Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Features  Compliant to RoHS EU Directive 2011/65/EU (Z versions)  Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this produc twill no longer be RoHS compliant (non-Z versions) RoHS Compliant  Compliant to ROHS EU Directive 2002/95/EC with lead solder exemption (non-Z versions)  High efficiency 92% at 5.0V full load (Vin=48Vdc)  Industry standard, DOSA compliant footprint 58.4mm x 22.8mm x 7.77mm (2.30 in x 0.9 in x 0.306 in)  Low profile height and reduced component skyline Applications  Wide input voltage range: 36-75 Vdc  Distributed Power Architectures  Tightly regulated output  Wireless Network Infrastructure  Constant switching frequency  Access and Optical Network Equipment  Positive remote On/Off logic  Enterprise Networks, including Power over Ethernet (PoE)  Input under/over voltage protection  Output overcurrent and overvoltage protection  Over-temperature protection Options  Remote sense  Negative Remote On/Off logic  No reverse current during output shutdown  Over current/Over temperature/Over voltage protections  Output Voltage adjust: 90% to 112% of V (Auto-restart) o,nom  Wide operating temperature range (-40°C to 85°C)  Surface Mount version (-S)  Suitable for cold wall cooling using suitable Gap Pad applied directly to top side of module †  UL*Recognized to UL60950-1, CAN/CSA C22.2 ‡ No.60950-1, and EN60950-1(VDE 0805-1) Licensed §  CE mark meets 2006/95/EC directive  Meets the voltage and current requirements for ETSI 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1  2250 Vdc Isolation tested in compliance with IEEE ¤ 802.3 PoE standards **  ISO 9001 and ISO 14001 certified manufacturing facilities Description The EHW015A0A, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 15A of output current and provide a precisely regulated output voltage of 5.0V over a wide range of input voltages (VIN = 36 - 75Vdc). The modules achieve typical full load efficiency of 92%. The open frame modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection. October 1, 2015 ©2012 General Electric Company. All rights reserved. Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All VIN -0.3 80 Vdc Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc Operating Ambient Temperature All T -40 85 °C A (see Thermal Considerations section) Storage Temperature All T -55 125 °C stg I/O Isolation voltage (100% factory Hi-Pot tested) All   2250 V dc Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All V 36 48 75 V IN dc Maximum Input Current All IIN,max 2.75 3.0 Adc (V = V to V , I =I ) IN IN, min IN, max O O, max Input No Load Current All IIN,No load 70 mA (VIN = VIN, nom, IO = 0, module enabled) Input Stand-by Current All I 2.5 5.0 mA IN,stand-by (VIN = VIN, nom, module disabled) 2 2 Inrush Transient All It 0.5 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO= All 20 mAp-p I ; See Test configuration section) Omax Input Ripple Rejection (120Hz) All 65 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 2 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Nominal Output Voltage Set-point V =V , I =I , T=25°C) All V 4.90 5.0 5.10 V IN IN, min O O, max A O, set dc Output Voltage (Over all operating input voltage, resistive load, and All VO 4.85  5.15 % VO, set temperature conditions until end of life) Output Regulation Line (VIN=VIN, min to VIN, max) All   ±0.2 % VO, set All Load (IO=IO, min to IO, max)   ±0.2 % VO, set Temperature (Tref=TA, min to TA, max) All   % VO, set ±0.2 Output Ripple and Noise on nominal output (VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max) RMS (5Hz to 20MHz bandwidth) All  15 25 mVrms Peak-to-Peak (5Hz to 20MHz bandwidth) All  40 75 mVpk-pk External Capacitance All C 500 4,700 μF O  Output Current All I 0 15 A O  dc Output Current Limit Inception (Hiccup Mode ) I % I O, lim o All 105 120 130 (VO= 90% of VO, set) Output Short-Circuit Current All IO, s/c 5 Arms (V≤250mV) ( Hiccup Mode ) O Efficiency V = V , T =25°C, I =I V = V All η 92.0 % IN IN, nom A O O, max , O O,set V = V , T =25°C, I =0.5I V = V All η 90.0 % IN IN, nom A O O, max , O O,set Switching Frequency All fsw 400 kHz Dynamic Load Response (dIo/dt=0.1A/s; VIN = VIN, nom; TA=25°C, Co=Co,min) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation All V 2 % V pk   O, set Settling Time (Vo<10% peak deviation) All ts  200  s (dIo/dt=1.0A/s; VIN = VIN, nom; TA=25°C, Co=Co,min) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation All V  2  % V pk O, set Settling Time (Vo<10% peak deviation) All t 200 s   s Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All Ciso  2000  pF Isolation Resistance All R 100 MΩ iso   I/O Isolation Voltage (100% factory Hi-pot tested) All All 2250 V   dc General Specifications Parameter Device Symbol Min Typ Max Unit 9 All FIT 244.1 10 /Hours Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3 (I =80%I , T =40°C, airflow = 200 lfm, O O, max A All MTBF 4,097,359 Hours 90% confidence) 19 g Weight (Open Frame) All   (0.67) (oz.) 31 g Weight (with Heatplate) All   (1.09) (oz.) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 3 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All Ion/off  0.3 1.0 mA Logic Low - On/Off Voltage All Von/off -0.7  1.2 Vdc Logic High Voltage – (Typ = Open Collector) All Von/off  5 Vdc Logic High maximum allowable leakage current All I 10 μA on/off   Turn-On Delay and Rise Times o (IO=IO, max , VIN=VIN, nom, TA = 25C) Case 1: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (Tdelay = All Tdelay — — 50 msec from instant at which VIN=VIN, min until VO = 10% of VO, set). Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (T from All T — — 50 msec delay delay instant at which VIN = VIN, min until Vo=10% of VO,set) Output voltage Rise time (time for Vo to rise from 10% All T — 5 12 msec rise to 90% of V ) of Vo,set o, set Output voltage overshoot – Startup All — 3 % VO, set o IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C Remote Sense Range All VSENSE 10 % VO, set Output Voltage Adjustment Range All 90 112 % VO, set Output Overvoltage Protection All VO, limit 5.75  7.0 Vdc O Overtemperature Protecdtion – Hiccup Auto Restart All T 130 C ref   Input Undervoltage Lockout All V UVLO Turn-on Threshold 33 36 V  dc Turn-off Threshold 27 28  Vdc Hysterisis 3 5.5  Vdc October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 4 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Characteristic Curves o The following figures provide typical characteristics for the EHW015A0A (5.0V, 15A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 94 91 88 85 Vin=75V 82 Vin=48V 79 Vin=36V 76 73 70 03 69 12 15 OUTPUT CURRENT, IO (A) TIME, t (200µs/div) Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 1.0A/µS Dynamic Load Change from 50% to 75% to 50% of full load (VIN = VIN,NOM). TIME, t (20ms/div) TIME, t (2s/div) Figure 2. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 5. Typical Start-up Using Remote On/Off, negative Io,max). logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (200µs/div) TIME, t (20ms/div) Figure 3. Transient Response to 0.1A/µS Dynamic Load Figure 6. Typical Start-up Using Input Voltage (VIN = VIN,NOM, Change from 50% to 75% to 50% of full load (VIN = VIN,NOM). Io = Io,max). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 5 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io(A) (5A/div) VO (V) (100mV/div) EFFICIENCY,  (%) V (V) (20mV/div) O OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE VO (V) (2V/div) VOn/Off (V) (5V/div) Io(A) (5A/div) VO (V) (100mV/div) VO (V) (2V/div) VIN (V) (20V/div) Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE The power module should be connected to a low ac-impedance source. Highly inductive source impedance L TES T Vin+ can affect the stability of the power module. For the test 12μH configuration in Figure 7, a 33-100μF electrolytic capacitor (ESR<0.7 at 100kHz), mounted close to the power 33-100μF C 220μF S module helps ensure the stability of the unit. Consult the E.S.R.<0.1 factory for further application guidelines. @ 20°C 100kHz Safety Considerations Vin- For safety-agency approval of the system in which the power module is used, the power module must be NOTE: Measure input reflected ripple current with a simulated source inductance (L ) of 12μH. Capacitor C offsets TEST S installed in compliance with the spacing and separation possible battery impedance. Measure current as shown above. requirements of the end-use safety agency standard, i.e. UL60950-1, CSA C22.2 No.60950-1, and VDE0805- Figure 7. Input Reflected Ripple Current Test Setup. 1(IEC60950-1). COPPER STRIP If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for V (+) RESISTIVE O LOAD the module’s output to be considered as meeting the SCOPE requirements for safety extra-low voltage (SELV), all of the 1uF 10uF following must be true: V (– ) O  The input source is to be provided with reinforced insulation from any other hazardous voltages, GROUND PLANE including the ac mains. NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then  One VIN pin and one VOUT pin are to be grounded, or Kelvin connections are required at the module terminals both the input and output pins are to be kept floating. to avoid measurement errors due to socket contact resistance.  The input pins of the module are not operator Figure 8. Output Ripple and Noise Test Setup. accessible.  Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages R R R R distribution contact contact distribution do not appear at the module’s output. Vin+ Vout+ Note: Do not ground either of the input pins of the module without grounding one of the output pins. R LOAD V V IN O This may allow a non-SELV voltage to appear between the output pins and ground. R R R R distribution contact contact distribution The power module has extra-low voltage (ELV) outputs Vin- Vout- when all inputs are ELV. All flammable materials used in the manufacturing of NOTE: All voltage measurements to be taken at the module these modules are rated 94V-0, or tested to the UL60950 terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals A.2 for reduced thickness. to avoid measurement errors due to socket contact resistance. For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to Figure 9. Output Voltage and Efficiency Test Setup. the applicable requirements of BASIC INSULATION V . I O O between secondary DC MAINS DISTRIBUTION input Efficiency  = x 100 % (classified as TNV-2 in Europe) and unearthed SELV V . I IN IN outputs. The input to these units is to be provided with a maximum 6 A fast-acting fuse in the ungrounded lead. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 6 BATTERY Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current the same output current would increase the power output Feature Description of the module. Care should be taken to ensure that the Remote On/Off maximum output power of the module remains at or below the maximum rated power (Maximum rated power Two remote on/off options are available. Positive logic = Vo,set x Io,max). turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off SENSE(+) during a logic high and on during a logic low. SENSE(–) VI(+) VO(+) IO Vin+ SUPPL Y LOAD Vout+ II VI(-) VO(–) CONTACT CONT ACT AND RESIST ANCE DISTRIBUTION LOSSE I on/off ON/OFF TRIM Figure 11. Circuit Configuration for remote sense . Von/off Input Undervoltage Lockout At input voltages below the input undervoltage lockout Vout- Vin- limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON. Figure 10. Remote On/Off Implementation. Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, V . UV/OFF To turn the power module on and off, the user must supply Overtemperature Protection a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VIN(-) To provide protection under certain fault conditions, the terminal (see Figure 10). Logic low is 0V ≤ Von/off ≤ 1.2V. The unit is equipped with a thermal shutdown circuit. The unit maximum I during a logic low is 1mA, the switch on/off will shutdown if the thermal reference point Tref (Figure should be maintain a logic low level whilst sinking this o 13), exceeds 130 C (typical), but the thermal shutdown is current. not intended as a guarantee that the unit will survive During a logic high, the typical maximum Von/off generated temperatures beyond its rating. The module can be by the module is 15V, and the maximum allowable restarted by cycling the dc input power for at least one leakage current at Von/off = 5V is 1μA. second or by toggling the remote on/off signal for at least If not using the remote on/off feature: one second. If the auto-restart option (4) is ordered, the module will automatically restart upon cool-down to a For positive logic, leave the ON/OFF pin open. safe temperature. For negative logic, short the ON/OFF pin to VIN(-). Remote Sense Output Overvoltage Protection Remote sense minimizes the effects of distribution losses The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single by regulating the voltage at the remote-sense connections point of failure. This protection feature latches in the (See Figure 11). The voltage between the remote-sense event of over voltage across the output. Cycling the on/off pins and the output terminals must not exceed the output pin or input voltage resets the latching protection feature. voltage sense range given in the Feature Specifications If the auto-restart option (4) is ordered, the module will table: automatically restart upon an internally programmed time [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V elapsing. Although the output voltage can be increased by both the Overcurrent Protection remote sense and by the trim, the maximum increase for To provide protection in a fault (output overload) condition, the output voltage is not the sum of both. The maximum the unit is equipped with internal increase is the larger of either the remote sense or the trim. current-limiting circuitry and can endure current limiting continuously. At the point of current-limit The amount of power delivered by the module is defined inception, the unit enters hiccup mode. If the unit is as the voltage at the output terminals multiplied by the not configured with auto–restart, then it will latch off output current. When using remote sense and trim, the following the over current condition. The module can be output voltage of the module can be increased, which at October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 7 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current required external resistor value to obtain a percentage Feature Descriptions (continued) output voltage change of ∆%: restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at 5.11V  (100%)  511  o,set least one second. If the unit is configured with the auto- R   10.22 trimup   1.225% %   restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally,   V V Where desired o ,set   once the output current is brought back into its specified  %  100   V o ,set range. The average output current during hiccup is 10% IO,   max. For example, to trim-up the output voltage of the module by 5% to 5.25V, Rtrim-up is calculated is as follows: Output Voltage Programming  %  5 Trimming allows the output voltage set point to be increased or decreased, this is accomplished by  5.11 5.0 (100 5) 511  R    10 .22  trimup   connecting an external resistor between the TRIM pin and 1.225 5 5   either the VO(+) pin or the VO(-) pin. R  325.6 trimup The voltage between the V (+) and V (–) terminals must O O not exceed the minimum output overvoltage protection V (+) V (+) IN O value shown in the Feature Specifications table. This limit R trim-up includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment ON/OFF trim. LOAD V TRIM O Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for R trim-down the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the V (-) V (-) IN O trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which Figure 12. Circuit Configuration to Trim Output Voltage. at the same output current would increase the power output of the module. Care should be taken to ensure that Connecting an external resistor (R ) between the trim-down the maximum output power of the module remains at or TRIM pin and the VO(-) (or Sense(-)) pin decreases the below the maximum rated power (Maximum rated power output voltage set point. To maintain set point accuracy, = V x I ). O,set O,max the trim resistor tolerance should be ±1.0%. The following equation determines the required external Thermal Considerations resistor value to obtain a percentage output voltage The power modules operate in a variety of thermal change of ∆% environments; however, sufficient cooling should be 511 provided to help ensure reliable operation.   R   10 .22  trimdown    %   Considerations include ambient temperature, airflow, module power dissipation, and the need for increased   V V Where o,set desired   %  100 reliability. A reduction in the operating temperature of the   V o,set   module will result in an increase in reliability. The thermal data presented here is based on physical measurements For example, to trim-down the output voltage of the taken in a wind tunnel. module by 8% to 4.6V, Rtrim-down is calculated as follows: The thermal reference point, Tref used in the specifications % 8 for open frame modules is shown in Figure 13. For reliable o operation this temperature should not exceed 117 C. 511  R  10.22 trimdown   The thermal reference point, T used in the specifications ref 8   for modules with heatplate is shown in Figure 14. For R  53 .6 reliable operation this temperature should not exceed trimdown o 105 C. Connecting an external resistor (Rtrim-up) between the TRIM pin and the V (+) (or Sense (+)) pin increases the output O voltage set point. The following equation determines the October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 8 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current convection and up to 3m/s (600 ft./min) forced airflow are Thermal Considerations (continued) shown in Figures 16 -19. 16 14 12 10 3.0 m/s (600 LFM) AIRFLOW 8 2.0 m/s (400 LFM) 6 1.0 m/s (200 LFM) 4 0.5 m/s Figure 13. T Temperature Measurement Location for ref (100 LFM) Open Frame Module. 2 NC 0 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, TA ( C) Figure 16. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. AIRFLOW 16 14 Figure 14. T Temperature Measurement Location for ref 12 Module with Heatplate. 10 3.0 m/s (600 LFM) Heat Transfer via Convection 8 2.0 m/s Increased airflow over the module enhances the heat (400 LFM) 6 1.0 m/s transfer via convection. Derating curves showing the (200 LFM) maximum output current that can be delivered by the 4 0.5 m/s (100 LFM) open frame module versus local ambient temperature (TA) 2 NC for natural convection and up to 3m/s (600 ft./min) forced 0 airflow are shown in Figure 15. 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, TA ( C) 16 14 Figure 17. Output Current Derating for the Module with Heatplate and 0.25 in. heat sink; Airflow in the 12 Transverse Direction from Vout(+) to Vout(-); Vin =48V. 10 3.0 m/s 16 (600 LFM) 8 2.0 m/s 14 (400 LFM) 6 1.0 m/s 12 (200 LFM) 4 0.5 m/s 10 3.0 m/s (100 LFM) 2 (600 LFM) NC 8 2.0 m/s (400 LFM) 0 6 20 30 40 50 60 70 80 90 1.0 m/s (200 LFM) 4 o 0.5 m/s AMBIENT TEMEPERATURE, TA ( C) (100 LFM) 2 NC Figure 15. Output Current Derating for the Open Frame 0 Module; Airflow in the Transverse Direction from Vout(+) 20 30 40 50 60 70 80 90 to Vout(-); Vin =48V. o AMBIENT TEMEPERATURE, T ( C) A For additional power, the module is available with an optional heatplate (-H), that allows for the use of heat Figure 18. Output Current Derating for the Module with sinks to improve the thermal derating. Derating curves Heatplate and 0.5 in. heat sink; Airflow in the showing the maximum output current that can be Transverse Direction from Vout(+) to Vout(-); Vin =48V. delivered by the heatplate module with different heat sink heights versus local ambient temperature (TA) for natural October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT, I (A) O OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O O Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Thermal Considerations (continued) Surface Mount Information 16 Pick and Place 14 The EHW015A0A-S modules use an open frame 12 construction and are designed for a fully automated 10 assembly process. The modules are fitted with a label 2.0 m/s designed to provide a large surface area for pick and 8 (400 LFM) place operations. The label meets all the requirements for 1.0 m/s 6 (200 LFM) surface mount processing, as well as safety standards, 0.5 m/s and is able to withstand reflow temperatures of up to 4 (100 LFM) o NC 300 C. The label also carries product information such as 2 product code, serial number and the location of 0 manufacture. 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, T ( C) A Figure 19. Output Current Derating for the Module with Heatplate and 1.0 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board-Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures. Figure 23. Pick and Place Location. Heat Transfer via Conduction The module can also be used in a sealed Nozzle Recommendations environment with cooling via conduction from the module’s top surface through a gap pad material to a The module weight has been kept to a minimum by using cold wall, as shown in Figure 20. The output current open frame construction. Even so, these modules have a derating versus cold wall temperature, when using a gap relatively large mass when compared to conventional SMT pad such as Bergquist GP2500S20, is shown in Figure 21. components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used Figure 20. Cold Wall Mounting within the space available. 16 The surface mountable modules in the EHW family use our 14 newest SMT technology called “Column Pin” (CP) connectors. Figure 24 shows the new CP connector 12 before and after reflow soldering onto the end-board 10 assembly. 8 EHW Board 6 4 2 20 30 40 50 60 70 80 90 Insulator o COLDPLATE TEMEPERATURE, TC ( C) Solder Ball Figure 21. Derated Output Current versus Cold Wall End assembly PCB Temperature with local ambient temperature around module at 85C; Vin=48V. Figure 24. Column Pin Connector Before and After Reflow Soldering . October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 10 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Figure 25. Reflow Profile for Tin/Lead (Sn/Pb) process. Surface Mount Information (continued) 240 The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of 235 tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag/Cu (SAC) 230 solder for –Z codes. The CP connector design is able to compensate for large amounts of co-planarity and still 225 ensure a reliable SMT solder joint. Typically, the eutectic o o 220 solder melts at 183 C (Sn/Pb solder) or 217-218 C (SAC solder), wets the land, and subsequently wicks the device 215 connection. Sufficient time must be allowed to fuse the 210 plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies 205 currently used in the industry. These surface mount 200 power modules can be reliably soldered using natural 0 1020 30 4050 60 forced convection, IR (radiant infrared), or a combination o Figure 26. Time Limit Curve Above 205 C for Tin/Lead of convection/IR. (Sn/Pb) process Tin Lead Soldering Lead Free Soldering The EHW015A0A power modules are lead free modules The –Z version of the EHW015A0A modules are lead-free and can be soldered either in a lead-free solder process or (Pb-free) and RoHS compliant and are both forward and in a conventional Tin/Lead (Sn/Pb) process. It is backward compatible in a Pb-free and a SnPb soldering recommended that the customer review data sheets in process. Failure to observe the instructions below may order to customize the solder reflow profile for each result in the failure of or cause damage to the modules application board assembly. The following instructions and can adversely affect long-term reliability. must be observed when soldering these units. Failure to observe these instructions may result in the failure of or Pb-free Reflow Profile cause damage to the modules, and can adversely affect long-term reliability. Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic In a conventional Tin/Lead (Sn/Pb) solder process peak Solid State Surface Mount Devices) for both Pb-free solder o reflow temperatures are limited to less than 235 C. profiles and MSL classification procedures. This standard o Typically, the eutectic solder melts at 183 C, wets the land, provides a recommended forced-air-convection reflow and subsequently wicks the device connection. Sufficient profile based on the volume and thickness of the package time must be allowed to fuse the plating on the (table 4-2). The suggested Pb-free solder paste is connection to ensure a reliable solder joint. There are Sn/Ag/Cu (SAC). The recommended linear reflow profile several types of SMT reflow technologies currently used in using Sn/Ag/Cu solder is shown in Figure 27. the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For MSL Rating reliable soldering the solder reflow profile should be established by accurately measuring the modules CP The EHW015A0A modules have a MSL rating of 2. connector temperatures. Storage and Handling 300 The recommended storage environment and handling o procedures for moisture-sensitive surface mount Peak Temp 235 C 250 packages is detailed in J-STD-033 Rev. A (Handling, Cooling Packing, Shipping and Use of Moisture/Reflow Sensitive zone Heat zone 200 o -1 Surface Mount Devices). Moisture barrier bags (MBB) with o -1 1-4 Cs max 4 Cs desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of 150 use. Once the original package is Soak zo ne 10 0 T above 30-240s lim o 205 C 50 Preheat zo ne o -1 max 4 Cs 0 REFLOW TIME (S) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 11 REFLOW TEMP (C) MAX TEMP SOLDER (C) Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Surface Mount Information (continued) Through-Hole Lead-Free Soldering Information broken, the floor life of the product at conditions of  30°C The RoHS-compliant through-hole products use the SAC and 60% relative humidity varies according to the MSL (Sn/Ag/Cu) Pb-free solder and RoHS-compliant rating (see J-STD-033A). The shelf life for dry packed SMT components. They are designed to be processed through packages will be a minimum of 12 months from the bag single or dual wave soldering machines. The pins have an seal date, when stored at the following conditions: < 40° RoHS-compliant finish that is compatible with both Pb and C, < 90% relative humidity. Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process Post Solder Cleaning and Drying Considerations should be such that the temperature of the power module board is kept below 210C. For Pb solder, the Post solder cleaning is usually the final circuit-board recommended pot temperature is 260C, while the Pb-free assembly process prior to electrical board testing. The solder pot is 270C max. Not all RoHS-compliant through- result of inadequate cleaning and drying can affect both hole products can be processed with paste-through-hole the reliability of a power module and the testability of the Pb or Pb-free reflow process. If additional information is finished circuit-board assembly. For guidance on needed, please consult with your GE representative for appropriate soldering, cleaning and drying procedures, more details. refer to GE Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). 300 Per J-STD-020 Rev. C Peak Temp 260°C 250 Cooling 200 Zone * Min. Time Above 235°C 15 Seconds 150 Heating Zone *Time Above 217°C 1°C/Second 60 Seconds 100 50 0 Reflow Time (Seconds) Figure 27. Recommended linear reflow profile using Sn/Ag/Cu solder. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 12 Reflow Temp (°C) Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current EMC Considerations The circuit and plots in Figure 28 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B. Level [dBµV] 80 70 60 50 x 40 x x x x 30 20 10 0 150k 300k 500k 1M 2M 3M 4M5M 7M 10M 30M Frequency [Hz] x xMES CE0526091159_fin QP MES CE0526091159_pre PK Level [dBµV] 80 70 60 50 + 40 + + + + 30 + 20 10 0 150k 300k 500k 1M 2M 3M 4M5M 7M 10M 30M Frequency [Hz] + +MES CE0526091159_fin AV MES CE0526091159_pre AV Figure 28. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 13 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in.  0.010 in.] † Top side label includes GE name, product designation and date code. Top † View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 14 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Mechanical Outline for Surface Mount Module (-S Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] † Top side label includes GE name, product designation and date code. Top † View Side View Bottom View Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 15 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Mechanical Outline for Through-Hole Module with Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom † View † Bottom side label includes GE name, product designation and date code. Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 16 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) SMT Recommended Pad Layout (Component Side View) Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER TH Recommended Pad Layout (Component Side View) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 17 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Each tray contains a total of 12 power modules. The trays Packaging Details are self-stacking and each shipping box for the The open frame through hole versions of the EHW015A0A EHW015A0A through hole module will contain 2 full trays and surface mount versions of the EHW015A0A (suffix –S) plus one empty hold down tray giving a total number of 24 are supplied as standard in the plastic trays shown in power modules; and each shipping box for the Figures 28 and 29. EHW015A0A (suffix –S) surface mount module will contain 4 full trays plus one empty hold down tray giving a total Tray Specification number of 48 power modules. Material Antistatic coated PVC 12 Max surface resistivity 10 /sq Color Clear Capacity 12 power modules Figure 28. Through Hole Packaging Tray October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 18 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Figure 29. Surface Mount Packaging Tray October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 19 Data Sheet GE EHW015A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 15A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1. Device Codes Output Output Connector Product Codes Input Voltage On/Off Logic Comcodes Voltage Current Type EHW015A0A1 48V (36-75Vdc) 5.0V 15A Negative Through hole CC109150587 EHW015A0A41Z 48V (36-75Vdc) 5.0V 15A Negative Through hole CC109141818 EHW015A0A41-HZ 48V (36-75Vdc) 5.0V 15A Negative Through hole CC109146387 EHW015A0A41-SZ CC109146395 48V (36-75Vdc) 5.0V 15A Negative Surface mount Table 2. Device Coding Scheme and Options Characteristic Character and Position Definition Form Factor E E = Eighth Brick Family Designator H Input Voltage W W = Wide Input Voltage Range, 36V -75V Output Current 015A0 015A0 = 015.0 Amps Rated Output Current Output Voltage A A = 5.0 Vout Nominal Omit = No Pin Trim Pin Length 6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 8 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) Action following Omit = Latching Mode Protective Shutdown 4 4 = Auto-restart following shutdown (Overcurrent/Overvoltage) Omit = Positive Logic On/Off logic 1 1 = Negative Logic - Customer Specific XY XY = Customer Specific Modified Code, Omit for Standard Code Omit = Standard open Frame Module Mechanical Features H H = Heat plate (not available with –S option) S S = Surface mount connections Omit = RoHS 5/6, Lead Based Solder Used RoHS Z Z = RoHS 6/6 Compliant, Lead free Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 1, 2015 ©2012 General Electric Company. All International rights reserved. Version 1.03 Options Ratings