Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Features  Compliant to RoHS EU Directive 2011/65/EU (Z versions)  Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this produc twill no longer be RoHS compliant (non-Z versions) RoHS Compliant  Compatible in a Pb-free or SnPb reflow environment  High efficiency – 93.5% at 12V full load  Industry standard, DOSA compliant, Eighth brick footprint 57.9mm x 22.9mm x 7.8mm Applications (2.28in x 0.90in x 0.31in)  Wide Input voltage range: 36-75 Vdc  Distributed Power Architectures  Wireless Networks  Tightly regulated output  Constant switching frequency  Access and Optical Network Equipment  Enterprise Networks including Power over Ethernet  Positive Remote On/Off logic (PoE)  Input under/over voltage protection  Output overcurrent/voltage protection  Over-temperature protection Options  Remote sense  Negative Remote On/Off logic  No minimum load required  Over current/Over temperature/Over voltage  No reverse current during output shutdown protections (Auto-restart)  Output Voltage adjust: 80% to 110% of V o,nom  Heat plate versions (-H)  Operating temperature range (-40°C to 85°C)  Surface Mount version (-S) † C22.2 No. 60950-1-  UL* 60950-1Recognized, CSA ‡ 03 Certified, and VDE 0805:2001-12 (EN60950-1) Licensed  CE mark meets 73/23/EEC and 96/68/EEC § directives  Meets the voltage and current requirements for ETSI 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1  2250 Vdc Isolation tested in compliance with IEEE ¤ 802.3 PoE standards **  ISO 9001 and ISO 14001 certified manufacturing facilities Description The EVW010A0B, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 10A of output current and provide a precisely regulated output voltage of 12V over a wide range of input voltages (VIN = 36 - 75Vdc). The modules achieve typical full load efficiency of 93.5%. The open frame modules construction, available in both surface- mount and through-hole packaging, enable designers to develop cost and space efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection. October 1, 2015 ©2012 General Electric Company. All rights reserved. Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All V -0.3 80 V IN dc Transient (≤100 ms) All VIN,trans -0.3 100 Vdc Operating Ambient Temperature All TA -40 85 °C (see Thermal Considerations section) Storage Temperature All T -55 125 °C stg   I/O Isolation voltage (100% factory Hi-Pot tested) All 2250 Vdc Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All VIN 36 48 75 Vdc Maximum Input Current All I 3.4 3.7 A IN,max dc (VIN= VIN, min to VIN, max, IO=IO, max) Input No Load Current All I 75 mA IN,No load (V = V , I = 0, module enabled) IN IN, nom O Input Stand-by Current All IIN,stand-by 20 mA (V = V , module disabled) IN IN, nom 2 2 Inrush Transient All It 0.5 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; V to V All 20 mA IN, min IN, p-p max, IO= IOmax ; See Test configuration section) Input Ripple Rejection (120Hz) All 50 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a time-delay fuse with a maximum rating of 8 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 2 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Nominal Output Voltage Set-point All VO, set 11.76 12.0 12.24 Vdc V =V , I =I , T =25°C) IN IN, min O O, max A Output Voltage All V -3.0 +3.0 % V (Over all operating input voltage, resistive load, and O  O, set temperature conditions until end of life) Output Regulation Line (V =V to V) All 0.2 % V IN IN, min IN, max   O, set Load (I =I to I ) All   0.2 % V O O, min O, max O, set Temperature (Tref=TA, min to TA, max) All   1.0 % VO, set Output Ripple and Noise on nominal output (VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max) RMS (5Hz to 20MHz bandwidth) All 30 mV   rms Peak-to-Peak (5Hz to 20MHz bandwidth) All   100 mVpk-pk External Capacitance All CO 100  2,000 μF Output Current All I 0 10 A o  dc Output Current Limit Inception (Hiccup Mode ) All 105 115 130 % Io IO, lim (V = 90% of V) O O, set Output Short-Circuit Current All IO, s/c  3 5 Arms (VO≤250mV) ( Hiccup Mode ) Efficiency All η 93.5 % VIN= VIN, nom, TA=25°C I =I V = V O O, max , O O,set Switching Frequency (Input ripple is ½ f) All f 370 kHz sw sw Dynamic Load Response (dIo/dt=0.1A/s; VIN = VIN, nom; TA=25°C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max; Peak Deviation All V  3  % V pk O, set Settling Time (Vo<10% peak deviation) All t 200 s   s (dIo/dt=1A/s; VIN = VIN, nom; TA=25°C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max; Peak Deviation All Vpk  5  % VO, set Settling Time (Vo<10% peak deviation) All ts  200  s Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All Ciso  1000  pF Isolation Resistance All Riso 10   MΩ I/O Isolation Voltage (100% factory Hi-pot tested) All All   2250 V dc General Specifications Parameter Device Symbol Min Typ Max Unit 9 Calculated Reliability based upon Telcordia SR-332 All FIT 323.4 10 /Hours Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C, All MTBF 3,092,530 Hours airflow = 200 lfm, 90% confidence) 19 g Weight (Open Frame) All   (0.67) (oz.) 32 g Weight (with Heatplate) All   (1.13) (oz.) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 3 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All I 1.0 mA on/off   Logic Low - On/Off Voltage All Von/off -0.7  1.0 Vdc Logic High Voltage – (Typ = Open Collector) All Von/off 2.0 5.0 Vdc Logic High maximum allowable leakage current All Ion/off   10 μA 1 Turn-On Delay and Rise Times o (IO=IO, max , VIN=VIN, nom, TA = 25 C) Case 1: On/Off input is set to Logic Low (Module ON) and then input power is applied (Tdelay from All Tdelay — 25 30 msec instant at which VIN = VIN, min until VO = 10% of VO,set) Case 2: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (Tdelay from All Tdelay — 12 20 msec instant Von/off toggles until VO = 10% of VO, set). Output voltage Rise time (time for Vo to rise from 10% All Trise — 10 15 msec of V to 90% of V ) o,set o, set Output voltage overshoot – Startup All — 3 % VO, set o IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C Remote Sense Range All V 10 % V SENSE O, set (Max voltage drop is 0.5V) 2 Output Voltage Adjustment Range All 80 110 % V O, set Output Overvoltage Protection All V 13.8 16.5 V O, limit  dc Input Undervoltage Lockout All VUVLO Turn-on Threshold 30 34.5 36 Vdc Turn-off Threshold 30 32.5  Vdc Hysterisis 1.5 2.0  Vdc Input Overvoltage Lockout All V OVLO Turn-off Threshold 80 83 V  dc Turn-on Threshold 75 78  Vdc Hysterisis 1 2  Vdc Notes: 1. The module has an adaptable extended Turn-On Delay interval, T , of 4 seconds. The extended T will occur when the module restarts following either: delay delay 1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, Tdelay, will occur whenever a module restarts with input voltage removed from the module for the preceding 1 second. 2. Maximum trim up possible only for Vin>40V. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 4 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Characteristic Curves o The following figures provide typical characteristics for the EVW010A0B (12V, 10A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 95 90 Vin = 75V 85 Vin = 48V 80 Vin = 36V 75 70 02 4 6 8 10 OUTPUT CURRENT, I (A) TIME, t (100µs/div) O Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 1.0A/µS Dynamic Load Change from 50% to 75% to 50% of full load (V = V ). IN IN,NOM TIME, t (2s/div) TIME, t (5ms/div) Figure 2. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 5. Typical Start-up Using Remote On/Off, negative Io,max). logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (100µs/div) TIME, t (10ms/div) Figure 3. Transient Response to 0.1A/µS Dynamic Load Figure 6. Typical Start-up Using Input Voltage (VIN = VIN,NOM, Change from 50% to 75% to 50% of full load (VIN = VIN,NOM). Io = Io,max). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 5 OUTPUT VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE VO (V) (200mV/div) Io(A) (2A/div) EFFICIENCY,  (%) V (V) (50mV/div) O On/Off VOLTAGE OUTPUT VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT INPUT VOLTAGE OUTPUT VOLTAGE VO (V) (2V/div) VOn/Off (V) (2V/div) VO (V) (200mV/div) Io(A) (2A/div) VIN (V) (20V/div) VO (V) (2V/div) Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Test Configurations CURRENT PROBE TO OSCILLOSCOPE L TES T Vin+ 12μH 33-100μF C 220μF S E.S.R.<0.1 @ 20°C 100kHz Vin- NOTE: Measure input reflected ripple current with a simulated source inductance (L ) of 12μH. Capacitor C offsets TEST S possible battery impedance. Measure current as shown above. Figure 7. Input Reflected Ripple Current Test Setup. COPPER STRIP V (+) RESISTIVE O LOAD SCOPE V O (–) 1uF 10uF GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 8. Output Ripple and Noise Test Setup. R R R R distribution contact contact distribution Vin+ Vout+ RLOAD V V IN O Rdistribution Rcontact Rcontact Rdistribution Vin- Vout- NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 9. Output Voltage and Efficiency Test Setup. V .I O O Efficiency = x 100 %  V .I IN IN October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 6 BATTERY Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Design Considerations Input Filtering The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7 a 33-100μF electrolytic capacitor (ESR<0.1 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines. Safety Considerations For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE 0805:2001-12 (IEC60950-1). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true:  The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains.  One V pin and one V pin are to be grounded, or both the input and output pins are to be kept floating. IN OUT  The input pins of the module are not operator accessible.  Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module’s output. Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. All flammable materials used in the manufacturing of these modules are rated 94V-0, or tested to the UL60950 A.2 for reduced thickness. For input voltages exceeding –60 Vdc but less than or equal to –75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 8 A time-delay fuse in the ungrounded lead. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 7 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Feature Description Remote On/Off Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low. Vin+ Vout+ I on/off ON/OFF TRIM Von/off Vout- Vin- Figure 10. Remote On/Off Implementation. To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VIN(-) terminal (see Figure 10). Logic low is 0V ≤ Von/off ≤ 1.0V. The maximum Ion/off during a logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current. During a logic high, the typical maximum Von/off generated by the module is 5V, and the maximum allowable leakage current at V = 5V is 1μA. on/off If not using the remote on/off feature: For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to VIN(-). Remote Sense Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table: [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max). SENSE(+) SENSE(–) VI(+) VO(+) IO SUPPL Y LOAD II VI(-) VO(–) CONTACT CONT ACT AND RESIST ANCE DISTRIBUTION LOSSE Figure 11. Circuit Configuration for remote sense . Input Undervoltage Lockout At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 8 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, VUV/OFF. Overtemperature Protection To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will o shutdown if the thermal reference point Tref (Figure 13), exceeds 150 C (typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the auto-restart option (4) is ordered, the module will automatically restart upon cool-down to a safe temperature. Output Overvoltage Protection The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the auto-restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing. Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, then it will latch off following the over current condition. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. The average output current during hiccup is 10% I . O, max Output Voltage Programming Trimming allows the output voltage set point to be increased or decreased, this is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin. VIN(+) VO(+) R trim-up ON/OFF LOAD V TRIM O R trim-down V (-) V (-) IN O Figure 12. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (R ) between the TRIM pin and the Vo(-) (or Sense(-)) pin decreases the output voltage trim-down set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆% 511   R   10 .22  trimdown    %     V V Where o,set desired   %  100   V o,set   For example, to trim-down the output voltage of the module by 8% to 11.04V, Rtrim-down is calculated as follows: % 8 511  R  10.22 trimdown   8   R  53 .655 trimdown October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 9 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Connecting an external resistor (R ) between the TRIM pin and the V (+) (or Sense (+)) pin increases the output voltage trim-up O set point. The following equations determine the required external resistor value to obtain a percentage output voltage change of ∆%: 5.11V  (100%)  511  o,set R   10.22 trimup   1.225% %   V V  Where desired o ,set    %  100   V o ,set   For example, to trim-up the output voltage of the module by 5% to 12.6V, Rtrim-up is calculated is as follows:  % 5 5.1112 .0 (100 5) 511   R  938.8 R    10 .22  trimup trimup   1.225 5 5   The voltage between the Vo(+) and Vo(–) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = VO,set x IO,max). Thermal Considerations The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel. The thermal reference point, T used in the specifications for open frame modules is shown in Figure 13. For reliable ref o operation this temperature should not exceed 122 C. AIRFLOW Figure 13. Tref Temperature Measurement Location for open Frame Module. The thermal reference point, Tref used in the specifications for modules with heat plates (–H) is shown in Figure 14. For o reliable operation this temperature should not exceed 114 C. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 10 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Thermal Considerations (continued) AIRFLOW Figure 14. T Temperature Measurement Location for Heat plate Module. ref Heat Transfer via Convection Increased airflow over the module enhances the heat transfer via convection. Derating curves showing the maximum output current that can be delivered by the open frame module versus local ambient temperature (TA) for natural convection and up to 3m/s (600 ft./min) forced airflow are shown in Figure 15. 10 9 8 3.0 m/s (600LFM) 7 2.0 m/s (400LFM) 6 1.0 m/s (200LFM) 5 0.5 m/s (100LFM) 4 NC 3 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, T ( C) A Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. For additional power, the module is available with an optional heatplate (-H), that allows for the use of heatsinks to improve the thermal derating. Derating curves showing the maximum output current that can be delivered by the heatplate module with different heatsink heights versus local ambient temperature (TA) for natural convection and up to 3m/s (600 ft./min) forced airflow are shown in Figures 16 -19. 10 9 3.0 m/s (600LFM) 8 2.0 m/s (400LFM) 7 1.0 m/s (200LFM) 6 0.5 m/s (100LFM) 5 NC 4 3 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, TA ( C) Figure 16. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 11 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current 10 9 2.0 m/s 8 (400LFM) 1.0 m/s 7 (200LFM) 0.5 m/s 6 (100LFM) NC 5 4 3 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, TA ( C) Figure 17. Output Current Derating for the Module with Heatplate and 0.25 in. heatsink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. 10 9 2.0 m/s (400LFM) 8 1.0 m/s (200LFM) 7 0.5 m/s (100LFM) 6 NC 5 4 3 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, TA ( C) Figure 18. Output Current Derating for the Module with Heatplate and 0.5 in. heatsink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 12 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Thermal Considerations (continued) 10 9 1.0 m/s (200LFM) 8 0.5 m/s (100LFM) 7 NC 6 5 4 3 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, T ( C) A Figure 19. Output Current Derating for the Module with Heatplate and 1.0 in. heatsink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board-Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures. Through-Hole Soldering Information The RoHS-compliant (Z codes) through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. The RoHS-compliant with lead solder exemption (non-Z codes) through-hole products use Sn/Pb solder and RoHS-compliant components. Both non-Z and Z codes are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHS-compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If additional information is needed, please consult with your GE representative for more details. Surface Mount Information Pick and Place The EVW010A0B modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures o of up to 300 C. The label also carries product information such as product code, serial number and the location of manufacture. Figure 20. Pick and Place Location. Nozzle Recommendations The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 13 OUTPUT CURRENT, I (A) O Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. Reflow Soldering Information The surface mountable modules in the EVW family use our newest SMT technology called “Column Pin” (CP) connectors. Figure 21 shows the new CP connector before and after reflow soldering onto the end-board assembly. EVW Board Insulator Solder Ball End assembly PCB Figure 21. Column Pin Connector Before and After Reflow Soldering. The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag/Cu (SAC) solder for –Z codes. The CP connector design is able to compensate for large o amounts of co-planarity and still ensure a reliable SMT solder joint. Typically, the eutectic solder melts at 183 C (Sn/Pb o solder) or 217-218 C (SAC solder), wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. Tin Lead Soldering The recommended linear reflow profile using Sn/Pb solder is shown in Figure 22 and 23. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures. 300 o Peak Temp 235 C 250 Cooling zone Heat zone 200 o -1 o -1 1-4 Cs max 4 Cs 150 Soak zo ne 10 0 T above 30-240s lim o 205 C 50 Preheat zo ne o -1 max 4 Cs 0 REFLOW TIME (S) Figure 22. Recommended Reflow Profile for Tin/Lead (Sn/Pb) process Lead Free Soldering The –Z version of the EVW010A0B modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 14 REFLOW TEMP (C) Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current 240 235 230 225 220 215 210 205 200 0 1020 30 4050 60 o Figure 23. Time Limit, Tlim, Curve Above 205 C for Tin/Lead (Sn/Pb) process Pb-free Reflow Profile Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4-2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Fig. 24. 300 Per J-STD-020 Rev. C Peak Temp 260°C 250 Cooling 200 Zone * Min. Time Above 235°C 15 Seconds 150 Heating Zone *Time Above 217°C 1°C/Second 60 Seconds 100 50 0 Reflow Time (Seconds) Figure 24. Recommended linear reflow profile using Sn/Ag/Cu solder MSL Rating The EVW010A0B modules have a MSL rating of 2A. Storage and Handling The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of  30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: <40°C, < 90% relative humidity. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to GE Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 15 MAX TEMP SOLDER (C) Reflow Temp (°C) Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current EMC Considerations The circuit and plots in Figure 25 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B. Level [dBµV] 80 70 60 50 x 40 30 xxx x x 20 10 0 150k 300k 500k 1M 2M 3M 4M5M 7M 10M 30M Frequency [Hz] x xMES CE0615090841_fin QP MES CE0615090841_pre PK Level [dBµV] 80 70 60 50 + 40 30 + + 20 +++ 10 0 150k 300k 500k 1M 2M 3M 4M5M 7M 10M 30M Frequency [Hz] + +MES CE0615090841_fin AV MES CE0615090841_pre AV Figure 25. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 16 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Mechanical Outline for Surface Mount Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] # Top side label includes GE name, product designation and date code. Top # View Side View Bottom View October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 17 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] # Top side label includes GE name, product designation and date code. Top # View Side View * For optional pin lengths, see Table 2 Device Options and Coding Scheme Bottom View October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 18 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Mechanical Outline for Through-Hole Module with Heat Plate (-H) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top View Side View * For optional pin lengths, see Table 2 Device Options and Coding Scheme # Bottom side label includes GE name, product designation and date code. Bottom # View October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 19 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] SMT Recommended Pad Layout (Component Side View) TH Recommended Pad Layout (Component Side View) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 20 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Packaging Details Tray Specification The surface mount versions of the EVW surface mount Material Antistatic coated PVC modules (suffix –S) are supplied as standard in the 12 plastic tray shown in Figure 26. The tray has external Max surface resistivity 10 /sq dimensions of 135.1mm (W) x 321.8mm (L) x 12.42mm (H) Color Clear or 5.319in (W) x 12.669in (L) x 0..489in (H). Capacity 12 power modules Min order quantity 48 pcs (1 box of 4 full trays) Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box will contain 4 full trays plus one empty hold down tray giving a total number of 48 power modules. Figure 26. Surface Mount Packaging Tray. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 21 Data Sheet GE EVW010A0B Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 12.0Vdc Output; 10A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1. Device Codes Output Output Connector Product Codes Input Voltage On/Off Logic Comcodes Voltage Current Type EVW010A0B41Z 48V (36-75Vdc) 12V 10A Negative Through hole CC109143203 EVW010A0B64Z 48V (36-75Vdc) 12V 10A Positive Through hole CC109156015 EVW010A0B641Z 48V (36-75Vdc) 12V 10A Negative Through hole CC109158473 EVW010A0B41-HZ 48V (36-75Vdc) 12V 10A Negative Through hole CC109152781 EVW010A0B41-SZ 48V (36-75Vdc) 12V 10A Negative Surface mount CC109153516 Table 2. Device Options and Coding Scheme Characteristic Character and Position Definition Form Factor E E = Eighth Brick Family Designator V Input Voltage W W = Wide Input Voltage Range, 36V -75V Output Current 010A0 010A0 = 010.0 Amps Rated Output Current Output Voltage B B = 12.0 Vout Nominal Omit = No Pin Trim Pin Length 6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 8 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) Action following Omit = Latching Mode Protective Shutdown 4 4 = Auto-restart following shutdown (Overcurrent/Overvoltage) Omit = Positive Logic On/Off logic 1 1 = Negative Logic - Customer Specific XY XY = Customer Specific Modified Code, Omit for Standard Code Omit = Standard open Frame Module Mechanical Features H H = Heat plate (not available with –S option) S S = Surface mount connections Omit = RoHS 5/6, Lead Based Solder Used RoHS Z Z = RoHS 6/6 Compliant, Lead free Contact Us For more information, call us at USA/Canada: +1 888 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 1, 2015 ©2012 General Electric Company. All International rights reserved. Version 1.3 Options Ratings