® MicroSpeed Power Modules www.erni.com Katalog D 074518 Catalog E 074587 Ausgabe 3, 03/05 09/08 www.erni.com Edition 1 1 www.erni.com Catalog E 074587 09/08 Edition 1 ® MicroSpeed Power Modules Table of Contents General .............................................................................................. 2 Mating Conditions ...................................................................................... 3 Board-to-Board Height Configurations ...................................................................... 4 Electrical and Mechanical Characteristics .................................................................... 5 Packaging ............................................................................................ 7 Male Connectors....................................................................................... 8 Female Connectors .................................................................................... 12 Part Number Index .................................................................................... 16 Catalog E 074587 09/08 Catalog E 074587 09/08 Edition 1 Edition 1 www.erni.com www.erni.com 1 1 ® MicroSpeed Power Modules General This complementary range of Power Module connectors, with 2.0 mm The contacts are post plated, leaving no bare edges in the contact contact pitch, fulfils the need for miniaturized and high reliability power and solder areas. The connectors are equipped with polarized posi- systems, and offers a large number of options for mezzanine applica- tioning pegs, and the connector plating is lead free, complying with tions. One of its unique features is its high current-carrying capacity the European RoHS directive. in comparison to its small size. Therefore, the system is ideally suited for use with small, high performance devices such as CPUs, drives, LCD panels, etc. Providing a variety of height versions of the male and female connectors, the Power Module series enables stacking heights from 5 mm to 20 mm. Subsequently, almost every need for different PCB arrangements can be addressed. Another major advantage is the multiple-connector mating capability, which allows the mating of more than one connector pair at the same time. The SMT connectors meet all the needs of fast automatic assembly machines. They are manufactured and 100% inline quality checked by machine to ensure high coplanarity and optimized soldering. The layout is designed with an optimal solder pad size to guarantee high retention forces. The integrated 3-point double beam female contact ensures durable low-contact resistance over the whole lifecycle. 2 2 Catalog E 074587 Catalog E 074587 09/08 09/08 Edition 1 Edition 1 www.erni.com www.erni.com ® MicroSpeed Power Modules Mating Conditions Allowed misalignment tolerances longitudinal and transverse axes ±0.7 mm 0,7 0,7 Allowed angular inclination tolerances longitudinal: ±4°; transverse: ±2° Wipe length 1.5 mm / Board-to-Board distance 5-20 mm (including wipe length up to 21.5 mm) All dimensions in mm. Catalog E 074587 09/08 Catalog E 074587 09/08 Edition 1 Edition 1 www.erni.com www.erni.com 3 3 2° 5,0 - 20,0 1,5 4° ® MicroSpeed Power Modules Board-to-Board Height Configurations Male Female Part Number Part Number Part Number Part Number Boart-to-Board Height Height SMD THR SMD THR Height 1 mm 214357 214916 4 mm 214356 214912 5 mm 2 mm 214550 214917 4 mm 214356 214912 6 mm 1 mm 214357 214916 6 mm 214547 214913 7 mm 2 mm 214550 214917 6 mm 214547 214913 8 mm 1 mm 214357 214916 8 mm 214548 214914 9 mm 2 mm 214550 214917 8 mm 214548 214914 10 mm 1 mm 214357 214916 10 mm 214549 214915 11 mm 2 mm 214550 214917 10 mm 214549 214915 12 mm 9 mm 214551 214918 4 mm 214356 214912 13 mm 10 mm 214552 214919 4 mm 214356 214912 14 mm 9 mm 214551 214918 6 mm 214547 214913 15 mm 10 mm 214552 214919 6 mm 214547 214913 16 mm 9 mm 214551 214918 8 mm 214548 214914 17 mm 10 mm 214552 214919 8 mm 214548 214914 18 mm 9 mm 214551 214918 10 mm 214549 214915 19 mm 10 mm 214552 214919 10 mm 214549 214915 20 mm 4 Catalog E 074587 09/08 Edition 1 www.erni.com ® MicroSpeed Power Modules Electrical and Mechanical Characteristics Standard Male Connectors Female Connectors Number of Pins 5 5 Technical data Climate category DIN EN 60068-1 -55/125/56 -55/125/56 test b Temperature range -55/125 °C -55/125 °C Current rating 20 °C 70 °C 100 °C per contact 6.6 A 5.0 A 3.4 A shields parallel 10.0 A 7.2 A 4.8 A Air – and creepage distance contact - contact 1.5 mm contact - contact 1.5 mm contact - ground 0.9 mm contact - ground 0.9 mm Voltage rating IEC60664 The permissible operating voltages depend on the customer application and on the applicable or specified safety require- ments. Insulation coordination according to IEC 60664-1 has to be regarded for the complete electrical device. Therefore, the maximum creepage and clearance distances of the mated connectors are specified for consideration as a part of the whole current path. In practice, reductions in creepage or clearance distances may occur due to the conductive pattern of the printed board or the wiring used, and have to be taken into account separately. As a result the creepage and clearance distances for the application may be reduced compared to those of the connector. Dielectric strength IEC 60512 contact - contact 750 Vrms contact - contact 750 Vrms test 4a contact - shield 750 Vrms contact - shield 750 Vrms Contact resistance IEC 60512 ≤ 4 mΩ ≤ 4 mΩ test 2a 4 4 Insulation resistance IEC 60512 ≥ 10 MΩ ≥ 10 MΩ test 3a Vibration, sine IEC 60512 10 - 2000 Hz 10 - 2000 Hz test 6d 20 g 20 g Contact disturbance IEC 60512 ≤ 1 µs ≤ 1 µs (while vibration test) test 2e 50 g Shock, halfsine IEC 60512 50 g 11 ms test 6c 11 ms Contact disturbance IEC 60512 ≤ 1µs ≤ 1µs (while shock test) test 2e IEC 60512 Mechanical operation ≥ 500 mating cycles ≥ 500 mating cycles test 9a (mating cycles) Insertion and withdrawal IEC 60512 ≤ 20 N ≤ 20 N force test 13b Gauge retention force IEC 60512 ≥ 0.5 N ≥ 0.5 N test 16e Catalog E 074587 09/08 Edition 1 www.erni.com 5 ® MicroSpeed Power Modules Electrical and Mechanical Characteristics Standard Male Connectors Female Connectors Number of Pins 5 5 Process-conditions Soldering temperature max. IEC 68-2-20 Hand soldering 3.5 s at 350 °C 3.5 s at 350 °C temperature max. Dip soldering 10 s at 260 °C 10 s at 260 °C temperature max. Reflow soldering JEDEC 20 - 40 s at 260 °C 20 - 40 s at 260 °C temperature max. J-STD-020C < 0.1 mm Coplanarity < 0.1 mm Housing Materials Plastic material LCP LCP CTI value IEC 60112 175 175 UL flame rating UL 94 V-0 UL 94 V-0 UL file E83005 E83005 Contact Materials Base material Cu alloy Cu alloy Mating area gold plating gold plating Termination area Sn Sn Environment compatibility Recycling no flame-retardent additives, no toxic additives allows easy recycling 6 Catalog E 074587 09/08 Edition 1 www.erni.com ® MicroSpeed Power Modules Packaging Verpackt in Gurtverpackung - Tape on Reel Packaging Male Connectors Verpackungseinheit: 420 Stück - Packaging unit: 420 pcs Abspulrichtung - Reel off Direction 4 16 a1 100 32,5 330 Verpackt in Gurtverpackung - Tape on Reel Packaging Female Connectors Verpackungseinheit: 420 Stück - Packaging unit: 420 pcs Abspulrichtung - Reel off Direction 4 16 a1 100 32,5 330 All dimensions in mm. Catalog E 074587 09/08 Edition 1 www.erni.com 7 32 32 32 ® MicroSpeed Power Modules Male Connectors • Current carrying capacity up to 10 A for both shields • Current up to 6.6 A (20°) per pin • Partial contact loading is possible • Board-to-Board heights 5-20 mm • Shield contacts available as SMT or THR version Dimensional Drawing Connectors with SMT Ground Pins 12,15 5,85 8,95 4,6 Ansaughaube hood 0,5 0,6 0,8 11 6,95 4,80 6,30 1 mm 7,95 5,80 7,30 2 mm 14,95 12,80 14,30 9 mm 15,95 13,80 15,30 10 mm ohne Angsaughaube Steckhöhe 12,15 without hood AB C Stacking Height 2 a5 a1 4 x 2 = 8 Leiterplatten-Layout / PCB-Layout 11 0,85 3 x 3 = 9 3 0,8 0,9 0,7 0,8 0,85 2 1,5 4 x 2 = 8 All dimensions in mm. 8 Catalog E 074587 09/08 Edition 1 www.erni.com 2,6 A 0,65 0,75 B 0,65 4,45 1,5 C ® MicroSpeed Power Modules Male Connectors Dimensional Drawing Connectors with THR Ground Pins 12,15 5,85 8,95 Angsaughaube 4,6 hood 6,60 5,40 3,80 4 mm 8,60 7,40 5,80 6 mm 10,609,40 7,80 8 mm 12,6011,40 9,80 10 mm Steckhöhe AB C Stacking Height 0,15 0,5 0,6 0,8 11 ohne Angsaughaube 12,15 without hood 2 a5 a1 4 x 2 = 8 Leiterplatten-Layout / PCB-Layout 11 1 3 x 3 = 9 3 0,6 ±0,05 0,9 0,7 0,8 1 2 0,275 1,5 4 x 2 = 8 All dimensions in mm. Catalog E 074587 09/08 Edition 1 www.erni.com 9 4,25 2,6 A 0,75 0,65 B 1,375 4,5 1,5 1,2 C ® MicroSpeed Power Modules Male Connectors Ordering Information Number Termination Unmated Stacking Packaging Part Number of Pins Height 5 SMT 1 mm Tape&Reel/420 pcs 214357 5 SMT/THR 1 mm Tape&Reel/420 pcs 214916 5 SMT 2 mm Tape&Reel/420 pcs 214550 5 SMT/THR 2 mm Tape&Reel/420 pcs 214917 10 Catalog E 074587 09/08 Edition 1 www.erni.com ® MicroSpeed Power Modules Male Connectors Ordering Information Number Termination Unmated Stacking Packaging Part Number of Pins Height 5 SMT 9 mm Tape&Reel/240 pcs 214551 5 SMT/THR 9 mm Tape&Reel/240 pcs 214918 5 SMT 10 mm Tape&Reel/240 pcs 214552 5 SMT/THR 10 mm Tape&Reel/240 pcs 214919 Catalog E 074587 09/08 Edition 1 www.erni.com 11 ® MicroSpeed Power Modules Female Connectors • Current carrying capacity up to 10 A for both shields • Current up to 6.6 A (20°) per pin • Partial contact loading is possible • Board-to-Board heights 5-20 mm • Shield contacts available as SMT or THR version Dimensional Drawing Connectors with SMT Ground Pins 11,55 5,5 6,5 Ansaughaube 4,15 hood 6,10 5,40 3,80 4 mm 8,10 7,40 5,80 6 mm 10,10 9,40 7,80 8 mm 12,10 11,40 9,80 10 mm Steckhöhe AB C Stacking Height 0,8 0,6 0,5 11,013 11,55 11,55 4 x 2 = 8 a1 a5 Leiterplatten-Layout / PCB-Layout 11 0,85 3 x 3 = 9 3 0,8 0,7 0,9 0,8 2 0,85 1,5 4 x 2 = 8 All dimensions in mm. 12 Catalog E 074587 09/08 Edition 1 www.erni.com A 2,6 3,85 0,65 0,75 4,45 B 0,7 C ® MicroSpeed Power Modules Female Connectors Dimensional Drawing Connectors with THR Ground Pins 11,55 5,5 6,5 Ansaughaube 4,15 hood 6,60 5,40 3,80 4 mm 8,60 7,40 5,80 6 mm 10,60 9,40 7,80 8 mm 12,60 11,40 9,80 10 mm Steckhöhe AB C Stacking Height 0,8 0,6 0,5 11,013 11,55 4 x 2 = 8 a1 a5 Leiterplatten-Layout / PCB-Layout 11 3 x 3 = 9 1 3 0,7 0,6 ±0,05 0,9 0,8 2 1 1,5 4 x 2 = 8 All dimensions in mm. Catalog E 074587 09/08 Edition 1 www.erni.com 13 2,6 A 3,85 0,75 0,7 4,5 B C 0,7 ® MicroSpeed Power Modules Female Connectors Ordering Information Number Termination Unmated Stacking Packaging Part Number of Pins Height 5 SMT 4 mm Tape&Reel/420 pcs 214356 5 SMT/THR 4 mm Tape&Reel/420 pcs 214912 5 SMT 6 mm Tape&Reel/420 pcs 214547 5 SMT/THR 6 mm Tape&Reel/420 pcs 214913 14 Catalog E 074587 09/08 Edition 1 www.erni.com ® MicroSpeed Power Modules Female Connectors Ordering Information Number Termination Unmated Stacking Packaging Part Number of Pins Height 5 SMT 8 mm Tape&Reel/300 pcs 214548 5 SMT/THR 8 mm Tape&Reel/300 pcs 214914 5 SMT 10 mm Tape&Reel/300 pcs 214549 5 SMT/THR 10 mm Tape&Reel/300 pcs 214915 Catalog E 074587 09/08 Edition 1 www.erni.com 15 ® MicroSpeed Power Modules Part Number Index Part Number Page 214356 ..................................... 14 214357 ..................................... 10 214547 ..................................... 14 214548 ..................................... 15 214549 ..................................... 15 214550 ..................................... 10 214551 ..................................... 11 214552 ..................................... 11 214912 ..................................... 14 214913 ..................................... 14 214914 ..................................... 15 214915 ..................................... 15 214916 ..................................... 10 214917 ..................................... 10 214918 ..................................... 11 214919 ..................................... 11 16 Catalog E 074587 09/08 Edition 1 www.erni.com Member www.erni.com Katalog D 074518 Catalog E 074587 Ausgabe 3, 03/05 09/08 www.erni.com Edition 1 17 ERNI Electronics GmbH & Co. KG Europe South America Africa Japan Seestrasse 9 73099 Adelberg/Germany Tel +49 7166 50-0 Fax +49 7166 50-282 info@erni.de ERNI Electronics, Inc. North America Canada Mexico 2201 Westwood Ave Richmond, VA 23230/USA Tel +1 804 228-4100 Fax +1 804 228-4099 info.usa@erni.com ERNI Asia Holding Pte Ltd. Asia Australia New Zealand Blk 4008 Ang Mo Kio Avenue 10 #04-01/02 Techplace I Singapore 569625 Tel +65 6 555 5885 Fax +65 6 555 5995 info@erni-asia.com www.erni.com © ERNI Electronics GmbH & Co. KG 2008 • Printed in Germany. A policy of continuous improvement is followed and the right to alter any published data without notice is reser- ® ® ® ® ® ® ® ® ® ved. ERNI , MicroStac , MicroSpeed , MiniBridge , MaxiBridge , ERmet , ERmet ZD , ERbic and ERNIPRESS are trademarks (registered or applied for in various countries) of ERNI Electronics GmbH & Co. KG. 18 18 Katalog D 074518 Katalog D 074518 Catalog E 074587 Ausgabe 3, 03/05 Ausgabe 3, 03/05 09/08 www.erni.com www.erni.com Edition 1