EATON BUSSMANN TR-CC12H2A

Effective November 2017 Technical Data 4309 Supersedes April 2016 CC12H High I²t Chip fuses HALOGEN Applications HF Pb Secondary circuit protection FREE • Laptop, notebook, netbook • Tablets, e-readers • Flat panel displays • High definition television (HDTV) • LCD/LED backlighting • Computers and peripherals • Gaming console systems • Handheld/portable equipment • Mobile device chargers Automotive • Central body control module • Heating ventilation and air conditioning Product features controllers (HVAC) • High I²t • Doors, window lift and seat control • High inrush withstand capability • Digital instrument cluster • AEC-Q200 qualified: (750 mA to 30 A) • In-vehicle infotainment (IVI) and navigation • Excellent temperature and cycling • Electric pumps, motor control and auxiliaries characteristics • Powertrain control module (PCU)/Engine • 1206 (3216 metric) compact design Control unit (ECU) utilizes less board space • Transmission Control Unit (TCU) • Compatible with solder reflow and wave solder Agency information • cURus Recognition: File E19180, Guide JDYX2/JDYX8 • AEC-Q200 qualified (750 mA to 30 A) Ordering • Use ordering number (see page 6 for details) Packaging suffixes • -TR (3000 parts per 7” diameter reel, tape width 8 mm) CC12H Technical Data 4309 Effective November 2017 High I²t Chip fuses Electrical characteristics Amp Rating % of Amp Rating Opening Time 250 mA – 30 A 100% 4 hours minimum 1 A – 3 A 200% 1.0 s – 60 s 25 A – 30 A 200% 120 s max 1 A – 5 A 250% 5.0 s max 1 A – 5 A 300% 0.1 s – 3.0 s 350% 5 s max 250 mA – 750 mA 6 A – 20 A 350% 5 s max 250 mA – 500 mA 1000% 0.01 ms – 1.0 ms 750 mA – 30 A 1000% 0.2 ms – 20 ms Product specifications Interrupting Voltage rating rating¹ Typical DC cold Typical pre-arcing³ Current rating Typical voltage Part 2 Part Number (A) (V ) (A) resistance² (mΩ) I²t (A s) drop (mV) marking DC CC12H250mA 0.25 63 50 3500 0.00038 1400 .25 CC12H375mA 0.375 63 50 1750 0.00077 730 A CC12H500mA 0.5 63 50 980 0.0019 700 .5 CC12H750mA 0.75 63 50 800 0.15 700 E CC12H1A 1 63 50 470 0.18 490 H CC12H1.5A 1.5 63 50 218 0.4 355 K CC12H2A 2 63 50 133 1.1 305 N CC12H2.5A 2.5 63 50 79 1.7 240 O CC12H3A 3 63 50 49 2.2 185 P CC12H3.5A 3.5 63 50 37 2.7 180 R CC12H4A 4 63 50 33 3.2 169 S CC12H4.5A 4.5 32 100 28 4.2 160 X CC12H5A 5 32 100 23 6 140 T CC12H6A 6 32 100 15.5 12 150 F CC12H7A 7 32 100 11.5 18 130 J CC12H8A 8 32 100 7.3 18 110 V CC12H10A 10 32 100 6.5 30 90 U CC12H12A 12 32 100 4.7 45 90 W CC12H15A 15 32 100 3 33 90 Y CC12H20A 20 32 100 2 80 90 Q CC12H25A 25 32 200 3 60 90 L CC12H30A 30 32 200 2.1 100 90 Z 1. DC interrupting rating measured at rated voltage, time constant of less than 50 microseconds, battery source. 2. Typical DC cold resistance measured at <10% of rated current. 3. Typical pre-arcing I²t value is measured at 10In rated current. www.eaton.com/electronics 2 CC12H Technical Data 4309 Effective November 2017 High I²t Chip fuses Dimensions–mm Packaging information- mm Supplied in tape and reel packaging, 3000 parts per 7” diameter reel. www.eaton.com/electronics 3 CC12H Technical Data 4309 Effective November 2017 High I²t Chip fuses 2 I t vs. time curve CC12H Time (s) www.eaton.com/electronics 4 2 2 I t (A s) CC12H Technical Data 4309 Effective November 2017 High I²t Chip fuses Time vs. current curve www.eaton.com/electronics 5 Time (s) CC12H Technical Data 4309 Effective November 2017 High I²t Chip fuses Temperature derating curve Environmental data Operating temperature: -55 °C to +125 °C (with derating); (20 A- 30 A) -40 °C to +85 °C (with derating) Thermal shock: MIL- STD- 202G, Method 107, (300 cycles -55 °C to +125 °C) Vibration: MIL-STD- 202G, Method 204, (20 g's for 20 minutes, 12 cycles in each of 3 orientations, 10- 2000 Hz) Humidity: MIL- STD- 202G, Method 103, (+85 °C, 85% relative humidty, 1000 hours 10% of operating power Mechanical shock: MIL-STD- 202G, Method 213, Condition C Ordering codes The ordering code is the part number replacing the “ .” with a “-” plus adding the packaging suffix. Packaging suffix • -TR (3000 parts on a 7” reel, tape width 8 mm). Ordering code Ordering code Part Number -TR option Part Number -TR option CC12H250mA CC12H250mA-TR CC12H4A CC12H4A-TR CC12H375mA CC12H375mA-TR CC12H4.5A CC12H4-5A-TR CC12H500mA CC12H500mA-TR CC12H5A CC12H5A-TR CC12H750mA-TR CC12H6A CC12H6A-TR CC12H750mA CC12H1A CC12H1A-TR CC12H7A CC12H7A-TR CC12H1-5A-TR CC12H8A CC12H8A-TR CC12H1.5A CC12H2A CC12H2A-TR CC12H10A CC12H10A-TR CC12H2.5A CC12H2-5A-TR CC12H12A CC12H12A-TR CC12H3A CC12H3A-TR CC12H15A CC12H15A-TR CC12H3.5A CC12H3-5A-TR CC12H20A CC12H20A-TR CC12H25A CC12H25A-TR CC12H30A CC12H30A-TR www.eaton.com/electronics 6 CC12H Technical Data 4309 Effective November 2017 High I²t Chip fuses Wave solder profile t p T p First Wave Second Wave T smax T styp T smin Preheat area Cool down area Time Reference EN 61760-1:2006 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat • Temperature min. (T ) 100°C 100°C smin • Temperature typ. (T ) 120°C 120°C styp • Temperature max. (T ) 130°C 130°C smax • Time (T to T ) (t ) 70 seconds 70 seconds smin smax s 150°C max. 150°C max. D preheat to max Temperature Peak temperature (T )* 235°C – 260°C 250°C – 260°C P Time at peak temperature (t ) 10 seconds max 10 seconds max p 5 seconds max each wave 5 seconds max each wave Ramp-down rate ~ 2 K/s min ~ 2 K/s min ~3.5 K/s typ ~3.5 K/s typ ~5 K/s max ~5 K/s max Time 25°C to 25°C 4 minutes 4 minutes Manual solder 350°C, 4-5 seconds. (by soldering iron), generally manual, hand soldering is not recommended. www.eaton.com/electronics 7 Temperature CC12H Technical Data 4309 Effective November 2017 High I²t Chip fuses Solder reflow profile TP Table 1 - Standard SnPb Solder (T ) c T -5°C C t Volume Volume P Max. Ramp Up Rate = 3°C/s Package mm3 mm3 Max. Ramp Down Rate = 6°C/s Thickness <350 ≥350 <2.5mm) 235°C 220°C T L Preheat t ≥2.5mm 220°C 220°C A Tsmax Table 2 - Lead (Pb) Free Solder (T ) c Volume Volume Volume 3 3 3 Package mm mm mm T smin Thickness <350 350 - 2000 >2000 t s <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C 25°C Time 25°C to Peak Time Reference JDEC J-STD-020 Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (T ) 100°C 150°C smin • Temperature max. (T ) 150°C 200°C smax • Time (T to T ) (t ) 60-120 Seconds 60-120 Seconds smin smax s Average ramp up rate T to T 3°C/ Second Max. 3°C/ Second Max. smax p Liquidous temperature (Tl) 183°C 217°C Time at liquidous (t ) 60-150 Seconds 60-150 Seconds L Peak package body temperature (T )* Table 1 Table 2 P Time (t )** within 5 °C of the specified classification temperature (T ) 20 Seconds** 30 Seconds** p c Average ramp-down rate (T to T ) 6°C/ Second Max. 6°C/ Second Max. p smax Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T ) is defined as a supplier minimum and a user maximum. p ** Tolerance for time at peak profile temperature (t ) is defined as a supplier minimum and a user maximum. p Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division 1000 Eaton Boulevard Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton Eaton is a registered trademark. All Rights Reserved Printed in USA All other trademarks are property Publication No. 4309 BU-MC16040 of their respective owners. November 2017 Temperature