Data Sheet GE EHHD020A0FHammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Features  Compliant to RoHS II EU “Directive 2011/65/EU (-Z versions)  Compliant to REACH Directive (EC) No 1907/2006  Flat and high efficiency curve  Industry standard, DOSA compliant footprint 57.9mm x 22.8mm x 7.6mm (2.28 in x 0.9 in x 0.30 in)  Low profile height and reduced component skyline  Ultra wide input voltage range: 18-75 Vdc  Tightly regulated output  Remote sense  Output Voltage adjust: 80% to 110% of VO,nom RoHS Compliant  Constant switching frequency  Positive remote On/Off logic Applications  Input under/over voltage protection  Distributed Power Architectures  Output overcurrent and overvoltage protection  Wireless Networks  Overtemperature protection  Access and Optical Network Equipment  No reverse current during output shutdown  Wide operating temperature range (-40°C to 85°C)  Industrial Equipment  Suitable for cold wall cooling using suitable Gap Pad applied directly to top side of module  ANSI/UL*60950-1-2011 and CAN/CSA† C22.2 No. 60950-1- 07, Second Edition + A1:2011 (MOD), dated March 19, 2011; and DIN EN 60950-1 (VDE‡ 0805 Teil 1):2011-01; EN 60950- Options 1:2006 + A11:2009 + A1:2010, DIN EN 60950-1/A12 (VDE  Negative Remote On/Off logic (preferred) 0805-1/A12):2011-08; EN 60950-1/A12:2011-02, IEC 60950- 1(ed.2);am1:2009  Over current/Over temperature/Over voltage protections (Auto-restart) (preferred) §  CE mark meets 2006/95/EC directive  Meets the voltage and current requirements for ETSI 300-  Heat plate versions (-H) 132-2 and complies with and licensed for Basic insulation  Surface Mount version (-S) rating per EN60950-1 ¤  2250 Vdc Isolation tested in compliance with IEEE 802.3 PoE standards **  ISO 9001 and ISO 14001 certified manufacturing facilities Description The EHHD020A0F [Hammerhead™] Series, eighth-brick, low-height power modules are isolated dc-dc converters that provide a single, precisely regulated output voltage over an ultra wide input voltage range of 18-75V . The dc EHHD020A0F provides 3.3V nominal output voltage rated for 20A output current. The module incorporates GE’s vast heritage dc dc for reliability and quality, while also using the latest in technology, and component and process standardization to achieve highly competitive cost. The open frame module construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. The module achieves typical full load efficiency greater than 91% at VIN=24Vdc or at VIN=48Vdc. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection. An optional heat plate allows for external standard, eighth-brick heat sink attachment to achieve higher output current in high temperature applications. * UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. § This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 1 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All VIN -0.3 80 Vdc Transient, operational (≤100 ms) All V -0.3 100 V IN,trans dc Operating Ambient Temperature All TA -40 85 °C Maximum Heat Plate Operating Temperature -18H, H TC -40 110 °C (see Thermal Considerations section) Storage Temperature All Tstg -55 125 °C Altitude* All 4000 m   I/O Isolation voltage (100% factory Hi-Pot tested) All 2250 Vdc * For higher altitude applications, contact your GE Sales Representative for alternative conditions of use. Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All VIN 18 24/48 75 Vdc Maximum Input Current All IIN 4.4 5.0 Adc (VIN= VIN, min to VIN, max, VO= VO, set, IO=IO, max) Input No Load Current All I 70 mA IN,No load (V = 48V, I = 0, module enabled) IN O Input Stand-by Current All IIN,stand-by 5 8 mA (V = 48V, module disabled) IN 2 2 Inrush Transient All It 0.5 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V to V I = I ; See All 30 mA IN, min IN, max, O Omax p-p Test configuration section) Input Ripple Rejection (120Hz) All 50 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 10 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 2 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Nominal Output Voltage Set-point All V 3.24 3.30 3.36 V O, set dc V = 24V to 48V I =I , T =25°C) IN O O, max A Output Voltage (Over all operating input voltage, resistive load, and temperature All VO 3.20  3.40 Vdc conditions until end of life) Output Regulation Line (VIN=VIN, min to VIN, max) All   ±0.2 % VO, set All Load (IO=IO, min to IO, max)   ±0.2 % VO, set Temperature (T =T to T) All % V ref A, min A, max   ±1.0 O, set Output Ripple and Noise (V =V to V , I = I , T =T to T) IN IN, min IN, max O O, max A A, min A, max RMS (5Hz to 20MHz bandwidth) All  10 30 mVrms Peak-to-Peak (5Hz to 20MHz bandwidth) All  35 100 mVpk-pk External Capacitance All C 0 5,000 μF O, max  Output Current All IO 0 20 Adc Output Current Limit Inception (Hiccup Mode ) I O, lim All 21 24 26 Adc (VO= 90% of VO, set) Output Short-Circuit Current All IO, s/c 5 Arms (VO≤250mV) ( Hiccup Mode ) Efficiency V =24V, T =25°C, I =10A, V = 3.3V All η 91.0 % IN A O O V =24V, T =25°C, I =20A, V = 3.3V All η 91.0 % IN A O O VIN=48V, TA=25°C, IO=10A, VO = 3.3V All η 89.5 % VIN=48V, TA=25°C, IO=20A, VO = 3.3V All η 91.0 % Switching Frequency All fsw 300 kHz Dynamic Load Response (dI /dt=0.1A/s; V = 24V or 48V; T =25°C; C >100μF) o IN A O Load Change from Io= 50% to 75% or 25% to 50% of I o,max Peak Deviation All Vpk  5  % VO, set Settling Time (Vo<10% peak deviation) All t  200  s s Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All C 1000 pF iso   Isolation Resistance All R 100 MΩ iso   I/O Isolation Voltage (100% factory Hi-pot tested) All All 2250 V   dc General Specifications Parameter Device Symbol Min Typ Max Unit 9 All FIT 317.3 10 /Hours Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C, airflow = 200 lfm, 90% confidence) All MTBF 3,151,604 Hours Weight (Open Frame) All 19 (0.7) g (oz.) Weight (with Heatplate) All 30 (1.1) g (oz.) April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 3 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (V =V to V ; open collector or equivalent, IN IN, min IN, max Signal referenced to V terminal) IN- Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All Ion/off   0.15 mA Logic Low - On/Off Voltage All Von/off -0.7  0.6 Vdc Logic High Voltage – (Typ = Open Collector) All V 2.5 6.7 V on/off  dc Logic High maximum allowable leakage current All I 25 μA on/off   Turn-On Delay and Rise Times o (IO=IO, max , VIN=VIN, nom, TA = 25C) Case 1: Input power is applied for at least 1 second, and then the On/Off input is set from OFF to ON All T — 20 — msec delay (Tdelay = on/off pin transition until VO = 10% of VO, set) Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied All T — 20 150 msec delay (T = V reaches V until V =10% of V ) delay IN IN, min o O,set Output voltage Rise time (time for Vo to rise from 10% All T — 18 25 msec rise of Vo,set to 90% of Vo, set) Output voltage overshoot – Startup All — 3 % V O, set o I = I ; V =V to V , T = 25C O O, max IN IN, min IN, max A Remote Sense Range All V 10 % V SENSE O, set Output Voltage Adjustment Range All 80 110 % VO, set Output Overvoltage Protection All V 3.8  4.3 V O, limit dc Overtemperature Protection – Hiccup Auto Restart Open O T 135 C ref frame Heat O Heat Plate Tref 120 C Plate Input Undervoltage Lockout All V UVLO Turn-on Threshold 17 18 V  dc Turn-off Threshold 14 15 16 Vdc Hysteresis 1 2 Vdc Input Overvoltage Lockout All V OVLO Turn-on Threshold 76 79 Vdc  Turn-off Threshold 81 83 Vdc  Hysteresis 1 2  Vdc April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 4 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Characteristic Curves o The following figures provide typical characteristics for the EHHD020A0F (3.3V, 20A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. OUTPUT CURRENT, IO (A) TIME, t (200µs/div) Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 0.1A/µS Dynamic Load Change from 50% to 75% to 50% of full load, Vin=48V, C >100μF. O TIME, t (10ms/div) TIME, t (2s/div) Figure 2. Typical output ripple and noise (Io = Io,max). Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = 24V or 48V, Io = Io,max). TIME, t (200µs/div) TIME, t (10ms/div) Figure 3. Transient Response to 0.1A/µS Dynamic Load Change Figure 6. Typical Start-up Using Input Voltage (VIN = 24V, Io from 50% to 75% to 50% of full load, Vin=24V, C >100μF. = Io,max). O April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 5 OUTPUT VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE V (V) (100mV/div) Io(A) (5A/div) EFFICIENCY,  (%) O V (V) (50mV/div) O OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE INPUT VOLTAGE VO (V) (1V/div) VOn/Off (V) (2V/div) VO (V) (100mV/div) Io(A) (5A/div) VO (V) (1V/div) VIN (V) (10V/div) Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE The power module should be connected to a low ac-impedance source. Highly inductive source impedance L TES T Vin+ can affect the stability of the power module. For the test 12μH configuration in Figure 7 a 33-100μF electrolytic capacitor (ESR<0.7 at 100kHz), mounted close to the power module 33-100μF CS 220μF helps ensure the stability of the unit. Consult the factory for E.S.R.<0.1 further application guidelines. @ 20°C 100kHz Vin- Safety Considerations For safety-agency approval of the system in which the NOTE: Measure input reflected ripple current with a simulated source inductance (LTEST) of 12μH. Capacitor CS offsets power module is used, the power module must be installed possible battery impedance. Measure current as shown in compliance with the spacing and separation above. requirements of the end-use safety agency standard, i.e. Figure 7. Input Reflected Ripple Current Test Setup. UL60950-1, CSA C22.2 No.60950-1, and VDE0805- COPPER STRIP 1(IEC60950-1). If the input source is non-SELV (ELV or a hazardous voltage V O (+) RESISTIVE LOAD greater than 60 Vdc and less than or equal to 75Vdc), for the SCOPE module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the V (– ) O 1uF 10uF following must be true:  The input source is to be provided with reinforced GROUND PLANE insulation from any other hazardous voltages, including NOTE: All voltage measurements to be taken at the module the ac mains. terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals  One VIN pin and one VOUT pin are to be grounded, or to avoid measurement errors due to socket contact resistance. both the input and output pins are to be kept floating.  The input pins of the module are not operator Figure 8. Output Ripple and Noise Test Setup. accessible.  Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify R R R R distribution contact contact distribution that under a single fault, hazardous voltages do not Vin+ Vout+ appear at the module’s output. Note: Do not ground either of the input pins of the module R LOAD V V IN O without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. Rdistribution Rcontact Rcontact Rdistribution Vin- Vout- The power module has extra-low voltage (ELV) outputs when all inputs are ELV. NOTE: All voltage measurements to be taken at the module All flammable materials used in the manufacturing of these terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals modules are rated 94V-0, or tested to the UL60950 A.2 for to avoid measurement errors due to socket contact reduced thickness. resistance. For input voltages exceeding –60 Vdc but less than or equal Figure 9. Output Voltage and Efficiency Test Setup. to –75 Vdc, these converters have been evaluated to the V . I O O applicable requirements of BASIC INSULATION between Efficiency  = x 100 % secondary DC MAINS DISTRIBUTION input (classified as V . I IN IN TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 10 A fast-acting fuse in the ungrounded lead. April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 6 BATTERY Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output The amount of power delivered by the module is defined as Feature Descriptions the voltage at the output terminals multiplied by the output Remote On/Off current. When using remote sense and trim, the output voltage of the module can be increased, which at the same Two remote on/off options are available. Positive logic turns output current would increase the power output of the the module on during a logic high voltage on the ON/OFF module. Care should be taken to ensure that the maximum pin, and off during a logic low. Negative logic remote On/Off, output power of the module remains at or below the device code suffix “1”, turns the module off during a logic maximum rated power (Maximum rated power = Vo,set x high and on during a logic low. Io,max). Vin+ Vout+ SENSE(+) SENSE(–) Ion/off VI(+) VO(+) ON/OFF IO SUPPL Y LOAD II TRIM VI(-) VO(–) CONTACT CONT ACT AND Von/off RESIST ANCE DISTRIBUTION LOSSE Figure 11. Circuit Configuration for remote sense. Vout- Vin- Input Undervoltage Lockout Figure 10. Remote On/Off Implementation. At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only To turn the power module on and off, the user must supply a begin to operate once the input voltage is raised above the switch (open collector or equivalent) to control the voltage undervoltage lockout turn-on threshold, V . UV/ON (V ) between the ON/OFF terminal and the V (-) terminal on/off IN Once operating, the module will continue to operate until (see Figure 10). Logic low is 0V ≤ V ≤ 0.6V. The maximum on/off the input voltage is taken below the undervoltage turn-off I during a logic low is 0.15mA; the switch should on/off threshold, VUV/OFF. maintain a logic low level whilst sinking this current. Overtemperature Protection During a logic high, the typical maximum Von/off generated by the module is 6.7V, and the maximum allowable leakage To provide protection under certain fault conditions, the unit = 2.5V is 25μA. current at Von/off is equipped with a thermal shutdown circuit. The unit will o If not using the remote on/off feature: shutdown if the thermal reference point, Tref, exceeds 135 C o (Figure 13, typical) or 120 C (Figure 14, typical), but the For positive logic, leave the ON/OFF pin open. thermal shutdown is not intended as a guarantee that the For negative logic, short the ON/OFF pin to VIN(-). unit will survive temperatures beyond its rating. The module Remote Sense will automatically restart upon cool-down to a safe temperature. Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Output Overvoltage Protection Figure 11). The voltage between the remote-sense pins and The output over voltage protection scheme of the modules the output terminals must not exceed the output voltage has an independent over voltage loop to prevent single sense range given in the Feature Specifications table: point of failure. This protection feature latches in the event [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V of over voltage across the output. Cycling the on/off pin or Although the output voltage can be increased by both the input voltage resets the latching protection feature. If the remote sense and by the trim, the maximum increase for auto-restart option (4) is ordered, the module will the output voltage is not the sum of both. The maximum automatically restart upon an internally programmed time increase is the larger of either the remote sense or the trim. elapsing. Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, then it will latch off following the over current condition. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 7 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output For example, to trim-up the output voltage of the module by Feature Descriptions (continued) 4% to 3.43V, R is calculated is as follows: trim-up If the unit is configured with the auto-restart option (4), it will  %  4 remain in the hiccup mode as long as the overcurrent 5.11 3.3 (100 4) 511  condition exists; it operates normally, once the output R    10.22  trimup   current is brought back into its specified range. The average 1.225 4 4   output current during hiccup is 10% IO, max. R  219.9 trimup Output Voltage Programming The voltage between the V (+) and V (–) terminals must not O O Trimming allows the output voltage set point to be exceed the minimum output overvoltage protection value increased or decreased from the default value; this is shown in the Feature Specifications table. This limit includes accomplished by connecting an external resistor between any increase in voltage due to remote-sense compensation the TRIM pin and either the VO(+) pin or the VO(-) pin. and output voltage set-point adjustment trim. Although the output voltage can be increased by both the V (+) V (+) IN O remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum R trim-up increase is the larger of either the remote sense or the trim. ON/OFF The amount of power delivered by the module is defined as LOAD V TRIM the voltage at the output terminals multiplied by the output O current. When using remote sense and trim, the output R voltage of the module can be increased, which at the same trim-down output current would increase the power output of the module. Care should be taken to ensure that the maximum V (-) V (-) IN O output power of the module remains at or below the maximum rated power (Maximum rated power = V x O,set I ). O,max Figure 12. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (R ) between the TRIM trim-down pin and the VO(-) (or Sense(-)) pin decreases the output Thermal Considerations voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%. The power modules operate in a variety of thermal environments; however, sufficient cooling should be The following equation determines the required external provided to help ensure reliable operation. resistor value to obtain a percentage output voltage change of ∆% Considerations include ambient temperature, airflow, module power dissipation, and the need for increased 511   R  10.22  reliability. A reduction in the operating temperature of the trimdown   %   module will result in an increase in reliability. 3.3VV   desired Where % 100   The thermal data presented here is based on physical 3.3V   measurements taken in a wind tunnel, using automated For example, to trim-down the output voltage of the module thermo-couple instrumentation to monitor key component temperatures: FETs, diodes, control ICs, magnetic cores, by 6% to 3.10V, Rtrim-down is calculated as follows: ceramic capacitors, opto-isolators, and module pwb % 6 conductors, while controlling the ambient airflow rate and temperature. For a given airflow and ambient temperature, 511  R  10.22  the module output power is increased, until one (or more) of trimdown   6   the components reaches its maximum derated operating temperature, as defined in IPC-9592. This procedure is then R  74 .9 trim  down repeated for a different airflow or ambient temperature until a family of module output derating curves is obtained. Connecting an external resistor (Rtrim-up) between the TRIM pin and the V (+) (or Sense (+)) pin increases the output O voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%: 5.11 3.3 (100%) 511  R    10.22 trimup   1.225% %   V  3.3   Where desired  %  100 3.3   April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 8 Data She eet G GE E EHHD020 0A0F Ha ammerhe ead™ S Series; DC C-DC Converter P Power M Modules 1 18-75Vdc In nput; 3.3Vd dc, 20.0A, 6 66W Outpu ut Po ower Modules” for a detailed discussion of thermal T Thermal Co onsideratio ons (continued) as spects including maximum de evice temperat tures. Figure 15. Therm mal Resistance e for the Open n Frame Module; Airflow w in the Transverse Direction n from V (-) to o out V (+); V =24V V or 48V, V =3.3 3V. o out IN O T The thermal ref ference points, Tref, used in the specification ns fo or open frame modules is sho own in Figure 1 13. For reliable e o o operation these e temperatures s should not ex xceed 125 C. AIR RFLOW o o AMBIENT TEMEPERATURE, TA ( C) Figure 16. Output Current Derating for the Open Frame F Figure 13. Tref T Temperature M Measurement t Locations for r Module; Airflow w in the Transverse Direction n from Vout(-) to o O Open Frame Module. Vo out(+); VIN =48V V. T The thermal ref ference point, T T , used in the e specifications s ref fo or modules wit th heatplate is shown in Figure 14. For reliable operation this temper rature should n not exceed o 1 110 C. A AIRFLOW F Figure 14. T T Temperature M Measurement t Location for ref o o M Module with He eatplate. AMBIENT TEMEPERATURE, TA ( C) Figure 17. Output Current Derating for the Module with He eatplate; Airflo ow in the Tran nsverse Direction from Vout(- -) H Heat Transfer via Convect tion to o Vout(+);VIN =48 8V. In ncreased airflo ow over the mo odule enhances the heat transfer via con nvection. Derat ting curves sho owing the m maximum outp put current that t can be delive ered by e each module ve ersus local ambient temperat ture (TA) fo or natural conv vection and up p to 1m/s (200 f ft./min) forced a airflow are show wn in Figures 1 16 - 21. P Please refer to t the Application n Note “Therma al C Characterizatio on Process For Open-Frame B Board-Mounted d A April 4, 2013 ©2012 Gen neral Electric Com mpany. All rights reserved. Page e 9 OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Thermal Considerations (continued) o AMBIENT TEMEPERATURE, TA ( C) o AMBIENT TEMEPERATURE, TA ( C) Figure 21. Output Current Derating for the Module with- 18 Heatplate; Airflow in the Transverse Direction from Figure 18. Output Current Derating for the Module with - Vout(-) to Vout(+);VIN =24V. 18 Heatplate; Airflow in the Transverse Direction from V (-) to V (+);V =48V. out out IN Heat Transfer via Conduction The module can also be used in a sealed environment with cooling via conduction from the module’s top surface through a gap pad material to a cold wall, as shown in Figure 21. This capability is achieved by insuring the top side component skyline profile achieves no more than 1mm height difference between the tallest and the shortest power train part that benefits from contact with the gap pad material. The output current derating versus cold wall temperature, when using a gap pad such as Bergquist GP2500S20, is shown in Figure 22. o AMBIENT TEMEPERATURE, TA ( C) Figure 19. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from V (-) to out V (+); V =24V. out IN Figure 22. Cold Wall Mounting o AMBIENT TEMEPERATURE, TA ( C) Figure 20. Output Current Derating for the Module with (-) Heatplate; Airflow in the Transverse Direction from Vout o COLDPLATE TEMEPERATURE, TC ( C) to V (+);V =24V. out IN Figure 23. Derated Output Current versus Cold Wall Temperature with local ambient temperature around module at 85C; VIN =24V or 48V. April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 10 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O O OUTPUT CURRENT, IO (A) OUTPUT CURRENT, IO (A) Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Through-Hole Soldering Information Lead-Free Soldering The EHHD020A0Fxx RoHS-compliant through-hole products use SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have a RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be Figure 24. Pick and Place Location. such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot Nozzle Recommendations temperature is 260C, while the Pb-free solder pot is 270C The module weight has been kept to a minimum by using max. open frame construction. Even so, these modules have a Paste-in-Hole Soldering relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, The EHHD020A0Fxx module is compatible with reflow paste- vacuum pressure and placement speed should be in-hole soldering processes shown in Figures 27-29. Since considered to optimize this process. The minimum the EHHD020A0FxxZ module is not packaged per J-STD-033 recommended nozzle diameter for reliable operation is Rev.A, the module must be baked prior to the paste-in-hole 6mm. The maximum nozzle outer diameter, which will safely reflow process. EHHD020A0Fxx-HZ modules are not fit within the allowable component spacing, is 9 mm. compatible with paste-in-hole reflow soldering. Please Oblong or oval nozzles up to 11 x 9 mm may also be used contact your GE Sales Representative for further within the space available. information. Reflow Soldering Information Surface Mount Information The surface mountable modules in the EHHD family use our MSL Rating newest SMT technology called “Column Pin” (CP) connectors. The EHHD020A0F-SZ module has a MSL rating of 2a. Figure 25 shows the new CP connector before and after Storage and Handling reflow soldering onto the end-board assembly. The CP is constructed from a solid copper pin with an integral solder The recommended storage environment and handling ball attached, which is composed of tin/lead (Sn/Pb) solder procedures for moisture-sensitive surface mount packages for non-Z codes, or Sn/Ag /Cu (SAC) solder for –Z codes. 3 is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount EHHD Board Devices). Moisture barrier bags (MBB) with desiccant are provided for the EHHD020A0Fxx-SZ modules. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at Insulator conditions of  30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life Solder Ball for dry packed SMT packages is a minimum of 12 months End assembly PCB from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Figure 25. Column Pin Connector Before and After Reflow Soldering . Pick and Place The CP connector design is able to compensate for large The EHHD020A0F modules use an open frame construction amounts of co-planarity and still ensure a reliable SMT and are designed for a fully automated assembly process. o solder joint. Typically, the eutectic solder melts at 183 C The modules are fitted with a label designed to provide a o (Sn/Pb solder) or 217-218 C (SAC solder), wets the land, and large surface area for pick and place operations. The label subsequently wicks the device connection. Sufficient time meets all the requirements for surface mount processing, as must be allowed to fuse the plating on the connection to well as safety standards, and is able to withstand reflow ensure a reliable solder joint. There are several types of SMT o temperatures of up to 300 C. The label also carries product reflow technologies currently used in the industry. These information such as product code, serial number and the surface mount power modules can be reliably soldered location of manufacture. using natural forced convection, IR (radiant infrared), or a combination of convection/IR. The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 11 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output 240 Surface Mount Information (continued) 235 Tin Lead Soldering 230 The EHHD020A0F power modules are lead free modules and can be soldered either in a lead-free solder process or in a 225 conventional Tin/Lead (Sn/Pb) process. It is recommended 220 that the customer review data sheets in order to customize the solder reflow profile for each application board 215 assembly. The following instructions must be observed 210 when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to 205 the modules, and can adversely affect long-term reliability. 200 0 10 203040 5060 In a conventional Tin/Lead (Sn/Pb) solder process peak o o reflow temperatures are limited to less than 235 C. Figure 27. Time Limit Curve Above 205 C for Tin/Lead o Typically, the eutectic solder melts at 183 C, wets the land, (Sn/Pb) process. and subsequently wicks the device connection. Sufficient Pb-free Reflow Profile time must be allowed to fuse the plating on the connection to ensure a reliable Power Systems will comply with J-STD-015 Rev. C solder joint. There are several types of SMT reflow (Moisture/Reflow Sensitivity Classification for Nonhermetic technologies currently used in the industry. These surface Solid State Surface Mount Devices) for both Pb-free solder mount power modules can be reliably soldered using profiles and MSL classification procedures. This standard natural forced convection, IR (radiant infrared), or a provides a recommended forced-air-convection reflow combination of convection/IR. For reliable soldering the profile based on the volume and thickness of the package solder reflow profile should be established by accurately (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu measuring the modules CP connector temperatures. (SAC). The recommended linear reflow profile using Lead Free Soldering Sn/Ag/Cu solder is shown in Figure 25. The –Z version of the EHHD020A0F modules are lead-free (Pb-free) and RoHS compliant and are both forward and 300 backward compatible in a Pb-free and a SnPb soldering Per J-STD-020 Rev. C Peak Temp 260°C process. Failure to observe the instructions below may 250 result in the failure of or cause damage to the modules and Cooling can adversely affect long-term reliability. 200 Zone * Min. Time Above 235°C 300 15 Seconds 150 o P eak Temp 235 C Heating Zone *Time Above 217°C 1°C/Second 250 60 Seconds Cooling 100 zone Heat zo ne 200 o -1 o -1 1-4 Cs max 4 Cs 50 150 0 Reflow Time (Seconds) Soak zone 10 0 T above Figure 28. Recommended linear reflow profile using 30-240s lim o Sn/Ag/Cu solder. 205 C 50 P reheat zo ne Post Solder Cleaning and Drying Considerations o -1 max 4 Cs 0 Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result REFLOW TIME (S) of inadequate cleaning and drying can affect both the Figure 26. Reflow Profile for Tin/Lead (Sn/Pb) reliability of a power module and the testability of the process. finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to GE Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 12 REFLOW TEMP (C) MAX TEMP SOLDER (C) Reflow Temp (°C) Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output EMC Considerations The circuit and plots in Figure 29 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B. Figure 29. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). VIN = 48V, Io = Io,max, L Line VIN = 48V, Io = Io,max, N Line April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 13 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] *Top side label includes GE name, product designation and date code. April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 14 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Mechanical Outline for Surface Mount Module (-S Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] * Top side label includes GE name, product designation and date code. April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 15 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Mechanical Outline for Through-Hole Module with Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 16 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Mechanical Outline for Through-Hole Module with ¼ Brick Heat Plate (-18H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 17 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) SMT Recommended Pad Layout (Component Side View) Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER TH Recommended Pad Layout (Component Side View) April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 18 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Each tray contains a total of 12 power modules. The trays are Packaging Details self-stacking and each shipping box for the EHHD020A0F The surface mount versions of the EHHD020A0F (suffix –S) are (suffix –S) surface mount module will contain 4 full trays plus supplied as standard in the plastic trays shown in Figure 30. one empty hold down tray giving a total number of 48 power modules. Tray Specification Material Antistatic coated PVC 12 Max surface resistivity 10 /sq Color Clear Capacity 12 power modules Min order quantity 48 pcs (1 box of 4 full trays + 1 empty top tray) Figure 30. Surface Mount Packaging Tray April 4, 2013 ©2012 General Electric Company. All rights reserved. Page 19 Data Sheet GE EHHD020A0F Hammerhead™ Series; DC-DC Converter Power Modules 18-75Vdc Input; 3.3Vdc, 20.0A, 66W Output Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1. Device Codes Output Output On/Off Connector Product Codes Input Voltage Comcodes Voltage Current Logic Type EHHD020A0F41Z 24/48V (18-75Vdc) 3.3V 20A Negative Through hole CC109161477 EHHD020A0F64Z 24/48V (18-75Vdc) 3.3V 20A Positive Through hole CC109171427 EHHD020A0F641Z 24/48V (18-75Vdc) 3.3V 20A Negative Through hole 150022799 EHHD020A0F41-HZ 24/48V (18-75Vdc) 3.3V 20A Negative Through hole CC109161964 EHHD020A0F641-HZ 24/48V (18-75Vdc) 3.3V 20A Negative Through hole 150022798 EHHD020A0F64-18HZ 24/48V (18-75Vdc) 3.3V 20A Positive Through hole CC109171435 EHHD020A0F41-SZ 24/48V (18-75Vdc) 3.3V 20A Negative Surface mount CC109161972 Table 2. Device Coding Scheme and Options Contact Us For more information, call us at USA/Canada: +1 888 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 India: +91.80.28411633 www.ge.com/powerelectronics April 4, 2013 ©2012 General Electric Company. All rights reserved. Version 1.08