Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Features  Compliant to RoHS EU Directive 2011/65/EU (Z versions)  Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this produc twill no longer be RoHS compliant (non-Z versions)  Compliant to IPC-9592, Category 2, Class II  High efficiency 92% at 5.0V full load (Vin=48Vdc)  Industry standard, DOSA compliant footprint 58.4 mm x 22.8 mm x 8.1 mm RoHS Compliant (2.30 in x 0.9 in x 0.32 in)  Wide input voltage range: 36-75 Vdc  Tightly regulated output Applications  Constant switching frequency  Distributed Power Architectures  Positive remote On/Off logic  Wireless Networks  Input under/over voltage protection  Access and Optical Network Equipment  Output overcurrent and overvoltage protection  Enterprise Networks including Power over Ethernet (PoE)  Over-temperature protection  LED Signage/Video boards  Remote sense  No reverse current during output shutdown  Output Voltage adjust: 80% to 110% of V o,nom Options  Wide operating temperature range (-40°C to 85°C)  Negative Remote On/Off logic †  UL*Recognized to UL60950-1, CAN/CSA C22.2  Over current/Over temperature/Over voltage protections ‡ No.60950-1, and EN60950-1(VDE 0805-1) Licensed (Auto-restart) §  CE mark meets 2006/95/EC directive  Heat plate version (-H)  Meets the voltage and current requirements for ETSI  Surface Mount version (-S) 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1  2250 Vdc Isolation tested in compliance with IEEE ¤ 802.3 PoE standards **  ISO 9001 and ISO 14001 certified manufacturing facilities Description The EVW020A0A, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 20A of output current and provide a precisely regulated output voltage of 5.0V over a wide range of input voltages (VIN = 36 - 75Vdc). The modules achieve typical full load efficiency of 92%. The open frame modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection. October 1, 2015 ©2012 General Electric Company. All rights reserved. Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All VIN -0.3 80 Vdc Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc Operating Ambient Temperature All T -40 85 °C A (see Thermal Considerations section) Storage Temperature All T -55 125 °C stg I/O Isolation voltage (100% factory Hi-Pot tested) All   2250 V dc Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All V 36 48 75 V IN dc Maximum Input Current All IIN,max 3.0 3.5 Adc (V = V to V , I =I ) IN IN, min IN, max O O, max Input No Load Current All IIN,No load 70 mA (V = V , I = 0, module enabled) IN IN, nom O Input Stand-by Current All I 2.5 5.0 mA IN,stand-by (V = V , module disabled) IN IN, nom 2 2 Inrush Transient All It 0.5 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO= All 20 mAp-p IOmax ; See Test configuration section) Input Ripple Rejection (120Hz) All 65 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 2 Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Nominal Output Voltage Set-point V =V , I =I , T=25°C) All V 4.90 5.0 5.10 V IN IN, min O O, max A O, set dc Output Voltage (Over all operating input voltage, resistive load, and All VO 4.85  5.15 Vdc temperature conditions until end of life) Output Regulation Temperature (T =T to T) ref A, min A, max Line (VIN=VIN, min to VIN, max) All   ±0.2 % VO, set All Load (IO=IO, min to IO, max)   ±0.2 % VO, set All   % V ±0.2 O, set Output Ripple and Noise on nominal output (V =V ,I = I , T =T to T) IN IN, nom O O, max A A, min A, max RMS (5Hz to 20MHz bandwidth) All  15 25 mVrms Peak-to-Peak (5Hz to 20MHz bandwidth) All  40 75 mVpk-pk External Capacitance All C 0 10,000 μF O, max  Output Current All Io 0  20 Adc Output Current Limit Inception (Hiccup Mode ) % I IO, lim o All 105 120 130 (VO= 90% of VO, set) Output Short-Circuit Current All I 5 A O, s/c rms (V≤250mV) ( Hiccup Mode ) O Efficiency V = V , T =25°C, I =I V = V All η 92.0 % IN IN, nom A O O, max , O O,set V = V , T =25°C, I =0.5xI V = V All η 91.0 % IN IN, nom A O O, max , O O,set Switching Frequency All fsw 400 kHz Dynamic Load Response (dIo/dt=0.1A/s; VIN = VIN, nom; TA=25°C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation All V 3 % V pk   O, set Settling Time (Vo<10% peak deviation) All ts  200  s (dIo/dt=1.0A/s; VIN = VIN, nom; TA=25°C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation All V 5 % V pk   O, set Settling Time (Vo<10% peak deviation) All t 200 s   s Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All C 2000 pF iso   Isolation Resistance All R 100 MΩ iso   I/O Isolation Voltage (100% factory Hi-pot tested) All All 2250 V   dc General Specifications Parameter Device Symbol Min Typ Max Unit 9 Calculated Reliability based upon Telcordia SR-332 Issue 2: All FIT 272.1 10 /Hours Method I Case 3 (I =80%I , T =40°C, airflow = 200 lfm, O O, max A All MTBF 3,675,359 Hours 90% confidence) 21 g Weight (Open Frame) All (0.77) (oz.) 33 g Weight (with Heatplate) All (1.16) (oz.) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 3 Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (V =V to V ; open collector or equivalent, IN IN, min IN, max Signal referenced to VIN- terminal) Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All Ion/off  0.3 1.0 mA Logic Low - On/Off Voltage All Von/off -0.7  1.2 Vdc Logic High Voltage – (Typ = Open Collector) All V  5 V on/off dc Logic High maximum allowable leakage current All I 10 μA on/off   Turn-On Delay and Rise Times o (IO=IO, max , VIN=VIN, nom, TA = 25C) Case 1: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (T = All T — — 50 msec delay delay from instant at which VIN=VIN, min until VO = 10% of VO, set). Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (T from All T — — 50 msec delay delay instant at which V = V until V =10% of V ) IN IN, min o O,set Output voltage Rise time (time for Vo to rise from 10% All T — 5 12 msec rise of Vo,set to 90% of Vo, set) Output voltage overshoot – Startup All — 3 % V O, set o I = I ; V =V to V , T = 25 C O O, max IN IN, min IN, max A Remote Sense Range All VSENSE 10 % VO, set Output Voltage Adjustment Range All 80 110 % VO, set Output Overvoltage Protection All VO, limit 5.75  7.0 Vdc O Overtemperature Protection – Hiccup Auto Restart All T 130 C ref   Input Undervoltage Lockout All VUVLO Turn-on Threshold  33 36 Vdc Turn-off Threshold 27 28 32 Vdc Hysterisis 3 5.5  Vdc October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 4 Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Characteristic Curves o The following figures provide typical characteristics for the EVW020A0A (5.0V, 20A) at 25 C. The figures are identical for either positive or negative remote On/Off logic. 94 91 88 85 Vin=75V 82 Vin=48V 79 Vin=36V 76 73 70 0 5 10 15 20 OUTPUT CURRENT, I (A) TIME, t (200µs/div) O Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 1.0A/µS Dynamic Load Change from 50% to 75% to 50% of full load. TIME, t (1s/div) TIME, t (20ms/div) Figure 2. Typical output ripple and noise (VIN = VIN,NOM, Io = Figure 5. Typical Start-up Using Remote On/Off, negative Io,max). logic version shown (VIN = VIN,NOM, Io = Io,max). TIME, t (100µs/div) TIME, t (20ms/div) Figure 3. Transient Response to 0.1A/µS Dynamic Load Figure 6. Typical Start-up Using Input Voltage (VIN = VIN,NOM, o = Io,max). Change from 50% to 75% to 50% of full load. I October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 5 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io(A) (5A/div) VO (V) (100mV/div) EFFICIENCY,  (%) V (V) (10mV/div) O OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE VO (V) (2V/div) VOn/Off (V) (5V/div) Io(A) (5A/div) VO (V) (200mV/div) VO (V) (2V/div) VIN (V) (20V/div) Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE The power module should be connected to a low ac-impedance source. Highly inductive source L TEST Vin+ impedance can affect the stability of the power module. 12μH For the test configuration in Figure 7 a 33-100μF electrolytic capacitor (ESR<0.7 at 100kHz), mounted 33-100μF C 220μF S close to the power module helps ensure the stability of E.S.R.<0.1 the unit. Consult the factory for further application @ 20°C 100kHz guidelines. Vin- Safety Considerations For safety-agency approval of the system in which the NOTE: Measure input reflected ripple current with a simulated source inductance (L ) of 12μH. Capacitor C offsets TEST S power module is used, the power module must be possible battery impedance. Measure current as shown above. installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e. Figure 7. Input Reflected Ripple Current Test Setup. UL60950-1, CSA C22.2 No.60950-1, and VDE0805- COPPER STRIP 1(IEC60950-1). If the input source is non-SELV (ELV or a hazardous V O (+) RESISTIVE LOAD voltage greater than 60 Vdc and less than or equal to SCOPE 75Vdc), for the module’s output to be considered as 10uF 1uF meeting the requirements for safety extra-low voltage V ( – ) O (SELV), all of the following must be true:  The input source is to be provided with reinforced GROUND PLANE insulation from any other hazardous voltages, NOTE: All voltage measurements to be taken at the module including the ac mains. terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals  One V pin and one V pin are to be grounded, or IN OUT to avoid measurement errors due to socket contact resistance. both the input and output pins are to be kept Figure 8. Output Ripple and Noise Test Setup. floating.  The input pins of the module are not operator accessible.  Another SELV reliability test is conducted on the whole system (combination of supply source and R R R R distribution contact contact distribution subject module), as required by the safety agencies, Vin+ Vout+ to verify that under a single fault, hazardous voltages do not appear at the module’s output. RLOAD V V IN O Note: Do not ground either of the input pins of the module without grounding one of the output R R R R pins. This may allow a non-SELV voltage to distribution contact contact distribution Vin- Vout- appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs NOTE: All voltage measurements to be taken at the module when all inputs are ELV. terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals All flammable materials used in the manufacturing of to avoid measurement errors due to socket contact these modules are rated 94V-0, or tested to the UL60950 resistance. A.2 for reduced thickness. Figure 9. Output Voltage and Efficiency Test Setup. For input voltages exceeding –60 Vdc but less than or V . I O O equal to –75 Vdc, these converters have been evaluated Efficiency = x 100 %  to the applicable requirements of BASIC INSULATION V . I IN IN between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 6 A fast-acting fuse in the ungrounded lead. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 6 BATTERY Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current The amount of power delivered by the module is defined Feature Description as the voltage at the output terminals multiplied by the Remote On/Off output current. When using remote sense and trim, the output voltage of the module can be increased, which at Two remote on/off options are available. Positive logic the same output current would increase the power turns the module on during a logic high voltage on the output of the module. Care should be taken to ensure ON/OFF pin, and off during a logic low. Negative logic that the maximum output power of the module remains remote On/Off, device code suffix “1”, turns the module at or below the maximum rated power (Maximum rated off during a logic high and on during a logic low. power = Vo,set x Io,max). Vin+ Vout+ SENSE(+) SENSE(–) I on/off VI(+) VO(+) ON/OFF IO SUPPL Y LOAD II TRIM VI(-) VO(–) CONTACT CONT ACT AND V on/off RESIST ANCE DISTRIBUTION LOSSE Figure 11. Circuit Configuration for remote sense . Vout- Vin- Input Undervoltage Lockout At input voltages below the input undervoltage lockout Figure 10. Remote On/Off Implementation. limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised To turn the power module on and off, the user must above the undervoltage lockout turn-on threshold, supply a switch (open collector or equivalent) to control V . UV/ON the voltage (Von/off) between the ON/OFF terminal and the Once operating, the module will continue to operate until V (-) terminal (see Figure 10). Logic low is IN the input voltage is taken below the undervoltage turn- 0V ≤ V ≤ 1.2V. The maximum I during a logic low on/off on/off off threshold, VUV/OFF. is 1mA, the switch should be maintain a logic low level whilst sinking this current. Overtemperature Protection During a logic high, the typical maximum Von/off To provide protection under certain fault conditions, the generated by the module is 15V, and the maximum unit is equipped with a thermal shutdown circuit. The allowable leakage current at Von/off = 5V is 1μA. unit will shutdown if the thermal reference point Tref o If not using the remote on/off feature: (Figure 13), exceeds 130 C (typical), but the thermal shutdown is not intended as a guarantee that the unit For positive logic, leave the ON/OFF pin open. will survive temperatures beyond its rating. The module For negative logic, short the ON/OFF pin to VIN(-). will automatically restart upon cool-down to a safe Remote Sense temperature. Remote sense minimizes the effects of distribution losses Output Overvoltage Protection by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the The output over voltage protection scheme of the remote-sense pins and the output terminals must not modules has an independent over voltage loop to exceed the output voltage sense range given in the prevent single point of failure. This protection feature Feature Specifications table: latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V protection feature. If the auto-restart option (4) is Although the output voltage can be increased by both ordered, the module will automatically restart upon an the remote sense and by the trim, the maximum internally programmed time elapsing. increase for the output voltage is not the sum of both. Overcurrent Protection The maximum increase is the larger of either the remote sense or the trim. To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto–restart, then it will latch off following the over current condition. The module can be restarted by cycling the dc input power for at least October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 7 Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current   Feature Descriptions (continued) V V Where desired o ,set    %  100   one second or by toggling the remote on/off signal for at V o ,set   least one second. If the unit is configured with the auto- For example, to trim-up the output voltage of the module restart option (4), it will remain in the hiccup mode as by 5% to 5.25V, Rtrim-up is calculated is as follows: long as the overcurrent condition exists; it operates normally, once the output current is brought back into its  %  5 specified range. The average output current during  5.11 5.0 (100 5) 511  R    10 .22  hiccup is 10% IO, max. trimup   1.225 5 5   Output Voltage Programming R  325.6 trimup Trimming allows the output voltage set point to be The voltage between the V (+) and V (–) terminals must O O increased or decreased, this is accomplished by not exceed the minimum output overvoltage protection connecting an external resistor between the TRIM pin value shown in the Feature Specifications table. This limit and either the VO(+) pin or the VO(-) pin. includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim. V (+) V (+) IN O Although the output voltage can be increased by both the remote sense and by the trim, the maximum R trim-up increase for the output voltage is not the sum of both. ON/OFF The maximum increase is the larger of either the remote LOAD V TRIM O sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals R trim-down multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would V (-) V (-) IN O increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = V x I ). O,set O,max Figure 12. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (Rtrim-down) between the TRIM pin and the VO(-) (or Sense(-)) pin decreases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆% 511   R   10 .22  trimdown    %     V V Where o,set desired   %  100   V o,set   For example, to trim-down the output voltage of the module by 8% to 4.6V, Rtrim-down is calculated as follows: % 8 511   R  10.22 trimdown   8   R  53 .6 trimdown Connecting an external resistor (R ) between the trim-up TRIM pin and the V (+) (or Sense (+)) pin increases the O output voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%: 5.11V  (100%)  511  o,set R   10.22 trimup   1.225% %   October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 8 Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current 20 Thermal Considerations The power modules operate in a variety of thermal 16 environments; however, sufficient cooling should be 3.0 m/s provided to help ensure reliable operation. (600 LM) 12 2.0 m/s Considerations include ambient temperature, airflow, (400 LM) 1.0 m/s module power dissipation, and the need for increased 8 (200 LM) reliability. A reduction in the operating temperature of 0.5 m/s (100 LM) the module will result in an increase in reliability. The 4 NC thermal data presented here is based on physical measurements taken in a wind tunnel. 0 20 30 40 50 60 70 80 90 The thermal reference point, Tref used in the o AMBIENT TEMEPERATURE, TA ( C) specifications for open frame modules is shown in Figure 13. For reliable operation this temperature should not Figure 15. Output Current Derating for the Open o exceed 114 C. Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. The thermal reference point, Tref used in the specifications for modules with heatplate is shown in 20 Figure 14. For reliable operation this temperature should o not exceed 105 C. 16 3.0 m/s 12 (600 LFM) 2.0 m/s (400 LFM) 8 1.0 m/s (200 LFM) 0.5 m/s 4 (100 LFM) NC AIRFLOW 0 20 30 40 50 60 70 80 90 Figure 13. Tref Temperature Measurement Location o AMBIENT TEMEPERATURE, T ( C) A for Open Frame Module. Figure 16. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. 20 16 AIRFLOW 3.0 m/s 12 (600 LFM) 2.0 m/s (400 LFM) Figure 14. Tref Temperature Measurement Location 8 1.0 m/s for Module with Heatplate. (200 LFM) 0.5 m/s 4 (100 LFM) Heat Transfer via Convection NC Increased airflow over the module enhances the heat 0 20 30 40 50 60 70 80 90 transfer via convection. Derating curves showing the o maximum output current that can be delivered by AMBIENT TEMEPERATURE, T ( C) A each module versus local ambient temperature (TA) Figure 17. Output Current Derating for the Module for natural convection and up to 3m/s (600 ft./min) with Heatplate and 0.25 in. heatsink; Airflow in the forced airflow are shown in Figure 14. Transverse Direction from Vout(+) to Vout(-); Vin =48V. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O O Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Thermal Considerations (continued) 20 16 12 2.0 m/s (400 LFM) 1.0 m/s (200 LFM) 8 Figure 20. Pick and Place Location. 0.5 m/s (100 LFM) 4 NC Nozzle Recommendations 0 20 30 40 50 60 70 80 90 The module weight has been kept to a minimum by using open frame construction. Even so, these modules o AMBIENT TEMEPERATURE, TA ( C) have a relatively large mass when compared to Figure 18. Output Current Derating for the Module conventional SMT components. Variables such as nozzle with Heatplate and 0.5 in. heatsink; Airflow in the size, tip style, vacuum pressure and placement speed Transverse Direction from Vout(+) to Vout(-); Vin =48V. should be considered to optimize this process. The minimum recommended nozzle diameter for reliable 20 operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component 16 spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be 2.0 m/s 12 (400 LFM) used within the space available. 1.0 m/s (200 LFM) 8 0.5 m/s The surface mountable modules in the EVW family use (100 LFM) our newest SMT technology called “Column Pin” (CP) NC 4 connectors. Figure 48 shows the new CP connector before and after reflow soldering onto the end-board 0 20 30 40 50 60 70 80 90 assembly. o AMBIENT TEMEPERATURE, T ( C) A EVW Board Figure 19. Output Current Derating for the Module with Heatplate and 1.0 in. heatsink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. Insulator Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board- Solder Ball Mounted Power Modules” for a detailed discussion of End assembly PCB thermal aspects including maximum device temperatures. Figure 21. Column Pin Connector Before and After Reflow Soldering . Surface Mount Information The CP is constructed from a solid copper pin with an integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag3/Cu Pick and Place (SAC) solder for –Z codes. The CP connector design is able to compensate for large amounts of co-planarity The EVW020A0A modules use an open frame and still ensure a reliable SMT solder joint. Typically, the construction and are designed for a fully automated o eutectic solder melts at 183 C (Sn/Pb solder) or 217-218 assembly process. The modules are fitted with a label o C (SAC solder), wets the land, and subsequently wicks designed to provide a large surface area for pick and the device connection. Sufficient time must be allowed to place operations. The label meets all the requirements fuse the plating on the connection to ensure a reliable for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures o of up to 300 C. The label also carries product information such as product code, serial number and the location of manufacture. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 10 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Surface Mount Information (continued) 240 235 solder joint. There are several types of SMT reflow technologies currently used in the industry. These 230 surface mount power modules can be reliably soldered 225 using natural forced convection, IR (radiant infrared), or a combination of convection/IR. 220 215 Tin Lead Soldering 210 The EVW020A0A power modules are lead free modules 205 and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is 200 recommended that the customer review data sheets in 0 1020 30 4050 60 o order to customize the solder reflow profile for each Figure 23. Time Limit Curve Above 205 C for Tin/Lead application board assembly. The (Sn/Pb) process following instructions must be observed when soldering Lead Free Soldering these units. Failure to observe these instructions may The –Z version of the EVW020A0A modules are lead-free result in the failure of or cause damage to the modules, (Pb-free) and RoHS compliant and are both forward and and can adversely affect long-term reliability. backward compatible in a Pb-free and a SnPb soldering In a conventional Tin/Lead (Sn/Pb) solder process peak process. Failure to observe the instructions below may o reflow temperatures are limited to less than 235 C. result in the failure of or cause damage to the modules o Typically, the eutectic solder melts at 183 C, wets the and can adversely affect long-term reliability. land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the Pb-free Reflow Profile connection to ensure a reliable solder joint. There are Power Systems will comply with J-STD-020 Rev. C several types of SMT reflow technologies currently used (Moisture/Reflow Sensitivity Classification for in the industry. These surface mount power modules Nonhermetic Solid State Surface Mount Devices) for both can be reliably soldered using natural forced convection, Pb-free solder profiles and MSL classification procedures. IR (radiant infrared), or a combination of convection/IR. This standard provides a recommended forced-air- For reliable soldering the solder reflow profile should be convection reflow profile based on the volume and established by accurately measuring the modules CP thickness of the package (table 4-2). The suggested Pb- connector temperatures. free solder paste is Sn/Ag/Cu (SAC). The recommended 300 linear reflow profile using Sn/Ag/Cu solder is shown in o Figure 23. Peak Temp 235 C 250 Cooling zone Heat zone MSL Rating 200 o -1 o -1 1-4 Cs max 4 Cs The EVW020A0A modules have a MSL rating of 2. 150 Soak zo ne Storage and Handling 10 0 T above 30-240s lim o 205 C The recommended storage environment and handling 50 Preheat zo ne procedures for moisture-sensitive surface mount o -1 max 4 Cs packages is detailed in J-STD-033 Rev. A (Handling, 0 Packing, Shipping and Use of Moisture/Reflow Sensitive REFLOW TIME (S) Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or Figure 22. Reflow Profile for Tin/Lead (Sn/Pb) process greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 11 REFLOW TEMP (C) MAX TEMP SOLDER (C) Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Through-Hole Lead-Free Soldering Surface Mount Information (continued) Information 300 Per J-STD-020 Rev. C The RoHS-compliant through-hole products use the SAC Peak Temp 260°C (Sn/Ag/Cu) Pb-free solder and RoHS-compliant 250 components. They are designed to be processed Cooling 200 through single or dual wave soldering machines. The Zone * Min. Time Above 235°C pins have an RoHS-compliant finish that is compatible 15 Seconds 150 with both Pb and Pb-free wave soldering processes. A Heating Zone *Time Above 217°C 1°C/Second 60 Seconds maximum preheat rate of 3C/s is suggested. The wave 100 preheat process should be such that the temperature of C. For Pb the power module board is kept below 210 50 solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHS- 0 Reflow Time (Seconds) compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If Figure 24. Recommended linear reflow profile using additional information is needed, please consult with Sn/Ag/Cu solder. your GE representative for more details. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to GE Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 12 Reflow Temp (°C) Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current EMC Considerations The circuit and plots in Figure 25 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B. Level [dBµV] 80 70 60 50 + 40 30 20 10 0 150k 300k 500k 1M 2M 3M 4M5M 7M 10M 30M Frequency [Hz] + +MES CE1204081008_fin AV MES CE1204081008_pre AV Level [dBµV] 80 70 60 50 40 30 x 20 10 0 150k 300k 500k 1M 2M 3M 4M5M 7M 10M 30M Frequency [Hz] x xMES CE1204081008_fin QP MES CE1204081008_pre PK Figure 25. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 13 Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top side label includes GE name, product designation and date code. Top View* Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 14 Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Mechanical Outline for Surface Mount Module (-S Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] * Top side label includes GE name, product designation and date code. Top View* Side View Bottom View Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 15 Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Mechanical Outline for Through-Hole Module with Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options * Bottom side label includes GE name, product designation and date code. Bottom View* Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 16 Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Recommended Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) SMT Recommended Pad Layout (Component Side View) Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER TH Recommended Pad Layout (Component Side View) October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 17 Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Each tray contains a total of 12 power modules. The trays Packaging Details are self-stacking and each shipping box for the The surface mount versions of the EVW020A0A (suffix –S) EVW020A0A (suffix –S) surface mount module will contain are supplied as standard in the plastic trays shown in 4 full trays plus one empty hold down tray giving a total Figure 26. number of 48 power modules. Tray Specification Material Antistatic coated PVC 12 Max surface resistivity 10 /sq Color Clear Capacity 12 power modules Figure 26. Surface Mount Packaging Tray October 1, 2015 ©2012 General Electric Company. All rights reserved. Page 18 Data Sheet GE EVW020A0A Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 5.0Vdc Output; 20A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1. Device Codes Output Output Connector Product Codes Input Voltage On/Off Logic Comcodes Voltage Current Type EVW020A0A41Z 48V (36-75Vdc) 5.0V 20A Negative Through hole CC109141826 EVW020A0A641Z 48V (36-75Vdc) 5.0V 20A Negative Through hole CC109166385 EVW020A0A841Z 48V (36-75Vdc) 5.0V 20A Negative Through hole CC109161386 EVW020A0A41-HZ 48V (36-75Vdc) 5.0V 20A Negative Through hole CC109147427 EVW020A0A641-HZ 48V (36-75Vdc) 5.0V 20A Negative Through hole CC109172342 EVW020A0A41-SZ 48V (36-75Vdc) 5.0V 20A Negative Surface mount CC109147435 Table 2. Device Coding Scheme and Options Characteristic Character and Position Definition Form Factor E E = Eighth Brick Family Designator V Input Voltage W W = Wide Input Voltage Range, 36V -75V Output Current 020A0 020A0 = 020.0 Amps Rated Output Current Output Voltage A A = 5.0 Vout Nominal Omit = Default Pin Length shown in Mechanical Outline Figures Pin Length 6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 8 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) Action following Omit = Latching Mode Protective Shutdown 4 4 = Auto-restart following shutdown (Overcurrent/Overvoltage) Omit = Positive Logic On/Off logic 1 1 = Negative Logic - Customer Specific XY XY = Customer Specific Modified Code, Omit for Standard Code Omit = Standard open Frame Module Mechanical Features H H = Heat plate (not available with –S option) S S = Surface mount connections Omit = RoHS 5/6, Lead Based Solder Used RoHS Z Z = RoHS 6/6 Compliant, Lead free Contact Us For more information, call us at USA/Canada: +1 888 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 1, 2015 ©2012 General Electric Company. All International rights reserved. Version 1.09 Options Ratings