Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Features  Compliant to RoHS EU Directive 2011/65/EU (Z versions)  Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this produc twill no longer be RoHS compliant (non-Z versions)  Compliant to ROHS EU Directive 2002/95/EC with lead solder exemption (non-Z versions)  High efficiency 92.5% at 12.0V full load (Vin=48Vdc)  Industry standard, DOSA compliant footprint RoHS Compliant 58.4mm x 22.8mm x 8.1mm (2.30 in x 0.9 in x 0.32 in) Applications  Low profile height and reduced component skyline  Distributed Power Architectures  Wide input voltage range: 36-75 Vdc  Wireless Networks  Tightly regulated output  Access and Optical Network Equipment  Constant switching frequency  Enterprise Networks including Power over Ethernet (PoE)  Positive remote On/Off logic  Input under/over voltage protection  Output overcurrent and overvoltage protection  Over-temperature protection Options  Remote sense  Negative Remote On/Off logic  No reverse current during output shutdown  Over current/Over temperature/Over voltage protections  Output Voltage adjust: 90% to 110% of V o,nom (Auto-restart)  Wide operating temperature range (-40°C to 85°C)  Heat plate version (-H)  Suitable for cold wall cooling using suitable Gap  Surface Mount version (-S) Pad applied directly to top side of module †  UL*Recognized to UL60950-1, CAN/CSA C22.2 ‡ No.60950-1, and EN60950-1(VDE 0805-1) Licensed §  CE mark meets 2006/95/EC directive  Meets the voltage and current requirements for ETSI 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1  2250 Vdc Isolation tested in compliance with IEEE ¤ 802.3 PoE standards **  ISO 9001 and ISO 14001 certified manufacturing facilities Description The EHW007A0B, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 7A of output current and provide a precisely regulated output voltage of 12.0V over a wide range of input voltages (VIN = 36 - 75Vdc). The modules achieve typical full load efficiency of 92.5%. The open frame modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection. October 1, 2015 ©2012 General Electric Company. All rights reserved. Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All VIN -0.3 80 Vdc Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc Operating Ambient Temperature All T -40 85 °C A (see Thermal Considerations section) Storage Temperature All T -55 125 °C stg I/O Isolation voltage (100% factory Hi-Pot tested) All   2250 V dc Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All V 36 48 75 V IN dc Maximum Input Current All I 2.75 3.0 A IN,max dc (VIN= VIN, min to VIN, max, IO=IO, max) Input No Load Current All IIN,No load 70 mA (VIN = VIN, nom, IO = 0, module enabled) Input Stand-by Current All IIN,stand-by 5 8 mA (VIN = VIN, nom, module disabled) 2 2 Inrush Transient All It 0.5 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO= All 30 mAp-p I ; See Test configuration section) Omax Input Ripple Rejection (120Hz) All 50 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 2 Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Nominal Output Voltage Set-point VIN=VIN, min, IO=IO, max, TA=25°C) All VO, set 11.8 12.0 12.24 Vdc Output Voltage All V 11.64 12.36 % V (Over all operating input voltage, resistive load, and O  O, set temperature conditions until end of life) Output Regulation Line (VIN=VIN, min to VIN, max) All   ±0.2 % VO, set Load (I =I to I ) All ±0.2 % V O O, min O, max   O, set Temperature (Tref=TA, min to TA, max) All   % VO, set ±1.0 Output Ripple and Noise on nominal output (VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max) RMS (5Hz to 20MHz bandwidth) All  20 30 mVrms Peak-to-Peak (5Hz to 20MHz bandwidth) All  50 100 mVpk-pk External Capacitance All C 0 2,000 μF O, max  Output Current All I 0 7 A o  dc Output Current Limit Inception (Hiccup Mode ) I % I O, lim o All 105 120 130 (VO= 90% of VO, set) Output Short-Circuit Current All IO, s/c 5 Arms (VO≤250mV) ( Hiccup Mode ) Efficiency V = V , T =25°C, I =I V = V All η 92.5 % IN IN, nom A O O, max , O O,set V = V , T =25°C, I =0.5I V = V All η 91.5 % IN IN, nom A O O, max , O O,set Switching Frequency All f 400 kHz sw Dynamic Load Response (dIo/dt=0.1A/s; VIN = VIN, nom; TA=25°C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation All V 3 % V pk   O, set Settling Time (Vo<10% peak deviation) All ts  200  s (dIo/dt=1.0A/s; VIN = VIN, nom; TA=25°C) Load Change from Io= 50% to 75% or 25% to 50% of I o,max Peak Deviation All V  5  % V pk O, set Settling Time (Vo<10% peak deviation) All t  200  s s Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All Ciso  1000  pF Isolation Resistance All R 100   MΩ iso I/O Isolation Voltage (100% factory Hi-pot tested) All All 2250 V   dc General Specifications Parameter Device Symbol Min Typ Max Unit 9 Calculated Reliability based upon Telcordia SR-332 Issue 2: All FIT 235.0 10 /Hours Method I Case 3 (I =80%I , T =40°C, airflow = 200 lfm, O O, max A All MTBF 4,254,493 Hours 90% confidence) 21 g Weight (Open Frame) All (0.77) (oz.) 33 g Weight (with Heatplate) All (1.16) (oz.) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 3 Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All Ion/off  0.3 1.0 mA Logic Low - On/Off Voltage All Von/off -0.7  1.2 Vdc Logic High Voltage – (Typ = Open Collector) All Von/off  5 Vdc Logic High maximum allowable leakage current All I   10 μA on/off Turn-On Delay and Rise Times o (IO=IO, max , VIN=VIN, nom, TA = 25C) Case 1: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (Tdelay = All Tdelay — 20 — msec from instant at which VIN=VIN, min until VO = 10% of VO, set). Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (T from All T — — 150 msec delay delay instant at which VIN = VIN, min until Vo=10% of VO,set) Output voltage Rise time (time for Vo to rise from 10% All Trise — 5 12 msec of V to 90% of V ) o,set o, set Output voltage overshoot – Startup All — 3 % VO, set o IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C Remote Sense Range All VSENSE 10 % VO, set Output Voltage Adjustment Range All 90 110 % VO, set Output Overvoltage Protection All VO, limit 13.8  16.5 Vdc O Overtemperature Protection – Hiccup Auto Restart All T  135  C ref Input Undervoltage Lockout All V UVLO Turn-on Threshold 34 36 V  dc Turn-off Threshold 30 32 V  dc Hysterisis 1 2 3 Vdc Input Overvoltage Lockout All V OVLO Turn-on Threshold 76 79  Vdc Turn-off Threshold 81 83 Vdc  Hysterisis 1 2 Vdc  October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 4 Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Characteristic Curves o The following figures provide typical characteristics for the EHW007A0B (12.0V, 7A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 95 90 85 Vin = 75V Vin = 48V Vin = 36V 80 75 70 0 123 456 7 OUTPUT CURRENT, I (A) TIME, t (100µs/div) O Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 1.0A/µS Dynamic Load Change from 50% to 75% to 50% of full load. TIME, t (2s/div) TIME, t (5ms/div) Figure 2. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 5. Typical Start-up Using Remote On/Off, negative Io,max). logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (200µs/div) TIME, t (20ms/div) Figure 3. Transient Response to 0.1A/µS Dynamic Load Figure 6. Typical Start-up Using Input Voltage (VIN = VIN,NOM, Change from 50% to 75% to 50% of full load. Io = Io,max). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 5 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io(A) (2A/div) VO (V) (200mV/div) EFFICIENCY,  (%) V (V) (50mV/div) O OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE VO (V) (5V/div) VOn/Off (V) (5V/div) Io(A) (2A/div) VO (V) (200mV/div) VO (V) (5V/div) VIN (V) (20V/div) Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE The power module should be connected to a low ac-impedance source. Highly inductive source L TES T Vin+ impedance can affect the stability of the power module. 12μH For the test configuration in Figure 7 a 33-100μF electrolytic capacitor (ESR<0.7 at 100kHz), mounted 33-100μF C 220μF S close to the power module helps ensure the stability of E.S.R.<0.1 the unit. Consult the factory for further application @ 20°C 100kHz guidelines. Vin- Safety Considerations For safety-agency approval of the system in which the NOTE: Measure input reflected ripple current with a simulated source inductance (L ) of 12μH. Capacitor C offsets TEST S power module is used, the power module must be possible battery impedance. Measure current as shown above. installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e. Figure 7. Input Reflected Ripple Current Test Setup. UL60950-1, CSA C22.2 No.60950-1, and VDE0805- COPPER STRIP 1(IEC60950-1). If the input source is non-SELV (ELV or a hazardous V (+) RESISTIVE O LOAD voltage greater than 60 Vdc and less than or equal to SCOPE 75Vdc), for the module’s output to be considered as meeting the requirements for safety extra-low voltage V O (– ) 1uF 10uF (SELV), all of the following must be true:  The input source is to be provided with reinforced GROUND PLANE insulation from any other hazardous voltages, NOTE: All voltage measurements to be taken at the module including the ac mains. terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals  One V pin and one V pin are to be grounded, or IN OUT to avoid measurement errors due to socket contact resistance. both the input and output pins are to be kept Figure 8. Output Ripple and Noise Test Setup. floating.  The input pins of the module are not operator accessible.  Another SELV reliability test is conducted on the whole system (combination of supply source and R R R R distribution contact contact distribution subject module), as required by the safety agencies, Vin+ Vout+ to verify that under a single fault, hazardous voltages do not appear at the module’s output. R LOAD V V IN O Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to R R R R distribution contact contact distribution Vin- Vout- appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs NOTE: All voltage measurements to be taken at the module when all inputs are ELV. terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals All flammable materials used in the manufacturing of to avoid measurement errors due to socket contact these modules are rated 94V-0, or tested to the UL60950 resistance. A.2 for reduced thickness. Figure 9. Output Voltage and Efficiency Test Setup. For input voltages exceeding –60 Vdc but less than or V . I O O equal to –75 Vdc, these converters have been evaluated Efficiency = x 100 %  to the applicable requirements of BASIC INSULATION VIN. IIN between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 6 A fast-acting fuse in the ungrounded lead. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 6 BATTERY Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current that the maximum output power of the module remains Feature Description at or below the maximum rated power (Maximum rated Remote On/Off power = Vo,set x Io,max). Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the SENSE(+) ON/OFF pin, and off during a logic low. Negative logic SENSE(–) remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low. VI(+) VO(+) IO SUPPL Y LOAD II VI(-) VO(–) CONTACT CONT ACT AND Vin+ Vout+ RESIST ANCE DISTRIBUTION LOSSE I Figure 11. Circuit Configuration for remote sense . on/off ON/OFF TRIM Input Undervoltage Lockout Von/off At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised Vout- Vin- above the undervoltage lockout turn-on threshold, VUV/ON. Figure 10. Remote On/Off Implementation. Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn- off threshold, V . UV/OFF To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control Overtemperature Protection the voltage (Von/off) between the ON/OFF terminal and the To provide protection under certain fault conditions, the VIN(-) terminal (see Figure 10). Logic low is unit is equipped with a thermal shutdown circuit. The 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a logic low unit will shutdown if the thermal reference point Tref is 1mA, the switch should be maintain a logic low level o (Figure 13), exceeds 135 C (typical), but the thermal whilst sinking this current. shutdown is not intended as a guarantee that the unit During a logic high, the typical maximum V on/off will survive temperatures beyond its rating. The module generated by the module is 5V, and the maximum can be restarted by cycling the dc input power for at allowable leakage current at Von/off = 5V is 1μA. least one second or by toggling the remote on/off signal If not using the remote on/off feature: for at least one second. If the auto-restart option (4) is For positive logic, leave the ON/OFF pin open. ordered, the module will automatically restart upon cool- down to a safe temperature. For negative logic, short the ON/OFF pin to VIN(-). Remote Sense Output Overvoltage Protection Remote sense minimizes the effects of distribution losses The output over voltage protection scheme of the by regulating the voltage at the remote-sense modules has an independent over voltage loop to connections (See Figure 11). The voltage between the prevent single point of failure. This protection feature remote-sense pins and the output terminals must not latches in the event of over voltage across the output. exceed the output voltage sense range given in the Cycling the on/off pin or input voltage resets the latching Feature Specifications table: protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an [V (+) – V (–)] – [SENSE(+) – SENSE(–)]  0.5 V O O internally programmed time elapsing. Although the output voltage can be increased by both Overcurrent Protection the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. To provide protection in a fault (output overload) The maximum increase is the larger of either the remote condition, the unit is equipped with internal sense or the trim. current-limiting circuitry and can endure current limiting continuously. At the point of current-limit The amount of power delivered by the module is defined inception, the unit enters hiccup mode. If the unit is as the voltage at the output terminals multiplied by the not configured with auto–restart, then it will latch off output current. When using remote sense and trim, the following the over current condition. The module can be output voltage of the module can be increased, which at restarted by cycling the dc input power for at least the same output current would increase the power output of the module. Care should be taken to ensure October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 7 Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current 5.11V  (100%)  Feature Descriptions (continued) 511 o,set R   10.22 trimup   one second or by toggling the remote on/off signal for at 1.225% %   least one second. If the unit is configured with the auto- V V  restart option (4), it will remain in the hiccup mode as Where desired o ,set    %  100   long as the overcurrent condition exists; it operates V o ,set   normally, once the output current is brought back into its For example, to trim-up the output voltage of the module specified range. The average output current during by 5% to 12.6V, R is calculated is as follows: trim-up hiccup is 10% IO, max.  % 5 Output Voltage Programming 5.1112.0 (100 5) 511   Trimming allows the output voltage set point to be R    10 .22  trimup   1.225 5 5   increased or decreased, this is accomplished by R  938.8 connecting an external resistor between the TRIM pin trimup and either the VO(+) pin or the VO(-) pin. The voltage between the VO(+) and VO(–) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit V (+) V (+) IN O includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment R trim-up trim. ON/OFF Although the output voltage can be increased by both LOAD V TRIM O the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. Rtrim-down The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals V (-) V (-) IN O multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be Figure 12. Circuit Configuration to Trim Output taken to ensure that the maximum output power of the Voltage. module remains at or below the maximum rated power Connecting an external resistor (Rtrim-down) between the (Maximum rated power = VO,set x IO,max). TRIM pin and the VO(-) (or Sense(-)) pin decreases the Thermal Considerations output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%. The power modules operate in a variety of thermal The following equation determines the required external environments; however, sufficient cooling should be resistor value to obtain a percentage output voltage provided to help ensure reliable operation. change of ∆% Considerations include ambient temperature, airflow, 511 module power dissipation, and the need for increased   R   10 .22  trimdown   reliability. A reduction in the operating temperature of  %   the module will result in an increase in reliability. The   V V thermal data presented here is based on physical Where o,set desired   %  100   measurements taken in a wind tunnel. V o,set   For example, to trim-down the output voltage of the The thermal reference point, T used in the ref module by 8% to 11.04V, Rtrim-down is calculated as specifications for open frame modules is shown in Figure follows: 13. For reliable operation this temperature should not o % 8 exceed 123 C. The thermal reference point, Tref used in the 511  specifications for modules with heatplate is shown in R  10.22 trimdown   8   Figure 14. For reliable operation this temperature should o not exceed 110 C. R  53 .655 trimdown ) between the Connecting an external resistor (Rtrim-up TRIM pin and the V (+) (or Sense (+)) pin increases the O output voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%: October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 8 Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current 8 Thermal Considerations (continued) 2.0 m/s (400 LFM) 7 6 1.0 m/s (200 LFM) 5 0.5 m/s (100 LFM) NC AIRFLOW 4 Figure 13. T Temperature Measurement Location ref 3 20 30 40 50 60 70 80 90 for Open Frame Module. o AMBIENT TEMEPERATURE, TA ( C) Figure 15. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. 8 AIRFLOW 7 Figure 14. Tref Temperature Measurement Location 6 for Module with Heatplate. 1.0 m/s (200 LFM) 5 0.5 m/s Heat Transfer via Convection (100 LFM) NC Increased airflow over the module enhances the heat 4 transfer via convection. Derating curves showing the maximum output current that can be delivered by 3 each module versus local ambient temperature (TA) 20 30 40 50 60 70 80 90 for natural convection and up to 3m/s (600 ft./min) o AMBIENT TEMEPERATURE, T ( C) A forced airflow are shown in Figure 14. Figure 16. Output Current Derating for the Module Please refer to the Application Note “Thermal with Heatplate and 0.25 in. heat sink; Airflow in the Characterization Process For Open-Frame Board- Transverse Direction from Vout(+) to Vout(-); Vin =48V. Mounted Power Modules” for a detailed discussion of 8 1.0 m/s thermal aspects including maximum device (200 LFM) temperatures. 7 8 6 3.0 m/s 0.5 m/s (600 LFM) (100 LFM) 7 5 NC 6 4 2.0 m/s 5 (400 LFM) 3 1.0 m/s 20 30 40 50 60 70 80 90 4 (200 LFM) 0.5 m/s o AMBIENT TEMEPERATURE, TA ( C) (100 LFM) 3 NC Figure 17. Output Current Derating for the Module 2 with Heatplate and 0.5 in. heat sink; Airflow in the 20 30 40 50 60 70 80 90 Transverse Direction from Vout(+) to Vout(-); Vin =48V. o AMBIENT TEMEPERATURE, T ( C) A Figure 14. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT, I (A) O OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O O Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current or in a conventional Tin/Lead (Sn/Pb) process. It is Thermal Considerations (continued) recommended that the customer review data sheets in 8 order to customize the solder reflow profile for each application board assembly. The following instructions 7 must be observed when soldering these units. Failure to observe these instructions may result in the failure of or 6 0.5 m/s cause damage to the modules, and can adversely affect (100 LFM) NC long-term reliability. 5 In a conventional Tin/Lead (Sn/Pb) solder process peak o reflow temperatures are limited to less than 235 C. 4 o Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device connection. 3 20 30 40 50 60 70 80 90 Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are o AMBIENT TEMEPERATURE, TA ( C) several types of SMT reflow technologies currently used Figure 18. Output Current Derating for the Module in the industry. These surface mount power modules with Heatplate and 1.0 in. heat sink; Airflow in the can be reliably soldered using natural forced convection, Transverse Direction from Vout(+) to Vout(-); Vin =48V. IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be Surface Mount Information established by accurately measuring the modules CP Pick and Place connector temperatures. 300 The EHW007A0B modules use an open frame o construction and are designed for a fully automated Peak Temp 235 C 250 assembly process. The modules are fitted with a label Cooling designed to provide a large surface area for pick and zone Heat zo ne place operations. The label meets all the requirements 200 o -1 o -1 1-4 Cs max 4 Cs for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures 150 o of up to 300 C. The label also carries product So ak zo ne information such as product code, serial number and the 10 0 T above 30-240s lim location of manufacture. o 205 C 50 Preheat zo ne o -1 max 4 Cs 0 REFLOW TIME (S) Figure 18. Reflow Profile for Tin/Lead (Sn/Pb) process 240 235 Figure 17. Pick and Place Location. 230 Nozzle Recommendations 225 The module weight has been kept to a minimum by 220 using open frame construction. Even so, these modules have a relatively large mass when compared to 215 conventional SMT components. Variables such as nozzle 210 size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The 205 minimum recommended nozzle diameter for reliable 200 operation is 6mm. The maximum nozzle outer diameter, 0 1020 30 4050 60 which will safely fit within the allowable component o Figure 19. Time Limit Curve Above 205 C for Tin/Lead spacing, is 9 mm. (Sn/Pb) process Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. Tin Lead Soldering The EHW007A0B power modules are lead free modules and can be soldered either in a lead-free solder process October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 10 OUTPUT CURRENT, I (A) O MAX TEMP SOLDER (C) REFLOW TEMP (C) Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current seal date, when stored at the following conditions: < 40° Surface Mount Information (continued) C, < 90% relative humidity. Lead Free Soldering Post Solder Cleaning and Drying Considerations The –Z version of the EHW007A0B modules are lead-free Post solder cleaning is usually the final circuit-board (Pb-free) and RoHS compliant and are both forward and assembly process prior to electrical board testing. The backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result of inadequate cleaning and drying can affect both result in the failure of or cause damage to the modules the reliability of a power module and the testability of and can adversely affect long-term reliability. the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, Pb-free Reflow Profile refer to GE Board Mounted Power Modules: Soldering and Cleaning Power Systems will comply with J-STD-020 Rev. C Application Note (AN04-001). (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. Through-Hole Lead-Free Soldering This standard provides a recommended forced-air- Information convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb- The RoHS-compliant through-hole products use the SAC free solder paste is Sn/Ag/Cu (SAC). The recommended (Sn/Ag/Cu) Pb-free solder and RoHS-compliant linear reflow profile using Sn/Ag/Cu solder is shown in components. They are designed to be processed Figure 20. through single or dual wave soldering machines. The 300 Per J-STD-020 Rev. C pins have an RoHS-compliant finish that is compatible Peak Temp 260°C with both Pb and Pb-free wave soldering processes. A 250 maximum preheat rate of 3C/s is suggested. The wave Cooling 200 preheat process should be such that the temperature of Zone * Min. Time Above 235°C the power module board is kept below 210C. For Pb 15 Seconds 150 solder, the recommended pot temperature is 260C, Heating Zone *Time Above 217°C 1°C/Second 60 Seconds while the Pb-free solder pot is 270C max. Not all RoHS- 100 compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If 50 additional information is needed, please consult with your GE representative for more details. 0 Reflow Time (Seconds) Figure 20. Recommended linear reflow profile using Sn/Ag/Cu solder. MSL Rating The EHW007A0B modules have a MSL rating of 2. Storage and Handling The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of  30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 11 Reflow Temp (°C) Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current EMC Considerations The circuit and plots in Figure 21 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B. Level [dBµV] 80 70 60 50 x x x x 40 x x 30 20 10 0 150k 300k 500k 1M 2M 3M 4M5M 7M 10M 30M Frequency [Hz] x xMES CE0508091459_fin QP MES CE0508091459_pre PK Level [dBµV] 80 70 60 50 + + + 40 + + + 30 20 10 0 150k 300k 500k 1M 2M 3M 4M5M 7M 10M 30M Frequency [Hz] + +MES CE0508091459_fin AV MES CE0508091459_pre AV Figure 21. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 12 Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top side label includes GE name, product designation and date code. Top View* Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 13 Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Mechanical Outline for Surface Mount Module (-S Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] * Top side label includes GE name, product designation and date code. Top View* Side View Bottom View Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 14 Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Mechanical Outline for Through-Hole Module with Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View* * Bottom side label includes GE name, product designation and date code. Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 15 Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) SMT Recommended Pad Layout (Component Side View) Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER TH Recommended Pad Layout (Component Side View) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 16 Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Each tray contains a total of 12 power modules. The trays Packaging Details are self-stacking and each shipping box for the The surface mount versions of the EHW007A0B (suffix –S) EHW007A0B (suffix –S) surface mount module will contain are supplied as standard in the plastic trays shown in 4 full trays plus one empty hold down tray giving a total Figure 22. number of 48 power modules. Tray Specification Material Antistatic coated PVC 12 Max surface resistivity 10 /sq Color Clear Capacity 12 power modules Figure 22. Surface Mount Packaging Tray October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 17 Data Sheet GE EHW007A0B Series Eighth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 7A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1. Device Codes Output Output On/Off Connector Product Codes Input Voltage Comcodes Voltage Current Logic Type EHW007A0B41Z 48V (36-75Vdc) 12.0V 7A Negative Through hole CC109145100 EHW007A0B641Z 48V (36-75Vdc) 12.0V 7A Negative Through hole CC109154316 EHW007A0B41-HZ 48V (36-75Vdc) 12.0V 7A Negative Through hole CC109143194 EHW007A0B41-SZ 48V (36-75Vdc) 12.0V 7A Negative Surface mount CC109147402 Table 2. Device Coding Scheme and Options Character and Position Characteristic Definition Form Factor E E = Eighth Brick Family Designator H Input Voltage W W = Wide Range, 36V-75V Output Current 007A0 007A0 = 007.0 Amps Maximum Output Current Output Voltage B B = 12.0V nominal Omit = Default Pin Length shown in Mechanical Outline Figures Pin Length 6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 8 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) Action following Omit = Latching Mode Protective Shutdown 4 4 = Auto-restart following shutdown (Overcurrent/Overvoltage) Omit = Positive Logic On/Off Logic 1 1 = Negative Logic Omit = Standard open Frame Module Mechanical Features H H = Heat plate, for use with heat sinks (not available with –S) option) S S = Surface mount connections Customer Specific XY XY = Customer Specific Modified Code, Omit for Standard Code Omit = RoHS 5/6, Lead Based Solder Used RoHS Z Z = RoHS 6/6 Compliant, Lead free Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 1, 2015 ©2012 General Electric Company. All International rights reserved. Version 1.04 Options Ratings