Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Features  Compliant to RoHS EU Directive 2011/65/EU (Z versions)  Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this produc twill no longer be RoHS compliant (non-Z versions)  Compatible in a Pb-free or SnPb reflow environment  High efficiency – 92% at 3.3V full load RoHS Compliant  Industry standard, DOSA compliant, Eighth brick footprint 57.9mm x 22.9mm x 8.5mm (2.28in x 0.9in x 0.335in) Applications  Wide Input voltage range: 36-75 Vdc  Distributed power architectures  Tightly regulated output  Wireless networks  Constant switching frequency  Access and optical network Equipment  Positive Remote On/Off logic  Enterprise Networks  Input under/over voltage protection  Latest generation IC’s (DSP, FPGA, ASIC) and  Output overcurrent/voltage protection Microprocessor powered applications  Over-temperature protection Options  Remote sense  Negative Remote On/Off logic  No minimum load required  Over current/Over temperature/Over voltage protections (Auto-restart)  No reverse current during output shutdown  Heat plate versions (-C, -H)  Output Voltage adjust: 80% to 110% of Vo,nom  Surface Mount version (-S)  Operating temperature range (-40°C to 85°C) †  UL* 60950-1Recognized, CSA C22.2 No. 60950-1-03 ‡ Certified, and VDE 0805:2001-12 (EN60950-1) Licensed §  CE mark meets 73/23/EEC and 96/68/EEC directives  Meets the voltage and current requirements for ETSI 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1 **  ISO 9001 and ISO 14001 certified manufacturing facilities Description The EQW010/040 series DC-DC converters are designed to provide up to 40A output current in an industry standard eighth brick package. These DC-DC converters operate over an input voltage range of 36 to 75 Vdc and provide a single, precisely- regulated output. The output is isolated from the input, allowing versatile polarity configurations and grounding connections. Built in filtering for both the input and output minimizes the need for external filtering. October 1, 2015 ©2012 General Electric Company. All rights reserved. Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All VIN -0.3 80 Vdc Transient (100 ms) All V -0.3 100 V IN,trans dc Operating Ambient Temperature All TA -40 85 °C (see Thermal Considerations section) Storage Temperature All Tstg -55 125 °C I/O Isolation voltage (100% factory Hi-Pot tested) All   1500 V dc Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All V 36 48 75 V IN dc Maximum Input Current All, except B IIN,max 3.2 3.5 Adc (VIN= VIN, min to VIN, max, IO=IO, max) B IIN,max 3.4 3.7 Adc Input No Load Current All IIN,No load 75 mA (VIN = VIN, nom, IO = 0, module enabled) Input Stand-by Current All IIN,stand-by 22 mA (VIN = VIN, nom, module disabled) 2 2 Inrush Transient All It 0.5 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V to V All 20 mA IN, min IN, p-p max, IO= IOmax ; See Test configuration section) Input Ripple Rejection (120Hz) All 50 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a time-delay fuse with a maximum rating of 8 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 2 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Nominal Output Voltage Set-point B V 11.76 12.0 12.24 V O, set dc V =V , I =I , T=25°C) A V 4.90 5.0 5.10 V IN IN, min O O, max A O, set dc F V 3.23 3.3 3.37 V O, set dc G VO, set 2.45 2.5 2.55 Vdc Y VO, set 1.76 1.8 1.84 Vdc M VO, set 1.47 1.5 1.53 Vdc P V 1.18 1.2 1.22 V O, set dc S1R0 V 0.98 1.0 1.02 V O, set dc Output Voltage (Over all operating input voltage, resistive load, All VO -3.0  +3.0 % VO, set and temperature conditions until end of life) Output Regulation Line (VIN=VIN, min to VIN, max) B, A, F, G   0.2 % VO, set Y, M, P, S1R0 5 mV B, A, F, G Load (IO=IO, min to IO, max)   0.2 % VO, set Y, M, P, S1R0 5 mV Temperature (Tref=TA, min to TA, max) All   1.0 % VO, set Output Ripple and Noise on nominal output (VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max) RMS (5Hz to 20MHz bandwidth) B 30 mV   rms Peak-to-Peak (5Hz to 20MHz bandwidth) B 100 mV   pk-pk RMS (5Hz to 20MHz bandwidth) All, except B   25 mVrms Peak-to-Peak (5Hz to 20MHz bandwidth) All, except B   75 mVpk-pk External Capacitance B C 0 1,500 μF O, max  A C 0 10,000 μF O, max  F, G, Y, M, P, C 0*  20,000 μF O, max S1R0 Output Current B I 0 10 A o  dc A I 0 20 A o  dc F I 0 30 A o  dc G Io 0  35 Adc Y, M, P, S1R0 Io 0  40 Adc Output Current Limit Inception (Hiccup Mode ) All, except G 105 115 130 % Io IO, lim % I (V = 90% of V) G I 103 115 130 o O O, set O, lim Output Short-Circuit Current All IO, s/c  130 150 Arms (VO≤250mV) ( Hiccup Mode ) Efficiency B η 93.0 % VIN= VIN, nom, TA=25°C A η 91.7 % IO=IO, max , VO= VO,set F η 92.0 % G η 89.8 % Y η 88.3 % M η 87.1 % P η 85.0 % S1R0 η 83.2 % Switching Frequency All fsw 420 kHz * Note: For 1.0V (S1R0) and 1.2 V (P) device codes, external capacitance, C , should be 1000uF minimum to achieve monotonic start-up with very light load O O O (≤ 2Amp). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 3 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Dynamic Load Response (dIo/dt=0.1A/s; V = V ; T =25°C) IN IN, nom A Load Change from Io= 50% to 75% or 25% to 50% of Io,max; Peak Deviation All Vpk  3  % VO, set Settling Time (Vo<10% peak deviation) All ts  200  s (dIo/dt=1A/s; VIN = VIN, nom; TA=25°C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max; Peak Deviation All V 5 % V pk   O, set Settling Time (Vo<10% peak deviation) All t 200 s   s Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All C 1000 pF iso   Isolation Resistance All R 10 MΩ iso   I/O Isolation Voltage (100% factory Hi-pot tested) All All   1500 Vdc General Specifications Parameter Device Symbol Min Typ Max Unit 9 B FIT 334 10 /Hours Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3 (I =80%I , T =40°C, 9 O O, max A A-S FIT 290 10 /Hours airflow = 200 lfm, 90% confidence) 9 F FIT 328 10 /Hours 9 Y FIT 302 10 /Hours B MTBF 2,997,896 Hours A-S MTBF 3,451,558 Hours F MTBF 3,051,626 Hours Y MTBF 3,312,888 Hours g Weight All 20.5 (0.72)   (oz.) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 4 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All I 1.0 mA on/off   Logic Low - On/Off Voltage All Von/off -0.7  1.2 Vdc Logic High Voltage – (Typ = Open Collector) All Von/off  5 Vdc Logic High maximum allowable leakage current All Ion/off   10 μA Turn-On Delay and Rise Times o (IO=IO, max , VIN=VIN, nom, TA = 25 C) Case 1: On/Off input is set to Logic Low (Module All Tdelay — 20 25 msec ON) and then input power is applied (Tdelay from B* T — 25 30 msec delay instant at which VIN = VIN, min until Vo=10% of VO,set) All Tdelay — 5 10 msec Case 2: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (Tdelay = B* Tdelay — 25 30 msec from instant at which VIN=VIN, min until VO = 10% of VO, set). msec Output voltage Rise time (time for Vo to rise from 10% All Trise — 8 12 of V to 90% of V ) o,set o, set msec Output voltage Rise time (time for Vo to rise from 10% All Trise — 8 12 of Vo,set to 90% of Vo, set with max ext capacitance) Output voltage overshoot – Startup All — 3 % VO, set o IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C G, Y, M, P, Remote Sense Range V 0.25 Vdc SENSE S1R0 (Max voltage drop is 0.5V) B*, A, F VSENSE 10 % VO, set Output Voltage Adjustment Range All* 80 110 % VO, set Output Overvoltage Protection B V 14 16 V O, limit  dc A V 5.7 6.5 V O, limit  dc F VO, limit 3.8  4.6 Vdc G V 2.9  3.4 V O, limit dc Y V 2.3 2.6 V O, limit  dc M VO, limit 1.8  2.2 Vdc P V 1.4  1.6 V O, limit dc S1R0 V 1.2 1.4 V O, limit  dc Input Undervoltage Lockout All VUVLO Turn-on Threshold 30 34.5 36 Vdc Turn-off Threshold 30 32  Vdc Hysterisis 1.5 2 V  dc Input Overvoltage Lockout All VOVLO Turn-on Threshold  80  Vdc Turn-off Threshold 75 79 83 Vdc Hysterisis 2 3.5  Vdc * Note: 12.0VO (B) device codes have an adaptable extended Turn-On Delay interval, Tdelay, as specified for B* devices. The extended Tdelay will occur when a 12VO module restarts following either 1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout and then back to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, T , as specified for All delay Devices, will occur whenever a 12VO module restarts with input voltage removed from the module for the preceding 1 second. 12.0VO (B) also achieves +10% VO, set Remote Sense drop or trim up to 110% VO, set only above Vin = 40Vdc. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 5 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Characteristic Curves o The following figures provide typical characteristics for the EQW010A0B (12V, 10A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 95 12 10 90 8 Vin = 36V 85 6 Vin = 48V NC 0.5 m/s 80 4 (100 LFM) 1.0 m/s Vin = 75V (200 LFM) 2.0 m/s 75 2 (400 LFM) 0 70 20 30 40 50 60 70 80 90 0 2 4 6 8 10 O OUTPUT CURRENT, I (A) AMBIENT TEMPERATURE, T C O A Figure 1. Converter Efficiency versus Output Current. Figure 4. Derating Output Current versus Local Ambient Temperature and Airflow (direction shown in Figure 63). TIME, t (1s/div) TIME, t (5ms/div) Figure 2. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 5. Typical Start-up Using Remote On/Off, Io,max). negative logic version, (VIN = VIN,NOM, Io = Io,max) [where input voltage has not been applied in the previous 1 second, see page 5]. TIME, t (0.1 ms /div) TIME, t (5ms/div) Figure 3. Transient Response to Dynamic Load Change Figure 6. Typical Start-up Using Input Voltage, (VIN = from 75% to 50% to 75% of full load. VIN,NOM, Io = Io,max) [where input voltage has not been applied in the previous 1 second , see page 5]. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 6 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE EFFICIENCY,  (%) Io (A) (5A/div) V (V) (200mV/div) O V (V) (50mV/div) O On/Off VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT, Io (A) V On/off (V) (5V/div) VO (V) (5V/div) VIN (V) (50V/div) VO (V) (5V/div) Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Characteristic Curves o The following figures provide typical characteristics for the EQW020A0A (5.0V, 20A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 95 25 90 20 85 15 Vin = 75V Vin = 48V NC 80 10 0.5 m/s 1.0 m/s (100 LFM) Vin = 36V (200 LFM) 2.0 m/s 75 5 (400 LFM) 70 0 0 5 10 15 20 20 30 40 50 60 70 80 90 O OUTPUT CURRENT, I (A) AMBIENT TEMPERATURE, T C O A Figure 7. Converter Efficiency versus Output Current. Figure 10. Derating Output Current versus Local Ambient Temperature and Airflow (direction shown in Figure 63). TIME, t (1s/div) TIME, t (5ms/div) Figure 8. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 11. Typical Start-up Using Remote On/Off, negative Io,max). logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (0.1ms/div) TIME, t (4ms/div) Figure 9. Transient Response to Dynamic Load Change Figure 12. Typical Start-up Using Input Voltage (VIN = from 50% to 75% to 50% of full load. VIN,NOM, Io = Io,max). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 7 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io(A) (10A/div) V (V) (100mV/div) EFFICIENCY,  (%) O V (V) (20mV/div) O On/Off VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT, Io (A) VOn/Off (V) (5V/div) VO (V) (2V/div) VIN (V) (20V/div) VO (V) (2V/div) Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Characteristic Curves (continued) o The following figures provide typical characteristics for the EQW030A0F (3.3V, 30A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 95 35 Vin = 36V 30 90 25 85 NC 20 Vin = 75V 0.5 m/s (100 LFM) 15 1.0 m/s 80 (200 LFM) Vin = 48V 2.0 m/s 10 (400 LFM) 75 5 0 70 20 30 40 50 60 70 80 90 0 5 10 15 20 25 30 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 13. Converter Efficiency versus Output Current. Figure 16. Derating Output Current versus Local Ambient Temperature and Airflow (direction shown in Figure 63). TIME, t (5ms/div) TIME, t (1s/div) Figure 14. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 17. Typical Start-up Using Remote On/Off, negative Io,max). logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (0.1ms/div) TIME, t (4ms/div) Figure 15. Transient Response to Dynamic Load Change Figure 18. Typical Start-up Using Input Voltage (VIN = from 50% to 75% to 50% of full load. VIN,NOM, Io = Io,max). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 8 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io(A) (10A/div) V (V) (100mV/div) EFFICIENCY,  (%) O V (V) (20mV/div) O On/Off VOLTAGE OUTPUT VOLTAGE INTPUT VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT, Io (A) VO (V) (5V/div) VOn/off (V) (1V/div) VO (V) (20V/div) VIN (V) (2V/div) Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Characteristic Curves (continued) o The following figures provide typical characteristics for the EQW035A0G (2.5V, 35A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 40 95 Vin = 36V 35 90 30 85 25 Vin = 75V NC 20 0.5 m/s 80 (100 LFM) 1.0 m/s Vin = 48V 15 (200 LFM) 2.0 m/s 75 10 (400 LFM) 70 5 0 5 10 15 20 25 30 35 20 30 40 50 60 70 80 90 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 19. Converter Efficiency versus Output Current. Figure 22. Derating Output Current versus Local Ambient Temperature and Airflow (direction shown in Figure 63). TIME, t (5ms/div) TIME, t (1s/div) Figure 20. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 23. Typical Start-up Using Remote On/Off, Io,max). negative logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (0.1ms/div) TIME, t (4ms/div) Figure 21. Transient Response to Dynamic Load Change Figure 24. Typical Start-up Using Input Voltage (VIN = from 50% to 75% to 50% of full load. VIN,NOM, Io = Io,max). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io (A) (10A/div) V (V) (100mV/div) EFFICIENCY,  (%) O V (V) (20mV/div) O On/Off VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE OUTUT VOLTAGE OUTPUT CURRENT, Io (A) VOn/Off (V) (5V/div) VO (V) (1V/div) VIN (V) (20V/div) VO (V) (1.0V/div) Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Characteristic Curves (continued) o The following figures provide typical characteristics for the EQW040A0Y (1.8V, 40A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 95 45 Vin = 36V 40 90 35 85 30 NC Vin = 75V 0.5 m/s 25 80 (100 LFM) 1.0 m/s Vin = 48V 20 (200 LFM) 2.0 m/s 75 15 (400 LFM) 10 70 0 5 10 15 20 25 30 35 40 20 30 40 50 60 70 80 90 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 25. Converter Efficiency versus Output Current. Figure 28. Derating Output Current versus Local Ambient Temperature and Airflow (direction shown in Figure 63). TIME, t (10ms/div) TIME, t (1s/div) Figure 26. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 29. Typical Start-up Using Remote On/Off, Io,max). negative logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (0.1ms/div) TIME, t (4ms/div) Figure 27. Transient Response to Dynamic Load Change Figure 30. Typical Start-up Using Input Voltage (VIN = from 50% to 75% to 50% of full load. VIN,NOM, Io = Io,max). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 10 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io (A) (10A/div) V (V) (50mV/div) EFFICIENCY,  (%) O V (V) (20mV/div) O On/Off VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT, Io (A) V On/off (V) (5V/div) V O (V) (1.0V/div) VIN (V) (20V/div) VO (V) (1.0V/div) Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Characteristic Curves (continued) o The following figures provide typical characteristics for the EQW040A0M (1.5V, 40A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 90 45 Vin = 36V 40 85 35 30 NC 80 Vin = 75V 0.5 m/s 25 Vin = 48V (100 LFM) 1.0 m/s 20 (200 LFM) 2.0 m/s 75 (400 LFM) 15 10 70 20 30 40 50 60 70 80 90 0 5 10 15 20 25 30 35 40 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 31. Converter Efficiency versus Output Current. Figure 34. Derating Output Current versus Local Ambient Temperature and Airflow (direction shown in Figure 63). TIME, t (5ms/div) TIME, t (1s/div) Figure 32. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 35. Typical Start-up Using Remote On/Off, Io,max). negative logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (0.1ms/div) TIME, t (4ms/div) Figure 33. Transient Response to Dynamic Load Change Figure 36. Typical Start-up Using Input Voltage (VIN = from 50% to 75% to 50% of full load. VIN,NOM, Io = Io,max). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 11 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io (A) (10A/div) V (V) (50mV/div) EFFICIENCY,  (%) O V (V) (20mV/div) O On/Off VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT, Io (A) VOn/Off (V) (5.0V/div) VO (V) (0.5V/div) VI (V) (20.0V/div) VO (V) (0.5V/div) Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Characteristic Curves (continued) o The following figures provide typical characteristics for the EQW040A0P (1.2V, 40A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 90 45 40 Vin = 36V 85 35 NC 30 80 0.5 m/s 25 Vin = 75V (100 LFM) 1.0 m/s Vin = 48V (200 LFM) 2.0 m/s 20 75 (400 LFM) 15 10 70 20 30 40 50 60 70 80 90 0 5 10 15 20 25 30 35 40 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 37. Converter Efficiency versus Output Current. Figure 40. Derating Output Current versus Local Ambient Temperature and Airflow (direction shown in Figure 63). TIME, t (5ms/div) TIME, t (1s/div) Figure 38. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 41. Typical Start-up Using Remote On/Off, Io,max). negative logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (0.1ms/div) TIME, t (4ms/div) Figure 39. Transient Response to Dynamic Load Change Figure 42. Typical Start-up Using Input Voltage (VIN = from 50% to 75% to 50% of full load. VIN,NOM, Io = Io,max). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 12 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io (A) (10A/div) V (V) (50mV/div) EFFICIENCY,  (%) O V (V) (20mV/div) O On/Off VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE OUTUT VOLTAGE OUTPUT CURRENT, Io (A) VO (V) (5.0V/div) VOn/off (V) (0.5V/div) VO (V) 20.0V/div) VIN (V) (0.5V/div) Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Characteristic Curves (continued) o The following figures provide typical characteristics for the EQW040A0S1R0 (1.0V, 40A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 45 90 Vin = 36V 40 85 35 NC 30 80 0.5 m/s 25 Vin = 48V Vin = 75V (100 LFM) 1.0 m/s 75 (200 LFM) 2.0 m/s 20 (400 70 15 0 5 10 15 20 25 30 35 40 20 30 40 50 60 70 80 90 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 43. Converter Efficiency versus Output Current. Figure 46. Derating Output Current versus Local Ambient Temperature and Airflow (direction shown in Figure 63). TIME, t (5ms/div) TIME, t (1s/div) Figure 44. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 47. Typical Start-up Using Remote On/Off, Io,max). negative logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (0.1ms/div) TIME, t (4ms/div) Figure 45. Transient Response to Dynamic Load Change Figure 48. Typical Start-up Using Input Voltage (VIN = from 50% to 75% to 50% of full load. VIN,NOM, Io = Io,max). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 13 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io (A) (20A/div) V (V) (50mV/div) EFFICIENCY,  (%) O V (V) (20mV/div) O On/Off VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT, Io (A) VO (V) (3.0V/div) VOn/off (V) (0.5V/div) VO (V) (20.0V/div) VIN (V) (0.5V/div) Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Characteristic Curves (continued) Derating Output Current versus Local Ambient Temperature and Airflow (direction shown in Figure 63) for heat plate versions (-C, -H). 12 45 40 10 35 8 NC 30 NC 0.5 m/s 6 0.5 m/s (100 LFM) 1.0 m/s 25 (100 LFM) (200 LFM) 1.0 m/s 4 2.0 m/s (200 LFM) 2.0 m/s 20 (400 LFM) (400 LFM) 15 2 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 O O AMBIENT TEMPERATURE, T C AMBIENT TEMPERATURE, T C A A Figure 49. EQW010A0B-C/H, (12.0V, 10A). Figure 53. EQW040A0Y-C/H, (1.8V, 40A). 25 45 40 20 35 15 30 NC NC 0.5 m/s 0.5 m/s 25 (100 LFM) (100 LFM) 10 1.0 m/s 1.0 m/s 2.0 m/s (200 LFM) 2.0 m/s (200 LFM) 20 (400 LFM) (400 LFM) 5 15 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 O O AMBIENT TEMPERATURE, T C AMBIENT TEMPERATURE, T C A A Figure 50. EQW020A0A-C/H, (5.0V, 20A). Figure 54. EQW040A0M-C/H, (1.5V, 40A). 35 45 30 40 25 35 NC 20 NC 0.5 m/s 30 (100 LFM) 15 1.0 m/s 0.5 m/s (200 LFM) 25 (100 LFM) 1.0 m/s 2.0 m/s 10 (200 LFM) (400 LFM) 2.0 m/s 20 5 (400 LFM) 15 0 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 O O AMBIENT TEMPERATURE, TA C AMBIENT TEMPERATURE, TA C Figure 51. EQW030A0F-C/H, (3.3V, 30A). Figure 55. EQW040A0P-C/H, (1.2V, 40A). 40 45 35 40 30 35 NC NC 25 30 0.5 m/s (100 LFM) 0.5 m/s 1.0 m/s 1.0 m/s 20 25 (100 LFM) (200 LFM) (200 LFM) 2.0 m/s 2.0 m/s 15 (400 LFM) 20 (400 LFM) 10 15 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 O O AMBIENT TEMPERATURE, TA C AMBIENT TEMPERATURE, TA C Figure 52. EQW035A0G-C/H, (2.5V, 35A). Figure 56. EQW040A0S-C/H, (1.0V, 40A). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 14 OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Output Filtering Test Configurations For 1.0V to 1.2V output voltage modules, an external capacitance of 1000uF is recommended to achieve CURRENT PROBE TO OSCILLOSCOPE monotonic start-up with very light load (≤ 2Amp). L TEST Safety Considerations Vin+ 12μH For safety-agency approval of the system in which the power module is used, the power module must be C 220μF S 33μF installed in compliance with the spacing and separation E.S.R.<0.1 requirements of the end-use safety agency standard, i.e., @ 20°C 100kHz UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE Vin- 0805:2001-12 (IEC60950-1). If the input source is non-SELV (ELV or a hazardous NOTE: Measure input reflected ripple current with a simulated voltage greater than 60 Vdc and less than or equal to source inductance (L ) of 12μH. Capacitor C offsets TEST S possible battery impedance. Measure current as shown 75Vdc), for the module’s output to be considered as above. meeting the requirements for safety extra-low voltage (SELV), all of the following must be true: Figure 57. Input Reflected Ripple Current Test Setup.  The input source is to be provided with reinforced COPPER STRIP insulation from any other hazardous voltages, V (+) RESISTIVE O including the ac mains. LOAD  One VIN pin and one VOUT pin are to be grounded, or SCOPE both the input and output pins are to be kept V (– ) floating. O 0.01uF 10uF 0.1uF  The input pins of the module are not operator accessible. GROUND PLANE  Another SELV reliability test is conducted on the NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then whole system (combination of supply source and Kelvin connections are required at the module terminals subject module), as required by the safety agencies, to avoid measurement errors due to socket contact resistance. to verify that under a single fault, hazardous Figure 58. Output Ripple and Noise Test Setup. voltages do not appear at the module’s output. Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. R R R R distribution contact contact distribution Vin+ Vout+ The power module has extra-low voltage (ELV) outputs when all inputs are ELV. All flammable materials used in the manufacturing of R LOAD V V IN O these modules are rated 94V-0, or tested to the UL60950 A.2 for reduced thickness. R R R R distribution contact contact distribution For input voltages exceeding –60 Vdc but less than or Vin- Vout- equal to –75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION NOTE: All voltage measurements to be taken at the module between secondary DC MAINS DISTRIBUTION input terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals (classified as TNV-2 in Europe) and unearthed SELV to avoid measurement errors due to socket contact outputs. resistance. The input to these units is to be provided with a Figure 59. Output Voltage and Efficiency Test Setup. maximum 8 A time-delay fuse in the ungrounded lead. V . I O O Efficiency = x 100 %  V . I IN IN Design Considerations Input Filtering The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 57 a 33μF electrolytic capacitor (ESR<0.1 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 15 BATTERY Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current at or below the maximum rated power (Maximum rated Feature Description power = Vo,set x Io,max). Remote On/Off Two remote on/off options are available. Positive logic SENSE(+) SENSE(–) turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic VI(+) VO(+) remote On/Off, device code suffix “1”, turns the module IO SUPPL Y LOAD II off during a logic high and on during a logic low. VI(-) VO(–) CONTACT CONT ACT AND RESIST ANCE DISTRIBUTION LOSSE Vin+ Vout+ Figure 61. Circuit Configuration for remote sense . I on/off Input Undervoltage Lockout ON/OFF TRIM At input voltages below the input undervoltage lockout Von/off limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, Vout- V . UV/ON Vin- Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn- off threshold, VUV/OFF. Figure 60. Remote On/Off Implementation. Overtemperature Protection To provide protection under certain fault conditions, the To turn the power module on and off, the user must unit is equipped with a thermal shutdown circuit. The supply a switch (open collector or equivalent) to control unit will shutdown if the thermal reference point Tref the voltage (Von/off) between the ON/OFF terminal and the o (-) terminal (see Figure 60). Logic low is (Figure 63), exceeds 125 C (typical), but the thermal VIN 0V ≤ V ≤ 1.2V. The maximum I during a logic low shutdown is not intended as a guarantee that the unit on/off on/off is 1mA, the switch should be maintain a logic low level will survive temperatures beyond its rating. The module can be restarted by cycling the dc input power for at whilst sinking this current. least one second or by toggling the remote on/off signal During a logic high, the typical maximum Von/off for at least one second. If the auto-restart option (4) is generated by the module is 15V, and the maximum ordered, the module will automatically restart upon cool- allowable leakage current at Von/off = 5V is 1μA. down to a safe temperature. If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. Output Overvoltage Protection For negative logic, short the ON/OFF pin to VIN(-). The output over voltage protection scheme of the Remote Sense modules has an independent over voltage loop to prevent single point of failure. This protection feature Remote sense minimizes the effects of distribution losses latches in the event of over voltage across the output. by regulating the voltage at the remote-sense Cycling the on/off pin or input voltage resets the latching connections (See Figure 61). The voltage between the protection feature. If the auto-restart option (4) is remote-sense pins and the output terminals must not ordered, the module will automatically restart upon an exceed the output voltage sense range given in the internally programmed time elapsing. Feature Specifications table: Overcurrent Protection [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V To provide protection in a fault (output overload) Although the output voltage can be increased by both condition, the unit is equipped with internal the remote sense and by the trim, the maximum current-limiting circuitry and can endure current increase for the output voltage is not the sum of both. limiting continuously. At the point of current-limit The maximum increase is the larger of either the remote inception, the unit enters hiccup mode. If the unit is sense or the trim. not configured with auto–restart, then it will latch off The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 16 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current For output voltage: 1.5V to 12V Feature Descriptions (continued) following the over current condition. The module can be 5.11V  (100%)  511 o,set R   10.22 restarted by cycling the dc input power for at least one trimup   1.225% %   second or by toggling the remote on/off signal for at least one second. If the unit is configured with the auto- For output voltage: 1.0V to 1.2V restart option (4), it will remain in the hiccup mode as 5.11V  (100%)  511 o,set long as the overcurrent condition exists; it operates R   10.22 trimup   0.6% % normally, once the output current is brought back into its   specified range. The average output current during   V V Where desired o ,set hiccup is 10% IO, max.    %  100   V o ,set   Output Voltage Programming For example, to trim-up the output voltage of 1.2V Trimming allows the output voltage set point to be module (EQW040A0P/P1) by 5% to 1.26V, Rtrim-up is increased or decreased, this is accomplished by calculated is as follows: connecting an external resistor between the TRIM pin  % 5 and either the VO(+) pin or the VO(-) pin.  5.111.2 (100 5) 511  R    10 .22  trimup   0.6 5 5   V (+) V (+) IN O R  102.2 trimup R trim-up Alternative voltage programming for output voltage: 1.0V to 1.2V (-V Option) ON/OFF LOAD An alternative set of trimming equations is available as V TRIM O an option for 1.0V and 1.2V output modules, by ordering the –V option. These equations will reduce the resistance Rtrim-down of the external programming resistor, making the impedance into the module trim pin lower for V (-) V (-) IN O applications in high electrical noise applications. 100   R   2  trim  down    %   Figure 62. Circuit Configuration to Trim Output 100   R   trim  up   Voltage.  %   Connecting an external resistor (Rtrim-down) between the V V  Where desired o ,set    %  100 TRIM pin and the Vo(-) (or Sense(-)) pin decreases the   V o ,set   output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%. For example, to trim-up the output voltage of 1.2V module (EQW040A0P/P1-V) by 5% to 1.26V, R is trim-up The following equation determines the required external calculated is as follows: resistor value to obtain a percentage output voltage change of ∆% % 5 For output voltage: 1.0V to 12V 100   R   trim  up    5   511  R   10 .22  trimdown   R  20.0  % trimup   The value of the external trim resistor for the optional –V V V  Where o,set desired   %  100 1.2V module is only 20% of the value required with the   V o,set   standard trim equations. For example, to trim-down the output voltage of 2.5V module (EQW035A0G/G1) by 8% to 2.3V, Rtrim-down is calculated as follows: % 8 511   R  10.22 trimdown   8   R  53 .655 trimdown Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage set point. The following equations determine the required external resistor value to obtain a percentage output voltage change of ∆%: October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 17 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Feature Descriptions (continued) The voltage between the Vo(+) and Vo(–) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote AIRFLOW sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals Figure 64. Tref Temperature Measurement Location multiplied by the output current. When using remote for Heat plate Module. sense and trim, the output voltage of the module can be increased, which at the same output current would Please refer to the Application Note “Thermal increase the power output of the module. Care should be Characterization Process For Open-Frame Board- taken to ensure that the maximum output power of the Mounted Power Modules” for a detailed discussion of module remains at or below the maximum rated power thermal aspects including maximum device (Maximum rated power = Vo,set x Io,max). temperatures. Thermal Considerations Through-Hole Soldering Information The power modules operate in a variety of thermal The RoHS-compliant (Z codes) through-hole products use environments; however, sufficient cooling should be the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant provided to help ensure reliable operation. components. The RoHS-compliant with lead solder exemption (non-Z codes) through-hole products use Considerations include ambient temperature, airflow, Sn/Pb solder and RoHS-compliant components. Both module power dissipation, and the need for increased non-Z and Z codes are designed to be processed reliability. A reduction in the operating temperature of through single or dual wave soldering machines. The the module will result in an increase in reliability. The pins have an RoHS-compliant finish that is compatible thermal data presented here is based on physical with both Pb and Pb-free wave soldering processes. A measurements taken in a wind tunnel. maximum preheat rate of 3C/s is suggested. The wave The thermal reference point, Tref used in the preheat process should be such that the temperature of specifications for open frame modules is shown in Figure the power module board is kept below 210C. For Pb 63. For reliable operation this temperature should not solder, the recommended pot temperature is 260C, o exceed 120 C. while the Pb-free solder pot is 270C max. Not all RoHS- compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your GE representative for more details. Surface Mount Information Pick and Place The EQW010-040 modules use an open frame construction and are designed for a fully automated AIRFLOW assembly process. The modules are fitted with a label designed to provide a large surface area for pick and Figure 63. Tref Temperature Measurement Location place operations. The label meets all the requirements for open Frame Module. for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures o of up to 300 C. The label also carries product The thermal reference point, T used in the ref information such as product code, serial number and the specifications for modules with heat plates (-C or –H) is location of manufacture. shown in Figure 64. For reliable operation this o temperature should not exceed 110 C for airflow rates o below 1.0m/s (200LFM), and should not exceed 105 C for airflow rates equal to or above 1.0m/s (200LFM). Surface Mount Information (continued) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 18 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. Tin Lead Soldering The recommended linear reflow profile using Sn/Pb solder is shown in Figure 67 and 68. For reliable soldering the solder reflow profile should be established Figure 65. Pick and Place Location. by accurately measuring the modules CP connector temperatures. Nozzle Recommendations 300 o The module weight has been kept to a minimum by Peak Temp 235 C 250 using open frame construction. Even so, these modules Cooling have a relatively large mass when compared to zone Heat zo ne conventional SMT components. Variables such as nozzle 200 o -1 o -1 1-4 Cs max 4 Cs size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The 150 minimum recommended nozzle diameter for reliable So ak zo ne operation is 6mm. The maximum nozzle outer diameter, T above 10 0 30-240s lim which will safely fit within the allowable component o 205 C spacing, is 9 mm. 50 Preheat zo ne o -1 max 4 Cs Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. 0 REFLOW TIME (S) Reflow Soldering Information Figure 67. Recommended Reflow Profile for Tin/Lead (Sn/Pb) process. The surface mountable modules in the EQW family use our newest SMT technology called “Column Pin” (CP) connectors. Figure 66 shows the new CP connector 240 before and after reflow soldering onto the end-board 235 assembly. 230 EQW Board 225 220 215 Insulator 210 205 Solder Ball 200 End assembly PCB 0 1020 30 4050 60 o Figure 68. Time Limit, Tlim, Curve Above 205 C for Figure 66. Column Pin Connector Before and After Tin/Lead (Sn/Pb) process. Reflow Soldering. The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn63/Pb37) solder for non-Z codes, or Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP connector design is able to compensate for large amounts of co-planarity and still ensure a reliable SMT o solder joint. Typically, the eutectic solder melts at 183 C o (Sn/Pb solder) or 217-218 C (SAC solder), wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. The following instructions must be observed when SMT soldering these units. Failure to observe these October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 19 MAX TEMP SOLDER (C) REFLOW TEMP (C) Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Figure 69. Recommended linear reflow profile using Surface Mount Information (continued) Sn/Ag/Cu solder. Lead Free Soldering MSL Rating The –Z version of the EQW010-040 modules are lead- free (Pb-free) and RoHS compliant and are both forward The EQW010-040 modules have a MSL rating of 1. and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions Storage and Handling below may result in the failure of or cause damage to the modules and can adversely affect long-term The recommended storage environment and handling reliability. procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Pb-free Reflow Profile Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) Power Systems will comply with J-STD-020 Rev. C with desiccant are required for MSL ratings of 2 or (Moisture/Reflow Sensitivity Classification for greater. These sealed packages should not be broken Nonhermetic Solid State Surface Mount Devices) for both until time of use. Once the original package is broken, Pb-free solder profiles and MSL classification procedures. the floor life of the product at conditions of  30°C and This standard provides a recommended forced-air- 60% relative humidity varies according to the MSL rating convection reflow profile based on the volume and (see J-STD-033A). The shelf life for dry packed SMT thickness of the package (table 4-2). The suggested Pb- packages will be a minimum of 12 months from the bag free solder paste is Sn/Ag/Cu (SAC). The recommended seal date, when stored at the following conditions: < 40° linear reflow profile using Sn/Ag/Cu solder is shown in C, < 90% relative humidity. Fig. 69. Post Solder Cleaning and Drying Considerations 300 Per J-STD-020 Rev. C Peak Temp 260°C Post solder cleaning is usually the final circuit-board 250 assembly process prior to electrical board testing. The Cooling result of inadequate cleaning and drying can affect both 200 Zone * Min. Time Above 235°C the reliability of a power module and the testability of 15 Seconds 150 the finished circuit-board assembly. For guidance on Heating Zone *Time Above 217°C appropriate soldering, cleaning and drying procedures, 1°C/Second 60 Seconds 100 refer to GE Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). 50 0 Reflow Time (Seconds) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 20 Reflow Temp (°C) Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Mechanical Outline for Surface Mount Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] # Top side label includes GE name, product designation and date code. Top # View Side View Bottom View October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 21 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] # Top side label includes GE name, product designation and date code. Top # View Side View Bottom View October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 22 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Mechanical Outline for Through-Hole Module with Heat Plate (-C) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top View Side View # Bottom side label includes GE name, product designation and date code. Bottom # View October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 23 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Mechanical Outline for Through-Hole Module with Heat Plate (-H) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top View Side View # Bottom side label includes GE name, product designation and date code. Bottom # View October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 24 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] SMT Recommended Pad Layout (Component Side View) TH Recommended Pad Layout (Component Side View) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 25 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Packaging Details Tray Specification The surface mount versions of the EQW surface mount Material Antistatic coated PVC modules (suffix –S) are supplied as standard in the 12 plastic tray shown in Figure 68. The tray has external Max surface resistivity 10 /sq dimensions of 135.1mm (W) x 321.8mm (L) x 12.42mm (H) Color Clear or 5.319in (W) x 12.669in (L) x 0..489in (H). Capacity 12 power modules Min order quantity 48 pcs (1 box of 4 full trays) Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box will contain 4 full trays plus one empty hold down tray giving a total number of 48 power modules. Figure 68. Surface Mount Packaging Tray. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 26 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1. Device Codes Output Output On/Off Connector Product Codes Input Voltage Comcodes Voltage Current Logic Type EQW010A0B1 48V (36-75Vdc) 12V 10A Negative Through hole 108997284 EQW020A0A41-SB 48V (36-75Vdc) 5V 20A Negative Surface Mount CC109103966 EQW030A0F1 48V (36-75Vdc) 3.3V 30A Negative Through hole 108996096 EQW010A0BZ 48V (36-75Vdc) 12V 10A Positive Through hole CC109129152 EQW010A0B1Z 48V (36-75Vdc) 12V 10A Negative Through hole CC109114823 EQW010A0B641Z 48V (36-75Vdc) 12V 10A Negative Through hole CC109122116 EQW010A0B4-CZ 48V (36-75Vdc) 12V 10A Positive Through hole CC109146404 EQW010A0B41-CZ 48V (36-75Vdc) 12V 10A Negative Through hole CC109135043 EQW010A0B1-HZ 48V (36-75Vdc) 12V 10A Negative Through hole CC109122207 EQW010A0B1-SZ 48V (36-75Vdc) 12V 10A Negative Surface Mount CC109114641 EQW010A0B41-SZ 48V (36-75Vdc) 12V 10A Negative Surface Mount CC109127957 EQW020A0A1Z 48V (36-75Vdc) 5V 20A Negative Through hole CC109114402 EQW020A0A61Z 48V (36-75Vdc) 5V 20A Negative Through hole CC109132701 EQW020A0A641Z 48V (36-75Vdc) 5V 20A Negative Through hole CC109139052 EQW020A0A81Z 48V (36-75Vdc) 5V 20A Negative Through hole CC109151560 EQW020A0A61-CZ 48V (36-75Vdc) 5V 20A Negative Through hole CC109127817 EQW020A0A641-CZ 48V (36-75Vdc) 5V 20A Negative Through hole CC109149051 EQW020A0A1-HZ 48V (36-75Vdc) 5V 20A Negative Through hole CC109122198 EQW020A0A4-HZ 48V (36-75Vdc) 5V 20A Positive Through hole CC109140415 EQW020A0A41-HZ 48V (36-75Vdc) 5V 20A Negative Through hole CC109143517 EQW020A0A41-SZ 48V (36-75Vdc) 5V 20A Negative Surface Mount CC109113866 EQW020A0A41-SBZ 48V (36-75Vdc) 5V 20A Negative Surface Mount CC109114096 EQW030A0F1Z 48V (36-75Vdc) 3.3V 30A Negative Through hole CC109114063 EQW030A0F41Z 48V (36-75Vdc) 3.3V 30A Negative Through hole CC109121225 EQW030A0F61Z 48V (36-75Vdc) 3.3V 30A Negative Through hole CC109136132 EQW030A0F641Z 48V (36-75Vdc) 3.3V 30A Negative Through hole CC109138921 EQW030A0F841Z 48V (36-75Vdc) 3.3V 30A Negative Through hole CC109133402 EQW030A0F1-HZ 48V (36-75Vdc) 3.3V 30A Negative Through hole CC109122173 EQW030A0F41-HZ 48V (36-75Vdc) 3.3V 30A Negative Through hole CC109137353 EQW030A0F641-HZ 48V (36-75Vdc) 3.3V 30A Negative Through hole CC109141033 EQW030A0F41-SZ 48V (36-75Vdc) 3.3V 30A Negative Surface Mount CC109129158 EQW035A0GZ 48V (36-75Vdc) 2.5V 35A Positive Through hole CC109162335 EQW035A0G1Z 48V (36-75Vdc) 2.5V 35A Negative Through hole CC109114427 EQW035A0G641Z 48V (36-75Vdc) 2.5V 35A Negative Through hole CC109138938 EQW040A0Y1Z 48V (36-75Vdc) 1.8V 40A Negative Through hole CC109114451 EQW040A0Y641Z 48V (36-75Vdc) 1.8V 40A Negative Through hole CC109132180 EQW040A0Y41-SZ 48V (36-75Vdc) 1.8V 40A Negative Surface Mount CC109129202 EQW040A0M1Z 48V (36-75Vdc) 1.5V 40A Negative Through hole CC109114435 EQW040A0M61-CZ 48V (36-75Vdc) 1.5V 40A Negative Through hole CC109127593 EQW040A0P1Z 48V (36-75Vdc) 1.2V 40A Negative Through hole CC109114443 EQW040A0P641Z 48V (36-75Vdc) 1.2V 40A Negative Through hole CC109121258 EQW040A0P41-SZ 48V (36-75Vdc) 1.2V 40A Negative Surface Mount CC109127841 EQW040A0S1R01Z 48V (36-75Vdc) 1.0V 40A Negative Through hole CC109114492 EQW040A0S1R041-SZ 48V (36-75Vdc) 1.0V 40A Negative Surface Mount CC109125787 -Z Indicates RoHS Compliant modules October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 27 Data Sheet GE EQW010-040 Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 1.0 to 12.0Vdc Output; 10 to 40A Output Current Table 2. Device Options Option* Suffix** Negative remote on/off logic 1 Auto Re-start (for Over Current / Over voltage Protection) 4 Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 6 Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) 8 Heat plate (Module height = 12.2 mm (0.48 in.) nominal, use with cold-plates -C Heat plate (Module height = 10.4 mm (0.41 in.) nominal, use with heat sinks -H Surface mount connections (not available with heat plate options -C, -H) -S Alternative Voltage Programming equations (1.0V and 1.2V modules only) -V Note: Legacy device codes may contain a –B option suffix to indicate 100% factory Hi-Pot tested to the isolation voltage specified in the Absolute Maximum Ratings table. The 100% Hi-Pot test is now applied to all device codes, with or without the –B option suffix. Existing comcodes for devices with the –B suffix are still valid; however, no new comcodes for devices containing the –B suffix will be created. Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 1, 2015 ©2012 General Electric Company. All International rights reserved. Version 1.27