Data Sheet GE EHHD006A0B Hammerhead* Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Features  Compliant to RoHS II EU “Directive 2011/65/EU (-Z versions)  Compliant to REACH Directive (EC) No 1907/2006  Flat and high-efficiency curve  Industry standard, DOSA compliant footprint 57.9mm x 22.8mm x 7.6mm (2.28 in x 0.9 in x 0.30 in)  Low-profile height and reduced component skyline  Ultra-wide input voltage range: 18-75 V dc  Tightly regulated output  Remote sense  Output voltage adjust: 90% to 110% of V O,nom RoHS Compliant  Constant switching frequency  Positive remote On/Off logic Applications  Input under/overvoltage protection  Distributed Power Architectures  Output overcurrent and overvoltage protection  Wireless Networks  Overtemperature protection  Access and Optical Network Equipment  No reverse current during output shutdown  Wide operating temperature range (-40°C to 85°C)  Industrial Equipment  Suitable for cold wall cooling using suitable Gap Pad applied directly to top side of module #  ANSI/UL 60950-1-2011 and CAN/CSA† C22.2 No. 60950-1- 07, Second Edition + A1:2011 (MOD), dated March 19, 2011; ‡ and DIN EN 60950-1 (VDE 0805 Teil 1):2011-01; EN 60950- Options 1:2006 + A11:2009 + A1:2010, DIN EN 60950-1/A12 (VDE  Negative Remote On/Off logic (preferred) 0805-1/A12):2011-08; EN 60950-1/A12:2011-02, IEC 60950- 1(ed.2);am1:2009  Overcurrent/Overtemperature/Overvoltage protections § (Auto-restart) (preferred)  CE mark meets 2006/95/EC directive  Heat plate version (-H)  Meets the voltage and current requirements for ETSI 300- 132-2 and complies with and licensed for basic insulation  Surface Mount version (-S) rating per EN60950-1 ¤  2250 Vdc Isolation tested in compliance with IEEE 802.3 PoE standards **  ISO 9001 and ISO 14001 certified manufacturing facilities Description The EHHD006A0B Series, eighth-brick, low-height power modules are isolated DC-DC converters that provide a single, precisely regulated output voltage over an ultra-wide input voltage range of 18-75V . The EHHD006A0B provides 12V nominal output dc dc voltage rated for 6Adc output current. The module incorporates GE’s vast heritage for reliability and quality, while also using the latest in technology and component and process standardization to achieve highly competitive cost. The open frame module construction, available in both surface mount and through-hole packaging, enables designers to develop cost and space efficient solutions. The module achieves typical full load efficiency greater than 92% at VIN=24Vdc and greater than 90% at VIN=48Vdc. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection. An optional heat plate allows for external standard, eighth-brick heat sink attachment to achieve higher output current in high temperature applications. * Trademark Of General Electric Company # UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. § This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 1 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All VIN -0.3 80 Vdc Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc Operating Ambient Temperature All T -40 85 °C A (see Thermal Considerations section) Storage Temperature All T -55 125 °C stg Altitude All 4000 m I/O Isolation Voltage (100% factory Hi-Pot tested) All   2250 V dc * For higher altitude applications, contact your GE Sales Representative for alternative conditions of use. Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All V 18 24/48 75 V IN dc Maximum Input Current All IIN 4.4 5.0 Adc (V = V to V , V = V , I =I ) IN IN, min IN, max O O, set O O, max Input No Load Current All IIN,No load 80 mA (VIN = 48V, IO = 0, module enabled) Input Stand-by Current All I 5 8 mA IN,stand-by (VIN = 48V, module disabled) 2 2 Inrush Transient All It 0.5 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO= IOmax ; See All 30 mAp-p test configuration section) Input Ripple Rejection (120Hz) All 50 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 10 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum DC input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 2 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Nominal Output Voltage Set-point All VO, set 11.80 12.00 12.24 Vdc VIN= 24V to 48V IO=IO, max, TA=25°C) Output Voltage All VO 11.64  12.36 Vdc (Overall operating input voltage, resistive load, and temperature conditions until end of life) Output Regulation Line (V =V to V) All   ±0.2 % V IN IN, min IN, max O, set All Load (IO=IO, min to IO, max)   ±0.2 % VO, set Temperature (T =T to T) All % V ref A, min A, max   ±1.0 O, set Output Ripple and Noise (V =V to V , I = I , T =T to T) IN IN, min IN, max O O, max A A, min A, max RMS (5Hz to 20MHz bandwidth) All  25 50 mVrms Peak-to-Peak (5Hz to 20MHz bandwidth) All 75 200 mV  pk-pk External Capacitance All CO, max 0  2,000 μF Output Current All IO 0 6 Adc Output Current Limit Inception (Hiccup Mode ) I O, lim All 6.6 7.8 9.0 Adc (VO= 90% of VO, set) Output Short-Circuit Current All I 5 A O, s/c rms (V≤250mV) ( Hiccup Mode ) O Efficiency V =24V, T =25°C, I =3A, V = 12V All η 90.0 % IN A O O V =24V, T =25°C, I =6A, V = 12V All η 92.5 % IN A O O VIN=48V, TA=25°C, IO=3A, VO = 12V All η 90.0 % VIN=48V, TA=25°C, IO=6A, VO = 12V All η 90.5 % Switching Frequency All fsw 280 kHz Dynamic Load Response (dI /dt=0.1A/s; V = 24V or 48V; T =25°C; C >100μF) o IN A O Load Change from Io= 50% to 75% or 25% to 50% of I o,max Peak Deviation All Vpk  3  % VO, set Settling Time (Vo<10% peak deviation) All t 200 s   s Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All C 1000 pF iso   Isolation Resistance All Riso 100   MΩ I/O Isolation Voltage (100% factory Hi-pot tested) All All   2250 Vdc General Specifications Parameter Device Symbol Min Typ Max Unit 9 All FIT 169.9 10 /Hours Calculated Reliability based upon Telcordia SR-332 Issue 3: Method I Case 3 (IO=80%IO, max, TA=40°C, airflow = 200 lfm, 90% confidence) All MTBF 5,887,341 Hours Weight (Open Frame) All 19 (0.7) g (oz.) Weight (with Heat Plate) All 30 (1.1) g (oz.) July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 3 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (V =V to V ; open collector or equivalent, IN IN, min IN, max Signal referenced to Vterminal) IN- Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All Ion/off   0.15 mA Logic Low - On/Off Voltage All V -0.7 0.6 V on/off  dc Logic High Voltage – (Typ = Open Collector) All V 2.5 6.7 V on/off  dc Logic High maximum allowable leakage current All Ion/off   25 μA Turn-On Delay and Rise Times o (I =I V =V T = 25C) O O, max , IN IN, nom, A Case 1: Input power is applied for at least 1 second then the On/Off input is set from OFF to ON All T — 12 — msec delay (T = On/Off pin transition until V = 10% of V ) delay O O, set Case 2: On/Off input is set to Logic Low (Module ON) then input power is applied All Tdelay — 25 35 msec (T = V reaches V until V =10% of V ) delay IN IN, min o O,set Output voltage Rise time (time for V to rise from 10% o All T — 15 25 msec rise of Vo,set to 90% of Vo, set) Output Voltage Overshoot – Startup All — 3 % V O, set o I = I ; V =V to V , T = 25 C O O, max IN IN, min IN, max A Remote Sense Range All V 10 % V SENSE O, set Output Voltage Adjustment Range All 90 110 % VO, set Output Overvoltage Protection All V 13.8 16.5 V O, limit  dc Overtemperature Protection – Hiccup Auto Restart Open O T 135 C ref frame Heat O Heat Plate Tref 120 C Plate Input Undervoltage Lockout All VUVLO Turn-on Threshold  17 18 Vdc Turn-off Threshold 14 15.5 16 Vdc Hysteresis 1 2.0 V dc Input Overvoltage Lockout All V OVLO Turn-on Threshold 76 77 Vdc  Turn-off Threshold  79 81 Vdc Hysteresis 1 2  Vdc July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 4 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Characteristic Curves o The following figures provide typical characteristics for the EHHD006A0B (12.0V, 6A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. OUTPUT CURRENT, IO (A) TIME, t (200µs/div) Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 0.1A/µS Dynamic Load Change from 50% to 75% to 50% of full load, Vin=48V, CO>100μF. TIME, t (10ms/div) TIME, t (2s/div) Figure 2. Typical output ripple and noise (Io = Io,max). Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = 24V or 48V, Io = Io,max). TIME, t (200µs/div) TIME, t (10ms/div) Figure 3. Transient Response to 0.1A/µS Dynamic Load Change Figure 6. Typical Start-up Using Input Voltage (VIN = 24V, from 50% to 75% to 50% of full load, Vin=24V, CO>100μF. Io = Io,max). July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 5 OUTPUT VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE V (V) (200mV/div) Io(A) (1A/div) EFFICIENCY,  (%) O VO (V) (100mV/div) OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE INPUT VOLTAGE V (V) (5V/div) V (V) (5V/div) V (V) (200mV/div) Io(A) (1A/div) O On/Off O V (V) (5V/div) V (V) (20V/div) O IN Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE The power module should be connected to a low AC impedance source. Highly inductive source impedance can L TES T Vin+ affect the stability of the power module. For the test 12μH configuration in Figure 7, a 33-100μF electrolytic capacitor (ESR<0.7 at 100kHz), mounting close to the power module 33-100μF CS 220μF helps ensure the stability of the unit. Consult the factory for E.S.R.<0.1 further application guidelines. @ 20°C 100kHz Vin- Safety Considerations For safety-agency approval of the system in which the NOTE: Measure input reflected ripple current with a simulated power module is used, the power module must be installed source inductance (LTEST) of 12μH. Capacitor CS offsets possible battery impedance. Measure current as shown in compliance with the spacing and separation above. requirements of the end-use safety agency standard, i.e., UL60950-1, CSA C22.2 No.60950-1, and VDE0805- Figure 7. Input Reflected Ripple Current Test Setup. 1(IEC60950-1). COPPER STRIP If the input source is non-SELV (ELV or a hazardous voltage V (+) RESISTIVE O greater than 60 Vdc and less than or equal to 75Vdc), for the LOAD module’s output to be considered as meeting the SCOPE requirements for safety extra-low voltage (SELV), all of the V O (– ) following must be true: 1uF 10uF  The input source is to be provided with reinforced GROUND PLANE insulation from any other hazardous voltages, including NOTE: All voltage measurements to be taken at the module the AC mains. terminals, as shown above. If sockets are used then  One V pin and one V pin are to be grounded, or Kelvin connections are required at the module terminals IN OUT to avoid measurement errors due to socket contact both the input and output pins are to be kept floating. resistance.  The input pins of the module are not operator Figure 8. Output Ripple and Noise Test Setup. accessible.  Another SELV reliability test is conducted on the whole system (combination of supply source and subject R R R R distribution contact contact distribution module) as required by the safety agencies to verify Vin+ Vout+ that under a single fault, hazardous voltages do not appear at the module’s output. R LOAD V VO IN Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the R R R R distribution contact contact distribution Vin- Vout- output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals All flammable materials used in the manufacturing of these to avoid measurement errors due to socket contact modules are rated 94V-0 or tested to the UL60950 A.2 for resistance. reduced thickness. Figure 9. Output Voltage and Efficiency Test Setup. For input voltages exceeding –60 Vdc but less than or equal V . I to –75 Vdc, these converters have been evaluated to the O O Efficiency  = x 100 % applicable requirements of basic insulation between V . I IN IN secondary DC mains distribution input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 10 A fast-acting fuse in the ungrounded lead. July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 6 BATTERY Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output The amount of power delivered by the module is defined as Feature Descriptions the voltage at the output terminals multiplied by the output Remote On/Off current. When using remote sense and trim, the output voltage of the module can be increased, which at the same Two remote On/Off options are available. Positive logic turns output current would increase the power output of the the module on during a logic high voltage on the On/Off pin module. Care should be taken to ensure that the maximum and off during a logic low. Negative logic remote On/Off, output power of the module remains at or below the device code suffix “1”, turns the module off during a logic maximum rated power (maximum rated power = Vo,set x high and on during a logic low. Io,max). Vin+ Vout+ SENSE(+) SENSE(–) Ion/off VI(+) VO(+) ON/OFF IO SUPPL Y LOAD II TRIM VI(-) VO(–) CONTACT CONT ACT AND V on/off RESIST ANCE DISTRIBUTION LOSSE Figure 11. Circuit Configuration for Remote Sense . Vout- Vin- Input Undervoltage Lockout Figure 10. Remote On/Off Implementation. At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only To turn the power module on and off, the user must supply a begin to operate once the input voltage is raised above the switch (open collector or equivalent) to control the voltage undervoltage lockout turn-on threshold, V . UV/ON (Von/off) between the On/Off terminal and the VIN(-) terminal Once operating, the module will continue to operate until (see Figure 10). Logic low is -0.7V ≤ Von/off ≤ 0.6V. The the input voltage is taken below the undervoltage turn-off maximum Ion/off during a logic low is 0.15mA and the switch threshold, VUV/OFF. should maintain a logic low level while sinking this current. Overtemperature Protection During a logic high, the typical maximum V generated on/off by the module is 5.6V and the maximum allowable leakage To provide protection under certain fault conditions, the unit current at Von/off = 5.6V is 25μA. is equipped with a thermal shutdown circuit. The unit will If not using the remote On/Off feature: shutdown if the thermal reference point, Tref, exceeds O O 135 C (Figure 13, typical) or 120 C (Figure 14, typical), but For positive logic, leave the On/Off pin open. the thermal shutdown is not intended as a guarantee that For negative logic, short the On/Off pin to V (-). IN the unit will survive temperatures beyond its rating. The Remote Sense module will automatically restart upon cool-down to a safe temperature. Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Output Overvoltage Protection Figure 11). The voltage between the remote-sense pins and The output overvoltage protection scheme of the modules the output terminals must not exceed the output voltage has an independent overvoltage loop to prevent single point sense range given in the Feature Specifications table: of failure. This protection feature latches in the event of [V (+) – V (–)] – [SENSE(+) – SENSE(–)]  0.5 V O O overvoltage across the output. Cycling the On/Off pin or Although the output voltage can be increased by both the input voltage resets the latching protection feature. If the remote sense and by the trim, the maximum increase for auto-restart option (4) is ordered, the module will the output voltage is not the sum of both. The maximum automatically restart upon an internally programmed time increase is the larger of either the remote sense or the trim. elapsing. Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, it will latch off following the overcurrent condition. The module can be restarted by cycling the DC input power for at least one second or by toggling the remote On/Off signal for at least one second. July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 7 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output If the unit is configured with the auto-restart option (4), it will 5.11 12 .0 (100 4) 511   R    10 .22  trimup   remain in the hiccup mode as long as the overcurrent  1.225 4 4  condition exists. Once the output current is brought back R  1.16M into its specified range, the unit will operate normally. The trimup average output current during hiccup is 10% IO, max. The voltage between the V (+) and V (–) terminals must not O O exceed the minimum output overvoltage protection value Output Voltage Programming shown in the Feature Specifications table. This limit includes Trimming allows the output voltage set point to be any increase in voltage due to remote-sense compensation increased or decreased from the default value. This is and output voltage set-point adjustment trim. accomplished by connecting an external resistor between Although the output voltage can be increased by both the the TRIM pin and either the VO(+) pin or the VO(-) pin. remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum V (+) V (+) IN O increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as R trim-up the voltage at the output terminals multiplied by the output ON/OFF current. When using remote sense and trim, the output LOAD V TRIM O voltage of the module can be increased, which at the same output current would increase the power output of the R trim-down module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (maximum rated power = V x O,set V (-) V (-) IN O I ). O,max Figure 12. Circuit Configuration to Trim Output Voltage. Thermal Considerations Connecting an external resistor (Rtrim-down) between the TRIM pin and the VO(-) (or Sense(-)) pin decreases the output The power modules operate in a variety of thermal voltage set point. To maintain set point accuracy, the trim environments; however, sufficient cooling should be resistor tolerance should be ±1.0%. provided to help ensure reliable operation. The following equation determines the required external Considerations include ambient temperature, airflow, resistor value to obtain a percentage output voltage change module power dissipation and the need for increased of ∆% reliability. A reduction in the operating temperature of the module will result in an increase in reliability. 511   R   10 .22  trimdown    %   The thermal data presented here is based on physical  12.0VV  desired measurements taken in a wind tunnel, using automated Where % 100   12.0V thermo-couple instrumentation to monitor key component   temperatures: FETs, diodes, control ICs, magnetic cores, For example, to trim-down the output voltage of the module ceramic capacitors, opto-isolators, and module pwb by 6% to 11.28V, Rtrim-down is calculated as follows: conductors, while controlling the ambient airflow rate and temperature. For a given airflow and ambient temperature, % 6 the module output power is increased, until one (or more) of 511   the components reaches its maximum derated operating R  10.22 trimdown   temperature, as defined in IPC-9592. This procedure is then 6   repeated for a different airflow or ambient temperature until R  74 .9 a family of module output derating curves is obtained. trim down Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%: 5.1112.0 (100%) 511   R   10.22 trimup   1.225% %   V  12 .0   Where desired  %  100 12 .0   For example, to trim-up the output voltage of the module by 4% to 12.48V, Rtrim-up is calculated is as follows:  % 4 July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 8 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Thermal Considerations (continued) o AMBIENT TEMEPERATURE, TA ( C) Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from V (-) to out V (+); V =48. out IN The thermal reference points, T , used in the specifications ref for open frame modules is shown in Figure 13. For reliable o operation, these temperatures should not exceed 125 C. o AIRFLOW AMBIENT TEMEPERATURE, T ( C) A Figure 16. Output Current Derating for the Module with Heat plate; Airflow in the Transverse Direction from V (-) out to Vout(+);VIN =48V. Figure 13. T Temperature Measurement Locations for ref Open Frame Module. The thermal reference point, Tref, used in the specifications for modules with a heat plate is shown in Figure 14. For reliable operation, this temperature should not exceed O 115 C. AIRFLOW o AMBIENT TEMEPERATURE, TA ( C) Figure 17. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(-) to Figure 14. Tref Temperature Measurement Location for Vout(+); VIN =24V. Module with Heat plate. Heat Transfer via Convection Increased airflow over the module enhances the heat transfer via convection. Derating curves showing the maximum output current that can be delivered by each module versus local ambient temperature (TA) for natural convection and up to 2m/s (400 ft./min) forced airflow are shown in Figures 15 - 18. July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Thermal Considerations (continued) Through-Hole Soldering Information Lead-Free Soldering The EHHD006A0Bxx RoHS-compliant through-hole products use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have a RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. o AMBIENT TEMEPERATURE, T ( C) A Paste-in-Hole Soldering Figure 18. Output Current Derating for the Module with The EHHD006A0Bxx module is compatible with reflow Heat plate; Airflow in the Transverse Direction from V (-) out paste-in-hole soldering processes shown in Figures 23-25. to V (+);V =24V. out IN Since the EHHD006A0BxxZ module is not packaged per J- STD-033 Rev.A, the module must be baked prior to the Please refer to the Application Note ‘Thermal paste-in-hole reflow process. EHHD006A0Bxx-HZ modules Characterization Process For Open-Frame Board-Mounted are not compatible with paste-in-hole reflow soldering. Power Modules’ for a detailed discussion of thermal aspects Please contact your GE Sales Representative for further including maximum device temperatures. information. Heat Transfer via Conduction Surface Mount Information The module can also be used in a sealed environment with MSL Rating cooling via conduction from the The EHHD006A0B-SZ module has a MSL rating of 2a. module’s top surface through a gap pad material to a cold wall, as shown in Figure 19. This capability is achieved Storage and Handling by insuring the top side component skyline profile achieves The recommended storage environment and handling no more than 1mm height difference between the tallest procedures for moisture-sensitive surface mount packages and the shortest power train part that benefits from contact is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping with the gap pad material. The output current derating and Use of Moisture/Reflow Sensitive Surface Mount versus cold wall temperature, when using a gap pad such as Devices). Moisture barrier bags (MBB) with desiccant are Bergquist GP2500S20, is shown in Figure 20. provided for the EHHD006A0Bxx-SZ modules. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of  30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages is a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Figure 19. Cold Wall Mounting Pick and Place The EHHD006A0Bxx-S modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able o to withstand reflow temperatures of up to 300 C. The label also carries product information such as product code, serial number and the location of manufacture. o COLDPLATE TEMEPERATURE, TC ( C) Figure 20. Derated Output Current versus Cold Wall Temperature with Local Ambient Temperature Around Module at 85C; VIN =24V or 48V. July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 10 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output cause damage to the modules, and can adversely affect Surface Mount Information (continued) long-term reliability. Tin Lead Soldering The EHHD006A0Bxx-S power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause Figure 21. Pick and Place Location. damage to the modules, and can adversely affect long-term reliability. Nozzle Recommendations In a conventional Tin/Lead (Sn/Pb) solder process, peak The module weight has been kept to a minimum by using reflow temperatures are limited to less than 235°C. open frame construction. Even so, these modules have a Typically, the eutectic solder melts at 183°C, wets the land, relatively large mass when compared to conventional SMT and subsequently wicks the device connection. Sufficient components. Variables such as nozzle size, tip style, time must be allowed to fuse the plating on the connection vacuum pressure and placement speed should be to ensure a reliable considered to optimize this process. The minimum solder joint. There are several types of SMT reflow recommended nozzle diameter for reliable operation is technologies currently used in the industry. These surface 6mm. The maximum nozzle outer diameter, which will safely mount power modules can be reliably soldered using fit within the allowable component spacing, is 9 mm. natural forced convection, IR (radiant infrared), or a Oblong or oval nozzles up to 11 x 9 mm may also be used combination of convection/IR. For reliable soldering, the within the space available. solder reflow profile should be established by accurately measuring the modules CP connector temperatures. Reflow Soldering Information Lead Free Soldering The surface mountable modules in the EHHD006A0Bxx-S family use our newest SMT technology called “Column Pin” The –Z version of the EHHD006A0B modules are lead-free (CP) connectors. Figure 22 shows the new CP connector (Pb-free) and RoHS compliant and are both forward and before and after reflow soldering onto the end-board backward compatible in a Pb-free and a SnPb soldering assembly. The CP is constructed from a solid copper pin with process. Failure to observe the instructions below may an integral solder ball attached, which is composed of result in the failure of or cause damage to the modules and tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag3/Cu (SAC) can adversely affect long-term reliability. solder for –Z codes. EHHD Board 300 o P eak Temp 235 C 250 Cooling zone Heat zo ne 200 o -1 o -1 1-4 Cs Insulator max 4 Cs Solder Ball 150 End assembly PCB Soak zone 10 0 T above 30-240s lim Figure 22. Column Pin Connector Before and After Reflow o 205 C Soldering. 50 P reheat zo ne o -1 max 4 Cs The CP connector design is able to compensate for large amounts of planarity and still ensure a reliable SMT solder 0 joint. Typically, the eutectic solder melts at 183°C (Sn/Pb REFLOW TIME (S) solder) or 217-218°C (SAC solder), wets the land, and Figure 23. Reflow Profile for Tin/Lead (Sn/Pb) process. subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 11 REFLOW TEMP (C) Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Post Solder Cleaning and Drying Considerations Surface Mount Information (continued) Post solder cleaning is usually the final circuit board assembly process prior to electrical board testing. The result 240 of inadequate cleaning and drying can affect both the 235 reliability of a power module and the testability of the finished circuit board assembly. For guidance on 230 appropriate soldering, cleaning and drying procedures, refer 225 to GE Board Mounted Power Modules: Soldering and Cleaning Application 220 Note (AN04-001). 215 210 205 200 0 10 203040 5060 o Figure 24. Time Limit Curve Above 205 C for Tin/Lead (Sn/Pb) process Pb-free Reflow Profile Power systems will comply with J-STD-015 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 25. 300 Per J-STD-020 Rev. C Peak Temp 260°C 250 Cooling 200 Zone * Min. Time Above 235°C 15 Seconds 150 Heating Zone *Time Above 217°C 1°C/Second 60 Seconds 100 50 0 Reflow Time (Seconds) Figure 25. Recommended linear reflow profile using Sn/Ag/Cu solder. July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 12 MAX TEMP SOLDER (C) Reflow Temp (°C) Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output EMC Considerations The circuit and plots in Figure 26 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B. Figure 26. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). VIN = 48V, Io = Io,max, L Line VIN = 48V, Io = Io,max, N Line July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 13 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] *Top side label includes GE name, product designation and date code. July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 14 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Mechanical Outline for Surface Mount Module (-S Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] * Top side label includes GE name, product designation and date code. July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 15 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Mechanical Outline for Through-Hole Module with Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 16 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) SMT Recommended Pad Layout (Component Side View) Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH- HOLE DIAMETER FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH- HOLE DIAMETER TH Recommended Pad Layout (Component Side View) July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 17 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Each tray contains a total of 12 power modules. The trays are Packaging Details self-stacking and each shipping box for the EHHD006A0B The surface mount versions of the EHHD006A0B (suffix –S) are (suffix –S) surface mount module contains 4 full trays plus one supplied as standard in the plastic trays shown in Figure 27. empty hold-down tray giving a total number of 48 power modules. Tray Specification Material Antistatic coated PVC 12 Max surface resistivity 10 /sq Color Clear Capacity 12 power modules Min order quantity 48 pcs (1 box of 4 full trays + 1 empty top tray) Figure 27. Surface Mount Packaging Tray July 12, 2013 ©2012 General Electric Company. All rights reserved. Page 18 Data Sheet GE EHHD006A0B Hammerhead Series; DC-DC Converter Power Modules 18-75Vdc Input; 12Vdc, 6.0A, 72W Output Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1. Device Codes Output Output Connector Product Codes Input Voltage On/Off Logic Comcodes Voltage Current Type EHHD006A0B41Z 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole CC109159364 EHHD006A0B641Z 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole 150024112 EHHD006A0B41-HZ 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole CC109167755 EHHD006A0B641-HZ 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole 150024113 EHHD006A0B841-HZ 24/48V (18-75Vdc) 12.0V 6A Negative Through-hole CC109171443 EHHD006A0B41-SZ 24/48V (18-75Vdc) 12.0V 6A Negative Surface mount CC109167763 Table 2. Device Coding Scheme and Options Contact Us For more information, call us at USA/Canada: +1 888 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 India: +91.80.28411633 www.ge.com/powerelectronics July 12, 2013 ©2012 General Electric Company. All rights reserved. Version 1.07