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GE CRITICAL POWER ATA006A0X4-SRZ

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Description

NON-ISOLATED DC/DC CONVERTERS 8.3-14VDC INPUT 6A 0.75-5.5VDC OUTPUT, NOT RECOMMENDED FOR NEW DESIGNS

Part Number

ATA006A0X4-SRZ

Price

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Manufacturer

GE CRITICAL POWER

Lead Time

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Category

Capacitors »  DC-DC Converter

Specifications

Manufacturer

GE Critical Power

Manufacturers Part #

ATA006A0X4-SRZ

Industry Aliases

ATA006A0X4-SRZ, 108996682

Brand

GE Critical Power

Packaging

Tape and Reel

Series

MicroLynx II

Factory Pack Quantity

400

Cooling Method

Air-Cooled

Dimensions

1.10 x 0.45 x 0.29"

Efficiency

91%

Environmental Conditions

Low Profile

Input Type

DC

Input Voltage Nominal

12 VDC

Mechanical Style

Non-Isolated / POL

Mounting

SMD/SMT

Operating Temperature

- 40 to + 85°C

Output Amps 1

6 A

Package Type

SMD

Subcategory

DC-DC Converter

Datasheet

pdf file

ATA006?TNR=Data Sheets|ATA006|generic#search= CC109104510%.pdf

1119 KiB

Extracted Text

Data Sheet GE Energy TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Module 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Features RoHS Compliant  Compliant to RoHS EU Directive 2011/65/EU (-Z versions)  Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this product will no longer be RoHS compliant (non-Z versions)  Flexible output voltage sequencing TM EZ-SEQUENCE  Delivers up to 6A output current  High efficiency – 89% at 3.3V full load (VIN = 12.0V)  Small size and low profile: 27.9 mm x 11.4 mm x 7.24 mm (1.10 in x 0.45 in x 0.285 in) Applications  Low output ripple and noise  Distributed power architectures  High Reliability:  Intermediate bus voltage applications o Calculated MTBF = 15.3M hours at 25 C Full-load  Telecommunications equipment  Output voltage programmable from 0.75 Vdc to 5.5Vdc  Servers and storage applications via external resistor  Networking equipment  Line Regulation: 0.3% (typical)  Enterprise Networks  Load Regulation: 0.4% (typical)  Latest generation IC’s (DSP, FPGA, ASIC) and  Temperature Regulation: 0.4 % (typical) Microprocessor powered applications  Remote On/Off  Output overcurrent protection (non-latching)  Wide operating temperature range (-40°C to 85°C) †  UL* 60950-1Recognized, CSA C22.2 No. 60950-1-03 ‡ Certified, and VDE 0805:2001-12 (EN60950-1) Licensed  ISO** 9001 and ISO 14001 certified manufacturing facilities Description TM Austin MicroLynx II 12V SMT (surface mount technology) power modules are non-isolated DC-DC converters that can deliver up to 6A of output current with full load efficiency of 89% at 5.0V output. These modules provide precisely regulated output voltage programmable via external resistor from 0.75Vdc to 5.5Vdc over a wide range of input voltage (VIN = 8.3 - 14V). The Austin TM TM MicroLynx II 12V series has a sequencing feature, EZ-SEQUENCE that enable designers to implement various types of output voltage sequencing when powering multiple voltages on a board. * UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards October 1, 2015 ©2012 General Electric Company. All rights reserved. GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage All V -0.3 15 Vdc IN Continuous Sequencing voltage All Vseq -0.3 VIN,max Vdc Operating Ambient Temperature All T -40 85 °C A (see Thermal Considerations section) Storage Temperature All Tstg -55 125 °C Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage Vo,set ≤ 3.63 V 8.3 12 14 Vdc IN Vo,set > 3.63 VIN 8.3 12 13.2 Vdc Maximum Input Current All IIN,max 4.5 Adc (VIN= VIN, min to VIN, max, IO=IO, max ) Input No Load Current V = 0.75 Vdc I 17 mA O,set IN,No load (V = V , Io = 0, module enabled) V = 5.0Vdc I 100 mA IN IN, nom O,set IN,No load Input Stand-by Current All IIN,stand-by 1.2 mA (V = V , module disabled) IN IN, nom 2 2 Inrush Transient All I t 0.4 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V to V All 30 mAp-p IN, min IN, max, IO= IOmax ; See Test configuration section) Input Ripple Rejection (120Hz) All 30 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of a complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 2 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Output Voltage Set-point All V -2.0 V +2.0 % V O, set O, set O, set (VIN=VIN, min, IO=IO, max, TA=25°C) Output Voltage All VO, set -2.5%  +3.5% % VO, set (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range All VO 0.7525 5.5 Vdc Selected by an external resistor Output Regulation Line (VIN=VIN, min to VIN, max) All  0.3  % VO, set Load (IO=IO, min to IO, max) All  0.4  % VO, set Temperature (Tref=TA, min to TA, max) All  0.4  % VO, set Output Ripple and Noise on nominal output (VIN=VIN, nom and IO=IO, min to IO, max Cout = 1μF ceramic//10μFtantalum capacitors) RMS (5Hz to 20MHz bandwidth) All  15 30 mVrms Peak-to-Peak (5Hz to 20MHz bandwidth) All  30 75 mVpk-pk External Capacitance ESR ≥ 1 mΩ All CO, max   1000 μF ESR ≥ 10 mΩ All CO, max   3000 μF Output Current All Io 0 6 Adc Output Current Limit Inception (Hiccup Mode ) All IO, lim  200  % Io (V = 90% of V ) O O, set Output Short-Circuit Current All I 2 Adc O, s/c   (V ≤250mV) ( Hiccup Mode ) O Efficiency V = 1.2Vdc η 80.0 % O, set V = V , T =25°C V = 1.5Vdc η 83.0 % IN IN, nom A O,set I =I V = V V = 1.8Vdc η 83.5 % O O, max , O O,set O,set V = 2.5Vdc η 86.5 % O,set V = 3.3Vdc η 89.0 % O,set V = 5.0Vdc η 91.0 % O,set Switching Frequency All f 300 kHz sw   Switching Frequency (-30 Option) All f 288 320 352 kHz sw Dynamic Load Response (dIo/dt=2.5A/µs; V = V ; T =25°C) All V 200 mV IN IN, nom A pk   Load Change from Io= 50% to 100% of Io,max; 1μF ceramic// 10 μF tantalum Peak Deviation Settling Time (Vo<10% peak deviation) All t 25 s   µs All V 200 mV (dIo/dt=2.5A/µs; VIN = VIN, nom; TA=25°C) pk   Load Change from Io= 100% to 50%of Io,max: 1μF ceramic// 10 μF tantalum Peak Deviation Settling Time (Vo<10% peak deviation) All t  25  µs s October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 3 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Dynamic Load Response (dIo/dt=2.5A/µs; V V = V ; T =25°C) All Vpk  50  mV IN IN, nom A Load Change from Io= 50% to 100% of Io,max; Co = 2x150 μF polymer capacitors Peak Deviation Settling Time (Vo<10% peak deviation) All t  50  µs s (dIo/dt=2.5A/µs; V = V ; T =25°C) All V  50  mV IN IN, nom A pk Load Change from Io= 100% to 50%of Io,max: Co = 2x150 μF polymer capacitors Peak Deviation Settling Time (Vo<10% peak deviation) All ts  50  µs General Specifications Parameter Min Typ Max Unit Calculated MTBF (I =I , T =25°C) 15,371,900 Hours O O, max A Telecordia SR-332 Issue 1: Method 1 Case 3 Weight  2.8 (0.1)  g (oz.) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 4 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit On/Off Signal interface Device code with Suffix “4” – Positive logic (On/Off is open collector/drain logic input; Signal referenced to GND - See feature description section) Input High Voltage (Module ON) All VIH ― ― VIN, max V Input High Current All IIH ― ― 10 μA Input Low Voltage (Module OFF) All VIL -0.2 ― 0.3 V Input Low Current All IIL ― 0.2 1 mA Device Code with no suffix – Negative Logic (On/OFF pin is open collector/drain logic input with external pull-up resistor; signal referenced to GND) Input High Voltage (Module OFF) All VIH 2.5 ― V Vdc IN,max Input High Current All IIH 0.2 1 mA Input Low Voltage (Module ON) All VIL -0.2 ― 0.3 Vdc Input low Current All IIL ― 10 μA Turn-On Delay and Rise Times o (IO=IO, max , VIN = VIN, nom, TA = 25 C, ) All Tdelay ― 3 ― msec Case 1: On/Off input is set to Logic Low (Module ON) and then input power is applied (delay from instant at which VIN =VIN, min until Vo=10% of Vo,set) All Tdelay ― 3 ― msec Case 2: Input power is applied for at least one second and then the On/Off input is set to logic Low (delay from instant at which Von/Off=0.3V until Vo=10% of Vo, set) All Trise ― 4 6 msec Output voltage Rise time (time for Vo to rise from 10% o,set to 90% of Vo, set) of V 1 Output voltage overshoot – Startup ― % V O, set o IO= IO, max; VIN =VIN, min to VIN, max, TA = 25 C Sequencing Delay time Delay from V to application of voltage on SEQ pin All TsEQ-delay 10 msec IN, min Tracking Accuracy (Power-Up: 2V/ms) All |VSEQ –Vo | 100 200 mV (Power-Down: 1V/ms) All |VSEQ –Vo | 300 500 mV (V to V ; I to I VSEQ < Vo) IN, min IN, max O, min O, max Overtemperature Protection All T 140 °C ref   (See Thermal Consideration section) Input Undervoltage Lockout Turn-on Threshold All 7.9 V Turn-off Threshold All 7.8 V October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 5 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Characteristic Curves TM The following figures provide typical characteristics for the Austin MicroLynx II 12V SMT modules at 25ºC. 86 91 84 88 82 85 80 82 IN V =8.3V 78 79 VIN=8.3V IN V =12V 76 76 IN V =12V IN V =14V 74 73 IN V =14V 72 70 0 1 2 3 4 5 6 0 1 2 3 4 5 6 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Figure 1. Converter Efficiency versus Output Current Figure 4. Converter Efficiency versus Output Current (Vout = (Vout = 1.2Vdc). 2.5Vdc). 88 93 90 86 87 84 84 82 IN V =8.3V 81 80 IN V =12V VIN=8.3V 78 78 IN V =14V IN V =12V 75 76 IN V =14V 72 74 0 1 2 3 4 5 6 0 1 2 3 4 5 6 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Figure 2. Converter Efficiency versus Output Current Figure 5. Converter Efficiency versus Output Current (Vout = (Vout = 1.5Vdc). 3.3Vdc). 88 96 86 93 90 84 87 82 IN V =8.3V 84 80 VIN=12V IN V =8.3V 81 78 IN V =14V VIN=12V 78 76 IN V =14V 75 74 0 1 2 3 4 5 6 0 1 2 3 4 5 6 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Figure 3. Converter Efficiency versus Output Current (Vout Figure 6. Converter Efficiency versus Output Current (Vout = = 1.8Vdc). 5.0Vdc). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 6 EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Characteristic Curves (continued) TM The following figures provide typical characteristics for the MicroLynx II 12V SMT modules at 25ºC. 4.5 Io = 6A 4 Io=3A 3.5 Io=0A 3 2.5 2 1.5 1 0.5 0 7 8 9 10 11 12 13 14 INPUT VOLTAGE, V (V) IN TIME, t (5 µs/div) Figure 7. Input voltage vs. Input Current Figure 10. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 3.3Vdc). (Vout = 3.3Vdc). TIME, t (2µs/div) TIME, t (5 µs/div) Figure 8. Typical Output Ripple and Noise Figure 11. Transient Response to Dynamic Load Change from 100% to 50% of full load (Vo = 3.3 Vdc). (Vin = 12V dc, Vo = 2.5 Vdc, Io=6A). TIME, t (2µs/div) TIME, t (10µs/div) Figure 9. Typical Output Ripple and Noise Figure 12. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 5.0 Vdc, Cext = 2x150 (Vin = 12.0V dc, Vo = 3.3 Vdc, Io=6A). μF Polymer Capacitors). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 7 OUTPUT VOLTAGE OUTPUT VOLTAGE INPUT CURRENT, I (A) VO (V) (10mV/div) VO (V) (10mV/div) IN OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE IO (A) (2A/div) VO (V) (50mV/div) IO (A) (2A/div) VO (V) (100mV/div) IO (A) (2A/div) VO (V) (100mV/div) GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Characteristic Curves (continued) TM The following figures provide typical characteristics for the Austin MicroLynx II 12V SMT modules at 25ºC. TIME, t (10µs/div) TIME, t (1 ms/div) Figure 13. Transient Response to Dynamic Load Change Figure 16. Typical Start-Up with application of Vin with (Vin from 100% of 50% full load (Vo = 5.0 Vdc, Cext = 2x150 μF = 12Vdc, Vo = 3.3Vdc, Io = 6A). Polymer Capacitors). TIME, t (1 ms/div) TIME, t (1 ms/div) Figure 14. Typical Start-Up Using Remote On/Off Figure 17 Typical Start-Up using Remote On/off with Prebias (Vin = 12Vdc, Vo = 1.8Vdc, Io = 1A, Vbias =1.0 Vdc). (Vin = 12Vdc, Vo = 3.3Vdc, Io = 6.0A). TIME, t (1 ms/div) TIME, t (20ms/div) Figure 15. Typical Start-Up Using Remote On/Off with Low- Figure 18. Output short circuit Current (Vin = 12Vdc, Vo = ESR external capacitors (7x150uF Polymer) 0.75Vdc). (Vin = 12Vdc, Vo = 3.3Vdc, Io = 6.0A, Co = 1050µF). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 8 OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT CURRENT OUTPUTVOLTAGE VOV) (1V/div) VOn/off (V) (2V/div) VOV) (2V/div) VOn/off (V) (5V/div) IO (A) (2A/div) VO (V) (50mV/div) OUTPUT CURRENT, OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE, INPUT VOLTAGE V (V) o IO (A) (5A/div) VOV) (1V/div) VOn/off (V) (2V/div) (2V/div) VIN (V) (5V/div) GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Characteristic Curves (continued) TM The following figures provide thermal derating curves for the Austin MicroLynx II 12V SMT modules. 7 7 6 6 5 5 NC NC 4 4 0.5m/s (100 LFM) 0.5m/s (100 LFM) 3 3 1.0m/s (200 LFM) 1.0m/s (200 LFM) 2 2 1.5m/s (300 LFM) 1.5m/s (300 LFM) 1 1 2.0m/s (400 LFM) 2.0m/s (400 LFM) 0 0 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 O O AMBIENT TEMPERATURE, TA C AMBIENT TEMPERATURE, TA C Figure 19. Derating Output Current versus Local Ambient Figure 22. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 12Vdc, Vo=0.75Vdc). Temperature and Airflow (Vin = 12Vdc, Vo=3.3 Vdc). 7 7 6 6 5 5 NC NC 4 4 0.5m/s (100 LFM) 0.5m/s (100 LFM) 3 3 1.0m/s (200 LFM) 1.0m/s (200 LFM) 2 2 1.5m/s (300 LFM) 1.5m/s (300 LFM) 1 1 2.0m/s (400 LFM) 2.0m/s (400 LFM) 0 0 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 O O AMBIENT TEMPERATURE, T C AMBIENT TEMPERATURE, T C A A Figure 20. Derating Output Current versus Local Ambient Figure 23. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 12Vdc, Vo=1.8 Vdc). Temperature and Airflow (Vin = 12Vdc, Vo=5.0 Vdc). 7 6 5 NC 4 0.5m/s (100 LFM) 3 1.0m/s (200 LFM) 2 1.5m/s (300 LFM) 1 2.0m/s (400 LFM) 0 20 30 40 50 60 70 80 90 O AMBIENT TEMPERATURE, TA C Figure 21. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 12Vdc, Vo=2.5 Vdc). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE TM The Austin MicroLynx II 12V SMT module should be L TEST connected to a low-impedance source. A highly inductive V (+) IN 1μH source can affect the stability of the module. An input capacitance must be placed directly adjacent to the input C pin of the module, to minimize input ripple voltage and IN C 1000μF S Electrolytic ensure module stability. 2x100μF E.S.R.<0.1Ω Tantalum @ 20°C 100kHz COM In a typical application, 2x47 µF low-ESR tantalum capacitors (AVX part #: TPSE476M025R0100, 47µF 25V 100 mΩ ESR tantalum capacitor) will be sufficient to provide NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 1μH. Capacitor CS offsets adequate ripple voltage at the input of the module. To possible battery impedance. Measure current as shown minimize ripple voltage at the input, low ESR ceramic above. capacitors are recommended at the input of the module. Figure 24. Input Reflected Ripple Current Test Setup. Figure 27 shows input ripple voltage (mVp-p) for various outputs with 2x47 µF tantalum capacitors and with 2x 22 µF ceramic capacitor (TDK part #: C4532X5R1C226M) at full COPPER STRIP load. V O (+) RESISTIVE LOAD 350 1uF . 10uF SCOPE 300 COM 250 200 GROUND PLANE 150 NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then 100 Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact Tantalum resistance. 50 Ceramic Figure 25. Output Ripple and Noise Test Setup. 0 0 1 2 3 4 5 6 R R R R distribution contact contact distribution V (+) V Output Voltage (Vdc) IN O Figure 27. Input ripple voltage for various output with 2x47 µF tantalum capacitors and with 2x22 µF ceramic capacitors R LOAD V V IN O at the input (80% of Io,max). R R R R distribution contact contact distribution COM COM NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 26. Output Voltage and Efficiency Test Setup. V . I O O Efficiency = x 100 % η V . I IN IN October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 10 BATTERY Input Ripple Voltage (mVp-p) GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Design Considerations (continued) Safety Considerations For safety agency approval the power module must be installed in compliance with the spacing and separation Output Filtering requirements of the end-use safety agency standards, i.e., UL TM The Austin MicroLynx II 12V module is designed for low 60950-1, CSA C22.2 No. 60950-1-03, and VDE 0850:2001-12 output ripple voltage and will meet the maximum output ripple (EN60950-1) Licensed. specification with 1 µF ceramic and 10 µF polymer capacitors at the output of the module. However, additional output For the converter output to be considered meeting the filtering may be required by the system designer for a number requirements of safety extra-low voltage (SELV), the input must of reasons. First, there may be a need to further reduce the meet SELV requirements. The power module has extra-low output ripple and noise of the module. Second, the dynamic voltage (ELV) outputs when all inputs are ELV. response characteristics may need to be customized to a particular load step change. The input to these units is to be provided with a fast-acting fuse with a maximum rating of 6A in the positive input lead. To reduce the output ripple and improve the dynamic response to a step load change, additional capacitance at the output can be used. Low ESR polymer and ceramic capacitors are recommended to improve the dynamic response of the module. For stable operation of the module, limit the capacitance to less than the maximum output capacitance as specified in the electrical specification table. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 11 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Feature Description VIN+ MODULE R pull-up Remote On/Off I ON/OFF TM Austin MicroLynx II 12V SMT power modules feature an ON/OFF On/Off pin for remote On/Off operation. Two On/Off logic TM + PWM Enable options are available in the Austin MicroLynx II 12V series V ON/OFF modules. Positive Logic On/Off signal, device code suffix “4”, R1 turns the module ON during a logic High on the On/Off pin and turns the module OFF during a logic Low. Negative logic Q2 CSS On/Off signal, no device code suffix, turns the module OFF Q1 during logic High and turns the module ON during logic Low. R2 For positive logic modules, the circuit configuration for using GND _ the On/Off pin is shown in Figure 28. The On/Off pin is an open collector/drain logic input signal (Von/Off) that is referenced to ground. During a logic-high (On/Off pin is pulled high internal Figure 29. Circuit configuration for using negative logic to the module) when the transistor Q1 is in the Off state, the On/OFF. power module is ON. Maximum allowable leakage current of the transistor when Von/off = VIN,max is 10µA. Applying a logic- Overcurrent Protection low when the transistor Q1 is turned-On, the power module is OFF. During this state VOn/Off must be less than 0.3V. When To provide protection in a fault (output overload) condition, the not using positive logic On/off pin, leave the pin unconnected unit is equipped with internal current-limiting circuitry and can or tie to VIN. endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. The unit VIN+ operates normally once the output current is brought back into MODULE its specified range. The typical average output current during R2 hiccup is 2A. ON/OFF Input Undervoltage Lockout Q2 + R1 V At input voltages below the input undervoltage lockout limit, ON/OFF I ON/OFF PWM Enable module operation is disabled. The module will begin to operate at an input voltage above the undervoltage lockout turn-on R3 threshold. Q1 Q3 CSS Overtemperature Protection R4 To provide over temperature protection in a fault condition, the unit relies upon the thermal protection feature of the controller GND _ IC. The unit will shutdown if the thermal reference point Tref2, o (see Figure 33) exceeds 140 C (typical), but the thermal Figure 28. Circuit configuration for using positive logic shutdown is not intended as a guarantee that the unit will On/OFF. survive temperatures beyond its rating. The module will automatically restarts after it cools down. For negative logic On/Off devices, the circuit configuration is shown is Figure 29. The On/Off pin is pulled high with an external pull-up resistor (typical Rpull-up = 68k, +/- 5%). When transistor Q1 is in the Off state, logic High is applied to the On/Off pin and the power module is Off. The minimum On/off voltage for logic High on the On/Off pin is 2.5 Vdc. To turn the module ON, logic Low is applied to the On/Off pin by turning ON Q1. When not using the negative logic On/Off, leave the pin unconnected or tie to GND. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 12 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current www.gecriticalpower.com under the Design Tools section, Feature Descriptions (continued) helps determine the required external trim resistor needed Output Voltage Programming for a specific output voltage. TM The output voltage of the Austin MicroLynx II 12V can be programmed to any voltage from 0.75Vdc to 5.5Vdc by The amount of power delivered by the module is defined as connecting a resistor (shown as Rtrim in Figure 30) between the voltage at the output terminals multiplied by the output Trim and GND pins of the module. Without an external resistor current. When using the trim feature, the output voltage of between Trim and GND pins, the output of the module will be the module can be increased, which at the same output 0.7525Vdc. To calculate the value of the trim resistor, Rtrim for current would increase the power output of the module. a desired output voltage, use the following equation: Care should be taken to ensure that the maximum output power of the module remains at or below the maximum 10500   rated power (P = V x I ). max o,set o,max Rtrim= −1000Ω   Vo− 0.7525   Voltage Margining Rtrim is the external resistor in Ω Output voltage margining can be implemented in the Austin Vo is the desired output voltage TM MicroLynx II modules by connecting a resistor, Rmargin-up, from Trim pin to ground pin for margining-up the output For example, to program the output voltage of the Austin voltage and by connecting a resistor, Rmargin-down, from Trim TM MicroLynx 12V module to 1.8V, Rtrim is calculated as follows: pin to Output pin. Figure 31 shows the circuit configuration 10500   for output voltage margining. The POL Programming Tool, Rtrim= −1000   available at www.gecriticalpower.com under the Design 1.8− 0.7525   Tools section, also calculates the values of Rmargin-up and Rtrim= 9.024kΩ R for a specific output voltage and % margin. margin-down Please consult your local GE Energy technical representative for additional details V (+) V (+) IN O Vo Rmargin-down ON/OFF LOAD Austin Lynx or TRIM Lynx II Series Q2 R trim GND Trim Rmargin-up Figure 30. Circuit configuration to program output voltage using an external resistor Rtrim Q1 Table 1 provides Rtrim values for most common output voltages. GND Table 1 VO, set (V) Rtrim (KΩ) Figure 31. Circuit Configuration for margining Output 0.7525 Open voltage. 1.2 22.46 1.5 13.05 1.8 9.024 2.5 5.009 3.3 3.122 5.0 1.472 Using 1% tolerance trim resistor, set point tolerance of ±2% is achieved as specified in the electrical specification. The POL Programming Tool, available at October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 13 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Feature Descriptions (continued) Voltage Sequencing TM Austin MicroLynx II 12V series of modules include a TM sequencing feature, EZ-SEQUENCE that enables users to implement various types of output voltage sequencing in their applications. This is accomplished via an additional sequencing pin. When not using the sequencing feature, either tie the SEQ pin to VIN or leave it unconnected. When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the set- point voltage. The SEQ voltage must be set higher than the set-point voltage of the module. The output voltage follows the voltage on the SEQ pin on a one-to-one volt basis. By connecting multiple modules together, customers can get multiple modules to track their output voltages to the voltage applied on the SEQ pin. For proper voltage sequencing, first, input voltage is applied to the module. The On/Off pin of the module is left unconnected (or tied to GND for negative logic modules or tied to VIN for positive logic modules) so that the module is ON by default. After applying input voltage to the module, a minimum of 10msec delay is required before applying voltage on the SEQ pin. During this time, potential of 50mV (± 10 mV) is maintained on the SEQ pin. After 10msec delay, an analog voltage is applied to the SEQ pin and the output voltage of the module will track this voltage on a one-to-one volt bases until output reaches the set-point voltage. To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. Output voltage of the modules tracks the voltages below their set-point voltages on a one-to-one basis. A valid input voltage must be maintained until the tracking and output voltages reach ground potential to ensure a controlled shutdown of the modules. TM When using the EZ-SEQUENCE feature to control start-up of the module, pre-bias immunity feature during start-up is disabled. The pre-bias immunity feature of the module relies on the module being in the diode-mode during start-up. When TM using the EZ-SEQUENCE feature, modules goes through an internal set-up time of 10msec, and will be in synchronous rectification mode when voltage at the SEQ pin is applied. This will result in sinking current in the module if pre-bias voltage is present at the output of the module. When pre-bias immunity TM during start-up is required, the EZ-SEQUENCE feature must TM be disabled. For additional guidelines on using EZ-SEQUENCE TM feature of Austin MicroLynx II 12V, contact A GE Energy technical representative for preliminary application note on output voltage sequencing using Austin Lynx II series. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 14 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Thermal Considerations The thermal reference point, T used in the specifications of ref 1 thermal derating curves is shown in Figure 32. For reliable o Power modules operate in a variety of thermal environments; operation this temperature should not exceed 125 C. however, sufficient cooling should be provided to help ensure The output power of the module should not exceed the rated reliable operation. power of the module (Vo,set x Io,max). Considerations include ambient temperature, airflow, module Please refer to the Application Note “Thermal Characterization power dissipation, and the need for increased reliability. A Process For Open-Frame Board-Mounted Power Modules” for a reduction in the operating temperature of the module will detailed discussion of thermal aspects including maximum result in an increase in reliability. The thermal data presented device temperatures. here is based on physical measurements taken in a wind tunnel. The test set-up is shown in Figure 33. Note that the airflow is parallel to the long axis of the module as shown in figure 32. The derating data applies to airflow in either 25.4_ direction of the module’s long axis. Wind Tunnel (1.0) PWBs Power Module 76.2_ (3.0) x Probe Location for measuring 7.24_ airflow and (0.285) ambient temperature Air flow Figure 33. Thermal Test Set-up. Heat Transfer via Convection Increased airflow over the module enhances the heat transfer via convection. Thermal derating curves showing the maximum output current that can be delivered by various module versus local ambient temperature (TA) for natural convection and up to 1m/s (200 ft./min) are shown in the Characteristics Curves section. Figure 32. T Temperature measurement location. ref October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 15 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Mechanical Outline Dimensions are in millimeters and (inches). Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated] x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.) Top View Side View Bottom View PIN FUNCTION 1 On/Off 2 VIN 3 SEQ 4 GND 5 Trim 6 VOUT Co-planarity (max): 0.102 [0.004] October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 16 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Recommended Pad Layout Dimensions are in millimeters and (inches). Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated] x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.) Surface Mount Pad Layout – Component side view. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 17 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Packaging Details TM The Austin MicroLynx II 12V SMT versions are supplied in tape & reel as standard. Modules are shipped in quantities of 400 modules per reel. A ll Dimensions are in millimeters and (in inches). Reel Dimensions Outside Dimensions: 330.2 mm (13.00) Inside Dimensions: 177.8 mm (7.00”) Width 44.0 mm (1.73”) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 18 GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Surface Mount Information Pick and Place soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable TM The Austin MicroLynx II 12V SMT modules use an open soldering the solder reflow profile should be established by frame construction and are designed for a fully automated accurately measuring the modules CP connector assembly process. The modules are fitted with a label temperatures. designed to provide a large surface area for pick and placing. The label meets all the requirements for surface mount processing, as well as safety standards and is able to withstand maximum reflow temperature. The label also carries product information such as product code, serial number and location of manufacture. REFLOW TIME (S) F igure 34. Pick and Place Location. Figure 35. Reflow Profile for Tin/Lead (Sn/Pb) process. Nozzle Recommendations The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and pick & placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 3mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 8 mm max. Tin Lead Soldering o Figure 36. Time Limit Curve Above 205 C for Tin/Lead TM The Austin MicroLynx II 12V SMT power modules are lead (Sn/Pb) process. free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak o reflow temperatures are limited to less than 235 C. o Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 19 MAX TEMP SOLDER (°C) REFLOW TEMP (°C) GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current 300 Surface Mount Information (continued) Per J-STD-020 Rev. C Peak Temp 260°C 250 Lead Free Soldering Cooling The –Z version Austin MicroLynx II 12V SMT modules are 200 Zone * Min. Time Above 235°C lead-free (Pb-free) and RoHS compliant and are both 15 Seconds forward and backward compatible in a Pb-free and a SnPb 150 Heating Zone *Time Above 217°C soldering process. Failure to observe the instructions below 1°C/Second 60 Seconds 100 may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. 50 0 Pb-free Reflow Profile Reflow Time (Seconds) Power Systems will comply with J-STD-020 Rev. C Figure 37. Recommended linear reflow profile using (Moisture/Reflow Sensitivity Classification for Nonhermetic Sn/Ag/Cu solder. Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure. 37. MSL Rating The Austin MicroLynx II 12V SMT modules have a MSL rating of 3. Storage and Handling The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of ≤ 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 20 Reflow Temp (°C) GE Energy Data Sheet TM 6A Austin MicroLynx II: 12V SMT Non-Isolated DC-DC Power Modules 8.3Vdc –14Vdc input; 0.75Vdc to 5.5Vdc output; 6A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 2. Device Codes Input Output Output Connector Device Code Voltage Comcodes Voltage Current Type Range ATA006A0X-SR 8.3 – 14Vdc 0.75 – 5.5Vdc 6 A SMT 108988374 0.75 – 5.5Vdc ATA006A0X-SRZ 8.3 – 14Vdc 6 A SMT CC109104510 0.75 – 5.5Vdc ATA006A0X4-SR 8.3 – 14Vdc 6 A SMT 108988382 0.75 – 5.5Vdc ATA006A0X4-SRZ 8.3 – 14Vdc 6 A SMT 108996682 ATA006A0X-30SRZ 8.3 – 14Vdc 0.75 – 5.5Vdc 6 A SMT 150026142 -Z refers to RoHS-compliant versions. Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 1, 2015 ©2015 General Electric Company. All International rights reserved. Version 1.45

Frequently asked questions

How does Electronics Finder differ from its competitors?

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Electronics Finder' parent company, GID Industrial, specializes in procuring industrial parts. We know where to find the rare and obsolete equipment that our customers need in order to get back to business. We stand apart from our competition through our commitment to quality, and look forward to the opportunity to show you how.

Is there a warranty for the ATA006A0X4-SRZ?

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The warranty we offer will be based on what we negotiate with our suppliers. Sometimes, a part will be sold as-is and without a warranty. We usually offer a one-year warranty for single board computers in particular because they are our specialty.

Which carrier will Electronics Finder use to ship my parts?

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We use FedEx, UPS, DHL, and USPS. We have accounts with each of them and generally ship using one of those, but we can also ship using your account if you would prefer. We are able to ship with other carriers if you would find it more convenient.

Can I buy parts from Electronics Finder if I am outside the USA?

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Electronics Finder will definitely serve you. We work with international clients all the time, which means we are regularly shipping goods all across the globe.

Which payment methods does Electronics Finder accept?

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Visa, MasterCard, Discover, and American Express are all accepted by Electronics Finder. We will also accept payment made with wire transfer or PayPal. Checks will only be accepted from customers in the USA. Terms may be offered (upon approval) for larger orders.

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What they say about us

FANTASTIC RESOURCE

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One of our top priorities is maintaining our business with precision, and we are constantly looking for affiliates that can help us achieve our goal. With the aid of GID Industrial, our obsolete product management has never been more efficient. They have been a great resource to our company, and have quickly become a go-to supplier on our list!

Bucher Emhart Glass

EXCELLENT SERVICE

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With our strict fundamentals and high expectations, we were surprised when we came across GID Industrial and their competitive pricing. When we approached them with our issue, they were incredibly confident in being able to provide us with a seamless solution at the best price for us. GID Industrial quickly understood our needs and provided us with excellent service, as well as fully tested product to ensure what we received would be the right fit for our company.

Fuji

HARD TO FIND A BETTER PROVIDER

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Our company provides services to aid in the manufacture of technological products, such as semiconductors and flat panel displays, and often searching for distributors of obsolete product we require can waste time and money. Finding GID Industrial proved to be a great asset to our company, with cost effective solutions and superior knowledge on all of their materials, it’d be hard to find a better provider of obsolete or hard to find products.

Applied Materials

CONSISTENTLY DELIVERS QUALITY SOLUTIONS

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Over the years, the equipment used in our company becomes discontinued, but they’re still of great use to us and our customers. Once these products are no longer available through the manufacturer, finding a reliable, quick supplier is a necessity, and luckily for us, GID Industrial has provided the most trustworthy, quality solutions to our obsolete component needs.

Nidec Vamco

TERRIFIC RESOURCE

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This company has been a terrific help to us (I work for Trican Well Service) in sourcing the Micron Ram Memory we needed for our Siemens computers. Great service! And great pricing! I know when the product is shipping and when it will arrive, all the way through the ordering process.

Trican Well Service

GO TO SOURCE

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When I can't find an obsolete part, I first call GID and they'll come up with my parts every time. Great customer service and follow up as well. Scott emails me from time to time to touch base and see if we're having trouble finding something.....which is often with our 25 yr old equipment.

ConAgra Foods

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