Data Sheet GE ESTW010A0A Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Features STINGRAY™ SERIES  Wide input voltage range: 36-75 Vdc  Monotonic startup into prebiased load  Output Voltage adjust: 80% to 110% of Vo,nom  Remote sense  Constant switching frequency  Positive remote On/Off logic  Input under/over voltage protection  Output overcurrent and overvoltage protection  Over-temperature protection  Industry standard, DOSA compliant footprint RoHS Compliant  57.9mm x 22.8mm x 8.5mm Applications  (2.28 in x 0.9 in x 0.335 in)  Distributed Power Architectures  Low profile height and reduced component skyline  Wireless Networks  Suitable for cold wall cooling using suitable Gap Pad applied directly to top side of module  Access and Optical Network Equipment  High efficiency: 91%  Industrial Equipment  No thermal derating up to 80 °C, 1.0m/s (200 LFM)  Wide operating temperature range (-40°C to 85°C) Options  Compliant to RoHS EU Directive 2002/95/EC (-Z versions)  Negative Remote On/Off logic (preferred)  Compliant to ROHS EU Directive 2002/95/EC with lead solder exemption (non-Z versions)  Over current/Over temperature/Over voltage protections  UL* 60950-1, 2nd Ed. Recognized, CSA† C22.2 No. 60950 1- (Auto-restart) (preferred) 07 Certified, and VDE‡ (EN60950-1, 2nd Ed.) Licensed  Heat plate version (-H)  CE mark meets 2006/95/EC directive§  Surface Mount version (-S)  Meets the voltage and current requirements for ETSI 300- 132-2 and complies with and licensed for Basic insulation  RoHS 6/6 compliant; Lead Free (-Z) rating per EN60950-1  For additional options, see Table 2 (Device Options)  2250 Vdc Isolation tested in compliance with IEEE 802.3¤ under “Ordering Information” section. PoE standards  ISO**9001 and ISO 14001 certified manufacturing facilities Description The ESTW010A0A, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 10A of output current and provide a precisely regulated output voltage of 5.0V over a wide range of input voltages (VIN = 36 - 75Vdc). The modules achieve typical full load efficiency of 91%. The open frame modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. * UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. § This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards February 23, 2017 ©2016 General Electric Company. All rights reserved. Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All VIN -0.3 80 Vdc Transient, operational (≤100 ms) All V -0.3 100 V IN,trans dc Operating Ambient Temperature All T -40 85 °C A (see Thermal Considerations section) Storage Temperature All Tstg -55 125 °C I/O Isolation voltage (100% factory Hi-Pot tested) All   2250 V dc Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All VIN 36 48 75 Vdc Maximum Input Current All IIN,max 2.0 Adc (VIN= VIN, min to VIN, max, IO=IO, max) Input No Load Current All I 30 mA IN,No load (V = 48V, I = 0, module enabled) IN O Input Stand-by Current All IIN,stand-by 5 8 mA (VIN = 48V, module disabled) 2 2 Inrush Transient All It 0.5 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V to V All 30 mA IN, min IN, max, p-p IO= IOmax ; See Test configuration section) Input Ripple Rejection (120Hz) All 50 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 2 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Nominal Output Voltage Set-point V = 48V I =I , T=25°C) All V 4.925 5.0 5.075 V IN O O, max A O, set dc Output Voltage All V 4.90 5.10 V (Over all operating input voltage, resistive load, and O  dc temperature conditions until end of life) Output Regulation Line (V =V to V) All ±0.2 % V IN IN, min IN, max   O, set All Load (I =I to I )   ±0.2 % V O O, min O, max O, set Temperature (Tref=TA, min to TA, max) All   ±1.0 % VO, set Output Ripple and Noise (Co=1uF,ceramic+10uF,tantalum, V =V to V , IN IN, min IN, max IO= IO, max , TA=TA, min to TA, max) RMS (5Hz to 20MHz bandwidth) All 25 50 mV  rms Peak-to-Peak (5Hz to 20MHz bandwidth) All 75 200 mV  pk-pk 1 External Capacitance All CO 0  2,000 μF Output Current All I 0  10 A o dc Output Current Limit Inception (Hiccup Mode ) IO, lim % Io All 105 120 130 (V = 90% of V ) O O, set Output Short-Circuit Current All IO, s/c 1.2 Arms (VO≤250mV) ( Hiccup Mode ) Efficiency VIN=48V, TA=25°C, IO=IO, max , VO= VO,set All η 91.0 % Switching Frequency All fsw 350 kHz Dynamic Load Response (Co=1uF,ceramic+10uF,tantalum, dIo/dt=0.1A/s; VIN = 48V; TA=25°C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation All Vpk  250  mV Settling Time (Vo<10% peak deviation) All ts  200  s 1. See Note 2 under Feature Specifications. Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All C 1000 pF iso   Isolation Resistance All Riso 10   MΩ I/O Isolation Voltage (100% factory Hi-pot tested) All All   2250 Vdc General Specifications Symbo Parameter Device Min Typ Max Unit l 9 Calculated Reliability based upon Telcordia SR-332 All FIT 242.1 10 /Hours Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C, All MTBF 4,130,475 Hours airflow = 200 lfm, 90% confidence) 17 g Weight (Open Frame) All (0.60) (oz.) 30 g Weight (with Heatplate) All (1.06) (oz.) February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 3 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (V =V to V ; open collector or equivalent, IN IN, min IN, max Signal referenced to VIN- terminal) Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All Ion/off   0.15 mA Logic Low - On/Off Voltage All Von/off -0.7  0.6 Vdc Logic High Voltage – (Typ = Open Collector) All V 2.4  15 V on/off dc 25 Logic High maximum allowable leakage current All I μA on/off   1 Turn-On Delay and Rise Times o (IO=IO, max , VIN=VIN, nom, TA = 25C) Case 1: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (Tdelay All T ― 20 ― msec delay = from instant at which On/Off signal is ON until VO = 10% of V ). O, set Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (Tdelay from All Tdelay ― ― 150 msec instant at which V = V until V =10% of V ) IN IN, min o O,set Output voltage Rise time (time for Vo to rise from 10% All T ― 15 ― msec rise of Vo,set to 90% of Vo, set) Output voltage overshoot – Startup All ― 3 % VO, set o IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C Prebias Output Load Performance: All Monotonic Output Start up characteristic Back Bias current drawn from output (Module Enabled) All -150 mA dc Remote Sense Range All V 10 % V SENSE O, set Output Voltage Adjustment range All 80 110 % V O, set 2 Output Overvoltage Protection (Co,min=220 μF) All V 6.0  7.0 V O, limit dc O Overtemperature Protection – Hiccup Auto Restart All T 135 C ref   Input Undervoltage Lockout All VUVLO Turn-on Threshold  32 34.5 Vdc Turn-off Threshold 27.5 30  Vdc Hysteresis 1 2 V  dc 1. The module has an adaptable extended Turn-On Delay interval, Tdelay, of 20mS. The extended Tdelay will occur when the module restarts following either: 1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, Tdelay, will occur whenever a module restarts with input voltage removed from the module for the preceding 1 second. 2. The module requires a minimum of 220 μF external output capacitor to prevent shutdown during no load to full load transients and to avoid exceeding the OVP maximum limits during startup into open loop fault conditions. February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 4 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Characteristic Curves o The following figures provide typical characteristics for the module at 25 C. The figures are identical for either positive or negative remote On/Off logic. OUTPUT CURRENT, I (A) TIME, t (200µs/div) O Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 0.1A/µS Dynamic Load Change from 50% to 75% to 50% of full load, Vin=48V. TIME, t (2s/div) TIME, t (20ms/div) Figure 2. Typical output ripple and noise (Vin=48V, Io = Figure 5. Typical Start-up Using Remote On/Off, Io,max). negative logic version shown (VIN = 48V, Io = Io,max). TIME, t (200µs/div) TIME, t (20ms/div) Figure 3. Transient Response to 0.1A/µS Dynamic Figure 6. Typical Start-up Using Input Voltage (VIN = Load Change from 25% to 50% to 25% of full load, 48V, Io = Io,max). Vin=48V. February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 5 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io(A) (2A/div) VO (V) (200mV/div) V (V) (20mV/div) EFFICIENCY,  (%) O INPUT VOLTAGE OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE VIN (V) (50V/div) Vo (V) (2V/div) VOn/Off (V) (2V/div) VO (V) (2V/div) Io(A) (2A/div) VO (V) (200mV/div) Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE The power module should be connected to a low ac-impedance source. Highly inductive source L TEST Vin+ impedance can affect the stability of the power module. 12μH For the test configuration in Figure 7 a 33-100μF electrolytic capacitor (ESR<0.7 at 100kHz), mounted 33-100μF C 220μF S close to the power module helps ensure the stability of E.S.R.<0.1 the unit. Consult the factory for further application @ 20°C 100kHz guidelines. Vin- Safety Considerations For safety-agency approval of the system in which the NOTE: Measure input reflected ripple current with a simulated source inductance (L ) of 12μH. Capacitor C offsets TEST S power module is used, the power module must be possible battery impedance. Measure current as shown installed in compliance with the spacing and separation above. requirements of the end-use safety agency standard, i.e. Figure 7. Input Reflected Ripple Current Test Setup. UL60950-1, CSA C22.2 No.60950-1, and VDE0805- COPPER STRIP 1(IEC60950-1). If the input source is non-SELV (ELV or a hazardous V O (+) RESISTIVE LOAD voltage greater than 60 Vdc and less than or equal to 75V ), for the module’s output to be considered as dc SCOPE meeting the requirements for safety extra-low voltage V (– ) O (SELV), all of the following must be true: 1uF 10uF  The input source is to be provided with reinforced GROUND PLANE insulation from any other hazardous voltages, NOTE: All voltage measurements to be taken at the module including the ac mains. terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals  One VIN pin and one VOUT pin are to be grounded, or to avoid measurement errors due to socket contact both the input and output pins are to be kept floating. resistance.  The input pins of the module are not operator Figure 8. Output Ripple and Noise Test Setup. accessible.  Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages R R R R distribution contact contact distribution do not appear at the module’s output. Vin+ Vout+ Note: Do not ground either of the input pins of the module without grounding one of the output pins. R LOAD V V IN O This may allow a non-SELV voltage to appear between the output pins and ground. R R R R distribution contact contact distribution The power module has extra-low voltage (ELV) outputs Vin- Vout- when all inputs are ELV. All flammable materials used in the manufacturing of NOTE: All voltage measurements to be taken at the module these modules are rated 94V-0, or tested to the UL60950 terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals A.2 for reduced thickness. to avoid measurement errors due to socket contact resistance. For input voltages exceeding 60 Vdc but less than or equal to 75 Vdc, these converters have been evaluated to Figure 9. Output Voltage and Efficiency Test Setup. the applicable requirements of BASIC INSULATION V . I between secondary DC MAINS DISTRIBUTION input O O Efficiency = x 100 % (classified as TNV-2 in Europe) and unearthed SELV  V . I IN IN outputs. The input to these units is to be provided with a maximum 5 A fast-acting fuse in the ungrounded lead. February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 6 BATTERY Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current maximum output power of the module remains at or Feature Description below the maximum rated power (Maximum rated power Remote On/Off = Vo,set x Io,max). Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the SENSE(+) ON/OFF pin, and off during a logic low. Negative logic SENSE(–) remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low. VI(+) VO(+) IO SUPPL Y LOAD II VI(-) VO(–) CONTACT CONT ACT AND Vin+ Vout+ RESIST ANCE DISTRIBUTION LOSSE Ion/off Figure 11. Circuit Configuration for remote ON/OFF sense . TRIM Input Undervoltage Lockout V on/off At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised Vout- Vin- above the undervoltage lockout turn-on threshold, V . UV/ON Once operating, the module will continue to operate until Figure 10. Remote On/Off Implementation. the input voltage is taken below the undervoltage turn-off threshold, VUV/OFF. To turn the power module on and off, the user must Overtemperature Protection supply a switch (open collector or equivalent) to control the voltage (V ) between the ON/OFF terminal and the on/off To provide protection under certain fault temperature VIN(-) terminal (see Figure 10). Logic low is conditions, the unit is equipped with a thermal shutdown 0V ≤ Von/off ≤ 0.6V. The maximum Ion/off during a logic low circuit. The unit will shutdown if any of the thermal is 0.15mA; the switch should maintain a logic low level reference points identified in Figures 13 & 14, exceed the whilst sinking this current. stated trip points (typical). However, the thermal shutdown is not intended as a guarantee that the unit will During a logic high, the typical maximum Von/off generated survive temperatures beyond its rating. The module can by the module is 15V, and the maximum allowable be restarted by cycling the dc input power for at least one leakage current at V = 2.4V is 25μA. on/off second or by toggling the remote on/off signal for at least If not using the remote on/off feature: one second. If the auto-restart option (4) is ordered, the For positive logic, leave the ON/OFF pin open. module will automatically restart upon cool-down to a For negative logic, short the ON/OFF pin to VIN(-). safe temperature. Remote Sense Output Overvoltage Protection Remote sense minimizes the effects of distribution losses The output over voltage protection scheme of the by regulating the voltage at the remote-sense modules has an independent over voltage loop to prevent connections (See Figure 11). The voltage between the single point of failure. This protection feature latches in remote-sense pins and the output terminals must not the event of over voltage across the output. Cycling the exceed the output voltage sense range given in the on/off pin or input voltage resets the latching protection Feature Specifications table: feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V programmed time elapsing. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for Overcurrent Protection the output voltage is not the sum of both. The maximum To provide protection in a fault (output overload) increase is the larger of either the remote sense or the condition, the unit is equipped with internal trim. current-limiting circuitry and can endure current limiting continuously. At the point of current-limit The amount of power delivered by the module is defined inception, the unit enters hiccup mode. If the unit is as the voltage at the output terminals multiplied by the not configured with auto–restart, then it will latch off output current. When using remote sense and trim, the following the over current condition. The module can be output voltage of the module can be increased, which at restarted by cycling the dc input power for at least one the same output current would increase the power output second or by toggling the remote on/off signal for at least of the module. Care should be taken to ensure that the one second. February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 7 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Feature Description (continued) 5.11V  (100%)  511 o,set R   10.22 trimup   If the unit is configured with the auto-restart option (4), it 1.225% %   will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output   V V Where desired o,set   %  100 current is brought back into its specified range. The   V o,set   average output current during hiccup is 10% IO, max. For example, to trim-up the output voltage of the module Output Voltage Programming by 5% to 12.6V, R is calculated is as follows: trim-up Trimming allows the output voltage set point to be % 5 increased or decreased, this is accomplished by 5.1112.0 (100 5) 511 connecting an external resistor between the TRIM pin   R    10 .22  trimup   and either the VO(+) pin or the VO(-) pin. 1.225 5 5   R  938.8 trimup The voltage between the VO(+) and VO(–) terminals must V (+) V (+) IN O not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit R trim-up includes any increase in voltage due to remote-sense ON/OFF compensation and output voltage set-point adjustment LOAD V TRIM O trim. Although the output voltage can be increased by both the R trim-down remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum V (-) V (-) IN O increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and Figure 12. Circuit Configuration to Trim Output trim, the output voltage of the module can be increased, Voltage. which at the same output current would increase the Connecting an external resistor (Rtrim-down) between the power output of the module. Care should be taken to TRIM pin and the VO(-) (or Sense(-)) pin decreases the ensure that the maximum output power of the module output voltage set point. To maintain set point accuracy, remains at or below the maximum rated power the trim resistor tolerance should be ±1.0%. (Maximum rated power = VO,set x IO,max). The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆% 511   R   10 .22  trimdown    %     V V Where o,set desired   %  100   V o,set   For example, to trim-down the output voltage of the module by 8% to 11.04V, Rtrim-down is calculated as follows: % 8 511   R  10.22 trimdown   8   R  53 .655 trimdown Connecting an external resistor (R ) between the trim-up TRIM pin and the V (+) (or Sense (+)) pin increases the O output voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%: February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 8 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Thermal Considerations The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. o AMBIENT TEMEPERATURE, TA ( C) The thermal reference points, T and T , used in the ref1 ref2 Figure 15. Output Current Derating for the Open specifications for open frame modules are shown in Frame Module; Airflow in the Transverse Direction Figure 13. For reliable operation these temperatures o o from Vout(+) to Vout(-); Vin =48V. should not exceed 110 C and 125 C respectively. AIRFLOW Figure 13. Tref 1 & Tref2 Temperature Measurement Locations for Open Frame Module. o AMBIENT TEMEPERATURE, TA ( C) The thermal reference point, Tref, used in the Figure 16. Output Current Derating for the Module specifications for modules with heatplate is shown in with Heatplate; Airflow in the Transverse Direction Figure 14. For reliable operation this temperature should o from Vout(+) to Vout(-); Vin =48V. not exceed 110 C. Figure 14. Tref Temperature Measurement Location for Module with Heatplate. Heat Transfer via Convection o AMBIENT TEMEPERATURE, TA ( C) Increased airflow over the module enhances the heat transfer via convection. Derating curves showing the Figure 17. Output Current Derating for the Open maximum output current that can be delivered by Frame Module with Heatplate and 0.25” Heatsink; each module versus local ambient temperature (TA) Airflow in the Transverse Direction from Vout(+) to for natural convection and up to 1m/s (200 ft./min) forced Vout(-); Vin =48V. airflow are shown in Figure 15. Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board- Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures. February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O O Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Thermal Considerations (continued) o AMBIENT TEMEPERATURE, TA ( C) o COLDPLATE TEMEPERATURE, TC ( C) Figure 18. Output Current Derating for the Module Figure 20. Derated Output Current versus Cold Wall with Heatplate with Heatplate and 0.50” Heatsink; Temperature with local ambient temperature around module at 85C; Vin=48V. Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. Heat Transfer via Conduction The module can also be used in a sealed environment with cooling via conduction from the module’s top surface through a gap pad material to a cold wall, as shown in Figure 19. This capability is achieved by insuring the top side component skyline profile achieves no more than 1mm height difference between the tallest and the shortest power train part that benefits from contact with the gap pad material. The output current derating versus cold wall temperature, when using a gap pad such as Bergquist GP2500S20, is shown in Figure 20. Figure 19. Cold Wall Mounting February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 10 OUTPUT CURRENT, I (A) O OUTPUT CURRENT, I (A) O Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current connection to ensure a reliable solder joint. There are Surface Mount Information several types of SMT reflow technologies currently used Pick and Place in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR The modules use an open frame construction and are (radiant infrared), or a combination of convection/IR. For designed for a fully automated assembly process. The reliable soldering the solder reflow profile should be modules are fitted with a label designed to provide a established by accurately measuring the modules CP large surface area for pick and place operations. The connector temperatures. label meets all the requirements for surface mount processing, as well as safety standards, and is able to 300 o withstand reflow temperatures of up to 300 C. The label o Peak Temp 235 C also carries product information such as product code, 250 Cooling serial number and the location of manufacture. zone Heat zo ne 200 o -1 o -1 1-4 Cs max 4 Cs 150 Soak zo ne 10 0 T above 30-240s lim o 205 C 50 Preheat zo ne o -1 max 4 Cs 0 REFLOW TIME (S) Figure 21. Pick and Place Location. Figure 22. Reflow Profile for Tin/Lead (Sn/Pb) process. Nozzle Recommendations 240 The module weight has been kept to a minimum by using open frame construction. Even so, these modules have 235 a relatively large mass when compared to conventional 230 SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be 225 considered to optimize this process. The minimum 220 recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will 215 safely fit within the allowable component spacing, is 9 210 mm. Oblong or oval nozzles up to 11 x 9 mm may also be 205 used within the space available. 200 0 10 203040 50 60 o Figure 23. Time Limit Curve Above 205 C for Tin Lead Soldering Tin/Lead (Sn/Pb) process The power modules are lead free modules and can be Lead Free Soldering soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is The –Z version of the modules are lead-free (Pb-free) recommended that the customer review data sheets in and RoHS compliant and are both forward and backward order to customize the solder reflow profile for each compatible in a Pb-free and a SnPb soldering process. application board assembly. The following instructions Failure to observe the instructions below may result in must be observed when soldering these units. Failure to the failure of or cause damage to the modules and can observe these instructions may result in the failure of or adversely affect long-term reliability. cause damage to the modules, and can adversely affect Reflow Soldering Information long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak The surface mountable modules in the family use our o newest SMT technology called “Column Pin” (CP) reflow temperatures are limited to less than 235 C. o connectors. Figure 24 shows the new CP connector Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device connection. before and after reflow soldering onto the end-board assembly. Sufficient time must be allowed to fuse the plating on the February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 11 MAX TEMP SOLDER (C) REFLOW TEMP (C) Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Surface Mount Information (continued) MSL Rating ESTW Board The modules have a MSL rating of 2A. Storage and Handling The recommended storage environment and handling Insulator procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Solder Ball Packing, Shipping and Use of Moisture/Reflow Sensitive End assembly PCB Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or Figure 24. Column Pin Connector Before and After greater. These sealed packages should not be broken Reflow Soldering . until time of use. Once the original package is broken, The CP is constructed from a solid copper pin with an the floor life of the product at conditions of  30°C and integral solder ball attached, which is composed of 60% relative humidity varies according to the MSL rating tin/lead (Sn63/Pb37) solder for non-Z codes, or (see J-STD-033A). The shelf life for dry packed SMT Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP packages will be a minimum of 12 months from the bag connector design is able to compensate for large seal date, when stored at the following conditions: < 40° amounts of co-planarity and still ensure a reliable SMT C, < 90% relative humidity. o solder joint. Typically, the eutectic solder melts at 183 C o Post Solder Cleaning and Drying (Sn/Pb solder) or 217-218 C (SAC solder), wets the Considerations land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the Post solder cleaning is usually the final circuit board connection to ensure a reliable solder joint. There are assembly process prior to electrical board testing. The several types of SMT reflow technologies currently used result of inadequate cleaning and drying can affect both in the industry. These surface mount power modules can the reliability of a power module and the testability of the be reliably soldered using natural forced convection, IR finished circuit board assembly. For guidance on (radiant infrared), or a combination of convection/IR. appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board Pb-free Reflow Profile Mounted Power Modules: Soldering and Cleaning Power Systems will comply with J-STD-020 Rev. C Application Note (AN04-001). (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification Through-Hole Lead-Free Soldering procedures. This standard provides a recommended Information forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested The RoHS-compliant through-hole products use the SAC Pb-free solder paste is Sn/Ag/Cu (SAC). The (Sn/Ag/Cu) Pb-free solder and RoHS-compliant recommended linear reflow profile using Sn/Ag/Cu solder components. They are designed to be processed is shown in Figure 25. through single or dual wave soldering machines. The pins have a RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHS- compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your Lineage Power representative for more details. Figure 25. Recommended linear reflow profile using Sn/Ag/Cu solder. February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 12 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current EMC Considerations The circuit and plots in Figure 26 show a suggested configuration to meet the conducted emission limits of EN55022 Class B. Note: Customer is ultimately responsible for the proper layout, component selection, rating and verification of the suggeted parts based on end application. LISN connected to L Line LISN connected to N Line Figure 26. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 13 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] *Top side label includes Lineage Power name, product designation and date code. Top View* Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 14 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Mechanical Outline for Surface Mount Module (-S Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] * Top side label includes Lineage Power name, product designation and date code. Top View Side View Bottom VI- VO- View* SENSE- ON/OFF TRIM SENSE+ VI+ VO+ Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 15 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Mechanical Outline for Through-Hole Module with Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View* Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 16 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) SMT Recommended Pad Layout (Component Side View) Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER TH Recommended Pad Layout (Component Side View) February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 17 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Each tray contains a total of 12 power modules. The trays Packaging Details are self-stacking and each shipping box for the surface The surface mount versions of the ESTW010A0A (suffix – mount module (suffix –S) will contain 4 full trays plus one S) are supplied as standard in the plastic trays shown in empty hold down tray giving a total number of 48 power Figure 27. modules. Tray Specification Material Antistatic coated PVC 12 Max surface resistivity 10 /sq Color Clear Capacity 12 power modules Min order quantity 48 pcs (1 box of 4 full trays + 1 empty top tray) Figure 27. Surface Mount Packaging Tray February 23, 2017 ©2016 General Electric Company. All rights reserved. Page 18 Data Sheet GE ESTW010A0A Series Eighth-Brick Power Modules 36–75Vdc Input; 5.0Vdc Output; 10A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1 Device Codes Output Output On/Off Connector Product Codes Input Voltage Comcodes Voltage Current Logic Type ESTW010A0A41Z CC109163481 48V (36-75Vdc) 5.0V 10A Negative Through hole ESTW010A0A41-HZ CC109169553 48V (36-75Vdc) 5.0V 10A Negative Through hole ESTW010A0A41-SZ CC109168877 48V (36-75Vdc) 5.0V 10A Negative Surface mount Table 2. Device Options Characteristic Character and Position Definition Form Factor E E = Eighth Brick Family Designator ST ST = STINGRAY Series Input Voltage W = Wide Range, 36V-75V W Output Current 010A0 010A0 = 010.0 amps maximum Output Voltage A A = 5.0V nominal Omit = Default Pin Length shown in Mechanical Outline Figures Pin Length 6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) 8 Omit = Latching Mode Action following 4 4 = Auto-restart following shutdown Protective Shutdown (Overcurrent/Overvoltage/Overtermperature) Omit = Positive Logic On/Off Logic 1 1 = Negative Logic Customer Specific XY = Customer Specific Modified Code, Omit for Standard Code XY Mechanical Features Omit = Standard open Frame Module H H = Heat plate, for use with heat sinks or cold walls S S = Surface mount connections Omit = RoHS 5/6, Lead Based Solder Used RoHS Z = RoHS 6/6 Compliant, Lead free Z Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.ge.com/powerelectronics GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. February 23, 2017 ©2012 General Electric Company. All rights reserved. Version 1.1 Options Ratings