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GE CRITICAL POWER ATH006A0X-SRZ

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Description

22 W, 2.4 -5.5 VDC Vin, Single Output, 3.3 VDC@6.0 A Industrial DC-DC Converter

Part Number

ATH006A0X-SRZ

Price

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Manufacturer

GE CRITICAL POWER

Lead Time

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Category

Capacitors »  DC-DC Converter

Specifications

Manufacturer

GE Critical Power

Manufacturers Part #

ATH006A0X-SRZ

Industry Aliases

CC109104535, ATH006A0X-SRZ

Brand

GE Critical Power

Packaging

Tape and Reel

Series

ATH006

Factory Pack Quantity

400

Connection Type

Surface Mount

Convection Rating

22 W

Convection Rating Temp

85°C

Cooling Method

Convection

Dimensions

0.48 x 0.48 x 0.29"

Efficiency

93%

Industry

Industrial

Input Type

DC

Input Voltage Nominal

5 VDC

Mechanical Style

Non-Isolated / POL

Mounting

PCB Mount

Number of Outputs

1

Operating Temperature

- 40 to + 85°C

Output Amps 1

6.0 A

Output Voltage V1 Nominal

3.3 VDC

Package Type

PCB Mount

PFC

No

Power

22 W

Subcategory

DC-DC Converter

Weight

1.95 G

Datasheet

pdf file

ATH006?TNR=Data Sheets|ATH006|generic#search= ATH006A0X-SRZ%.pdf

1003 KiB

Extracted Text

Data Sheet GE Energy TM 6A Austin MicroLynx II : SMT Non-Isolated DC-DC Power Module 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Features RoHS Compliant  Compliant to RoHS EU Directive 2011/65/EU (-Z versions)  Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this product will no longer be RoHS compliant (non-Z versions) TM  Flexible output voltage sequencing EZ-SEQUENCE  Delivers up to 6A output current  High efficiency – 96% at 3.3V full load (VIN = 5.0V)  Small size and low profile: 27.9 mm x 11.4 mm x 7.24 mm Applications (1.10 in x 0.45 in x 0.285 in)  Low output ripple and noise  Distributed power architectures  High Reliability:  Intermediate bus voltage applications o Calculated MTBF = 12.8M hours at 25 C Full-load  Telecommunications equipment  Output voltage programmable from 0.75 Vdc to  Servers and storage applications 3.63Vdc via external resistor  Networking equipment  Line Regulation: 0.3% (typical)  Enterprise Networks  Load Regulation: 0.4% (typical)  Latest generation IC’s (DSP, FPGA, ASIC) and  Temperature Regulation: 0.4 % (typical) Microprocessor powered applications  Remote On/Off  Output overcurrent protection (non-latching)  Wide operating temperature range (-40°C to 85°C) †  UL* 60950-1Recognized, CSA C22.2 No. 60950-1-03 ‡ Certified, and VDE 0805:2001-12 (EN60950-1) Licensed  ISO** 9001 and ISO 14001 certified manufacturing facilities Description TM Austin MicroLynx II SMT (surface mount technology) power modules are non-isolated dc-dc converters that can deliver up to 6A of output current with full load efficiency of 96.0% at 3.3V output. These modules provide a precisely regulated output voltage programmable via an external resistor from 0.75Vdc to 3.63Vdc over a wide range of input voltage (V = IN TM TM 2.4 – 5.5Vdc). Austin MicroLynx II has a sequencing feature, EZ-SEQUENCE that enable designers to implement various types of output voltage sequencing when powering multiple modules on board. * UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards October 1, 2015 ©2015 General Electric Company. All rights reserved. GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage All V -0.3 5.8 Vdc IN Continuous Sequencing voltage All Vseq -0.3 VIN,max Vdc Operating Ambient Temperature All T -40 85 °C A (see Thermal Considerations section) Storage Temperature All Tstg -55 125 °C Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage Vo,set ≤ 3.63 V 2.4 5.5 Vdc IN  Maximum Input Current All I 6.0 Adc IN,max (V = V to V , I =I ) IN IN, min IN, max O O, max Input No Load Current VO,set = 0.75 Vdc IIN,No load 20 mA (VIN = VIN, nom, Io = 0, module enabled) VO,set = 3.3Vdc IIN,No load 45 mA Input Stand-by Current All I 0.6 mA IN,stand-by (VIN = VIN, nom, module disabled) 2 2 Inrush Transient All I t 0.04 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, All 35 mAp-p I = I ; See Test configuration section) max, O Omax Input Ripple Rejection (120Hz) All 30 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of a complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 2 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Output Voltage Set-point All VO, set -2.0  +2.0 % VO, set (V = , I =I , T =25°C) IN IN, min O O, max A Output Voltage All VO, set –3.0  +3.0 % VO, set (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range All V 0.7525 3.63 Vdc O Selected by an external resistor Output Regulation Line (VIN=VIN, min to VIN, max) All  0.3  % VO, set Load (IO=IO, min to IO, max) All  0.4  % VO, set Temperature (Tref=TA, min to TA, max) All  0.4  % VO, set Output Ripple and Noise on nominal output (VIN=VIN, nom and IO=IO, min to IO, max Cout = 1μF ceramic//10μFtantalum capacitors) RMS (5Hz to 20MHz bandwidth) All 10 15 mV  rms Peak-to-Peak (5Hz to 20MHz bandwidth) All 40 50 mV  pk-pk External Capacitance ESR ≥ 1 mΩ All C 1000 μF O, max   ESR ≥ 10 mΩ All C 5000 μF O, max   Output Current All I 0 6 Adc o Output Current Limit Inception (Hiccup Mode ) All I 220 % I O, lim   o (VO= 90% of VO, set) Output Short-Circuit Current All I  2  Adc O, s/c (V ≤250mV) ( Hiccup Mode ) O Efficiency VO, set = 0.75Vdc η 81.2 % VIN= VIN, nom, TA=25°C VO, set = 1.2Vdc η 86.8 % IO=IO, max , VO= VO,set VO,set = 1.5Vdc η 88.8 % VO,set = 1.8Vdc η 89.7 % VO,set = 2.5Vdc η 92.5 % VO,set = 3.3Vdc η 95.4 % Switching Frequency All f  300  kHz sw Dynamic Load Response (dIo/dt=2.5A/µs; V = V ; T =25°C) All Vpk  130  mV IN IN, nom A Load Change from Io= 50% to 100% of Io,max; 1μF ceramic// 10 μF tantalum Peak Deviation Settling Time (Vo<10% peak deviation) All ts  25  µs (dIo/dt=2.5A/µs; V = V ; T =25°C) All Vpk  130  mV IN IN, nom A Load Change from Io= 100% to 50%of Io,max: 1μF ceramic// 10 μF tantalum Peak Deviation Settling Time (Vo<10% peak deviation) All ts  25  µs October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 3 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Dynamic Load Response (dIo/dt=2.5A/µs; V V = V ; T =25°C) All Vpk  50  mV IN IN, nom A Load Change from Io= 50% to 100% of Io,max; Co = 2x150 μF polymer capacitors Peak Deviation Settling Time (Vo<10% peak deviation) All t  50  µs s (dIo/dt=2.5A/µs; V = V ; T =25°C) All V  50  mV IN IN, nom A pk Load Change from Io= 100% to 50%of Io,max: Co = 2x150 μF polymer capacitors Peak Deviation Settling Time (Vo<10% peak deviation) All ts  50  µs General Specifications Parameter Min Typ Max Unit Calculated MTBF (I =I , T =25°C) 12,841,800 Hours O O, max A Weight  2.8 (0.1)  g (oz.) October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 4 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit On/Off Signal interface Device code with Suffix “4” – Positive logic (On/Off is open collector/drain logic input; Signal referenced to GND - See feature description section) Input High Voltage (Module ON) All VIH ― ― V V IN, max Input High Current All IIH ― ― 10 μA Input Low Voltage (Module OFF) All VIL -0.2 ― 0.3 V Input Low Current All IIL ― 0.2 1 mA Device Code with no suffix – Negative Logic (On/OFF pin is open collector/drain logic input with external pull-up resistor; signal referenced to GND) Input High Voltage (Module OFF) All VIH 1.5 ― V Vdc IN,max Input High Current All IIH 0.2 1 mA Input Low Voltage (Module ON) All VIL -0.2 ― 0.3 Vdc Input low Current All IIL ― 10 μA Turn-On Delay and Rise Times o (I =I V = V T = 25 C, ) O O, max , IN IN, nom, A Case 1: On/Off input is set to Logic Low (Module All Tdelay ― 3.9 ― msec ON) and then input power is applied (delay from instant at which VIN =VIN, min until Vo=10% of Vo,set) All Tdelay ― 3.9 ― msec Case 2: Input power is applied for at least one second and then the On/Off input is set to logic Low (delay from instant at which Von/Off=0.3V until Vo=10% of Vo, set) All Trise ― 4.2 8.5 msec Output voltage Rise time (time for Vo to rise from 10% of Vo,set to 90% of Vo, set) 1 Output voltage overshoot – Startup ― % VO, set o IO= IO, max; VIN = 3.0 to 5.5Vdc, TA = 25 C Sequencing Delay time TsEQ- Delay from VIN, min to application of voltage on SEQ pin All 10 msec delay |VSEQ – Tracking Accuracy (Power-Up: 2V/ms) All 100 200 mV V | |VSEQ – (Power-Down: 1V/ms) All 200 400 mV V | (V to V ; I to I VSEQ < Vo) IN, min IN, max O, min O, max Overtemperature Protection All T 150 °C ref   (See Thermal Considerations section) Input Undervoltage Lockout Turn-on Threshold All 2.2 V Turn-off Threshold All 2.0 V October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 5 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves TM The following figures provide typical characteristics for the Austin MicroLynx II SMT modules at 25ºC. 98 91 95 88 92 85 89 82 86 79 IN V =2.4V 83 VIN=2.4V 76 VIN=5V 80 IN V =5V 73 77 IN V =5.5V IN V =5.5V 70 74 0 1 2 3 4 5 6 0 1 2 3 4 5 6 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Figure 1. Converter Efficiency versus Output Current (Vout Figure 4. Converter Efficiency versus Output Current (Vout = 0.75Vdc). = 1.8Vdc). 94 98 91 95 88 92 85 89 82 86 IN V =2.4V 79 83 IN VIN=5V V =3V 76 80 IN IN V =5.5V V =5V 73 77 IN V =5.5V 74 70 0 1 2 3 4 5 6 0 1 2 3 4 5 6 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Figure 2. Converter Efficiency versus Output Current (Vout Figure 5. Converter Efficiency versus Output Current (Vout = 1.2Vdc). = 2.5Vdc). 94 98 91 95 88 92 85 89 82 86 IN V =2.4V 79 83 IN V =5V IN V =4.5V 76 80 IN V =5.5V VIN=5V 73 77 IN V =5.5V 70 74 0 1 2 3 4 5 6 0 1 2 3 4 5 6 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Figure3. Converter Efficiency versus Output Current (Vout Figure 6. Converter Efficiency versus Output Current (Vout = 1.5Vdc). = 3.3Vdc). October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 6 EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves (continued) TM The following figures provide typical characteristics for the MicroLynx II SMT modules at 25ºC. 7 Io=6A 6 Io=3A 5 Io=0A 4 3 2 1 0 1 1.75 2.5 3.25 4 4.75 5.5 INPUT VOLTAGE, V (V) IN TIME, t (5 µs/div) Figure 7. Input voltage vs. Input Current Figure 10. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 3.3Vdc). (Vout =2.5Vdc). TIME, t (2µs/div) TIME, t (5 µs/div) Figure 8. Typical Output Ripple and Noise Figure 11. Transient Response to Dynamic Load Change from 100% to 50% of full load (Vo = 3.3 Vdc). (Vin = 5.0V dc, Vo = 0.75 Vdc, Io=6A). TIME, t (2µs/div) TIME, t (10µs/div) Figure 9. Typical Output Ripple and Noise Figure 12. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 3.3 Vdc, Cext = 2x150 (Vin = 5.0V dc, Vo = 3.3 Vdc, Io=6A). μF Polymer Capacitors). October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 7 OUTPUT VOLTAGE OUTPUT VOLTAGE INPUT CURRENT, I (A) VO (V) (20mV/div) VO (V) (20mV/div) IN OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE IO (A) (2A/div) VO (V) (50mV/div) IO (A) (2A/div) VO (V) (100mV/div) IO (A) (2A/div) VO (V) (100mV/div) GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves (continued) TM The following figures provide typical characteristics for the Austin MicroLynx II SMT modules at 25ºC. TIME, t (10µs/div) TIME, t (2 ms/div) Figure 13. Transient Response to Dynamic Load Change Figure 16. Typical Start-Up with application of Vin from 100% of 50% full load (Vo = 3.3Vdc, Cext = 2x150 μF (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A). Polymer Capacitors). TIME, t (2 ms/div) TIME, t (2 ms/div) Figure 14. Typical Start-Up Using Remote On/Off Figure 17 Typical Start-Up Using Remote On/Off with Prebias (Vin = 3.3Vdc, Vo = 1.8Vdc, Io = 1.0A, Vbias =1.0Vdc). (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A). TIME, t (2 ms/div) TIME, t (5ms/div) Figure 15. Typical Start-Up Using Remote On/Off with Low- Figure 18. Output short circuit Current ESR external capacitors (7x150uF Polymer) (Vin = 5.0Vdc, Vo (Vin = 5.0Vdc, Vo = 0.75Vdc). = 3.3Vdc, Io = 6A, Co = 1050µF). October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 8 OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT CURRENT, OUTPUTVOLTAGE VOV) (1V/div) VOn/off (V) (2V/div) VOV) (1V/div) VOn/off (V) (2V/div) IO (A) (2A/div) VO (V) (50mV/div) OUTPUT CURRENT, OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE, INPUT VOLTAGE IO (A) (5A/div) VOV) (1V/div) VOn/off (V) (2V/div) Vo (V) (1V/div) VIN (V) (2V/div) GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves (continued) TM The following figures provide thermal derating curves for the Austin MicroLynx II SMT modules. 7.5 8 6.0 6 4.5 5 NC NC 3.0 3 0.5m/s (100 LFM) 0.5m/s (100 LFM) 1.5 2 1.0m/s (200 LFM) 1.0m/s (200 LFM) 0.0 0 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 O O AMBIENT TEMPERATURE, TA C AMBIENT TEMPERATURE, TA C Figure 19. Derating Output Current versus Local Ambient Figure 22. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0, Vo=3.3Vdc). Temperature and Airflow (Vin = 3.3dc, Vo=0.75 Vdc). 7.5 6.0 4.5 NC 3.0 0.5m/s (100 LFM) 1.5 1.0m/s (200 LFM) 0.0 20 30 40 50 60 70 80 90 O AMBIENT TEMPERATURE, TA C Figure 20. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0Vdc, Vo=0.75 Vdc). 7.5 6.0 4.5 NC 3.0 0.5m/s (100 LFM) 1.5 1.0m/s (200 LFM) 0.0 20 30 40 50 60 70 80 90 O AMBIENT TEMPERATURE, T C A Figure 21. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 3.3Vdc, Vo=2.5 Vdc). October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE TM The Austin MicroLynx II SMT module should be connected L TEST to a low-impedance source. A highly inductive source can V (+) IN 1μH affect the stability of the module. An input capacitance must be placed directly adjacent to the input pin of the module, to minimize input ripple voltage and ensure CIN CS 1000μF Electrolytic module stability. 2x100μF E.S.R.<0.1Ω Tantalum @ 20°C 100kHz COM To minimize input voltage ripple, low-ESR polymer and ceramic capacitors are recommended at the input of the module. Figure 26 shows the input ripple voltage (mVp-p) NOTE: Measure input reflected ripple current with a simulated source inductance (L ) of 1μH. Capacitor C offsets TEST S for various outputs with 1x150 µF polymer capacitors possible battery impedance. Measure current as shown (Panasonic p/n: EEFUE0J151R, Sanyo p/n: 6TPE150M) in above. parallel with 1 x 47 µF ceramic capacitor (Panasonic p/n: Figure 23. Input Reflected Ripple Current Test Setup. ECJ-5YB0J476M, Taiyo- Yuden p/n: CEJMK432BJ476MMT) at full load. Figure 27 shows the input ripple with 2x150 µF polymer capacitors in parallel with 2 x 47 µF ceramic COPPER STRIP capacitor at full load. V O (+) RESISTIVE LOAD 120 1uF . 10uF SCOPE 100 COM 80 GROUND PLANE 60 NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals 40 to avoid measurement errors due to socket contact resistance. Vin = 3.3V 20 Figure 24. Output Ripple and Noise Test Setup. Vin = 5.0V 0 0 1 2 3 4 R R R R distribution contact contact distribution V (+) V IN O Output Voltage (Vdc) Figure 26. Input ripple voltage for various output with 1x150 µF polymer and 1x47 µF ceramic capacitors at the input R LOAD V VIN O (80% of Io,max). 120 Rdistribution Rcontact Rcontact Rdistribution COM COM 100 NOTE: All voltage measurements to be taken at the module 80 terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact 60 resistance. 40 Figure 25. Output Voltage and Efficiency Test Setup. Vin = 3.3V 20 V . I O O Vin = 5.0V Efficiency η = x 100 % 0 V . I IN IN 0 1 2 3 4 Output Voltage (Vdc) Figure 27. Input ripple voltage for various output with 2x150 µF polymer and 2x47 µF ceramic capacitors at the input (80% of Io,max). October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 10 BATTERY Input Ripple Voltage (mVp-p) Input Ripple Voltage (mVp-p) GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Design Considerations (continued) Safety Considerations Output Filtering For safety agency approval the power module must be installed in compliance with the spacing and separation TM The Austin MicroLynx II SMT module is designed for low requirements of the end-use safety agency standards, i.e., UL output ripple voltage and will meet the maximum output ripple 60950-1, CSA C22.2 No. 60950-1-03, and VDE 0850:2001-12 specification with 1 µF ceramic and 10 µF tantalum capacitors (EN60950-1) Licensed. at the output of the module. However, additional output filtering may be required by the system designer for a number of reasons. First, there may be a need to further reduce the For the converter output to be considered meeting the output ripple and noise of the module. Second, the dynamic requirements of safety extra-low voltage (SELV), the input response characteristics may need to be customized to a must meet SELV requirements. The power module has extra- particular load step change. low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a fast-acting To reduce the output ripple and improve the dynamic response fuse with a maximum rating of 6A in the positive input lead. to a step load change, additional capacitance at the output can be used. Low ESR polymer and ceramic capacitors are recommended to improve the dynamic response of the module. For stable operation of the module, limit the capacitance to less than the maximum output capacitance as specified in the electrical specification table. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 11 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Feature Description VIN+ MODULE Remote On/Off R pull-up TM The Austin Lynx II SMT power modules feature an On/Off pin I ON/OFF for remote On/Off operation. Two On/Off logic options are ON/OFF TM available in the Austin Lynx II series modules. Positive Logic + PWM Enable On/Off signal, device code suffix “4”, turns the module ON V ON/OFF R1 during a logic High on the On/Off pin and turns the module OFF during a logic Low. Negative logic On/Off signal, no device code suffix, turns the module OFF during logic High on the Q2 CSS Q1 On/Off pin and turns the module ON during logic Low. R2 For positive logic modules, the circuit configuration for using GND _ the On/Off pin is shown in Figure 28. The On/Off pin is an open collector/drain logic input signal (Von/Off) that is referenced to ground. During a logic-high (On/Off pin is pulled high internal Figure 29. Circuit configuration for using negative logic to the module) when the transistor Q1 is in the Off state, the On/OFF. power module is ON. Maximum allowable leakage current of the transistor when Von/off = V is 10µA. Applying a logic- IN,max low when the transistor Q1 is turned-On, the power module is Overcurrent Protection OFF. During this state VOn/Off must be less than 0.3V. When To provide protection in a fault (output overload) condition, the not using positive logic On/off pin, leave the pin unconnected unit is equipped with internal current-limiting circuitry and can or tie to V IN. endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. The unit operates normally once the output current is brought back into its specified range. The typical average output current during VIN+ MODULE hiccup is 2A. R2 Input Undervoltage Lockout ON/OFF Q2 At input voltages below the input undervoltage lockout limit, + R1 V module operation is disabled. The module will begin to operate ON/OFF I at an input voltage above the undervoltage lockout turn-on ON/OFF PWM Enable threshold. R3 Overtemperature Protection Q1 Q3 CSS To provide over temperature protection in a fault condition, the unit relies upon the thermal protection feature of the controller R4 IC. The unit will shutdown if the thermal reference point Tref, GND _ o exceeds 150 C (typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures Figure 28. Circuit configuration for using positive logic beyond its rating. The module will automatically restart after it On/OFF. cools down. For negative logic On/Off devices, the circuit configuration is shown is Figure 29. The On/Off pin is pulled high with an external pull-up resistor (typical Rpull-up = 5k, +/- 5%). When transistor Q1 is in the Off state, logic High is applied to the On/Off pin and the power module is Off. The minimum On/off voltage for logic High on the On/Off pin is 1.5Vdc. To turn the module ON, logic Low is applied to the On/Off pin by turning ON Q1. When not using the negative logic On/Off, leave the pin unconnected or tie to GND. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 12 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current helps determine the required external trim resistor needed for Feature Descriptions (continued) a specific output voltage. Output Voltage Programming Voltage Margining TM The output voltage of the Austin MicroLynx II SMT can be Output voltage margining can be implemented in the Austin programmed to any voltage from 0.75 Vdc to 3.63 Vdc by TM MicroLynx II modules by connecting a resistor, R , margin-up connecting a single resistor (shown as Rtrim in Figure 30) from the Trim pin to the ground pin for margining-up the between the TRIM and GND pins of the module. Without an output voltage and by connecting a resistor, R , margin-down external resistor between TRIM pin and the ground, the output from the Trim pin to the Output pin for margining-down. voltage of the module is 0.7525 Vdc. To calculate the value of Figure 31 shows the circuit configuration for output voltage the resistor Rtrim for a particular output voltage Vo, use the margining. The POL Programming Tool, available at following equation: www.gecriticalpower.com under the Design Tools section, also calculates the values of Rmargin-up and Rmargin-down for a 21070   Rtrim= − 5110Ω specific output voltage and % margin. Please consult your   Vo− 0.7525   local GE technical representative for additional details. For example, to program the output voltage of the Austin Vo TM MicroLynx II module to 1.8 Vdc, Rtrim is calculated is follows: Rmargin-down  21070  Rtrim= − 5110 Austin Lynx or   1.8− 0.7525   Lynx II Series Rtrim= 15.004kΩ Q2 Trim Vout V (+) V (+) IN O Rmargin-up Rtrim ON/OFF LOAD TRIM Q1 R trim GND GND Figure 31. Circuit Configuration for margining Output Figure 30. Circuit configuration to program output voltage voltage. using an external resistor. Table 1 provides Rtrim values required for some common output voltages. Table 1 V (V) Rtrim (KΩ) O, set 0.7525 Open 1.2 41.973 1.5 23.077 1.8 15.004 2.5 6.947 3.3 3.160 By using a 1% tolerance trim resistor, set point tolerance of ±2% is achieved as specified in the electrical specification. The POL Programming Tool, available at www.gecriticalpower.com under the Design Tools section, October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 13 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Feature Descriptions (continued) Voltage Sequencing TM Austin MicroLynx II series of modules include a sequencing TM feature, EZ-SEQUENCE that enables users to implement various types of output voltage sequencing in their applications. This is accomplished via an additional sequencing pin. When not using the sequencing feature, either tie the SEQ pin to VIN or leave it unconnected. When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the set- point voltage. The SEQ voltage must be set higher than the set-point voltage of the module. The output voltage follows the voltage on the SEQ pin on a one-to-one volt basis. By connecting multiple modules together, customers can get multiple modules to track their output voltages to the voltage applied on the SEQ pin. For proper voltage sequencing, first, input voltage is applied to the module. The On/Off pin of the module is left unconnected (or tied to GND for negative logic modules or tied to VIN for positive logic modules) so that the module is ON by default. After applying input voltage to the module, a minimum of 10msec delay is required before applying voltage on the SEQ pin. During this time, potential of 50mV (± 10 mV) is maintained on the SEQ pin. After 10msec delay, an analog voltage is applied to the SEQ pin and the output voltage of the module will track this voltage on a one-to-one volt bases until output reaches the set-point voltage. To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. Output voltage of the modules tracks the voltages below their set-point voltages on a one-to-one basis. A valid input voltage must be maintained until the tracking and output voltages reach ground potential to ensure a controlled shutdown of the modules. TM When using the EZ-SEQUENCE feature to control start-up of the module, pre-bias immunity feature during start-up is disabled. The pre-bias immunity feature of the module relies on the module being in the diode-mode during start-up. When TM using the EZ-SEQUENCE feature, modules goes through an internal set-up time of 10msec, and will be in synchronous rectification mode when voltage at the SEQ pin is applied. This will result in sinking current in the module if pre-bias voltage is present at the output of the module. When pre-bias immunity TM during start-up is required, the EZ-SEQUENCE feature must TM be disabled. For additional guidelines on using EZ-SEQUENCE TM feature of Austin MicroLynx II , contact GE technical representative for preliminary application note on output voltage sequencing using Austin Lynx II series. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 14 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Thermal Considerations 25.4_ Power modules operate in a variety of thermal environments; Wind Tunnel (1.0) however, sufficient cooling should be provided to help ensure reliable operation. PWBs Power Module Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The test set-up is shown in Figure 33. Note that the 76.2_ airflow is parallel to the long axis of the module as shown in (3.0) figure 32. The derating data applies to airflow in either x direction of the module’s long axis. Probe Location for measuring 7.24_ airflow and (0.285) ambient temperature Air flow Figure 33. Thermal Test Set-up. Heat Transfer via Convection Increased airflow over the module enhances the heat transfer via convection. Thermal derating curves showing the maximum output current that can be delivered by various module versus local ambient temperature (TA) for natural convection and up to 1m/s (200 ft./min) are shown in the Characteristics Curves section. Figure 32. T Temperature measurement location. ref The thermal reference point, Tref 1 used in the specifications of thermal derating curves is shown in Figure 32. For reliable o operation this temperature should not exceed 125 C. The output power of the module should not exceed the rated power of the module (Vo,set x Io,max). Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board-Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 15 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Mechanical Outline Dimensions are in millimeters and (inches). Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated] x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.) Top View Side View Bottom View PIN FUNCTION 1 On/Off 2 VIN 3 SEQ 4 GND 5 Trim 6 VOUT Co-planarity (max): 0.102 [0.004] October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 16 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Recommended Pad Layout Dimensions are in millimeters and (inches). Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated] x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.) Surface Mount Pad Layout – Component side view. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 17 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Packaging Details TM The Austin MicroLynx II SMT versions are supplied in tape & reel as standard. Modules are shipped in quantities of 400 modules per reel. A ll Dimensions are in millimeters and (in inches). Reel Dimensions Outside Dimensions: 330.2 mm (13.00) Inside Dimensions: 177.8 mm (7.00”) Width 44.0 mm (1.73”) October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 18 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Surface Mount Information infrared), or a combination of convection/IR. For reliable Pick and Place soldering the solder reflow profile should be established by TM The Austin MicroLynx II SMT modules use an open frame accurately measuring the modules CP connector construction and are designed for a fully automated temperatures. assembly process. The modules are fitted with a label designed to provide a large surface area for pick and placing. The label meets all the requirements for surface mount processing, as well as safety standards and is able to withstand maximum reflow temperature. The label also carries product information such as product code, serial number and location of manufacture. REFLOW TIME (S) Figure 35. Reflow Profile for Tin/Lead (Sn/Pb) process. F igure 34. Pick and Place Location. Nozzle Recommendations The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and pick & placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 3mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 8 mm max. o Tin Lead Soldering Figure 36. Time Limit Curve Above 205 C for Tin/Lead (Sn/Pb) process. TM The Austin MicroLynx II SMT power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak o reflow temperatures are limited to less than 235 C. o Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 19 MAX TEMP SOLDER (°C) REFLOW TEMP (°C) GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current 300 Surface Mount Information (continued) Per J-STD-020 Rev. D Peak Temp 260°C 250 Lead Free Soldering Reflow Temp (°C) Cooling The –Z version Austin MicroLynx II SMT modules are lead- 200 Zone * Min. Time Above 235°C free (Pb-free) and RoHS compliant and are both forward and 15 Seconds backward compatible in a Pb-free and a SnPb soldering 150 Heating Zone *Time Above 217°C process. Failure to observe the instructions below may 1°C/Second 60 Seconds 100 result in the failure of or cause damage to the modules and can adversely affect long-term reliability. 50 0 Pb-free Reflow Profile Reflow Time (Seconds) Power Systems will comply with J-STD-020 Rev. D Figure 37. Recommended linear reflow profile using (Moisture/Reflow Sensitivity Classification for Nonhermetic Sn/Ag/Cu solder. Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure. 37. MSL Rating The Austin MicroLynx II modules have a MSL rating of 2a. Storage and Handling The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of ≤ 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 20 GE Energy Data Sheet TM 6A Austin MicroLynx II: SMT Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 2. Device Codes Input Output Output Efficiency On/Off Connector Device Code Comcodes Voltage Range Voltage Current 3.3V@ 6A Logic Type ATH006A0X-SR 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Negative SMT 108988358 ATH006A0X-SRZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Negative SMT CC109104535 ATH006A0X4-SR 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Positive SMT 108988366 ATH006A0X4-SRZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% Positive SMT 108996708 -Z refers to RoHS compliant parts Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 1, 2015 ©2015 General Electric Company. All International rights reserved. Version 1.07

Frequently asked questions

How does Electronics Finder differ from its competitors?

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Electronics Finder' parent company, GID Industrial, specializes in procuring industrial parts. We know where to find the rare and obsolete equipment that our customers need in order to get back to business. We stand apart from our competition through our commitment to quality, and look forward to the opportunity to show you how.

Is there a warranty for the ATH006A0X-SRZ?

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The warranty we offer will be based on what we negotiate with our suppliers. Sometimes, a part will be sold as-is and without a warranty. We usually offer a one-year warranty for single board computers in particular because they are our specialty.

Which carrier will Electronics Finder use to ship my parts?

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We use FedEx, UPS, DHL, and USPS. We have accounts with each of them and generally ship using one of those, but we can also ship using your account if you would prefer. We are able to ship with other carriers if you would find it more convenient.

Can I buy parts from Electronics Finder if I am outside the USA?

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Electronics Finder will definitely serve you. We work with international clients all the time, which means we are regularly shipping goods all across the globe.

Which payment methods does Electronics Finder accept?

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Visa, MasterCard, Discover, and American Express are all accepted by Electronics Finder. We will also accept payment made with wire transfer or PayPal. Checks will only be accepted from customers in the USA. Terms may be offered (upon approval) for larger orders.

Why buy from GID?

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Protection

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What they say about us

FANTASTIC RESOURCE

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One of our top priorities is maintaining our business with precision, and we are constantly looking for affiliates that can help us achieve our goal. With the aid of GID Industrial, our obsolete product management has never been more efficient. They have been a great resource to our company, and have quickly become a go-to supplier on our list!

Bucher Emhart Glass

EXCELLENT SERVICE

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With our strict fundamentals and high expectations, we were surprised when we came across GID Industrial and their competitive pricing. When we approached them with our issue, they were incredibly confident in being able to provide us with a seamless solution at the best price for us. GID Industrial quickly understood our needs and provided us with excellent service, as well as fully tested product to ensure what we received would be the right fit for our company.

Fuji

HARD TO FIND A BETTER PROVIDER

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Our company provides services to aid in the manufacture of technological products, such as semiconductors and flat panel displays, and often searching for distributors of obsolete product we require can waste time and money. Finding GID Industrial proved to be a great asset to our company, with cost effective solutions and superior knowledge on all of their materials, it’d be hard to find a better provider of obsolete or hard to find products.

Applied Materials

CONSISTENTLY DELIVERS QUALITY SOLUTIONS

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Over the years, the equipment used in our company becomes discontinued, but they’re still of great use to us and our customers. Once these products are no longer available through the manufacturer, finding a reliable, quick supplier is a necessity, and luckily for us, GID Industrial has provided the most trustworthy, quality solutions to our obsolete component needs.

Nidec Vamco

TERRIFIC RESOURCE

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This company has been a terrific help to us (I work for Trican Well Service) in sourcing the Micron Ram Memory we needed for our Siemens computers. Great service! And great pricing! I know when the product is shipping and when it will arrive, all the way through the ordering process.

Trican Well Service

GO TO SOURCE

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When I can't find an obsolete part, I first call GID and they'll come up with my parts every time. Great customer service and follow up as well. Scott emails me from time to time to touch base and see if we're having trouble finding something.....which is often with our 25 yr old equipment.

ConAgra Foods

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