Data Sheet October 11, 2011 ESTW025A0F Series (Eighth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 3.3Vdc Output; 25A Output Current Features STINGRAY™ SERIES  Wide input voltage range: 36-75 V dc  Delivers up to 25A Output current  Monotonic startup into prebiased load  Output Voltage adjust: 80% to 110% of V o,nom  Remote sense  Constant switching frequency  Positive remote On/Off logic  Input under voltage protection  Output overcurrent and overvoltage protection RoHS Compliant  Over-temperature protection  Industry standard, DOSA compliant footprint 57.9mm x 22.8mm x 8.5mm Applications (2.28 in x 0.9 in x 0.335 in)  Distributed power architectures  Low profile height and reduced component skyline  Wireless networks  Suitable for cold wall cooling using suitable Gap  Access and optical network Equipment Pad applied directly to top side of module  Enterprise Networks including Power over Ethernet  High efficiency 92% at full load (Vin=48V ) dc (PoE)  No thermal derating up to 68°C, 1.0m/s (200 LFM)  Latest generation IC’s (DSP, FPGA, ASIC) and  Wide operating temperature range (-40°C to 85°C) Microprocessor powered applications  Compliant to RoHS EU Directive 2002/95/EC (-Z versions)  Compliant to ROHS EU Directive 2002/95/EC with Options lead solder exemption (non-Z versions)  Negative Remote On/Off logic (-1 option, nd †  UL* 60950-1, 2 Ed. Recognized, CSA C22.2 No. preferred/standard) ‡ nd 60950-1-07 Certified, and VDE (EN60950-1, 2  Surface Mount version (-S option) Ed.) Licensed §  Auto-restart (-4 option, preferred/standard)  CE mark meets 2006/95/EC directive  Trimmed leads (-6 or -8 options)  Meets the voltage and current requirements for ETSI 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1  2250 V Isolation tested in compliance with IEEE dc ¤ 802.3 PoE standards **  ISO 9001 and ISO 14001 certified manufacturing facilities Description The ESTW025A0F series, Eighth-brick power modules are isolated dc-dc converters that can deliver up to 25A of output current and provide a precisely regulated output voltage over a wide range of input voltages (Vin = 36 -75Vdc). The module achieves typical full load efficiency of 92% at 3.3V output voltage. The open frame modules construction, available dc in both surface-mount and through-hole packaging, enable designers to develop cost- and space-efficient solutions. Document No: DS09-013 ver.1.01 * UL is a registered trademark of Underwriters Laboratories, Inc. † PDF name: ESTW025A0F.pdf CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. § This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All V -0.3 80 V IN dc Transient, operational (≤100 ms) All V -0.3 100 V IN,trans dc Operating Ambient Temperature All T -40 85 °C A Maximum Base-plate Operating Temperature -18H, H T -40 110 °C C (see Thermal Considerations section) Storage Temperature All T -55 125 °C stg I/O Isolation voltage (100% factory Hi-Pot tested) All   2250 V dc Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All V 36 48 75 V IN dc Maximum Input Current All I 2.7 A IN,max dc (V = V to V , I =I ) IN IN, min IN, max O O, max Input No Load Current All I 50 mA IN,No load (V = V , I = 0, module enabled) IN IN, nom O Input Stand-by Current All I 6 8 mA IN,stand-by (V = V , module disabled) IN IN, nom 2 2 Inrush Transient All It 1 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V to V All 30 mA IN, min IN, max, p-p I = I ; See Test configuration section) O Omax Input Ripple Rejection (120Hz) All 50 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. LINEAGE POWER 2 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Nominal Output Voltage Set-point V =V , I =I , T=25°C) All V 3.250 3.300 3.350 V IN IN, nom O O, max A O, set dc Output Voltage All V 3.200  3.400 V (Over all operating input voltage, resistive load, and O dc temperature conditions until end of life) Output Regulation Line (V =V to V) All   ±0.1 % V IN IN, min IN, max O, set All Load (I =I to I )   10 mV O O, min O, max Temperature (T =T to T) All ±0.2 % V ref A, min A, max  O, set Output Ripple and Noise on nominal output (Co=1uF,ceramic+10uF,tantalum, V =V ,I = I IN IN, nom O O, , T =T to T ) max A A, min A, max RMS (5Hz to 20MHz bandwidth) All  8 20 mV rms Peak-to-Peak (5Hz to 20MHz bandwidth) All 40 75 mV  pk-pk 1 External Capacitance All C 0  20,000 μF O, max Output Current All I 0  25.0 A o dc Output Current Limit Inception (Hiccup Mode ) I All O, lim 26.3 29 32.5 A dc (V = 90% of V ) O O, set Output Short-Circuit Current (V≤250mV) O All I 1.6 A O, s/c rms ( Hiccup Mode) Efficiency V = V , T =25°C, I =I V = V All η 91.0 92.0 % IN IN, nom A O O, max , O O,set V = V , T =25°C, I =10A V = V All η 91.0 92.0 % IN IN, nom A O , O O,set V = V , T =25°C, I =5A V = V All η 85.5 87.0 % IN IN, nom A O , O O,set Switching Frequency All f 355 kHz sw Dynamic Load Response (Co=1uF,ceramic+220uF,tantalum, dI /dt=0.1A/s; o V = 48V; T =25°C) IN A Load Change from Io= 50% to 75% or 25% to 50% of I o,max Peak Deviation All V  127  mV pk Settling Time (Vo<10% peak deviation) All t 200 s   s 1. See Note 2 under Feature Specifications. Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All C  1000  pF iso Isolation Resistance All R  30  MΩ iso I/O Isolation Voltage (100% factory Hi-pot tested) All All   2250 V dc General Specifications Parameter Device Symbol Min Typ Max Unit 9 Calculated Reliability based upon Telcordia SR-332 All FIT 229.4 10 /Hours Issue 2: Method I Case 3 (I =80%I , T =40°C, O O, max A All MTBF 4,359,904 Hours airflow = 200 lfm, 90% confidence) g(oz) Weight (Open Frame) All 22 (0.78) g(oz) Weight (with Heatplate) All 35 (1.23) LINEAGE POWER 3 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to V terminal) IN- Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All I   0.15 mA on/off Logic Low - On/Off Voltage All V -0.7 0.6 V on/off  dc Logic High Voltage – (Typ = Open Collector) All Von/off 2.4  15.0 Vdc Logic High maximum allowable leakage current All I   25 μA on/off 1 Turn-On Delay and Rise Times o (I =I V =V T = 25C) O O, max , IN IN, nom, A Case 1: Input power is applied for >1 second and then the On/Off input is set to ON (T = time from instant All T ― 12 ― msec delay delay On/Off signal is ON until V = 10% of V ) O O, set Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (T = time All T ― 20 ― msec delay delay at which V = V until V =10% of V ) IN IN, min o O,set Output voltage Rise time (time for V to rise from 10% o All T ― 4 ― msec rise of V to 90% of V ) o,set o, set Output voltage overshoot – Startup All ― 5 % V O, set o I = I ; V =V to V , T = 25 C O O, max IN IN, min IN, max A Prebias Output Load Performance: Output Start up characteristic All Monotonic Back Bias current drawn from output (Module Enabled) All -15 mA dc Remote Sense Range All V 10 % V SENSE O, set Output Voltage Adjustment Range All -20 +10 % V O, set 2 Output Overvoltage Protection (C =470μF) All V 3.9 5.1 V O O, limit dc O Overtemperature Protection – Hiccup Auto Restart All T  125  C ref Input Undervoltage Lockout All V UVLO Turn-on Threshold 34.0 35.5 V  dc Turn-off Threshold 30.5 32.0 V  dc Hysteresis 1.0 2.0  V dc 1. The module has an adaptable extended Turn-On Delay interval, Tdelay, of 25mS. The extended Tdelay will occur when the module restarts following the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back to normal. 2. The module requires a minimum of 470 μF external output capacitor to prevent shutdown during full load to no load transients and to avoid exceeding the OVP maximum limits during startup into open loop fault conditions. LINEAGE POWER 4 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Characteristic Curves o The following figures provide typical characteristics for the ESTW025A0F (3.3V, 25A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. OUTPUT CURRENT, I (A) TIME, t (200µs/div) O Figure 4. Transient Response to 0.1A/µS Dynamic Figure 1. Converter Efficiency versus Output Current. Load Change from 50% to 75% to 50% of full load. TIME, t (2s/div) TIME, t (10ms/div) Figure 2. Typical output ripple and noise (VIN = VIN,NOM, Figure 5. Typical Start-up Using Remote On/Off, Io = Io,max). negative logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (200µs/div) TIME, t (5ms/div) Figure 3. Transient Response to 0.1A/µS Dynamic Figure 6. Typical Start-up Using Input Voltage (VIN = Load Change from 25% to 50% to 25% of full load. VIN,NOM, Io = Io,max). LINEAGE POWER 5 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE EFFICIENCY,  (%) Io(A) (5A/div) V (V) (200mV/div) O V (V) (20mV/div) O INPUT VOLTAGE OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE V V Io(A) (5A/div) V IN (V) (20V/div Vo (V) (1V/div) On/off (V) (5V/div) VO (V) (1V/div) O (V) (200mV/div) Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE The power module should be connected to a low ac-impedance source. Highly inductive source LTEST Vin+ impedance can affect the stability of the power 12μH module. For the test configuration in Figure 7 a 100μF electrolytic capacitor (ESR<0.7 at 100kHz), mounted C 220μF S close to the power module helps ensure the stability of 100μF E.S.R.<0.1 the unit. Consult the factory for further application @ 20°C 100kHz guidelines. Vin- Safety Considerations For safety-agency approval of the system in which the NOTE: Measure input reflected ripple current with a simulated source inductance (L ) of 12μH. Capacitor C offsets TEST S power module is used, the power module must be possible battery impedance. Measure current as shown installed in compliance with the spacing and above. separation requirements of the end-use safety agency Figure 7. Input Reflected Ripple Current Test standard, i.e. UL60950-1, CSA C22.2 No.60950-1, Setup. and VDE0805-1(IEC60950-1). COPPER STRIP If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to V (+) RESISTIVE O LOAD 75Vdc), for the module’s output to be considered as meeting the requirements for safety extra-low voltage SCOPE (SELV), all of the following must be true: V O (– ) 0.01uF 10uF  The input source is to be provided with reinforced 0.1uF insulation from any other hazardous voltages, GROUND PLANE including the ac mains. NOTE: All voltage measurements to be taken at the module  One V pin and one V pin are to be grounded, IN OUT terminals, as shown above. If sockets are used then or both the input and output pins are to be kept Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact floating. resistance.  The input pins of the module are not operator Figure 8. Output Ripple and Noise Test Setup. accessible.  Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety R R R R agencies, to verify that under a single fault, distribution contact contact distribution Vin+ Vout+ hazardous voltages do not appear at the module’s output. R Note: Do not ground either of the input pins of the LOAD V V IN O module without grounding one of the output pins. This may allow a non-SELV voltage to Rdistribution Rcontact Rcontact Rdistribution appear between the output pins and ground. Vin- Vout- The power module has extra-low voltage (ELV) outputs when all inputs are ELV. NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then All flammable materials used in the manufacturing of Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact these modules are rated 94V-0, or tested to the resistance. UL60950 A.2 for reduced thickness. For input voltages exceeding 60 Vdc but less than or Figure 9. Output Voltage and Efficiency Test equal to 75 Vdc, these converters have been Setup. evaluated to the applicable requirements of BASIC V . I O O INSULATION between secondary DC MAINS Efficiency = x 100 %  V . I IN IN DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 5 A fast-acting fuse in the ungrounded lead. LINEAGE POWER 6 BATTERY Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output be increased, which at the same output current would Feature Description increase the power output of the module. Care should Remote On/Off be taken to ensure that the maximum output power of the module remains at or below the maximum rated Two remote on/off options are available. Positive logic power (Maximum rated power = Vo,set x Io,max). turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the SENSE(+) module off during a logic high and on during a logic SENSE(–) low. I(+) V VO(+) IO SUPPL Y LOAD II VI(-) VO(–) Vin+ Vout+ CONTACT CONTACT AND RESIST ANCE DISTRIBUTION LOSSE I on/off ON/OFF Figure 11. Circuit Configuration for remote TRIM sense . V on/off Input Undervoltage Lockout At input voltages below the input undervoltage lockout Vout- Vin- limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, V . UV/ON Figure 10. Remote On/Off Implementation. Once operating, the module will continue to operate until the input voltage is taken below the undervoltage To turn the power module on and off, the user must turn-off threshold, V . UV/OFF supply a switch (open collector or equivalent) to control the voltage (V ) between the ON/OFF on/off terminal and the V (-) terminal (see Figure 10). Logic IN Overtemperature Protection low is 0V ≤ V ≤ 1.2V. The maximum I during a on/off on/off To provide protection under certain fault conditions, logic low is 1mA, the switch should maintain a logic the unit is equipped with a thermal shutdown circuit. low level while sinking this current. The unit will shutdown if the thermal reference point During a logic high, the typical maximum V o on/off Tref (Figure 13), exceeds 125 C (typical), but the generated by the module is 15V, and the maximum thermal shutdown is not intended as a guarantee that allowable leakage current at Von/off = 5V is 1μA. the unit will survive temperatures beyond its rating. If not using the remote on/off feature: The module can be restarted by cycling the dc input power for at least one second or by toggling the For positive logic, leave the ON/OFF pin open. remote on/off signal for at least one second. If the For negative logic, short the ON/OFF pin to V (-). IN auto-restart option (4) is ordered, the module will automatically restart upon cool-down to a safe temperature. Remote Sense Output Overvoltage Protection Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense The output over voltage protection scheme of the connections (See Figure 11). The voltage between the modules has an independent over voltage loop to remote-sense pins and the output terminals must not prevent single point of failure. This protection feature exceed the output voltage sense range given in the latches in the event of over voltage across the output. Feature Specifications table: Cycling the on/off pin or input voltage resets the [V (+) – V (–)] – [SENSE(+) – SENSE(–)]  0.5 V O O latching protection feature. If the auto-restart option Although the output voltage can be increased by both (4) is ordered, the module will automatically restart the remote sense and by the trim, the maximum upon an internally programmed time elapsing. increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. Overcurrent Protection To provide protection in a fault (output overload) The amount of power delivered by the module is condition, the unit is equipped with internal defined as the voltage at the output terminals current limiting circuitry and can endure current multiplied by the output current. When using remote limiting continuously. At the point of current limit sense and trim, the output voltage of the module can inception, the unit enters hiccup mode. If the unit is LINEAGE POWER 7 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output the output voltage set point. The following equation Feature Descriptions (continued) determines the required external resistor value to not configured with auto–restart, then it will latch off obtain a percentage output voltage change of Δ%: following the over current condition. The module can be restarted by cycling the dc input power for at least 5.11V  (100%)  511  o,set R   10.22 one second or by toggling the remote on/off signal for trimup   1.225% %   at least one second. If the unit is configured with the auto-restart option (4), it will remain in the hiccup V V  Where desired o ,set    %  100 mode as long as the overcurrent condition exists; it   V o ,set   operates normally, once the output current is brought back into its specified range. The average output For example, to trim-up the output voltage of the current during hiccup is 10% I . O, max module by 5% to 3.465V, R is calculated is as trim-up follows: Output Voltage Programming  %  5 Trimming allows the output voltage set point to be 5.11 3.3 (100 5) 511   increased or decreased, this is accomplished by R    10.22  trimup   connecting an external resistor between the TRIM pin 1.225 5 5   and either the V (+) pin or the V (-) pin. O O R  176.7 trimup The voltage between the V (+) and V (–) terminals O O must not exceed the minimum output overvoltage V (+) V (+) IN O protection value shown in the Feature Specifications R table. This limit includes any increase in voltage due trim-up to remote-sense compensation and output voltage ON/OFF set-point adjustment trim. LOAD V TRIM O Although the output voltage can be increased by both the remote sense and by the trim, the maximum R trim-down increase for the output voltage is not the sum of both. The maximum increase is the larger of either the V (-) V (-) IN O remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage Figure 12. Circuit Configuration to Trim Output of the module can be increased, which at the same Voltage. output current would increase the power output of the module. Care should be taken to ensure that the Connecting an external resistor (R ) between trim-down maximum output power of the module remains at or the TRIM pin and the V (-) (or Sense(-)) pin O below the maximum rated power (Maximum rated decreases the output voltage set point. To maintain power = V x I ). O,set O,max set point accuracy, the trim resistor tolerance should be ±1.0%. The following equation determines the required external resistor value to obtain a percentage output voltage change of Δ% 511   R   10 .22  trimdown    %   V V  Where o,set desired    %  100   V o,set   For example, to trim-down the output voltage of the module by 8% to 3.036V, Rtrim-down is calculated as follows: % 8 511  R  10.22 trimdown   8   R  53.655 trimdown Connecting an external resistor (R ) between the trim-up TRIM pin and the V (+) (or Sense (+)) pin increases O LINEAGE POWER 8 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output for natural convection and up to 2.0 m/s (400 ft./min) Thermal Considerations forced airflow, are shown in Figure 15. The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The thermal reference points, T ,T and T used ref1 ref2 ref3 in the specifications for open frame modules are shown in Figures 13a and 13b. For reliable operation o o these temperatures should not exceed 125 C, 110 C o o AMBIENT TEMEPERATURE, TA ( C) and 105 C respectively. Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. Heat Transfer via Conduction The module can also be used in a sealed environment with cooling via conduction from the module’s top surface through a gap pad material to a cold wall, as Figure 13a. T Temperature Measurement ref 1 shown in Figure 16. The output current derating Location for Open Frame Module. versus cold wall temperature, when using a gap pad such as Bergquist GP2500S20, is shown in Figure 17. Figure 13b. T and T Temperature ref 2 ref 3 Measurement Locations for Open Frame Module. Figure 16. Cold Wall Mounting The thermal reference point, T , used in the ref specifications for modules with heatplate is shown in Figure 14. For reliable operation this temperature o should not exceed 110 C. o COLDPLATE TEMEPERATURE, T ( C) C Figure 17. Derated Output Current versus Cold Figure 14. T Temperature Measurement ref Wall Temperature with local ambient temperature Location for Module with Heatplate. around module at 85C; Vin=48V. Heat Transfer via Convection Please refer to the Application Note “Thermal Increased airflow over the module enhances the heat Characterization Process For Open-Frame Board- transfer via convection. Derating curves, showing the Mounted Power Modules” for a detailed discussion of maximum output current that can be delivered by thermal aspects including maximum device each module versus local ambient temperature (TA) temperatures. LINEAGE POWER 9 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Surface Mount Information the plating on the connection to ensure a reliable Pick and Place solder joint. There are several types of SMT reflow The ESTW025A0F modules use an open frame technologies currently used in the industry. These construction and are designed for a fully automated surface mount power modules can be reliably assembly process. The modules are fitted with a soldered using natural forced convection, IR (radiant label designed to provide a large surface area for pick infrared), or a combination of convection/IR. For and place operations. The label meets all the reliable soldering the solder reflow profile should be requirements for surface mount processing, as well as established by accurately measuring the modules CP safety standards, and is able to withstand reflow connector temperatures. o temperatures of up to 300 C. The label also carries 300 product information such as product code, serial o number and the location of manufacture. P eak Temp 235 C 250 Cooling zone Heat zone 200 o -1 o -1 1-4 Cs max 4 Cs 150 So ak zo ne T above 10 0 30-240s lim o 205 C 50 P reheat zo ne o -1 max 4 Cs 0 Figure 18. Pick and Place Location. REFLOW TIME (S) Figure 19. Reflow Profile for Tin/Lead (Sn/Pb) Nozzle Recommendations process. The module weight has been kept to a minimum by using open frame construction. Even so, these 240 modules have a relatively large mass when compared 235 to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement 230 speed should be considered to optimize this process. 225 The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer 220 diameter, which will safely fit within the allowable 215 component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be 210 used within the space available. 205 200 Tin Lead Soldering 0 10 203040 5060 o Figure 20. Time Limit Curve Above 205 C for The ESTW025A0F power modules are lead free Tin/Lead (Sn/Pb) process modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow Lead Free Soldering profile for each application board assembly. The The –Z version of the ESTW025A0F modules are following instructions must be observed when lead-free (Pb-free) and RoHS compliant and are both soldering these units. Failure to observe these forward and backward compatible in a Pb-free and a instructions may result in the failure of or cause SnPb soldering process. Failure to observe the damage to the modules, and can adversely affect instructions below may result in the failure of or cause long-term reliability. damage to the modules and can adversely affect In a conventional Tin/Lead (Sn/Pb) solder process long-term reliability. peak reflow temperatures are limited to less than o o Reflow Soldering Information 235 C. Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device The surface mountable modules in the connection. Sufficient time must be allowed to fuse ESTW025A0F-S family use our newest SMT LINEAGE POWER 10 MAX TEMP SOLDER (C) REFLOW TEMP (C) Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output should not be broken until time of use. Once the Surface Mount Information (continued) original package is broken, the floor life of the product technology called “Column Pin” (CP) connectors. at conditions of  30°C and 60% relative humidity Figure 19 shows the new CP connector before and varies according to the MSL rating (see J-STD-033A). after reflow soldering onto the end-board assembly. The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when ESTW Board stored at the following conditions: < 40° C, < 90% relative humidity. Post Solder Cleaning and Drying Considerations Insulator Post solder cleaning is usually the final circuit board Solder Ball assembly process prior to electrical board testing. The End assembly PCB result of inadequate cleaning and drying can affect both the reliability of a power module and the Figure 21. Column Pin Connector Before and After testability of the finished circuit board assembly. For Reflow Soldering . guidance on appropriate soldering, cleaning and drying procedures, refer to Lineage Power Board The CP is constructed from a solid copper pin with an Mounted Power Modules: Soldering and Cleaning integral solder ball attached, which is composed of Application Note (AN04-001). tin/lead (Sn /Pb ) solder for non-Z codes, or 63 37 Sn/Ag /Cu (SAC) solder for –Z codes. The CP 3.8 0.7 300 connector design is able to compensate for large Per J-STD-020 Rev. C amounts of co-planarity and still ensure a reliable Peak Temp 260°C 250 SMT solder joint. Typically, the eutectic solder melts o o at 183 C (Sn/Pb solder) or 217-218 C (SAC solder), Cooling 200 Zone wets the land, and subsequently wicks the device * Min. Time Above 235°C connection. Sufficient time must be allowed to fuse 15 Seconds 150 Heating Zone the plating on the connection to ensure a reliable *Time Above 217°C 1°C/Second 60 Seconds solder joint. There are several types of SMT reflow 100 technologies currently used in the industry. These surface mount power modules can be reliably 50 soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. 0 Reflow Time (Seconds) Pb-free Reflow Profile Figure 22. Recommended linear reflow profile Power Systems will comply with J-STD-020 Rev. C using Sn/Ag/Cu solder. (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification Through-Hole Lead-Free Soldering procedures. This standard provides a recommended Information forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The The RoHS-compliant through-hole products use the suggested Pb-free solder paste is Sn/Ag/Cu (SAC). SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant The recommended linear reflow profile using components. They are designed to be processed Sn/Ag/Cu solder is shown in Figure 22. through single or dual wave soldering machines. The pins have a RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. MSL Rating A maximum preheat rate of 3C/s is suggested. The The ESTW025A0F modules have a MSL rating of 2a. wave preheat process should be such that the temperature of the power module board is kept below Storage and Handling 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is The recommended storage environment and handling 270C max. Not all RoHS-compliant through-hole procedures for moisture-sensitive surface mount products can be processed with paste-through-hole packages is detailed in J-STD-033 Rev. A (Handling, Pb or Pb-free reflow process. If additional information Packing, Shipping and Use of Moisture/Reflow is needed, please consult with your Lineage Power Sensitive Surface Mount Devices). Moisture barrier representative for more details. bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages LINEAGE POWER 11 Reflow Temp (°C) Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output EMC Considerations The filter circuit schematic and plots in Figure 23 shows a suggested configuration as tested to meet the conducted emission limits of EN55022 Class B. Note: Customer is ultimately responsible for the proper selection, component rating and verification of the suggested parts based on the end application. Figure 23. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). LINEAGE POWER 12 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] *Top side label includes Lineage Power name, product designation and date code. Top View* Side View *For optional pin lengths, see Table 2, Device Options Bottom View Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) LINEAGE POWER 13 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Mechanical Outline for Surface Mount Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] * Top side label includes Lineage Power name, product designation and date code. Top View* Side View Bottom View Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) LINEAGE POWER 14 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Mechanical Outline for Through-Hole Module with 1/8th Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View* Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) LINEAGE POWER 15 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Mechanical Outline for Through-Hole Module with 1/4th Heat Plate (-18H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) LINEAGE POWER 16 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] SMT Recommended Pad Layout (Component Side View) LINEAGE POWER 17 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output TH Recommended Pad Layout (Component Side View) LINEAGE POWER 18 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Packaging Details Tray Specification The surface mount versions of the ESTW025A0F modules (suffix –S) are supplied as standard in Material Antistatic coated PVC the plastic tray shown in Figure 24. The tray has 12 Max surface resistivity 10 /sq external dimensions of 135.1mm(W) x 321.8mm(L) x 12.42mm(H) or 5.319in(W) x 12.669in(L) x 0.489in(H). Color Clear Capacity 12 power modules Min order quantity 48 pcs (1 box of 4 full trays) Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box will contain 4 full trays plus one empty hold down tray giving a total number of 48 power modules. Figure 24. Surface Mount Packaging Tray. LINEAGE POWER 19 Data Sheet ESTW025A0F Series Eighth-Brick Power Modules October 11, 2011 36–75Vdc Input; 3.3Vdc Output; 25A Output Ordering Information Please contact your Lineage Power Sales Representative for pricing, availability and optional features. Table 1. Device Codes Output Output On/Off Connector Product Codes Input Voltage Comcodes Voltage Current Logic Type ESTW025A0F41Z 48V (36-75Vdc) 3.3V 25A Negative Through hole CC109158498 ESTW025A0F41-HZ 48V (36-75Vdc) 3.3V 25A Negative Through hole CC109159505 CC109159496 ESTW025A0F41-SZ 48V (36-75Vdc) 3.3V 25A Negative Surface Mount CC109159125 ESTW025A0F641 48V (36-75Vdc) 3.3V 25A Negative Through hole ESTW025A0F4Z 48V (36-75Vdc) 3.3V 25A Positive Through hole CC109168118 CC109169363 ESTW025A0F641Z 48V (36-75Vdc) 3.3V 25A Negative Through hole CC109167367 ESTW025A0F841Z 48V (36-75Vdc) 3.3V 25A Negative Through hole ESTW025A0F64-18HZ 48V (36-75Vdc) 3.3V 25A Positive Through hole CC109172846 Table 2. Device Options Characteristic Character and Position Definition Form Factor E E = Eighth Brick Family Designator ST ST = Stingray Series Input Voltage W W = Wide Range, 36V-75V Output Current 025A0 025A0 = 025.0 Amps Maximum Output Current Output Voltage F F = 3.3V nominal Omit = Default Pin Length shown in Mechanical Outline Figures Pin Length 6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 8 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) Action following Omit = Latching Mode Protective 4 4 = Auto-restart following shutdown (Overcurrent/Overvoltage) Omit = Positive Logic On/Off Logic 1 1 = Negative Logic Customer Specific XY = Customer Specific Modified Code, Omit for Standard Code XY Omit = Standard open Frame Module H = 1/8th Brick size heat plate, for H use with heat sinks (not available with –S option) Mechanical Features 18H = 1/4th Brick size heat plate with unthreaded inserts for 18H use in coldwall applications (not available with –S option) S = Surface mount connections Omit = RoHS 5/6, Lead Based Solder Used RoHS Z Z = RoHS 6/6 Compliant, Lead free Asia-Pacific Headquarters Tel: +65 6593 7211 Europe, Middle-East and Africa Headquarters World Wide Headquarters Tel: +49 89 878067-280 Lineage Power Corporation 601 Shiloh Road, Plano, TX 75074, USA +1-800-526-7819 India Headquarters (Outside U.S.A.: +1-972-244-9428) Tel: +91 80 28411633 www.lineagepower.com e-mail: techsupport1@lineagepower.com Lineage Power reser ves the right to make changes to the product(s) or information contained herei n without notice. N o liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or infor mati on. Lineage Power DC-DC products are protected under various patents. Information on these patents is availabl e at www.lineagepower.com/patents. © 2011 Lineage Power Corporation, (Plano, Texas) All International Rights Reser ved. Document No: DS09-013 ver.1.01 f PDF name: ESTW025A0F.pd Options Ratings