Data Sheet GE Energy TM 6A Austin MicroLynx II : SIP Non-Isolated DC-DC Power Module 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Features RoHS Compliant  Compliant to RoHS EU Directive 2011/65/EU (-Z versions)  Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this product will no longer be RoHS compliant (non-Z versions) TM  Flexible output voltage sequencing EZ-SEQUENCE  Delivers up to 6A output current  High efficiency – 96% at 3.3V full load (VIN = 5.0V) TM EZ-SEQUENCE  Small size and low profile: 25.4 mm x 12.7mm x 6.68 mm Applications (1.00 in x 0. 5 in x 0.263 in)  Low output ripple and noise  Distributed power architectures  High Reliability:  Intermediate bus voltage applications o Calculated MTBF = 12.8M hours at 25 C Full-load  Telecommunications equipment  Programmable Output voltage  Servers and storage applications  Line Regulation: 0.3% (typical)  Networking equipment  Load Regulation: 0.4% (typical)  Enterprise Networks  Temperature Regulation: 0.4 % (typical)  Latest generation IC’s (DSP, FPGA, ASIC) and Microprocessor powered applications  Remote On/Off  Output overcurrent protection (non-latching)  Wide operating temperature range (-40°C to 85°C) †  UL* 60950-1Recognized, CSA C22.2 No. 60950-1-03 ‡ Certified, and VDE 0805:2001-12 (EN60950-1) Licensed  ISO** 9001 and ISO 14001 certified manufacturing facilities Description TM Austin MicroLynx II SIP power modules are non-isolated dc-dc converters that can deliver up to 6A of output current with full load efficiency of 96.0% at 3.3V output. These modules provide a precisely regulated output voltage programmable via an external resistor from 0.75Vdc to 3.63Vdc over a wide range of input voltage (VIN = 2.4 – 5.5Vdc). TM TM Austin MicroLynx II has a sequencing feature, EZ-SEQUENCE that enable designers to implement various types of output voltage sequencing when powering multiple modules on board. Their open-frame construction and small footprint enable designers to develop cost- and space-efficient solutions. In addition to sequencing, standard features include remote On/Off, programmable output voltage and over current protection. * UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards October 1, 2015 ©2015 General Electric Company. All rights reserved. GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage All VIN -0.3 5.8 Vdc Continuous Sequencing voltage All Vseq -0.3 VIN,max Vdc Operating Ambient Temperature All TA -40 85 °C (see Thermal Considerations section) Storage Temperature All Tstg -55 125 °C Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage Vo,set ≤ 3.63 VIN 2.4  5.5 Vdc Maximum Input Current All IIN,max Adc (VIN= VIN, min to VIN, max, IO=IO, max ) 6.0 Input No Load Current V = 0.75 Vdc I 20 mA O,set IN,No load (V = V , Io = 0, module enabled) V = 3.3Vdc I 45 mA IN IN, nom O,set IN,No load Input Stand-by Current All IIN,stand-by 0.6 mA (V = V , module disabled) IN IN, nom 2 2 Inrush Transient All I t 0.04 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V to V All 35 mAp-p IN, min IN, max, IO= IOmax ; See Test configuration section) Input Ripple Rejection (120Hz) All 30 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of a complex power architecture. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 2 GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Output Voltage Set-point All V -2.0 +2.0 % V O, set  O, set (VIN=IN, min, IO=IO, max, TA=25°C) Output Voltage All VO, set –3.0  +3.0 % VO, set (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range All VO 0.7525 3.63 Vdc Selected by an external resistor Output Regulation Line (VIN=VIN, min to VIN, max) All  0.3  % VO, set Load (IO=IO, min to IO, max) All  0.4  % VO, set Temperature (Tref=TA, min to TA, max) All  0.4  % VO, set Output Ripple and Noise on nominal output (VIN=VIN, nom and IO=IO, min to IO, max Cout = 1μF ceramic//10μFtantalum capacitors) RMS (5Hz to 20MHz bandwidth) All  10 15 mVrms Peak-to-Peak (5Hz to 20MHz bandwidth) All  40 50 mVpk-pk External Capacitance ESR ≥ 1 mΩ All CO, max   1000 μF ESR ≥ 10 mΩ All CO, max   3000 μF Output Current All Io 0 6 Adc Output Current Limit Inception (Hiccup Mode ) All IO, lim  220  % Io (V = 90% of V ) O O, set Output Short-Circuit Current All I 2 Adc O, s/c   (V ≤250mV) ( Hiccup Mode ) O VO, set = Efficiency η 81.0 % 0.75Vdc V = V , T =25°C V = 1.2Vdc η 87.0 % IN IN, nom A O, set I =I V = V V = 1.5Vdc η 89.0 % O O, max , O O,set O,set V = 1.8Vdc η 90.0 % O,set V = 2.5Vdc η 93.0 % O,set V = 3.3Vdc η 96.0 % O,set Switching Frequency All f 300 kHz sw   Dynamic Load Response (dIo/dt=2.5A/µs; V = V ; T =25°C) All V 130 mV IN IN, nom A pk   Load Change from Io= 50% to 100% of Io,max; 1μF ceramic// 10 μF tantalum Peak Deviation Settling Time (Vo<10% peak deviation) All t 25 s   µs All V 130 mV (dIo/dt=2.5A/µs; VIN = VIN, nom; TA=25°C) pk   Load Change from Io= 100% to 50%of Io,max: 1μF ceramic// 10 μF tantalum Peak Deviation Settling Time (Vo<10% peak deviation) All t  25  µs s October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 3 GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Dynamic Load Response (dIo/dt=2.5A/µs; V V = V ; T =25°C) All V  50  mV IN IN, nom A pk Load Change from Io= 50% to 100% of Io,max; Co = 2x150 μF polymer capacitors Peak Deviation Settling Time (Vo<10% peak deviation) All t 50 s   µs All V 50 mV (dIo/dt=2.5A/µs; VIN = VIN, nom; TA=25°C) pk   Load Change from Io= 100% to 50%of Io,max: Co = 2x150 μF polymer capacitors Peak Deviation Settling Time (Vo<10% peak deviation) All t 50 s   µs General Specifications Parameter Min Typ Max Unit Calculated MTBF (I =I , T =25°C) 12,841,800 Hours O O, max A per Telecordia SR-332 Issue 1: Method 1 Case 3 Weight 2.8 (0.1) g (oz.)   October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 4 GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit On/Off Signal interface Device code with Suffix “4” – Positive logic (On/Off is open collector/drain logic input; Signal referenced to GND - See feature description section) Input High Voltage (Module ON) All VIH ― ― VIN, max V Input High Current All IIH ― ― 10 μA Input Low Voltage (Module OFF) All VIL -0.2 ― 0.3 V Input Low Current All IIL ― 0.2 1 mA Device Code with no suffix – Negative Logic (On/OFF pin is open collector/drain logic input with external pull-up resistor; signal referenced to GND) Input High Voltage (Module OFF) All VIH 1.5 ― V Vdc IN,max Input High Current All IIH 0.2 1 mA Input Low Voltage (Module ON) All VIL -0.2 ― 0.3 Vdc Input low Current All IIL ― 10 μA Turn-On Delay and Rise Times o (IO=IO, max , VIN = VIN, nom, TA = 25 C, ) All Tdelay ― 3.9 ― msec Case 1: On/Off input is set to Logic Low (Module ON) and then input power is applied (delay from instant at which VIN =VIN, min until Vo=10% of Vo,set) All Tdelay ― 3.9 ― msec Case 2: Input power is applied for at least one second and then the On/Off input is set to logic Low (delay from instant at which Von/Off=0.3V until Vo=10% of Vo, set) All Trise ― 4.2 8.5 msec Output voltage Rise time (time for Vo to rise from 10% of Vo,set to 90% of Vo, set) 1 Output voltage overshoot – Startup ― % VO, set o IO= IO, max; VIN = 2.4 to 5.5Vdc, TA = 25 C Sequencing Delay time TsEQ- Delay from V to application of voltage on SEQ pin All 10 msec IN, min delay |VSEQ –Vo Tracking Accuracy (Power-Up: 2V/ms) All 100 200 mV | |VSEQ –Vo (Power-Down: 1V/ms) All 200 400 mV | (VIN, min to VIN, max; IO, min to IO, max VSEQ < Vo) Overtemperature Protection All T 150 °C ref   (See Thermal Consideration section) Input Undervoltage Lockout Turn-on Threshold All 2.2 V Turn-off Threshold All 2.0 V October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 5 GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves TM The following figures provide typical characteristics for the Austin MicroLynx II SIP modules at 25ºC. 98 91 95 88 92 85 89 82 86 79 IN V =2.4V 83 IN 76 V =2.4V IN 80 V =5V IN V =5V 73 77 IN V =5.5V IN V =5.5V 70 74 0 1 2 3 4 5 6 0 1 2 3 4 5 6 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Figure 1. Converter Efficiency versus Output Current (Vout Figure 4. Converter Efficiency versus Output Current (Vout = 0.75Vdc). = 1.8Vdc). 94 98 91 95 88 92 85 89 82 86 IN V =2.4V 79 83 IN IN V =3V V =5V 76 80 IN IN V =5.5V V =5V 77 73 VIN=5.5V 74 70 0 1 2 3 4 5 6 0 1 2 3 4 5 6 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Figure 2. Converter Efficiency versus Output Current (Vout Figure 5. Converter Efficiency versus Output Current (Vout = 1.2Vdc). = 2.5Vdc). 94 98 91 95 88 92 85 89 82 86 VIN=2.4V 79 83 IN V =5V IN V =4.5V 76 80 IN V =5.5V IN V =5V 73 77 IN V =5.5V 70 74 0 1 2 3 4 5 6 0 1 2 3 4 5 6 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Figure 3. Converter Efficiency versus Output Current (Vout Figure 6. Converter Efficiency versus Output Current (Vout = 1.5Vdc). = 3.3Vdc). October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 6 EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) EFFICIENCY, η (%) GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves (continued) TM The following figures provide typical characteristics for the MicroLynx II SIP modules at 25ºC. 7 Io=6A 6 Io=3A 5 Io=0A 4 3 2 1 0 1 1.75 2.5 3.25 4 4.75 5.5 INPUT VOLTAGE, V (V) IN TIME, t (5 µs/div) Figure 7. Input voltage vs. Input Current Figure 10. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 3.3Vdc). (Vout =2.5Vdc). TIME, t (2µs/div) TIME, t (5 µs/div) Figure 8. Typical Output Ripple and Noise Figure 11. Transient Response to Dynamic Load Change from 100% to 50% of full load (Vo = 3.3 Vdc). (Vin = 5.0V dc, Vo = 0.75 Vdc, Io=6A). TIME, t (2µs/div) TIME, t (10µs/div) Figure 9. Typical Output Ripple and Noise Figure 12. Transient Response to Dynamic Load Change from 50% to 100% of full load (Vo = 3.3 Vdc, Cext = 2x150 (Vin = 5.0V dc, Vo = 3.3 Vdc, Io=6A). μF Polymer Capacitors). October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 7 OUTPUT VOLTAGE OUTPUT VOLTAGE INPUT CURRENT, I (A) VO (V) (20mV/div) VO (V) (20mV/div) IN OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE IO (A) (2A/div) VO (V) (100mV/div) IO (A) (2A/div) VO (V) (100mV/div) IO (A) (2A/div) VO (V) (100mV/div) GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves (continued) TM The following figures provide typical characteristics for the Austin MicroLynx II SIP modules at 25ºC. TIME, t (10µs/div) TIME, t (2 ms/div) Figure 13. Transient Response to Dynamic Load Change Figure 16. Typical Start-Up with application of Vin from 100% of 50% full load (Vo = 3.3Vdc, Cext = 2x150 μF (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A). Polymer Capacitors). TIME, t (2 ms/div) Figure 14. Typical Start-Up Using Remote On/Off Figure 17 Typical Start-Up Using Remote On/Off with Prebias (Vin = 3.3Vdc, Vo = 1.8Vdc, Io = 1.0A, Vbias =1.0Vdc). (Vin = 5.0Vdc, Vo = 3.3Vdc, Io = 6A). TIME, t (2 ms/div) TIME, t (5ms/div) Figure 15. Typical Start-Up Using Remote On/Off with Low- Figure 18. Output short circuit Current ESR external capacitors (7x150uF Polymer) (Vin = 5.0Vdc, Vo (Vin = 5.0Vdc, Vo = 0.75Vdc). = 3.3Vdc, Io = 6A, Co = 1050µF). October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 8 OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT CURRENT, OUTPUTVOLTAGE VOV) (1V/div) VOn/off (V) (2V/div) VOV) (1V/div) VOn/off (V) (2V/div) IO (A) (2A/div) VO (V) (100mV/div) OUTPUT CURRENT, OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE, INPUT VOLTAGE IO (A) (5A/div) VOV) (1V/div) VOn/off (V) (2V/div) Vo (V) (1V/div) VIN (V) (2V/div) GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Characteristic Curves (continued) TM The following figures provide thermal derating curves for the Austin MicroLynx II SIP modules. 7.5 8 6.0 6 4.5 5 NC NC 3.0 3 0.5m/s (100 LFM) 0.5m/s (100 LFM) 1.5 2 1.0m/s (200 LFM) 1.0m/s (200 LFM) 0.0 0 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 O O AMBIENT TEMPERATURE, TA C AMBIENT TEMPERATURE, TA C Figure 19. Derating Output Current versus Local Ambient Figure 22. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0, Vo=3.3Vdc). Temperature and Airflow (Vin = 3.3dc, Vo=0.75 Vdc). 7.5 6.0 4.5 NC 3.0 0.5m/s (100 LFM) 1.5 1.0m/s (200 LFM) 0.0 20 30 40 50 60 70 80 90 O AMBIENT TEMPERATURE, T C A Figure 20. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 5.0Vdc, Vo=0.75 Vdc). 7.5 6.0 4.5 NC 3.0 0.5m/s (100 LFM) 1.5 1.0m/s (200 LFM) 0.0 20 30 40 50 60 70 80 90 O AMBIENT TEMPERATURE, TA C Figure 21. Derating Output Current versus Local Ambient Temperature and Airflow (Vin = 3.3Vdc, Vo=2.5 Vdc). Test Configurations October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current CURRENT PROBE TO OSCILLOSCOPE Design Considerations LTEST Input Filtering VIN(+) 1μH TM The Austin MicroLynx II SIP module should be connected to a low-impedance source. A highly inductive source can C IN CS 1000μF Electrolytic affect the stability of the module. An input capacitance 2x100μF E.S.R.<0.1Ω must be placed directly adjacent to the input pin of the Tantalum @ 20°C 100kHz module, to minimize input ripple voltage and ensure COM module stability. NOTE: Measure input reflected ripple current with a simulated source inductance (L ) of 1μH. Capacitor C offsets To minimize input voltage ripple, low-ESR polymer and TEST S possible battery impedance. Measure current as shown ceramic capacitors are recommended at the input of the above. module. Figure 26 shows the input ripple voltage (mVp-p) Figure 23. Input Reflected Ripple Current Test Setup. for various outputs with 1x150 µF polymer capacitors (Panasonic p/n: EEFUE0J151R, Sanyo p/n: 6TPE150M) in parallel with 1 x 47 µF ceramic capacitor (Panasonic p/n: COPPER STRIP ECJ-5YB0J476M, Taiyo- Yuden p/n: CEJMK432BJ476MMT) V (+) RESISTIVE at full load. Figure 27 shows the input ripple with 2x150 µF O LOAD polymer capacitors in parallel with 2 x 47 µF ceramic 1uF . 10uF SCOPE capacitor at full load. COM 120 100 GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then 80 Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. 60 Figure 24. Output Ripple and Noise Test Setup. 40 Vin = 3.3V 20 R R R R distribution contact contact distribution Vin = 5.0V VIN(+) VO 0 0 1 2 3 4 RLOAD V V IN O Output Voltage (Vdc) Figure 26. Input ripple voltage for various output with 1x150 Rdistribution Rcontact Rcontact Rdistribution µF polymer and 1x47 µF ceramic capacitors at the input COM COM (80% of Io,max). 120 NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals 100 to avoid measurement errors due to socket contact resistance. 80 Figure 25. Output Voltage and Efficiency Test Setup. 60 VO. IO 40 Efficiency = x 100 % η V . I IN IN Vin = 3.3V 20 Vin = 5.0V 0 0 1 2 3 4 Output Voltage (Vdc) Figure 27. Input ripple voltage for various output with 2x150 µF polymer and 2x47 µF ceramic capacitors at the input (80% of Io,max). October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 10 BATTERY Input Ripple Voltage (mVp-p) Input Ripple Voltage (mVp-p) GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Design Considerations (continued) Safety Considerations Output Filtering For safety agency approval the power module must be installed in compliance with the spacing and separation TM The Austin MicroLynx II SIP module is designed for low output requirements of the end-use safety agency standards, i.e., UL ripple voltage and will meet the maximum output ripple 60950-1, CSA C22.2 No. 60950-1-03, and VDE 0850:2001-12 specification with 1 µF ceramic and 10 µF tantalum capacitors (EN60950-1) Licensed. at the output of the module. However, additional output filtering may be required by the system designer for a number of reasons. First, there may be a need to further reduce the For the converter output to be considered meeting the output ripple and noise of the module. Second, the dynamic requirements of safety extra-low voltage (SELV), the input response characteristics may need to be customized to a must meet SELV requirements. The power module has extra- particular load step change. low voltage (ELV) outputs when all inputs are ELV. The input to these units is to be provided with a fast-acting fuse with a maximum rating of 6A in the positive input lead. To reduce the output ripple and improve the dynamic response to a step load change, additional capacitance at the output can be used. Low ESR polymer and ceramic capacitors are recommended to improve the dynamic response of the module. For stable operation of the module, limit the capacitance to less than the maximum output capacitance as specified in the electrical specification table. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 11 GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Feature Description VIN+ MODULE Remote On/Off R pull-up TM The Austin Lynx II SIP power modules feature an On/Off pin I ON/OFF for remote On/Off operation. Two On/Off logic options are ON/OFF TM available in the Austin Lynx II series modules. Positive Logic + PWM Enable On/Off signal, device code suffix “4”, turns the module ON V ON/OFF R1 during a logic High on the On/Off pin and turns the module OFF during a logic Low. Negative logic On/Off signal, no device code suffix, turns the module OFF during logic High on the Q2 CSS Q1 On/Off pin and turns the module ON during logic Low. R2 For positive logic modules, the circuit configuration for using the On/Off pin is shown in Figure 28. The On/Off pin is an open GND _ collector/drain logic input signal (Von/Off) that is referenced to ground. During a logic-high (On/Off pin is pulled high internal Figure 29. Circuit configuration for using negative logic to the module) when the transistor Q1 is in the Off state, the On/OFF. power module is ON. Maximum allowable leakage current of the transistor when Von/off = VIN,max is 10µA. Applying a logic- low when the transistor Q1 is turned-On, the power module is Overcurrent Protection OFF. During this state VOn/Off must be less than 0.3V. When To provide protection in a fault (output overload) condition, the not using positive logic On/off pin, leave the pin unconnected unit is equipped with internal current-limiting circuitry and can or tie to VIN. endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. The unit operates normally once the output current is brought back into its specified range. The typical average output current during VIN+ MODULE hiccup is 2A. R2 Input Undervoltage Lockout ON/OFF Q2 At input voltages below the input undervoltage lockout limit, + R1 V module operation is disabled. The module will begin to operate ON/OFF I at an input voltage above the undervoltage lockout turn-on ON/OFF PWM Enable threshold. R3 Overtemperature Protection Q1 Q3 CSS To provide over temperature protection in a fault condition, the unit relies upon the thermal protection feature of the controller R4 IC. The unit will shutdown if the thermal reference point T , ref GND _ o exceeds 150 C (typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures Figure 28. Circuit configuration for using positive logic beyond its rating. The module will automatically restart after it On/OFF. cools down. For negative logic On/Off devices, the circuit configuration is shown is Figure 29. The On/Off pin is pulled high with an external pull-up resistor (typical Rpull-up = 5k, +/- 5%). When transistor Q1 is in the Off state, logic High is applied to the On/Off pin and the power module is Off. The minimum On/off voltage for logic High on the On/Off pin is 1.5Vdc. To turn the module ON, logic Low is applied to the On/Off pin by turning ON Q1. When not using the negative logic On/Off, leave the pin unconnected or tie to GND. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 12 GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Voltage Margining Feature Descriptions (continued) Output voltage margining can be implemented in the Austin Output Voltage Programming TM MicroLynx II modules by connecting a resistor, Rmargin-up, TM The output voltage of the Austin MicroLynx II SIP can be from the Trim pin to the ground pin for margining-up the programmed to any voltage from 0.75 Vdc to 3.3 Vdc by output voltage and by connecting a resistor, Rmargin-down, connecting a single resistor (shown as Rtrim in Figure 30) from the Trim pin to the Output pin for margining-down. between the TRIM and GND pins of the module. Without an Figure 31 shows the circuit configuration for output voltage external resistor between TRIM pin and the ground, the output margining. The POL Programming Tool, available at voltage of the module is 0.7525 Vdc. To calculate the value of www.gecriticalpower.com under the Design Tools section, the resistor Rtrim for a particular output voltage Vo, use the also calculates the values of Rmargin-up and Rmargin-down for a following equation: specific output voltage and % margin. Please consult your local GE technical representative for additional details.  21070  Rtrim= − 5110Ω   Vo− 0.7525   Vo Rmargin-down For example, to program the output voltage of the Austin TM MicroLynx II module to 1.8 Vdc, Rtrim is calculated is follows: Austin Lynx or Lynx II Series  21070  Rtrim= − 5110 Q2   1.8− 0.7525   Trim Rtrim= 15.004kΩ Rmargin-up Vout V (+) V (+) IN O Rtrim Q1 ON/OFF LOAD TRIM GND R trim Figure 31. Circuit Configuration for margining Output GND voltage. Figure 30. Circuit configuration to program output voltage using an external resistor. Table 1 provides Rtrim values required for some common output voltages. Table 1 V (V) Rtrim (KΩ) O, set 0.7525 Open 1.2 41.973 1.5 23.077 1.8 15.004 2.5 6.947 3.3 3.160 By using a 1% tolerance trim resistor, set point tolerance of ±2% is achieved as specified in the electrical specification. The POL Programming Tool, available at www.gecriticalpower.com under the Design Tools section, helps determine the required external trim resistor needed for a specific output voltage. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 13 GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Feature Descriptions (continued) Voltage Sequencing TM Austin MicroLynx II series of modules include a sequencing TM feature, EZ-SEQUENCE that enables users to implement various types of output voltage sequencing in their applications. This is accomplished via an additional sequencing pin. When not using the sequencing feature, either IN or leave it unconnected. tie the SEQ pin to V When an analog voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the set- point voltage. The SEQ voltage must be set higher than the set-point voltage of the module. The output voltage follows the voltage on the SEQ pin on a one-to-one volt basis. By connecting multiple modules together, customers can get multiple modules to track their output voltages to the voltage applied on the SEQ pin. For proper voltage sequencing, first, input voltage is applied to the module. The On/Off pin of the module is left unconnected (or tied to GND for negative logic modules or tied to VIN for positive logic modules) so that the module is ON by default. After applying input voltage to the module, a minimum of 10msec delay is required before applying voltage on the SEQ pin. During this time, potential of 50mV (± 10 mV) is maintained on the SEQ pin. After 10msec delay, an analog voltage is applied to the SEQ pin and the output voltage of the module will track this voltage on a one-to-one volt bases until output reaches the set-point voltage. To initiate simultaneous shutdown of the modules, the SEQ pin voltage is lowered in a controlled manner. Output voltage of the modules tracks the voltages below their set-point voltages on a one-to-one basis. A valid input voltage must be maintained until the tracking and output voltages reach ground potential to ensure a controlled shutdown of the modules. TM When using the EZ-SEQUENCE feature to control start-up of the module, pre-bias immunity feature during start-up is disabled. The pre-bias immunity feature of the module relies on the module being in the diode-mode during start-up. When TM using the EZ-SEQUENCE feature, modules goes through an internal set-up time of 10msec, and will be in synchronous rectification mode when voltage at the SEQ pin is applied. This will result in sinking current in the module if pre-bias voltage is present at the output of the module. When pre-bias immunity TM during start-up is required, the EZ-SEQUENCE feature must TM be disabled. For additional guidelines on using EZ-SEQUENCE TM feature of Austin MicroLynx II , contact GE technical representative for preliminary application note on output voltage sequencing using Austin Lynx II series. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 14 GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current The output power of the module should not exceed the rated Thermal Considerations power of the module (Vo,set x Io,max). Power modules operate in a variety of thermal environments; Please refer to the Application Note “Thermal Characterization however, sufficient cooling should be provided to help ensure Process For Open-Frame Board-Mounted Power Modules” for a reliable operation. detailed discussion of thermal aspects including maximum Considerations include ambient temperature, airflow, module device temperatures. power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The test set-up is shown in Figure 33. Note that the airflow is parallel to the long axis of the module as shown in figure 32. The derating data applies to airflow in either direction of the module’s long axis. Figure 33. Thermal Test Set-up. Heat Transfer via Convection Increased airflow over the module enhances the heat transfer via convection. Thermal derating curves showing the maximum output current that can be delivered by various module versus local ambient temperature (TA) for natural convection and up to 1m/s (200 ft./min) are shown in the Characteristics Curves section. Figure 32. T Temperature measurement location. ref The thermal reference point, T used in the specifications of ref 1 thermal derating curves is shown in Figure 32. For reliable o operation this temperature should not exceed 125 C. 25.4_ Wind Tunnel (1.0) Post solder Cleaning and Drying PWBs Considerations Power Module Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, 76.2_ cleaning and drying procedures, refer to Board Mounted Power (3.0) Modules: Soldering and Cleaning Application Note. x Probe Location for measuring 7.24_ airflow and (0.285) ambient October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 15 temperature Air flow GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current processes. A maximum preheat rate of 3°C/s is suggested. The Through-Hole Lead-Free Soldering wave preheat process should be such that the temperature of Information the power module board is kept below 210°C. For Pb solder, the recommended pot temperature is 260°C, while the Pb-free The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. solder pot is 270°C max. Not all RoHS-compliant through-hole They are designed to be processed through single or dual wave products can be processed with paste-through-hole Pb or Pb- soldering machines. The pins have an RoHS-compliant finish free reflow process. If additional information is needed, please that is compatible with both Pb and Pb-free wave soldering consult with your GE technical representative for more details. October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 16 GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Mechanical Outline Dimensions are in millimeters and (inches). Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated] x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.) Top View Side View Bottom View PIN FUNCTION 1 Vo 2 Trim 3 GND A SEQ 4 VIN 5 On/Off October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 17 GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Recommended Pad Layout Dimensions are in millimeters and (inches). Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [unless otherwise indicated] x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.) PIN FUNCTION 1 Vo 2 Trim 3 GND A SEQ 4 VIN 5 On/Off Through-Hole Pad Layout – Back view October 1, 2015 ©2015 General Electric Company. All rights reserved. Page 18 GE Energy Data Sheet TM 6A Austin MicroLynx II: SIP Non-Isolated DC-DC Power Modules 2.4Vdc –5.5Vdc input; 0.75Vdc to 3.63Vdc output; 6A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 2. Device Codes Input Output Output Efficiency Connector Device Code Comcodes Voltage Voltage Current 3.3V@ 6A Type ATH006A0X 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% SIP 108989018 ATH006A0XZ 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% SIP CC109104717 ATH006A0X4 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% SIP 108989026 ATH006A0X4Z 2.4 – 5.5Vdc 0.75 – 3.63Vdc 6 A 96.0% SIP CC109104725 -Z refers to RoHS-compliant versions. Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 1, 2015 ©2015 General Electric Company. All International rights reserved. Version 1.24