Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Features  Compliant to RoHS EU Directive 2011/65/EU (Z versions)  Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this produc twill no longer be RoHS compliant (non-Z versions)  Compliant to IPC-9592, Category 2, Class II  High efficiency 92% at 6.0V full load (Vin=48V ) dc dc  Industry standard, DOSA compliant footprint RoHS Compliant 58.4 mm x 22.8 mm x 8.1 mm (2.30 in x 0.9 in x 0.32 in)  Wide input voltage range: 36-75 V dc Applications  Tightly regulated output  Automated Test Equipment  Constant switching frequency  Wireless PA Pre-amps  Positive remote On/Off logic  Precision Instruments  Input under/over voltage protection  Output overcurrent and overvoltage protection  Over-temperature protection  Remote sense Options  No reverse current during output shutdown  Negative Remote On/Off logic (preferred)  Output Voltage adjustment range: 5.0Vdc to 7.0Vdc  Over current/Over temperature/Over voltage  Wide operating temperature range (-40°C to 85°C) protections (Auto-restart) (preferred) * †  ANSI/UL 60950-1, 2nd Ed. Recognized, CSA C22.2 No.  Heat plate version (-H) ‡ 60950-1-07 Certified, and VDE 0805-1 (EN60950-1, 2nd  Surface Mount version (-S) Ed.) Licensed §  Trimmed pin lengths  CE mark meets 2006/95/EC directive  Meets the voltage and current requirements for ETSI 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1 ¤  2250 Vdc Isolation tested in compliance with IEEE 802.3 PoE standards **  ISO 9001 and ISO 14001 certified manufacturing facilities Description The EVW020A0S6R0, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 20A of output current and provide a precisely regulated output voltage of 6.0Vdc over a wide range of input voltages (VIN = 36 - 75Vdc). The modules achieve typical full load efficiency of 92%. The module offers wide output voltage trim (5.0Vdc to 7.0Vdc), allowing designers to use the module with a wide variety of output LDOs for final load voltage. The open frame modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and overtemperature protection. October 2, 2015 ©2012 General Electric Company. All rights reserved. Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All V -0.3 80 V IN dc Transient, operational (≤100 ms) All V -0.3 100 V IN,trans dc Operating Ambient Temperature All TA -40 85 °C (see Thermal Considerations section) Storage Temperature All Tstg -55 125 °C   I/O Isolation voltage (100% factory Hi-Pot tested) All 2250 Vdc Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All VIN 36 48 75 Vdc Maximum Input Current All IIN,max 3.7 4.1 Adc (V = V to V , I =I ) IN IN, min IN, max O O, max Input No Load Current All I 90 mA IN,No load (V = V , I = 0, module enabled) IN IN, nom O Input Stand-by Current All IIN,stand-by 3.2 4.0 mA (V = V , module disabled) IN IN, nom 2 2 Inrush Transient All It 0.5 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO= All 20 mAp-p IOmax ; See Test configuration section) Input Ripple Rejection (120Hz) All 52 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 2 Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Nominal Output Voltage Set-point VIN=VIN, min, IO=IO, max, TA=25°C) All VO, set 5.88 6.0 6.15 Vdc Output Voltage All VO 5.82  6.21 % VO, set (Over all operating input voltage, resistive load, and temperature conditions until end of life) Output Regulation Temperature (Tref=TA, min to TA, max) Line (V =V to V) All   ±0.2 % V IN IN, min IN, max O, set All Load (IO=IO, min to IO, max)   ±0.2 % VO, set All % V   ±0.2 O, set Output Ripple and Noise on nominal output (V =V ,I = I , T =T to T) IN IN, nom O O, max A A, min A, max RMS (5Hz to 20MHz bandwidth) All  15 25 mV rms Peak-to-Peak (5Hz to 20MHz bandwidth) All 40 75 mV  pk-pk External Capacitance All CO, max 0  10,000 μF Output Current All Io 0  20 Adc Output Current Limit Inception (Hiccup Mode ) IO, lim % Io All 105 120 130 (V = 90% of V ) O O, set Output Short-Circuit Current All I 5 A O, s/c rms (VO≤250mV) ( Hiccup Mode ) Efficiency VIN= VIN, nom, TA=25°C, IO=IO, max , VO= VO,set All η 90.0 92.0 % VIN= VIN, nom, TA=25°C, IO=0.5xIO, max , VO= VO,set All η 91.0 % Switching Frequency All fsw 400 kHz Dynamic Load Response (dI /dt=0.1A/s; V = V ; T =25°C) o IN IN, nom A Load Change from Io= 50% to 75% or 25% to 50% of I o,max Peak Deviation All Vpk  3  % VO, set Settling Time (Vo<10% peak deviation) All t  200  s s (dI /dt=1.0A/s; V = V ; T =25°C) o IN IN, nom A Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation All Vpk  5  % VO, set Settling Time (V <10% peak deviation) o All ts  200  s Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All C 2000 pF iso   Isolation Resistance All Riso 100   MΩ I/O Isolation Voltage (100% factory Hi-pot tested) All All   2250 Vdc General Specifications Parameter Device Symbol Min Typ Max Unit 9 Calculated Reliability based upon Telcordia SR-332 Issue 2: All FIT 252.7 10 /Hours Method I Case 3 (IO=80%IO, max, TA=40°C, airflow = 200 lfm, All MTBF Hours 3,957,033 90% confidence) 21 g Weight (Open Frame) All (0.77) (oz.) 33 g Weight (with Heatplate) All (1.16) (oz.) October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 3 Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (V =V to V ; open collector or equivalent, IN IN, min IN, max Signal referenced to V terminal) IN- Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All Ion/off  0.3 1.0 mA Logic Low - On/Off Voltage All V -0.7 1.0 V on/off  dc Logic High Voltage – (Typ = Open Collector) All V 2.0 5 V on/off dc Logic High maximum allowable leakage current All Ion/off   10 μA 1 Turn-On Delay and Rise Times o (I =I V =V T = 25C) O O, max , IN IN, nom, A Case 1: Input power is applied for at least 1 second, and then the On/Off input is set from OFF to ON (Tdelay All Tdelay — — 15 msec from instant at which VIN=VIN, min until VO=10% of VO, set). Case 2: On/Off input is set to ON, and then input power is applied (Tdelay from instant at which VIN = VIN, min until All Tdelay — — 150 msec Vo=10% of VO,set) Output voltage Rise time (time for V to rise from 10% o All Trise — 5 10 msec of Vo,set to 90% of Vo, set) Output voltage overshoot – Startup All — 3 % V O, set o IO= IO, max, VIN=VIN, min to VIN, max, TA = 25 C Remote Sense Range All V 10 % V SENSE O, set 2 Output Voltage Adjustment Range All 5.0 7.0 V dc Output Overvoltage Protection All V 7.5 9.5 V O, limit  dc O Overtemperature Protection – Hiccup Auto Restart All Tref  128  C Input Undervoltage Lockout All VUVLO Turn-on Threshold 32 34 36 Vdc Turn-off Threshold 30 32 34 V dc Hysteresis 1 2 V  dc Notes: 1. The module has an adaptable extended Turn-On Delay interval, Tdelay, of 4 seconds. The extended Tdelay will occur when the module restarts following either: 1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, T , will occur whenever a delay module restarts with input voltage removed from the module for the preceding 1 second. 2. Maximum trim up possible only for Vin>40V. Maximum rated power = VO,set x IO,max. See Feature Descriptions for more details. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 4 Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Characteristic Curves o The following figures provide typical characteristics for the EVW020A0S6R0 (6.0V , 20A) at 25 C. The figures are identical for either positive dc or negative remote On/Off logic. 94 Vin = 36V 91 88 85 Vin = 75V 82 Vin = 48V 79 76 73 70 0 5 10 15 20 OUTPUT CURRENT, IO (A) TIME, t (100µs/div) Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 1.0A/µS Dynamic Load Change from 50% to 75% to 50% of full load. TIME, t (5ms/div) TIME, t (2s/div) Figure 2. Typical output ripple and noise (V = V , I = Figure 5. Typical Start-up Using Remote On/Off, negative IN IN,NOM O IO,max). logic version shown (VIN = VIN,NOM, IO = IO,max). TIME, t (100µs/div) TIME, t (50ms/div) Figure 3. Transient Response to 0.1A/µS Dynamic Load Figure 6. Typical Start-up Using Input Voltage (VIN = VIN,NOM, Change from 50% to 75% to 50% of full load. IO = IO,max). October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 5 OUTPUT VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE VO(V) (100mV/div) IO (A) (5AV/div) EFFICIENCY,  (%) V (V) (20mV/div) O OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE INPUT VOLTAGE VO (V) (2V/div) VOn/Off (V) (5V/div) VO(V) (100mV/div) IO (A) (5AV/div) VO (V) (2V/div) VIN (V) (20V/div) Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE The power module should be connected to a low ac-impedance source. Highly inductive source L TEST Vin+ impedance can affect the stability of the power module. 12μH For the test configuration in Figure 7 a 33-100μF electrolytic capacitor (ESR<0.7 at 100kHz), mounted 33-100μF CS 220μF close to the power module helps ensure the stability of E.S.R.<0.1 the unit. Consult the factory for further application @ 20°C 100kHz guidelines. Vin- Safety Considerations For safety-agency approval of the system in which the NOTE: Measure input reflected ripple current with a simulated source inductance (L ) of 12μH. Capacitor C offsets TEST S power module is used, the power module must be possible battery impedance. Measure current as shown above. installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., Figure 7. Input Reflected Ripple Current Test Setup. nd nd UL60950-1 2 Ed., CSA C22.2 No. 60950-1 2 Ed., and COPPER STRIP nd VDE0805-1 EN60950-1 2 Ed. If the input source is non-SELV (ELV or a hazardous V (+) RESISTIVE O LOAD voltage greater than 60 V and less than or equal to dc SCOPE 75V ), for the module’s output to be considered as dc 10uF 1uF meeting the requirements for safety extra-low voltage V O ( – ) (SELV), all of the following must be true:  The input source is to be provided with reinforced GROUND PLANE insulation from any other hazardous voltages, NOTE: All voltage measurements to be taken at the module including the ac mains. terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals  One VIN pin and one VOUT pin are to be grounded, or to avoid measurement errors due to socket contact both the input and output pins are to be kept resistance. floating. Figure 8. Output Ripple and Noise Test Setup.  The input pins of the module are not operator accessible.  Another SELV reliability test is conducted on the whole system (combination of supply source and R R R R distribution contact contact distribution subject module), as required by the safety agencies, Vin+ Vout+ to verify that under a single fault, hazardous voltages do not appear at the module’s output. R LOAD V V Note: Do not ground either of the input pins of the IN O module without grounding one of the output pins. This may allow a non-SELV voltage to R R R R distribution contact contact distribution appear between the output pins and ground. Vin- Vout- The power module has extra-low voltage (ELV) outputs when all inputs are ELV. NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then All flammable materials used in the manufacturing of Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact these modules are rated 94V-0, or tested to the UL60950 resistance. A.2 for reduced thickness. Figure 9. Output Voltage and Efficiency Test Setup. For input voltages exceeding –60Vdc but less than or V . I equal to –75Vdc, these converters have been evaluated O O to the applicable requirements of BASIC INSULATION Efficiency  = x 100 % V . I IN IN between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 6 A fast-acting fuse in the ungrounded lead. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 6 BATTERY Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current that the maximum output power of the module remains Feature Description at or below the maximum rated power (Maximum rated Remote On/Off power = Vo,set x Io,max). Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the SENSE(+) ON/OFF pin, and off during a logic low. Negative logic SENSE(–) remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low. VI(+) VO(+) IO SUPPL Y LOAD II VI(-) VO(–) CONTACT CONT ACT AND Vin+ Vout+ RESIST ANCE DISTRIBUTION LOSSE Figure 11. Circuit Configuration for remote sense . I on/off ON/OFF Input Undervoltage Lockout TRIM At input voltages below the input undervoltage lockout Von/off limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, Vout- Vin- V . UV/ON Once operating, the module will continue to operate until Figure 10. Remote On/Off Implementation. the input voltage is taken below the undervoltage turn- off threshold, VUV/OFF. To turn the power module on and off, the user must Overtemperature Protection supply a switch (open collector or equivalent) to control To provide protection under certain fault conditions, the the voltage (Von/off) between the ON/OFF terminal and the unit is equipped with a thermal shutdown circuit. The VIN(-) terminal (see Figure 10). Logic low is unit will shutdown if the thermal reference point Tref 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a logic low O (Figure 13), exceeds 128 C (typical), but the thermal is 1mA; the switch should maintain a logic low level while shutdown is not intended as a guarantee that the unit sinking this current. will survive temperatures beyond its rating. The module During a logic high, the typical maximum V on/off can be restarted by cycling the dc input power for at generated by the module is 15V, and the maximum least one second or by toggling the remote on/off signal allowable leakage current at V = 5V is 1μA. on/off for at least one second. If the auto-restart option (4) is If not using the remote on/off feature: ordered, the module will automatically restart upon cool- down to a safe temperature. For positive logic, leave the ON/OFF pin open. For negative logic, short the ON/OFF pin to V (-). IN Output Overvoltage Protection Remote Sense The output over voltage protection scheme of the Remote sense minimizes the effects of distribution losses modules has an independent over voltage loop to by regulating the voltage at the remote-sense prevent single point of failure. This protection feature connections (See Figure 11). The voltage between the latches in the event of over voltage across the output. remote-sense pins and the output terminals must not Cycling the on/off pin or input voltage resets the latching exceed the output voltage sense range given in the protection feature. If the auto-restart option (4) is Feature Specifications table: ordered, the module will automatically restart upon an internally programmed time elapsing. [V (+) – V (–)] – [SENSE(+) – SENSE(–)]  0.5 V O O Overcurrent Protection Although the output voltage can be increased by both the remote sense and by the trim, the maximum To provide protection in a fault (output overload) increase for the output voltage is not the sum of both. condition, the unit is equipped with internal The maximum increase is the larger of either the remote current limiting circuitry and can endure current sense or the trim. limiting continuously. At the point of current limit inception, the unit enters hiccup mode. If the unit is The amount of power delivered by the module is defined not configured with auto–restart, then it will latch off as the voltage at the output terminals multiplied by the following the over current condition. The module can be output current. When using remote sense and trim, the restarted by cycling the dc input power for at least output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 7 Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current 5.11V  (100%)  511  Feature Descriptions (continued) o,set R  10.22 k   trimup   one second or by toggling the remote on/off signal for at 1.225% %   least one second. If the unit is configured with the auto-   V V Where restart option (4), it will remain in the hiccup mode as desired o ,set    %  100   long as the overcurrent condition exists; it operates V o ,set   normally, once the output current is brought back into its For example, to trim-up the output voltage of the module specified range. The average output current during by 5% to 6.3V, Rtrim-up is calculated is as follows: hiccup is 10% IO, max.  % 5 Output Voltage Programming  5.11 6.0 (100 5) 511  R    10 .22 k Trimming allows the output voltage set point to be trimup   1.225 5 5   increased or decreased, this is accomplished by R  413.2k connecting an external resistor between the TRIM pin trimup and either the VO(+) pin or the VO(-) pin. The voltage between the VO(+) and VO(–) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense V (+) V (+) IN O compensation and output voltage set-point adjustment R trim-up trim. ON/OFF Although the output voltage can be increased by both LOAD V TRIM O the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. R The maximum increase is the larger of either the remote trim-down sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals V (-) V (-) IN O multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be Figure 12. Circuit Configuration to Trim Output taken to ensure that the maximum output power of the Voltage. module remains at or below the maximum rated power Connecting an external resistor (R ) between the trim-down (Maximum rated power = VO,set x IO,max). TRIM pin and the V (-) (or Sense(-)) pin decreases the O output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±1.0%. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆% 511   R   10 .22 k trimdown    %     V V Where o,set desired   %  100   V o,set   For example, to trim-down the output voltage of the module by 8% to 5.52V, Rtrim-down is calculated as follows: % 8 511  R  10.22 k trimdown   8   R  53 .6k trimdown Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of ∆%: October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 8 Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current 20 Thermal Considerations 18 The power modules operate in a variety of thermal 16 environments; however, sufficient cooling should be 14 provided to help ensure reliable operation. 12 10 Considerations include ambient temperature, airflow, 8 module power dissipation, and the need for increased 6 reliability. A reduction in the operating temperature of 4 the module will result in an increase in reliability. The 2 thermal data presented here is based on physical measurements taken in a wind tunnel. 0 20 30 40 50 60 70 80 90 100 o COLD PLATE TEMPERATURE, TC ( C) The thermal reference points, Tref1 and Tref2 used in the specifications for open frame modules are shown in Figure 15. Output Current Derating for the Module in Figure 13. For reliable operation Tref1 should not exceed Conduction Cooling (cold plate) Applications, with or O O 122 C and Tref should not exceed 124 C 2 without Heatplate; Ta <70ºC in vicinity of module interior; VIN = 48V. 20 18 NC 16 0.5 m/s 14 (100LFM) AIRFLOW 1.0 m/s 12 (200LFM) 10 2.0 m/s Figure 13. Tref Temperature Measurement Location (400LFM) 8 for Open Frame Module. 3.0 m/s 6 (600LFM) 4 The thermal reference point, Tref3 used in the specifications for modules with heatplate is shown in 2 Figure 14. For reliable operation this temperature should 0 O not exceed 105 C. 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, T ( C) A Figure 16. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. 20 2.0 m/s 18 (400LFM) AIRFLOW 16 NC Figure 14. Tref Temperature Measurement Location 14 0.5 m/s for Module with Heatplate. 12 (100LFM) 1.0 m/s 10 (200LFM) Heat Transfer via Conduction or Convection 8 Thermal derating is presented for two different 6 applications: 1) Figure 15, the EVW020A0S6R0 module is 4 thermally coupled to a cold plate inside a sealed 2 clamshell chassis, without any internal air circulation; 0 and 2) Figures 16-20, the EVW020A0S6R0 module is 20 30 40 50 60 70 80 90 mounted in a traditional open chassis or cards with o forced air flow. In application 1, the module is cooled AMBIENT TEMEPERATURE, T ( C) A entirely by conduction of heat from the module primarily Figure 17. Output Current Derating for the Module through the top surface to a cold plate, with some with Heatplate; Airflow in the Transverse Direction conduction through the module’s pins to the power from Vout(+) to Vout(-); Vin =48V. layers in the system board. For application 2, the module is cooled by heat removal into a forced airflow that passes through the interior of the module and over the top base plate and/or attached heat sink. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O O Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current 20 Pick and Place 18 The EVW020A0S6R0 modules use an open frame 16 NC construction and are designed for a fully automated 14 0.5 m/s assembly process. The modules are fitted with a label 12 (100LFM) 1.0 m/s designed to provide a large surface area for pick and 10 (200LFM) place operations. The label meets all the requirements 2.0 m/s 8 for surface mount processing, as well as safety (400LFM) 6 standards, and is able to withstand reflow temperatures o 4 of up to 300 C. The label also carries product information such as product code, serial number and the 2 location of manufacture. 0 20 30 40 50 60 70 80 90 o AMBIENT TEMEPERATURE, T ( C) A Figure 18. Output Current Derating for the Module with Heatplate and 0.25 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. 20 18 16 Figure 21. Pick and Place Location. 14 NC 12 Nozzle Recommendations 10 0.5 m/s (100LFM) 8 The module weight has been kept to a minimum by 1.0 m/s (200LFM) 6 using open frame construction. Even so, these modules 4 have a relatively large mass when compared to conventional SMT components. Variables such as nozzle 2 size, tip style, vacuum pressure and placement speed 0 should be considered to optimize this process. The 20 30 40 50 60 70 80 90 minimum recommended nozzle diameter for reliable o AMBIENT TEMEPERATURE, TA ( C) operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component Figure 19. Output Current Derating for the Module spacing, is 9 mm. with Heatplate and 0.5 in. heat sink; Airflow in the Transverse Direction from Vout(+) to Vout(-); Vin =48V. Oblong or oval nozzles up to 11 x 9 mm may also be 20 used within the space available. 18 The surface mountable modules in the EVW family use 16 NC our newest SMT technology called “Column Pin” (CP) 14 connectors. Figure 22 shows the new CP connector 0.5 m/s 12 (100LFM) before and after reflow soldering onto the end-board 10 1.0 m/s assembly. (200LFM) 8 6 EVW Board 4 2 0 20 30 40 50 60 70 80 90 Insulator o AMBIENT TEMEPERATURE, T ( C) A Figure 20. Output Current Derating for the Module Solder Ball with Heatplate and 1.0 in. heat sink; Airflow in the End assembly PCB Transverse Direction from Vout(+) to Vout(-); Vin =48V. Please refer to the Application Note “Thermal Figure 22. Column Pin Connector Before and After Characterization Process For Open-Frame Board- Reflow Soldering . Mounted Power Modules” for a detailed discussion of Surface Mount Information (continued) thermal aspects including maximum device temperatures. The CP is constructed from a solid copper pin with an Surface Mount Information integral solder ball attached, which is composed of October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 10 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O O Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current tin/lead (Sn/Pb) solder for non-Z codes, or Sn/Ag /Cu 3 240 (SAC) solder for –Z codes. The CP connector design is 235 able to compensate for large amounts of co-planarity and still ensure a reliable SMT solder joint. Typically, the 230 o eutectic solder melts at 183 C (Sn/Pb solder) or 217-218 225 o C (SAC solder), wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to 220 fuse the plating on the connection to ensure a reliable 215 solder joint. There are several types of SMT reflow technologies currently used in the industry. These 210 surface mount power modules can be reliably soldered 205 using natural forced convection, IR (radiant infrared), or a combination of convection/IR. 200 0 1020 30 4050 60 Tin Lead Soldering o Figure 24. Time Limit Curve Above 205 C for Tin/Lead (Sn/Pb) process The EVW020A0S6R0 power modules are lead free modules and can be soldered either in a lead-free solder Lead Free Soldering process or in a conventional Tin/Lead (Sn/Pb) process. It The –Z version of the EVW020A0S6R0 modules are lead- is recommended that the customer review data sheets free (Pb-free) and RoHS compliant and are both forward in order to customize the solder reflow profile for each and backward compatible in a Pb-free and a SnPb application board assembly. The following instructions soldering process. Failure to observe the instructions must be observed when soldering these units. Failure to below may result in the failure of or cause damage to observe these instructions may result in the failure of or the modules and can adversely affect long-term cause damage to the modules, and can adversely affect reliability. long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak Pb-free Reflow Profile o reflow temperatures are limited to less than 235 C. Power Systems will comply with J-STD-020 Rev. C o Typically, the eutectic solder melts at 183 C, wets the (Moisture/Reflow Sensitivity Classification for land, and subsequently wicks the device connection. Nonhermetic Solid State Surface Mount Devices) for both Sufficient time must be allowed to fuse the plating on the Pb-free solder profiles and MSL classification procedures. connection to ensure a reliable solder joint. There are This standard provides a recommended forced-air- several types of SMT reflow technologies currently used convection reflow profile based on the volume and in the industry. These surface mount power modules thickness of the package (table 4-2). The suggested Pb- can be reliably soldered using natural forced convection, free solder paste is Sn/Ag/Cu (SAC). The recommended IR (radiant infrared), or a combination of convection/IR. linear reflow profile using Sn/Ag/Cu solder is shown in For reliable soldering the solder reflow profile should be Figure 25. established by accurately measuring the modules CP connector temperatures. 300 MSL Rating o Peak Temp 235 C 250 The EVW020A0S6R0 modules have a MSL rating of 2a. Cooling zone Heat zone 200 o -1 o -1 1-4 Cs max 4 Cs Storage and Handling 150 The recommended storage environment and handling Soak zo ne T above procedures for moisture-sensitive surface mount 10 0 30-240s lim o 205 C packages is detailed in J-STD-033 Rev. A (Handling, 50 Preheat zo ne Packing, Shipping and Use of Moisture/Reflow Sensitive o -1 max 4 Cs Surface Mount Devices). Moisture barrier bags (MBB) 0 with desiccant are required for MSL ratings of 2 or REFLOW TIME (S) greater. These sealed packages should not be broken until time of use. Once the original package is broken, Figure 23. Reflow Profile for Tin/Lead (Sn/Pb) process the floor life of the product at conditions of 30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT packages will be a minimum of 12 months from the bag seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 11 REFLOW TEMP (C) MAX TEMP SOLDER (C) Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Through-Hole Lead-Free Soldering Surface Mount Information (continued) Information 300 Per J-STD-020 Rev. C The RoHS-compliant through-hole products use the SAC Peak Temp 260°C 250 (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed Cooling 200 through single or dual wave soldering machines. The Zone * Min. Time Above 235°C pins have a RoHS-compliant finish that is compatible 15 Seconds 150 with both Pb and Pb-free wave soldering processes. A Heating Zone *Time Above 217°C 1°C/Second 60 Seconds maximum preheat rate of 3C/s is suggested. The wave 100 preheat process should be such that the temperature of the power module board is kept below 210C. For Pb 50 solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHS- 0 Reflow Time (Seconds) compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If Figure 25. Recommended linear reflow profile using additional information is needed, please consult with Sn/Ag/Cu solder. your GE representative for more details. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to GE Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 12 Reflow Temp (°C) Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current EMC Considerations The circuit and plots in Figure 26 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B. Figure 26. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). Level [dBµV] 70 60 50 x x x x 40 x x x x x x 30 20 10 0 -10 150k 300k 500k 1M 2M 3M 5M 7M 10M 30M Frequency [Hz] x MES CE1102091326_fin QP MES CE1102091326_pre PK LIM EN 55022B V QP Voltage QP Limit Level [dBµV] 70 60 50 + ++ 40 + + + + + + + 30 20 10 0 -10 150k 300k 500k 1M 2M 3M 5M 7M 10M 30M Frequency [Hz] + MES CE1102091326_fin AV MES CE1102091326_pre AV LIM EN 55022B V AV Voltage AV Limit October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 13 Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top side label includes GE name, product designation and date code. Top View* Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options Bottom View Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 14 Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Mechanical Outline for Surface Mount Module (-S Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] * Top side label includes GE name, product designation and date code. Top View* Side View Bottom View Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 15 Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Mechanical Outline for Through-Hole Module with Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Top View Side View *For optional pin lengths, see Table 2, Device Coding Scheme and Options *Bottom label includes GE name, product designation and date code. *Side label includes product designation and date code. Bottom View* Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 16 Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) SMT Recommended Pad Layout (Component Side View) Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER TH Recommended Pad Layout (Component Side View) October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 17 Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Each tray contains a total of 12 power modules. The trays Packaging Details are self-stacking and each shipping box for the The surface mount versions of the EVW020A0S6R0 (suffix – EVW020A0S6R0 (suffix –S) surface mount module will S) are supplied as standard in the plastic trays shown in contain 4 full trays plus one empty hold down tray giving a Figure 27. total number of 48 power modules. Tray Specification Material Antistatic coated PVC 12 Max surface resistivity 10 /sq Color Clear Capacity 12 power modules Figure 27. Surface Mount Packaging Tray October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 18 Data Sheet GE EVW020A0S6R0 Series (Eighth-Brick) DC-DC Power Modules 36–75Vdc Input; 6.0Vdc Output; 20A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1. Device Codes Output Output Connector Product Codes Input Voltage On/Off Logic Comcodes Voltage Current Type EVW020A0S6R041Z 48V (36-75Vdc) 6.0V 20A Negative Through hole TBD EVW020A0S6R041-HZ CC109151833 48V (36-75Vdc) 6.0V 20A Negative Through hole EVW020A0S6R0841-HZ 48V (36-75Vdc) 6.0V 20A Negative Through hole CC109153680 EVW020A0S6R041-SZ TBD 48V (36-75Vdc) 6.0V 20A Negative Surface mount Table 2. Device Coding Scheme and Options Characteristic Character and Position Definition Form Factor E E = Eighth Brick Family Designator V Input Voltage W W = Wide Range, 36V-75V Output Current 020A0 020A0 = 020.0 Amps Maximum Output Current Output Voltage S6R0 S6R0 = Special output voltage 6.0V nominal Omit = Default Pin Length shown in Mechanical Outline Figures Pin Length 6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 8 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) Action following Omit = Latching Mode Protective Shutdown 4 4 = Auto-restart following shutdown (Overcurrent/Overvoltage) Omit = Positive Logic On/Off Logic 1 1 = Negative Logic Omit = Standard open Frame Module Mechanical Features H H = Heat plate, for use with heat sinks (not available with –S option) S S = Surface mount connections Customer Specific XY XY = Customer Specific Modified Code, Omit for Standard Code Omit = RoHS 5/6, Lead Based Solder Used RoHS Z Z = RoHS 6/6 Compliant, Lead free Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 2, 2015 ©2012 General Electric Company. All International rights reserved. Version 1.3 Options Ratings