <350 >350 T L <2.5mm 235°C 220°C Preheat t A _ >2.5mm 220°C 220°C T smax T Taabbllee 2 2 - - L Leeaadd ((P Pbb)) F Fr reeee S So ollddeer r ((T T )) c c Volume Volume Volume T smin 3 3 3 t s Package mm mm mm Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T ) 100°C 150°C smin T emperature max. (T ) 150°C 200°C smax Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (TL) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. 4128 of their respective owners. August 2017 Temperature