EATON BUSSMANN SD52-101-R
Specifications
Manufacturer
Eaton Bussmann
Manufacturers Part #
SD52-101-R
Industry Aliases
SD52-101-R
Sub-Category
Surface Mount Inductors
Factory Pack Quantity
3500
Datasheet
Extracted Text
Effective November 2015 Technical Data 4311 Supersedes March 2007 SD52 High power density, low profile shielded power inductors Applications • Desktop computers • Notebook and laptop regulators • Graphics cards • Digital cameras, media devices Environmental Data • Storage temperature range: -40 °C to +125 °C • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise). • Solder reflow temperature: J-STD-020D compliant Product description HALOGEN • Octagonal shape shielded drum core HF Pb FREE • Inductance range from 1.2 uH to 150 uH • Current range from 0.28 A to 3.14 A • 5.6 mm x 5.2 mm footprint surface mount package in a 2.0 mm height • Ferrite core material • Halogen free, lead free, RoHS compliant SD52 Technical Data 4311 Effective November 2015 High power density, low profile shielded power inductors Product Specifications 2 3 4 I I DCR (Ω) rms sat 6 1 Part Number OCL (μH) ±20% Part marking (A) (A) typ. (V us) typ. SD52-1R2-R 1.20 A 2.33 3.14 0.0279 1.49 SD52-2R2-R 2.20 B 1.98 2.30 0.0385 2.03 SD52-3R5-R 3.50 C 1.73 1.82 0.0503 2.57 SD52-4R7-R 4.70 D 1.63 1.64 0.0568 2.84 SD52-6R8-R 6.80 E 1.39 1.28 0.0777 3.65 SD52-100-R 10.0 F 1.11 1.11 0.1215 4.19 SD52-150-R 15.0 G 0.97 0.88 0.1618 5.27 SD52-220-R 22.0 H 0.86 0.73 0.2042 6.35 SD52-270-R 27.0 J 0.73 0.65 0.2864 7.16 SD52-330-R 33.0 K 0.70 0.61 0.3074 7.70 SD52-470-R 47.0 L 0.58 0.50 0.4465 9.32 SD52-680-R 68.0 M 0.47 0.42 0.6829 11.21 SD52-101-R 100 N 0.39 0.35 1.0000 13.37 SD52-151-R 150 O 0.31 0.28 1.6100 17.00 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc. 4. DCR limits @ 20°C. 2. Irms: DC current for an approximate ∆T of 40 °C without core loss. De-rating is necessary for AC currents. 5. Applied Volt-Time product (V-us) across the inductor at 100 kHz necessary to generate a core loss equal to 10% of Temperature rise is dependent upon several factors, including the PCB pad layout, trace thickness and width, air-flow the total losses for 40 °C temperature rise. and proximity to other heat generating components. It is recommended the part temperature not exceed 125 °C under 6. Part number definition: SD52-xxx-R worst case operating conditions and therefore, the temperature rise should be verified in the end use application. SD52= Product code and size 3. Isat: Peak current for approximately 30% rolloff at +20 °C. -xxx=Inductance value in µH, R= decimal point - If no R is present, then last character equals the number of zeros Dimensions (mm) 1 RECOMMENDED PCB LAYOUT SCHEMATIC 5.2 max Pin #1 indicator 5.6 ma m x 1.3 1 2 plcs Part marking xxxx 2.0 52 0.65 2 plcs ±0.10 2 2 6.0 5.2 max m 2.0 max m Part Marking: 1st digit= the inductance value per part marking designator, 2nd digit = bi-weekly production date code, 3rd digit = last digit of the year produced, 4th digit= internal manufacturing code. 52 = the product size code. Do not route traces or vias underneath the inductor. Packaging information (mm) Parts packaged on 13” Diameter reel, 3,500 parts per reel. 4.00 1.5 Dia 1.5 Dia. min. +0.1/-0.0 2.00 ± 0.05 1.75 A 12.0 10. 0 2 3.0 Bo B +/-0.3 0 5.50 Ao=5.72mm Bo=5.72mm Ko A Ao A Ko=2.30mm 8. 8 0 0 SECTION A-A Direction of feed www.eaton.com/elx 2 SD52 Technical Data 4311 Effective November 2015 High power density, low profile shielded power inductors DC current vs.temperature SD52-101 SD52-1R2 100.0 100.0 90.0 90.0 80.0 80.0 70.0 70.0 60.0 60.0 50.0 50.0 40.0 40.0 30.0 30.0 20.0 20.0 10.0 10.0 0.0 0.0 0.0 0.51.0 1.52.0 2.53.0 3.54.0 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 I (A) I (A) DC DC Inductance characteristics OCL vs Isat SD52 100 90 80 70 60 50 40 30 20 10 0 0102030405060708090100 110120 130140 %ofIsat Core loss Irms DERATING WITH CORE LOSS % of applied V us www.eaton.com/elx 3 TemperatureRise(Deg. C) OCL (%) %ofLossesfromIrms (maximum) Temperature Rise (Deg.C) SD52 Technical Data 4311 Effective November 2015 High power density, low profile shielded power inductors Solder reflow profile TP Table 1 - Standard SnPb Solder (T ) c T -5°C C t P Volume Volume Max. Ramp Up Rate = 3°C/s Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 T <2.5mm) 235°C 220°C L Preheat t ≥2.5mm 220°C 220°C A Tsmax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 T Package mm mm mm smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Eaton is a registered trademark. Printed in USA Publication No. 4311 All other trademarks are property November 2015 of their respective owners. Temperature
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