Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Features RoHS Compliant  Compliant to RoHS EU Directive 2011/65/EU (Z versions)  Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this produc twill no longer be RoHS compliant (non-Z versions)  Delivers up to 6A Output current 5V (4A), 3.3V (5A), 2.5V – 1.0V (6A each)  High efficiency – 89% at 5.0V full load  Low Output voltage- supports migration to future IC supply voltages down to 1.0V Applications  Low output ripple and noise  Wireless Networks  Small Size and low profile  Distributed power architectures 47.2mm x 29.5mm x 8.5mm  Optical and Access Network Equipment (1.86 x 1.16 x 0.335 in)  Enterprise Networks  Surface mount or Through hole (TH)  Latest generation IC’s (DSP, FPGA, ASIC) and  Remote On/Off Microprocessor powered applications  Output overcurrent/Over voltage protection  Over temperature protection Options  Single Tightly regulated output  Remote On/Off logic (positive or negative)  Output voltage adjustment trim 10%  Surface Mount (-S Suffix)  Wide operating temperature range (-40°C to 85°C)  Additional Vout+ pin (-3 Suffix)  Meets the voltage insulation requirements for ETSI 300- 132-2 and complies with and is Licensed for Basic Insulation rating per EN 60950 §  CE mark meets 73/23/EEC and 93/68/EEC directives †  UL* 60950-1Recognized, CSA C22.2 No. 60950-1-03 ‡ Certified, and VDE 0805:2001-12 (EN60950-1) Licensed  ISO** 9001 and ISO 14001 certified manufacturing facilities Description The HW/HC series power modules are isolated dc-dc converters that operate over a wide input voltage range of 18 to 36 Vdc (HC) or 36 to 75 Vdc (HW) and provide one precisely regulated output. The output is fully isolated from the input, allowing versatile polarity configurations and grounding connections. The modules exhibit high efficiency, e.g. typical efficiency of 87% 3.3V/5A, 86% at 2.5V/6A. Built-in filtering for both input and output minimizes the need for external filtering. These open frame modules are available either in surface-mount (-S) or in through-hole form. * UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards October 2, 2015 ©2012 General Electric Company. All rights reserved. Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage HC V -0.3 50 Vdc IN Continuous HW V -0.3 80 Vdc IN Transient (100ms) HW V -0.3 100 Vdc IN, trans Operating Ambient Temperature All TA -40 85 °C (see Thermal Considerations section) Storage Temperature All Tstg -55 125 °C I/O Isolation Voltage (100% factory tested) All 2250 Vdc   Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage HC V 18 24 36 Vdc IN HW VIN 36 54 75 Vdc Maximum Input Current HC IIN,max 1.75 Adc (V =0V to 75V, I =I) HW I 0.85 Adc IN O O, max IN,max 2 2 Inrush Transient All It 1 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 12μH source impedance; VIN=0V to 75V, All 5 mAp-p I = I ; see Figure 9) O Omax Input Ripple Rejection (120Hz) All 50 dB EMC, EN55022 See EMC Considerations section CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of complex power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 3A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 2 Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit 5V, 3.3V Output Voltage Set-point 2.5V, 2.0V, VO, set -1.0  +1.0 % VO, nom 1.8V, 1.5V (VIN=VIN,nom, IO=IO, max, Tref=25°C) 1.2V, 1.0V VO, set -1.25  +1.25 % VO, nom Output Voltage All V -3.0 +3.0 % V O  O, nom (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range All VO -10.0 +10.0 % VO, nom Selected by external resistor Output Regulation Line (VIN=VIN, min to VIN, max) All   10 mV Load (IO=IO, min to IO, max) All   15 mV Temperature (T =T to T) All   1.00 % ref A, min A, max Output Ripple and Noise on nominal output (V =V and I =I to I) IN IN, nom O O, min O, max RMS (5Hz to 20MHz bandwidth) All 8 15 mV  rms Peak-to-Peak (5Hz to 20MHz bandwidth) All  25 50 mVpk-pk External Capacitance All C 470 μF O, max   Output Current 5V I 0 4.0 Adc o 3.3V I 0 5.0 Adc o 2.5V, 2.0, 1.8V, 1.5V, I 0 6.0 Adc o 1.2V, 1.0V Output Current Limit Inception 5V IO, lim  6.5  Adc ( Hiccup Mode ) 3.3V I 7 Adc O, lim   2.5V, 2.0V, 1.8V, 1.5V, I 8.5 Adc O, lim   1.2V, 1.0V Output Short-Circuit Current 5V IO, s/c  2.4  A rms (VO≤250mV) ( Hiccup Mode ) 3.3V IO, s/c  2.4  A rms 2.5V, 2.0V, 1.8V, 1.5V, I 2.8 A rms O, s/c   1.2V, 1.0V October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 3 Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit HW 5V η 89.0 %   Efficiency HW 3.3V η 87.0 %   VIN=VIN, nom, TA=25°C HW 2.5V η  86.0  % IO=IO, max , VO= VO,set HW 2.0V η  82.0  % HW 1.8V η 82.0 %   HW 1.5V η  80.0  % HW 1.2V η  77.0  % HW 1.0V η 75.0 %   HC 5V η  88.0  % HC 3.3V η 86.0 %   Switching Frequency All HW fsw  300  kHz All HC fsw  380  kHz Dynamic Load Response (Io/t=1A/s; V =V ,nom; T =25°C) 5V, 3.3V Vpk  100  mV in in A 2.5V, 2.0V, Load Change from Io= 50% to 75% of Io,max: 1.8V, 1.5V, Vpk  80  mV 1.2V, 1.0V Peak Deviation Settling Time (Vo<10% peak deviation) All t 100 s   s Dynamic Line Response (Vin / t0.5V/s; Vin=Vin,nom; TA=25°C) Peak Deviation All V  0.6 2 %Vo, set pk Settling Time (Vo<10% peak deviation) All ts  150 1000 s Isolation Specifications Parameter Symbol Min Typ Max Unit Isolation Capacitance Ciso  200  pF Isolation Resistance Riso 10   MΩ General Specifications Parameter Min Typ Max Unit Calculated MTBF (for HW005A0F1-S in accordance with Lucent RIN 6: >4,000,000 Hours IO=80% of IO, max, TA=25°C, airflow=1m/s) Weight  13  g (oz.) October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 4 Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (V =V to V ; open collector or equivalent, IN IN, min IN, max Signal referenced to VIN- terminal) Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low Specification Remote On/Off Current – Logic Low All Ion/off  0.15 1.0 mA On/Off Voltage: Logic Low All V 0.0  1.2 V on/off Logic High – (Typ = Open Collector) All V 5.8 15 V on/off  Logic High maximum allowable leakage current All I 10 μA on/off   Turn-On Delay and Rise Times (IO=IO, max) Tdelay  100  ms 5V, 3.3V Tdelay = Time until VO = 10% of VO,set from either Trise  40  ms application of Vin with Remote On/Off set to On or operation of Remote On/Off from Off to On with Vin already applied for at least one second. 2.5V, 2.0V, T 12 ms delay   1.8V, 1.5V, Trise = time for VO to rise from 10% of VO,set to 90% of 1.2V, 1.0V VO,set. Trise  3  ms 5V V   7.0 V O, limit # Output Overvoltage Protection 3.3V   4.6 V 2.5V   3.5 V Values are the same for HW and HC codes 2.0V 3.2 V   1.8V 2.8 V   1.5V   2.5 V 1.2V   2.0 V 1.0V   1.8 V Overtemperature Protection All T 125 °C ref   (See Feature Descriptions) Input Undervoltage Lockout Turn-on Threshold All HW  33 36 V Turn-off Threshold All HW 27 30  V Turn-on Threshold All HC  17 18 V Turn-off Threshold All HC 13.5 15  V # More accurate Overvoltage protection can be accomplished externally by means of the remote On/Off pin. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 5 Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Characteristic Curves The following figures provide typical characteristics for the HW004A0A (5.0V, 4A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic. 90 5 88 4 86 84 3 82 V = 36V 80 I V = 54V I 2 3.0 m/s (600 ft./min.) 78 V = 75V I 2.0 m/s (400 ft./min.) 76 1.0 m/s (200 ft./min.) 1 74 NATURAL CONVECTION 72 0 70 0 10 203040 50 60 708090100 110 01 2 3 4 O OUTPUT CURRENT, I (A) AMBIENT TEMPERATURE, T C O A Figure 1. Converter Efficiency versus Output Current Figure 4. Derating Output Current versus Local Ambient Temperature and Airflow TIME, t (20ms/div) TIME, t (1s/div) Figure 2. Typical Output Ripple and Noise. Figure 5. Typical Start-Up with application of Vin. TIME, t (50s/div) TIME, t (20ms/div) Figure 3. Transient Response to Dynamic Load Change Figure 6. Typical Start-Up Using Remote On/Off, negative from 50% to 75% to 50% of full load. logic version shown. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 6 OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT VOLTAGE, I (A) (1A/div) V (V) (50mV/div) EFFICIENCY,  (%) O O V (V) (20mV/div) O INPUT VOLTAGE OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT VOLTAGE OUTPUT CURRENT, Io (A) VIN (V) (50V/div) VO (V) (2V/div) VON/OFF(V) (5V/div) VO (V) (2V/div) Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Characteristic Curves (continued) The following figures provide typical characteristics for the HW005A0F (3.3V, 5A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic. 90 6 88 5 86 84 4 82 V = 36V I 3 80 3.0 m/s (600 ft./min.) V = 54V I 78 2.0 m/s (400 ft./min.) V = 75V I 2 1.0 m/s (200 ft./min.) 76 NATURAL CONVECTION 74 1 72 0 70 0 10 203040 50 60 708090100 110 01 2 3 4 5 O OUTPUT CURRENT, I (A) AMBIENT TEMPERATURE, T C O A Figure 7. Converter Efficiency versus Output Current Figure 10. Derating Output Current versus Local Ambient Temperature and Airflow TIME, t (20ms/div) TIME, t (1s/div) Figure 8. Typical Output Ripple and Noise. Figure 11. Typical Start-Up with application of Vin. TIME, t (50s/div) TIME, t (20ms/div) Figure 9. Transient Response to Dynamic Load Change Figure 12. Typical Start-Up Using Remote On/Off, negative from 50% to 75% to 50% of full load. logic version shown. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 7 OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT VOLTAGE, I (A) (2A/div) V (V) (50mV/div) V (V) (20mV/div) EFFICIENCY,  (%) O O O On/Off VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE, OUTPUT VOLTAGE OUTPUT CURRENT, Io (A) VON/OFF(V) (5V/div) VO (V) (1V/div) VIN (V) (50V/div) VO (V) (1V/div) Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Characteristic Curves (continued) The following figures provide typical characteristics for the HW006A0G (2.5V, 6A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic. 88 7 86 6 84 5 82 80 4 78 76 V = 36V 3 I V = 54V I 74 2.0 m/s (400 ft./min.) V = 75V 2 I 72 1.0 m/s (200 ft./min.) NATURAL CONVECTION 1 70 68 0 0 1 234 56 0 10 20 30 40 506070 80 90 100 110 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 13. Converter Efficiency versus Output Current. Figure 16. Derating Output Current versus Local Ambient Temperature and Airflow. TIME, t (5ms/div) TIME, t (1s/div) Figure 14. Typical Output Ripple and Noise. Figure 17. Typical Start-Up with application of Vin. TIME, t (5ms/div) TIME, t (50s/div) Figure 15. Transient Response to Dynamic Load Change Figure 18. Typical Start-Up Using Remote On/Off, negative from 50% to 75% to 50% of full load. logic version shown. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 8 OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT VOLTAGE, I (A) (2A/div) V (V) (50mV/div) V (V) (20mV/div) EFFICIENCY,  (%) O O O On/Off VOLTAGE, OUTPUT VOLTAGE INPUT VOLTAGE, OUTPUT VOLTAGE OUTPUT CURRENT, Io (A) VON/OFF(V) (5V/div) VO (V) (1V/div) VIN (V) (50V/div) VO (V) (1V/div) Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Characteristic Curves (continued) The following figures provide typical characteristics for the HW006A0D (2.0V, 6A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic. 88 7 86 6 84 5 82 80 4 78 76 V = 36V 3 I V = 54V I 74 2.0 m/s (400 ft./min.) V = 75V 2 I 72 1.0 m/s (200 ft./min.) NATURAL CONVECTION 1 70 68 0 0 1 234 56 0 10 20 3040 50 60 708090100 110 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 13. Converter Efficiency versus Output Current. Figure 16. Derating Output Current versus Local Ambient Temperature and Airflow TIME, t (5ms/div) TIME, t (1s/div) Figure 14. Typical Output Ripple and Noise. Figure 17. Typical Start-Up with application of Vin. TIME, t (5ms/div) TIME, t (50s/div) Figure 15. Transient Response to Dynamic Load Change Figure 18. Typical Start-Up Using Remote On/Off, negative from 50% to 75% to 50% of full load. logic version shown. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT VOLTAGE, I (A) (2A/div) V (V) (50mV/div) V (V) (20mV/div) EFFICIENCY,  (%) O O O On/Off VOLTAGE, OUTPUT VOLTAGE INPUT VOLTAGE, OUTPUT VOLTAGE VON/OFF(V) (5V/div) VO (V) (1V/div) VIN (V) (50V/div) VO (V) (1V/div) OUTPUT CURRENT, Io (A) Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Characteristic Curves (continued) The following figures provide typical characteristics for the HW006A0Y (1.8V, 6A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic. 86 7 84 6 82 5 80 78 4 76 3 74 2.0 m/s (400 ft./min.) 72 2 V = 36V I 1.0 m/s (200 ft./min.) 70 V = 54V I NATURAL CONVECTION 1 V = 75V I 68 0 66 0 10 20 3040 50 60 70 8090100 110 0 1 234 56 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 25. Converter Efficiency versus Output Current Figure 28. Derating Output Current versus Local Ambient Temperature and Airflow TIME, t (1s/div) TIME, t (5ms/div) Figure 26. Typical Output Ripple and Noise. Figure 29. Typical Start-Up with application of Vin. TIME, t (5ms/div) TIME, t (50s/div) Figure 27. Transient Response to Dynamic Load Change Figure 30. Typical Start-Up Using Remote On/Off, negative from 50% to 75% to 50% of full load. logic version shown. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 10 OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT VOLTAGE, I (A) (2A/div) V (V) (50mV/div) V (V) (20mV/div) EFFICIENCY,  (%) O O O On/Off VOLTAGE, OUTPUT VOLTAGE INPUT VOLTAGE, OUTPUT VOLTAGE OUTPUT CURRENT, Io (A) VON/OFF(V) (5V/div) VO (V) (500mV/div) VIN (V) (25V/div) VO (V) (500mV/div) Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Characteristic Curves (continued) The following figures provide typical characteristics for the HW006A0M (1.5V, 6A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic. 86 7 84 6 82 5 80 78 4 76 3 74 72 2.0 m/s (400 ft./min.) V = 36V 2 I 1.0 m/s (200 ft./min.) 70 V = 54V I NATURAL CONVECTION 1 V = 75V I 68 66 0 0 1 234 56 0 10 20 3040 50 60 70 8090100 110 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 31. Converter Efficiency versus Output Current. Figure 34. Derating Output Current versus Local Ambient Temperature and Airflow TIME, t (1s/div) TIME, t (5ms/div) Figure 32. Typical Output Ripple and Noise. Figure 35. Typical Start-Up with application of Vin. TIME, t (5ms/div) TIME, t (50s/div) Figure 33. Transient Response to Dynamic Load Change Figure 36. Typical Start-Up Using Remote On/Off, negative from 50% to 75% to 50% of full load. logic version shown. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 11 OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT VOLTAGE, I (A) (2A/div) V (V) (50mV/div) V (V) (20mV/div) EFFICIENCY,  (%) O O O On/Off VOLTAGE, OUTPUT VOLTAGE INPUT VOLTAGE, OUTPUT VOLTAGE V (V) (5V/div) V (V) (500mV/div) V (V) (25V/div) V (V) (500mV/div) OUTPUT CURRENT, Io (A) ON/OFF O IN O Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Characteristic Curves (continued) The following figures provide typical characteristics for the HW006A0P (1.2V, 6A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic. 80 7 78 6 76 5 74 72 4 70 V = 36V I 68 3 V = 54V 3.0 m/s (600 ft./min.) I 66 V = 75V I 2.0 m/s (400 ft./min.) 2 64 1.0 m/s (200 ft./min.) 62 1 NATURAL CONVECTION 60 0 0 1 234 56 0 10 20 30 40 506070 80 90 100 110 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 37. Converter Efficiency versus Output Current. Figure 40. Derating Output Current versus Local Ambient Temperature and Airflow TIME, t (5ms/div) TIME, t (1s/div) Figure 38. Typical Output Ripple and Noise. Figure 41. Typical Start-Up with application of Vin. TIME, t (5ms/div) TIME, t (50s/div) Figure 39. Transient Response to Dynamic Load Change Figure 42. Typical Start-Up Using Remote On/Off, negative from 50% to 75% to 50% of full load. logic version shown. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 12 OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT VOLTAGE, I (A) (2A/div) V (V) (50mV/div) V (V) (20mV/div) EFFICIENCY,  (%) O O O On/Off VOLTAGE, OUTPUT VOLTAGE INPUT VOLTAGE, OUTPUT VOLTAGE VON/OFF(V) (5V/div) VO (V) (500mV/div) VIN (V) (50V/div) VO (V) (500mV/div) OUTPUT CURRENT, Io (A) Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Characteristic Curves (continued) The following figures provide typical characteristics for the HW006A0S1R0 (1.0V, 6A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic. 80 7 78 6 76 5 74 72 4 70 68 3 3.0 m/s (600 ft./min.) VI = 36V 66 2.0 m/s (400 ft./min.) VI = 54V 2 64 1.0 m/s (200 ft./min.) VI = 75V 62 1 NATURAL CONVECTION 60 0 0 1 234 56 0 10 2030 40 50 60 7080 90100 110 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 43. Converter Efficiency versus Output Current. Figure 46. Derating Output Current versus Local Ambient Temperature and Airflow. TIME, t (5ms/div) TIME, t (1s/div) Figure 44. Typical Output Ripple and Noise. Figure 47. Typical Start-Up with application of Vin. TIME, t (5ms/div) TIME, t (50s/div) Figure 45. Transient Response to Dynamic Load Change Figure 48. Typical Start-Up Using Remote On/Off, negative from 50% to 75% to 50% of full load. logic version shown. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 13 OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT VOLTAGE, I (A) (2A/div) V (V) (50mV/div) V (V) (20mV/div) EFFICIENCY,  (%) O O O On/Off VOLTAGE, OUTPUT VOLTAGE INPUT VOLTAGE, OUTPUT VOLTAGE V (V) (5V/div) V (V) (500mV/div) V (V) (50V/div) V (V) (500mV/div) OUTPUT CURRENT, Io (A) ON/OFF O IN O Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Characteristic Curves (continued) The following figures provide typical characteristics for the HC004A0A (5.0V, 4A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic. 5 4 3 2 3.0 m/s (600 ft./min.) 2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) 1 Natural Convection 0 0 10 20 3040 50 60 708090100 110 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 49. Converter Efficiency versus Output Current. Figure 52. Derating Output Current versus Local Ambient Temperature and Airflow. TIME, t (20ms/div) TIME, t (1s/div) Figure 50. Typical Output Ripple and Noise. Figure 53. Typical Start-Up with application of Vin. TIME, t (20ms/div) TIME, t (50s/div) Figure 51. Transient Response to Dynamic Load Change Figure 54. Typical Start-Up Using Remote On/Off, negative from 50% to 75% to 50% of full load. logic version shown. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 14 OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT VOLTAGE, I (A) (1A/div) V (V) (50mV/div) V (V) (20mV/div) EFFICIENCY,  (%) O O O On/Off VOLTAGE, OUTPUT VOLTAGE INPUT VOLTAGE, OUTPUT VOLTAGE VON/OFF(V) (5V/div) VO (V) (2V/div) VIN (V) (25V/div) VO (V) (2V/div) OUTPUT CURRENT, Io (A) Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Characteristic Curves (continued) The following figures provide typical characteristics for the HC005A0F (3.3V, 5A) at 25ºC. The figures are identical for either positive or negative Remote On/Off logic. 6 5 4 3 3.0 m/s (600 ft./min.) 2 2.0 m/s (400 ft./min.) 1.0 m/s (200 ft./min.) 1 Natural Convection 0 0 10 2030 40 50 60 7080 90100 110 O OUTPUT CURRENT, IO (A) AMBIENT TEMPERATURE, TA C Figure 55. Converter Efficiency versus Output Current. Figure 58. Derating Output Current versus Local Ambient Temperature and Airflow. TIME, t (20ms/div) TIME, t (1s/div) Figure 56. Typical Output Ripple and Noise. Figure 59. Typical Start-Up with application of Vin. TIME, t (20ms/div) TIME, t (50s/div) Figure 57. Transient Response to Dynamic Load Change Figure 60. Typical Start-Up Using Remote On/Off, negative from 50% to 75% to 50% of full load. logic version shown. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 15 OUTPUT CURRENT, OUTPUT VOLTAGE OUTPUT VOLTAGE, I (A) (2A/div) V (V) (50mV/div) V (V) (20mV/div) EFFICIENCY,  (%) O O O On/Off VOLTAGE, OUTPUT VOLTAGE INPUT VOLTAGE, OUTPUT VOLTAGE V (V) (5V/div) V (V) (1V/div) V (V) (25V/div) V (V) (1V/div) OUTPUT CURRENT, Io (A) ON/OFF O IN O Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Test Configurations Design Considerations CURRENT PROBE TO OSCILLOSCOPE Input Source Impedance L TEST The power module should be connected to a low Vin+ ac-impedance source. A highly inductive source impedance 12μH can affect the stability of the power module. For the test configuration in Figure 61, a 33μF electrolytic capacitor C 220μF S 33μF (ESR<0.7 at 100kHz), mounted close to the power module E.S.R.<0.1 helps ensure the stability of the unit. Consult the factory for @ 20°C 100kHz further application guidelines. Vin- Safety Considerations NOTE: Measure input reflected ripple current with a simulated For safety-agency approval of the system in which the source inductance (LTEST) of 12μH. Capacitor CS offsets possible battery impedance. Measure current as shown power module is used, the power module must be installed above. in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., Figure 61. Input Reflected Ripple Current Test Setup. UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE COPPER STRIP 0805:2001-12 (IEC60950-1). V (+) R E SISTIVE O If the input source is non-SELV (ELV or a hazardous voltage LOAD greater than 60 Vdc and less than or equal to 75Vdc), for 1uF . 10uF SC O PE the module’s output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the V (– ) O following must be true:  The input source is to be provided with reinforced insulation GROUND PLANE from any other hazardous voltages, including the ac mains. NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then  One V pin and one V pin are to be grounded, or both the IN OUT Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact input and output pins are to be kept floating. resistance.  The input pins of the module are not operator accessible. Figure 62. Output Ripple and Noise Test Setup.  Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as R R R R required by the safety agencies, to verify that under a single distribution contact contact distribution Vin+ Vout+ fault, hazardous voltages do not appear at the module’s output. Note: Do not ground either of the input pins of the module RLOAD V V IN O without grounding one of the output pins. This may allow a non-SELV voltage to appear between the Rdistribution Rcontact Rcontact Rdistribution output pins and ground. Vin- Vout- The power module has extra-low voltage (ELV) outputs when all inputs are ELV. NOTE: All voltage measurements to be taken at the module For input voltages exceeding –60 Vdc but less than or equal terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to –75 Vdc, these converters have been evaluated to the to avoid measurement errors due to socket contact resistance. applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as Figure 63. Output Voltage and Efficiency Test Setup. TNV-2 in Europe) and unearthed SELV outputs. V . I O O "All flammable materials used in the manufacturing of Efficiency = x 100 %  these modules are rated 94V-0 and UL60950 A.2 for V . I IN IN reduced thicknesses. The input to these units is to be provided with a maximum 3A fast-acting fuse in the unearthed lead." Feature Description Remote On/Off Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 16 BATTERY Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A pin, and off during a logic low. Negative logic remote Over Voltage Protection On/Off, device code suffix “1”, turns the module off during a The output overvoltage protection consists of circuitry that logic high and on during a logic low. internally clamps the output voltage. If a more accurate To maintain compatibility with LW series power modules output overvoltage protection scheme is required then this the Remote On/Off pin is optional for the TH (through hole) should be implemented externally via use of the remote version. Standard TH modules have no On/Off pin fitted. TH on/off pin. modules ordered with device code suffix “1” are negative logic with the On/Off pin fitted. Over Temperature Protection To provide protection in a fault condition, the unit is equipped with a thermal shutdown circuit. The unit will V (+) IN o shutdown if the overtemperature threshold of 125 C is exceeded at the thermal reference point Tref . Once the unit VO goes into thermal shutdown it will then wait to cool before Ion/off ON/OFF attempting to restart. Output Voltage Programming Von/off Trimming allows the output voltage set point to be COM increased or decreased, this is accomplished by connecting an external resistor between the TRIM pin and either the VIN(-) VO(+) pin or the VO(-) pin (COM pin) . V (+) V (+) IN O Figure 64. Remote On/Off Implementation. R trim-up To turn the power module on and off, the user must supply ON/OFF a switch (open collector or equivalent) to control the voltage LOAD V TRIM O (Von/off) between the ON/OFF terminal and the VIN(-) terminal. Logic low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a R trim-down logic low is 1mA, the switch should be maintain a logic low level whilst sinking this current. V (-) COM IN During a logic high, the typical V generated by the on/off module is 5.8V, and the maximum allowable leakage current at V = 5.8V is 10μA. on/off Figure 65. Circuit Configuration to Trim Output Voltage. If not using the remote on/off feature: Connecting an external resistor (R ) between the TRIM trim-down For positive logic, leave the ON/OFF pin open. pin and the COM pin decreases the output voltage set point. For negative logic, short the ON/OFF pin to V (-). IN To maintain set point accuracy, the trim resistor tolerance should be ±0.1%. Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. The unit operates normally once the output current is brought back into its specified range. The average output current during hiccup is 10% I . O, max Input Undervoltage Lockout At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON. Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, V . UV/OFF October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 17 Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A ∆% = 2 Feature Descriptions (continued) The relationship between the output voltage and the trim 511 resistor value for a ∆% reduction in output voltage is: R = - 6.11 k trim-down  R = 249.39 k Nominal 5V, 3.3V, 2.5V, 2.0V, 1.8V, & 1.5V modules: trim-down To trim up the output of a nominal 3.3V module 511 (HW005A0F) to 3.63V R = - 6.11 k trim-down % ∆% = 10 Nominal 1.2V module: 5.11x3.3(100+10) 511 346 R = - - 6.11 k trim-up 1.225x10  R = - 4.46 k trim-down % Rtrim-up =94.2 k Nominal 1.0V module: 390 R = - 4.90 k trim-down % Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) pin increases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be ±0.5%. The relationship between the output voltage and the trim resistor value for a ∆% increase in output voltage is: Nominal 5V, 3.3V, 2.5V, 2.0V, 1.8V, & 1.5V modules: 511 5.11VO(100+%) R = - - 6.11 k trim-up 1.225% % Nominal 1.2V module: 5.11V (100+%) 346 O R = - - 4.46 k trim-up 1.225% % Nominal 1.0V module: 390 5.11V (100+%) O R = - - 4.90 k trim-up 1.225% % (VO refers to the nominal output voltage, i.e. 5.0V for VO on an HW004A0A. ∆% is the required % change in output voltage, i.e. to trim a 5.0V module to 5.10V the ∆% value is 2). Examples: To trim down the output of a nominal 5.0V module (HW004A0A) to 4.90V October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 18 Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Thermal Considerations C5 56nF L2 The power modules operate in a variety of thermal 10uH Vin+ Vout+ environments; however, sufficient cooling should be provided to help ensure reliable operation. C4 33uF HW005 Considerations include ambient temperature, airflow, C1 C2 C3 100V 0.68uF 0.68uF 0.68uF module power dissipation, and the need for increased Vin- Vout- reliability. A reduction in the operating temperature of the L1 - CMC module will result in an increase in reliability. The thermal Pulse P0354 data presented here is based on physical measurements C6 56nF taken in a wind tunnel. The thermal reference point, Tref used in the specifications Figure 67. Suggested Configuration for EN55022 Class is shown in Figure 66. For reliable operation this o B. temperature should not exceed 115 C. 90 80 70 60 EN 55022 Class B Conducted Average dBuV 50 40 30 20 10 100K 500K 1M 5M 10M 30M Frequency(Hz) Figure 66. Tref Temperature Measurement Location. Figure 68. EMC signature using above filter, HW005A0F. For further information on designing for EMC compliance, Please refer to the Application Note “Thermal please refer to the FLTR100V10 data sheet (FDS01-043EPS). Characterization Process For Open-Frame Board-Mounted Power Modules” for a detailed discussion of thermal aspects including maximum device temperatures. Layout Considerations The HW/HC005 power module series are low profile in order to be used in fine pitch system card architectures. As such, Heat Transfer via Convection component clearance between the bottom of the power Increased airflow over the module enhances the heat module and the mounting board is limited. Avoid placing transfer via convection. Derating figures showing the copper areas on the outer layer directly underneath the maximum output current that can be delivered by each power module. Also avoid placing via interconnects module versus local ambient temperature (TA) for natural underneath the power module. convection and up to 3m/s (600 ft./min) are shown in the For additional layout guide-lines, refer to FLTR100V10 data respective Characteristics Curves section. sheet. EMC Considerations The figure 67 shows a suggested configuration to meet the conducted emission limits of EN55022 Class B. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 19 Level (dBµV) Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Mechanical Outline for HW/HC Surface-Mount Module Dimensions are in millimeters and (inches). Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated] x.xx mm  0.25 mm (x.xxx in  0.010 in.) 47.2 (1.860) Top View 29.5 (1.162) 2.54 (0.100) 8.50 min stand-off (0.335) height Side View MAX 0.5 (.020) max compliance 40.00 Bottom View (1.576) 10.00 (0.394) Pin Function PIN 3 2 3 1 9 1 Vout + OPTIONAL 2 Vout - 26.16 Standard = No Pin (1.031) 3 Optional = Vout + 9 Trim 18 17 11 11 On/Off 1.65 5.00 17 Vin - (0.065) (0.197) 18 Vin + 3.63 35.00 (1.379) (0.143) October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 20 Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Mechanical Outline for HW/HC Through Hole Module Dimensions are in millimeters and (inches). Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated] x.xx mm  0.25 mm (x.xxx in  0.010 in.) 47.2 (1.860) Top View 29.5 (1.162) 8.50 9.0 (0.335) (0.35) MAX MIN Side View 1.05 0.99 (0.041) (0.039) 40.00 Bottom View (1.576) Pin Function 1 2 9 1 Vout + 26.16 2 Vout - (1.031) 9 Trim 11 On/Off 18 17 11 17 Vin - 18 Vin + 1.65 5.00 (0.065) (0.197) 3.63 35.00 (1.379) (0.143) October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 21 Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Recommended Pad Layout for Surface Mount and Through Hole Module Dimensions are in millimeters and (inches). Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated] x.xx mm  0.25 mm (x.xxx in  0.010 in.) 47.2 (1.860) 3.63 40.00 (0.143) (1.576) 35.00 (1.379) 10.00 Pin Function 1.65 (0.394) (0.065) 5.00 1 Vout + (0.197) 2 Vout - Standard = No Pin 18 17 11 3 29.5 Optional = Vout + (1.162) 9 Trim 26.16 11 On/Off (1.031) 17 Vin - 3 9 1 2 18 Vin + IN 7 POSITIONS PAD Ø 2.8mm Surface Mount Pad Layout – Component side view 47.2 (1.860) (0.143) 3.63 40.00 (1.576) 35.00 1.65 (1.379) (0.065) 5.00 Pin Function (0.197) 1 Vout + 2 Vout - 11 18 17 29.5 9 Trim INSULATIVE (1.162) 11 On/Off SPACER IN 3 26.16 POSITIONS 17 Vin - (1.031) 18 Vin + 1 2 9 IN 6 POSITIONS PAD Ø4.0mm HOLE Ø1.5mm Through-Hole Pad Layout – Component side view October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 22 Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Packaging Details The surface mount versions of the HW005 family are also available in tape & reel (suffix –SR) as an option. Detailed of tape dimensions are shown below. Modules are shipped in quantities of 115 per reel. Tape Dimensions Dimensions are in millimeters and (inches). 9.02 4.00 40.00 (0.355) PICK POINT (0.157) (1.575) FEED 72.00 34.20 DIRECTION (1.346) (2.834) 68.40 (2.692) 66.50 (2.692) EMBOSSED CARRIER TOP COVER TAPE NOTE: CONFORMS TO EAI-481 REV. A STANDARD Reel Dimensions Outside diameter: 330.2 mm (13.00”) Inside diameter: 177.8 mm (7.00”) Tape Width: 72.00 mm (2.834”) October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 23 Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Through-Hole Lead-Free Soldering Information The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. Not all RoHS- Figure 69. Surface Mount Packaging Tray compliant through-hole products can be processed with paste-through-hole Pb or Pb-free reflow process. If Tray Specification additional information is needed, please consult with your GE representative for more details. Material Antistatic coated PVC 12 Max surface resistivity 10 /sq Color Clear Surface Mount Information Capacity 15 power modules Packaging Details Min order quantity 60 pcs (1 box of 4 full trays) The surface mount versions of the HW005 family (suffix – S) are supplied as standard in the plastic tray shown in Each tray contains a total of 15 power modules. The Figure 69. The tray has external dimensions of trays are self-stacking and each shipping box will 135.1mm (W) x 321.8mm (L) x 12.4mm (H) or 5.319in (W) x contain 4 full trays plus one empty hold down tray giving 12.669in (L) x 0.489in (H). a total number of 60 power modules. Surface mount versions of the HW005 family are also Pick and Place available as an option packaged in Tape and Reel. For The HW005-S series of DC-to-DC power converters use further information on this please contact your local GE an open-frame construction and are designed for Technical Sales Representative. surface mount assembly within a fully automated manufacturing process. The HW005-S series modules are fitted with a Kapton label designed to provide a large flat surface for pick and placing. The label is located covering the Centre of Gravity of the power module. The label meets all the requirements for surface-mount processing, as well as meeting UL safety agency standards. The label will withstand reflow temperatures up to 300C. The label also carries product information such as product code, date and location of manufacture. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 24 Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A The surface mountable modules in the HW005 family Surface Mount Information (continued) use our newest SMT technology called “Column Pin” (CP) connectors. Fig 71 shows the new CP connector before and after reflow soldering onto the end-board assembly. 24.2 COG HW005 Board Insulator Solder Ball End assembly PCB 19.0 9.5 Figure 71. Column Pin Connector Before and After Reflow Soldering. Note: All dimensions in mm. The CP is constructed from a solid copper pin with an Figure 70. Pick and Place Location. integral solder ball attached, which is composed of tin/lead (Sn/Pb) solder. The CP connector design is able Z Plane Height to compensate for large amounts of co-planarity and still ensure a reliable SMT solder joint. The ‘Z’ plane height of the pick and place location is 7.50mm nominal with an RSS tolerance of +/-0.25 mm. o Typically, the eutectic solder melts at 183 C, wets the land, and subsequently wicks the device connection. Nozzle Recommendations Sufficient time must be allowed to fuse the plating on the The module weight has been kept to a minimum by connection to ensure a reliable solder joint. There are using open frame construction. Even so, they have a several types of SMT reflow technologies currently used relatively large mass when compared with conventional in the industry. These surface mount power modules SMT components. Variables such as nozzle size, tip style, can be reliably soldered using natural forced convection, vacuum pressure and placement speed should be IR (radiant infrared), or a combination of convection/IR. considered to optimize this process. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP The minimum recommended nozzle diameter for reliable connector temperatures. operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component 300 spacing, is 9 mm. o Peak Temp 235 C Oblong or oval nozzles up to 11 x 9 mm may also be 250 Cooling used within the space available. zone Heat zo ne 200 o -1 o -1 1-4 Cs max 4 Cs For further information please contact your local GE 150 Technical Sales Representative. So ak zo ne Reflow Soldering Information 10 0 T above 30-240s lim o 205 C The HW005 family of power modules is available for 50 Preheat zo ne either Through-Hole (TH) or Surface Mount (SMT) o -1 max 4 Cs soldering. These power modules are large mass, low 0 thermal resistance devices and typically heat up slower REFLOW TIME (S) than other SMT components. It is recommended that the customer review data sheets in order to customize Figure 72. Recommended Reflow Profile the solder reflow profile for each application board assembly. The following instructions must be observed when SMT soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 25 8.0 12.7 14.7 REFLOW TEMP (C) Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A packages will be a minimum of 12 months from the bag Surface Mount Information (continued) seal date, when stored at the following conditions: < 40° 240 C, < 90% relative humidity. 235 Post Solder Cleaning and Drying Considerations 230 Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The 225 result of inadequate cleaning and drying can affect both 220 the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on 215 appropriate soldering, cleaning and drying procedures, 210 refer to GE Board Mounted Power Modules: Soldering and Cleaning Application Note (AP01-056EPS). 205 300 200 Per J-STD-020 Rev. C 0 1020 30 4050 60 Peak Temp 260°C 250 TIME LIMIT (S) Cooling o Figure 73. Time Limit Curve Above 205 C Reflow . 200 Zone * Min. Time Above 235°C 15 Seconds 150 Heating Zone *Time Above 217°C Lead Free Soldering 1°C/Second 60 Seconds 100 The –Z version SMT modules of the HW/HC series are lead-free (Pb-free) and RoHS compliant and are 50 compatible in a Pb-free soldering process. Failure to observe the instructions below may result in the failure 0 Reflow Time (Seconds) of or cause damage to the modules and can adversely affect long-term reliability. Figure 74. Recommended linear reflow profile using Sn/Ag/Cu solder. Pb-free Reflow Profile Solder Ball and Cleanliness Requirements Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for The open frame (no case or potting) power module will Nonhermetic Solid State Surface Mount Devices) for both meet the solder ball requirements per J-STD-001B. These Pb-free solder profiles and MSL classification procedures. requirements state that solder balls must neither be This standard provides a recommended forced-air- loose nor violate the power module minimum electrical convection reflow profile based on the volume and spacing. thickness of the package (table 4-2). The suggested Pb- The cleanliness designator of the open frame power free solder paste is Sn/Ag/Cu (SAC). The recommended module is C00 (per J specification). linear reflow profile using Sn/Ag/Cu solder is shown in Figure. 74. MSL Rating The HW/HC series SMT modules have a MSL rating of 2A. Storage and Handling The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). Moisture barrier bags (MBB) with desiccant are required for MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is broken, the floor life of the product at conditions of  30°C and 60% relative humidity varies according to the MSL rating (see J-STD-033A). The shelf life for dry packed SMT October 2, 2015 ©2012 General Electric Company. All rights reserved. Page 26 MAX TEMP SOLDER (C) Reflow Temp (°C) Data Sheet GE HW006/010/012 Series Power Modules; dc-dc Converters 36-75Vdc Input; 1.2 Vdc to 5 Vdc Output; 6.6A to 12A Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 1. Device Codes Output Output Connector Input Voltage Efficiency Device Code Comcodes Voltage Current Type 36 – 75 Vdc 3.3V 10A Through-Hole HW010A0F1 108967985 36 – 75 Vdc 3.3V 10A Through-Hole HW010A0F1Z CC109107141 36 – 75 Vdc 3.3V 10A Through-Hole HW010A0F1-43Z 150035318 36 – 75 Vdc 5.0V 6.6A Through-Hole HW006A6A1 108968355 36 – 75 Vdc 5.0V 6.6A Through-Hole HW006A6A1Z CC109107133 36 – 75 Vdc 1.2V 12A SMT HW012A0Y1-S 108968405 36 – 75 Vdc 2.5V 10A SMT HW010A0G1-S 108968421 36 – 75 Vdc 2.5V 5A SMT HW010A0G1-SZ CC109113602 36 – 75 Vdc 3.3V 10A SMT HW010A0F1-S 108965625 36 – 75 Vdc 3.3V 10A SMT HW010A0F1-SZ 108995214 36 – 75 Vdc 3.3V 10A SMT HW010A0F1-SR 108997656 36 – 75 Vdc 3.3V 10A SMT (tape & reel) HW010A0F1-SRZ CC109107158 36 – 75 Vdc 3.3V 10A SMT (tape & reel) HW010A0F1-55SR CC109124822 36 – 75 Vdc 5.0V 6.6A SMT HW006A6A-S CC109142155 36 – 75 Vdc 5.0V 6.6A SMT HW006A6A1-S 108968363 36 – 75 Vdc 5.0V 6.6A SMT HW006A6A1-SZ 109100352 Table 2. Device Options Option Suffix Negative remote on/off logic 1 Customer specific -43 Customer specific -55 Tape & Reel -R Surface mount connections -S RoHS Compliant -Z * Please contact GE for availability of these options, samples, minimum order quantity and lead times Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. October 2, 2015 ©2012 General Electric Company. All International rights reserved. Version 1.22