Data Sheet GE KBVW006A0B Series (Sixteenth-Brick) DC-DC Converter Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Features * BARRACUDA SERIES  Wide input voltage range: 36-75 Vdc  Monotonic startup into prebiased load  Output Voltage adjust: 80% to 110% of Vo,nom  Remote sense  Constant switching frequency  Positive remote On/Off logic  Input under/over voltage protection  Output overcurrent and overvoltage protection  Over-temperature protection RoHS Compliant  Industry standard, DOSA compliant footprint 33.0 mm x 22.9 mm x 9.3 mm (1.30 x 0.90 x 0.366 in)  Low profile height and reduced component skyline Applications  High efficiency: 91.0%  Distributed Power Architectures  Wide operating temperature range (-40°C to 85°C)  Wireless Networks  Compliant to RoHS II EU Directive 2011/65/EU (-Z versions)  Access and Optical Network Equipment  Compliant to REACH Directive (EC) No 1907/2006  Industrial Equipment  Compliant to IPC-9592A (May 2010), Category 2, Class II # nd †  UL 60950-1, 2 Ed. Recognized, CSA C22.2 No. ‡ nd 60950-1-07 Certified, and VDE (EN60950-1, 2 Ed.) Options Licensed  Negative Remote On/Off logic (preferred) §  CE mark meets 2006/95/EC directive  Over current/Over temperature/Over voltage protections  Meets the voltage and current requirements for ETSI (Auto-restart) (preferred) 300-132-2 and complies with and licensed for Basic  Surface Mount version (-S) insulation rating per EN60950-1 ¤  Heat Plate version (-H)  2250 Vdc Isolation tested in compliance with IEEE 802.3 PoE standards  For additional options, see Table 2 (Device Options) under ** “Ordering Information” section.  ISO 9001 and ISO 14001 certified manufacturing facilities Description The KBVW006A0B, Sixteenth-brick low-height power module is an isolated dc-dc converters that can deliver up to 6A of output current and provide a precisely regulated output voltage of 12.0V over a wide range of input voltages (VIN = 36 - 75Vdc). The modules achieve typical full load efficiency of 91%. The open frame modules construction, available in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions. * Trademark of General Electric Company # UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. § This product is intended for integration into end-user equipment. All of the required procedures of end-use equipment should be followed. ¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards September 4, 2015 ©2014 General Electric Company. All rights reserved. Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage Continuous All V -0.3 80 V IN dc Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc Operating Ambient Temperature All TA -40 85 °C (see Thermal Considerations section) Storage Temperature All T -55 125 °C stg   I/O Isolation voltage (100% factory Hi-Pot tested) All 2250 V dc Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All VIN 36 48 75 Vdc Maximum Input Current All I 2.8 A IN,max dc (VIN= VIN, min to VIN, max, IO=IO, max) Input No Load Current All IIN,No load 45 mA (V = 48V, I = 0, module enabled) IN O Input Stand-by Current All IIN,stand-by 8 10 mA (V = 48V, module disabled) IN 2 2 Inrush Transient All It 0.5 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max, IO= IOmax ; All 30 mAp-p See Test configuration section) Input Ripple Rejection (120Hz) All 50 dB CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to an integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included, however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 2 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Nominal Output Voltage Set-point V = 48V I =I , T=25°C) All V 11.67 12.0 12.25 V IN O O, max A O, set dc Output Voltage (Over all operating input voltage, resistive load, and All VO 11.64  12.36 Vdc temperature conditions until end of life) Output Regulation Line (V =V to V) All   ±0.2 % V IN IN, min IN, max O, set All Load (IO=IO, min to IO, max)   ±0.2 % VO, set Temperature (T =T to T) All ref A, min A, max   ±1.0 % VO, set Output Ripple and Noise (Co=1uF,ceramic+10uF,tantalum,V =V to V , I = I , IN IN, min IN, max O O, max TA=TA, min to TA, max) RMS (5Hz to 20MHz bandwidth) All  40  mVrms Peak-to-Peak (5Hz to 20MHz bandwidth) All  120  mVpk-pk 1 External Capacitance All C 0 2,000 μF O, max  Output Current All I 0 6 A o  dc Output Current Limit Inception (Hiccup Mode ) % I IO, lim o All 105 120 140 (VO= 90% of VO, set) Output Short-Circuit Current All I 2.5 A O, s/c rms (V≤250mV) ( Hiccup Mode ) O Efficiency VIN=48V, TA=25°C, IO=IO, max , VO= VO,set All η 91.0 % Switching Frequency All fsw 350 kHz Dynamic Load Response (Co=1uF,ceramic+10uF,tantalum,dIo/dt=0.1A/s; VIN = 48V; TA=25°C) Load Change from Io= 50% to 75% or 25% to 50% of Io,max Peak Deviation All V 360 mV pk   Settling Time (Vo<10% peak deviation) All ts  200  s 1. See Note 2 under Feature Specifications. Isolation Specifications Parameter Device Symbol Min Typ Max Unit Isolation Capacitance All C 1000 pF iso   Isolation Resistance All Riso 10   MΩ I/O Isolation Voltage (100% factory Hi-pot tested) All All   2250 Vdc General Specifications Parameter Device Symbol Min Typ Max Unit 9 Calculated Reliability based upon Telcordia SR-332 Issue 3: All FIT 89.8 10 /Hours Method I Case 3 (I =80%I , T =40°C, airflow = 200 lfm, 90% O O, max A All MTBF 11,133,281 Hours confidence) Weight (Open Frame) All 13 (0.46) g (oz.) Weight (with Heatplate) All 21 (0.74) g (oz) September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 3 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix “1” Logic Low = module On, Logic High = module Off Positive Logic: No device code suffix required Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current All I   0.15 mA on/off Logic Low - On/Off Voltage All V -0.7 0.6 V on/off  dc Logic High Voltage – (Typ = Open Collector) All Von/off 2.4  15 Vdc Logic High maximum leakage current All I 25 μA on/off   1 Turn-On Delay and Rise Times o (I =I V =V T = 25C) O O, max , IN IN, nom, A Case 1: Input power is applied for at least 1 second and then the On/Off input is set from OFF to ON (T = from All T — 20 — msec delay delay instant at which On/Off signal is ON until VO = 10% of VO, set). Case 2: On/Off input is set to Logic Low (Module ON) and then input power is applied (T from All T — — 150 msec delay delay instant at which VIN = VIN, min until Vo=10% of VO,set) Output voltage Rise time (time for Vo to rise from 10% All T — 5 12 msec rise of Vo,set to 90% of Vo, set) Output voltage overshoot – Startup All — 3 % VO, set o IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 C Prebiased Output Load Performance: All Monotonic Output Start up characteristic Back Bias current drawn from output (Module Enabled) All -50 mAdc Back Bias current drawn from output (Module Disabled) All -50 mA dc Remote Sense Range All V 10 % V SENSE O, set Output Voltage Adjustment Range All 80 110 % V O, set Output Overvoltage Protection All VO, limit 13.8  16.5 Vdc O Overtemperature Protection – Hiccup Auto Restart All T  135  C ref Input Undervoltage Lockout All VUVLO Turn-on Threshold  32 34.5 Vdc Turn-off Threshold 27.5 30  Vdc Hysteresis 1 2 V  dc 1. The module has an adaptable extended Turn-On Delay interval, T , of 25mS. The extended T will occur when the module restarts following either: 1) delay delay the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module shutdown), and then back to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The normal Turn-On Delay interval, Tdelay, will occur whenever a module restarts with input voltage removed from the module for the preceding 1 second. 2. The module requires a minimum of 220 μF external output capacitor to prevent shutdown during no load to full load transients and to avoid exceeding the OVP maximum limits during startup into open loop fault conditions. September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 4 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Characteristic Curves o The following figures provide typical characteristics for the module at 25 C. The figures are identical for either positive or negative remote On/Off logic. OUTPUT CURRENT, I (A) TIME, t (200µs/div) O Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 0.1A/µS Dynamic Load Change from 50% to 75% to 50% of full load, Vin=48V. TIME, t (2s/div) TIME, t (5ms/div) Figure 2. Typical output ripple and noise (Io = Io,max). Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = 48V, Io = Io,max). TIME, t (200µs/div) TIME, t (20ms/div) Figure 3. Transient Response to 0.1A/µS Dynamic Load Figure 6. Typical Start-up Using Input Voltage (VIN = 48V, Io = Change from 25% to 50% to 25% of full load, Vin=48V. Io,max). September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 5 OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE Io(A) (2A/div) VO (V) (200mV/div) EFFICIENCY,  (%) V (V) (50mV/div) O OUTPUT VOLTAGE On/Off VOLTAGE OUTPUT CURRENT OUTPUT VOLTAGE OUTPUT VOLTAGE INPUT VOLTAGE V (V) (5V/div) V (V) (5V/div) Io(A) (2A/div) V (V) (200mV/div) O On/Off O V (V) (5V/div) V (V) (20V/div) O IN Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Test Configurations Design Considerations Input Filtering CURRENT PROBE TO OSCILLOSCOPE The power module should be connected to a low ac-impedance source. Highly inductive source LTEST Vin+ impedance can affect the stability of the power module. 12μH For the test configuration in Figure 7 a 33μF electrolytic capacitor (ESR<0.7 at 100kHz), mounted close to the C 220μF S 33μF power module helps ensure the stability of the unit. E.S.R.<0.1 Consult the factory for further application guidelines. @ 20°C 100kHz Safety Considerations Vin- For safety-agency approval of the system in which the power module is used, the power module must be NOTE: Measure input reflected ripple current with a simulated source inductance (L ) of 12μH. Capacitor C offsets TEST S installed in compliance with the spacing and separation possible battery impedance. Measure current as shown above. requirements of the end-use safety agency standard, i.e. UL60950-1, CSA C22.2 No.60950-1, and VDE0805- Figure 7. Input Reflected Ripple Current Test Setup. 1(IEC60950-1). COPPER STRIP If the input source is non-SELV (ELV or a hazardous voltage greater than 60 V and less than or equal to dc V O (+) RESISTIVE LOAD 75V ), for the module’s output to be considered as dc SCOPE meeting the requirements for safety extra-low voltage (SELV), all of the following must be true: V O (– ) 1uF 10uF  The input source is to be provided with reinforced insulation from any other hazardous voltages, GROUND PLANE including the ac mains. NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then  One V pin and one V pin are to be grounded, or IN OUT Kelvin connections are required at the module terminals both the input and output pins are to be kept to avoid measurement errors due to socket contact resistance. floating. Figure 8. Output Ripple and Noise Test Setup.  The input pins of the module are not operator accessible.  Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, R R R R distribution contact contact distribution to verify that under a single fault, hazardous Vin+ Vout+ voltages do not appear at the module’s output. Note: Do not ground either of the input pins of the R LOAD V V IN O module without grounding one of the output pins. This may allow a non-SELV voltage to R R R R appear between the output pins and ground. distribution contact contact distribution Vin- Vout- The power module has extra-low voltage (ELV) outputs when all inputs are ELV. NOTE: All voltage measurements to be taken at the module All flammable materials used in the manufacturing of terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals these modules are rated 94V-0, or tested to the UL60950 to avoid measurement errors due to socket contact resistance. A.2 for reduced thickness. For input voltages exceeding 60 Vdc but less than or Figure 9. Output Voltage and Efficiency Test Setup. equal to 75 Vdc, these converters have been evaluated to V . I O O the applicable requirements of BASIC INSULATION Efficiency = x 100 %  between secondary DC MAINS DISTRIBUTION input V . I IN IN (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a maximum 5 A fast-acting fuse in the ungrounded input lead. Feature Description Remote On/Off Two remote on/off options are available. Positive logic turns the module on during a logic high voltage on the ON/OFF pin, and off during a logic low. Negative logic September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 6 BATTERY Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current remote On/Off, device code suffix “1”, turns the module off during a logic high and on during a logic low. SENSE(+) SENSE(–) Vin+ VI(+) VO(+) Vout+ IO SUPPL Y LOAD II VI(-) VO(–) CONTACT CONT ACT AND Ion/off RESIST ANCE DISTRIBUTION LOSSE ON/OFF TRIM Figure 11. Circuit Configuration for remote sense . V on/off Input Undervoltage Lockout Vout- Vin- At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised Figure 10. Remote On/Off Implementation. above the undervoltage lockout turn-on threshold, . VUV/ON To turn the power module on and off, the user must Once operating, the module will continue to operate until supply a switch (open collector or equivalent) to control the input voltage is taken below the undervoltage turn- the voltage (V ) between the ON/OFF terminal and the on/off off threshold, VUV/OFF. V (-) terminal (see Figure 10). Logic low is - IN Overtemperature Protection 0.75V ≤ V ≤ 0.6V. The maximum I during a logic on/off on/off low is 0.15mA; the switch should maintain a logic low To provide protection under certain fault conditions, the level whilst sinking this current. unit is equipped with a thermal shutdown circuit. The During a logic high, the typical maximum Von/off unit will shutdown if the thermal reference point Tref generated by the module is 3.9V, and the maximum o (Figure 13), exceeds 125 C (typical), but the thermal allowable leakage current at V = 2.4V is 25μA. on/off shutdown is not intended as a guarantee that the unit If not using the remote on/off feature: will survive temperatures beyond its rating. The module can be restarted by cycling the dc input power for at For positive logic, leave the ON/OFF pin open. least one second or by toggling the remote on/off signal For negative logic, short the ON/OFF pin to VIN(-). for at least one second. If the auto-restart option (4) is Remote Sense ordered, the module will automatically restart upon cool- down to a safe temperature. Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense Output Overvoltage Protection connections (See Figure 11). The voltage between the The output over voltage protection scheme of the remote-sense pins and the output terminals must not modules has an independent over voltage loop to exceed the output voltage sense range given in the prevent single point of failure. This protection feature Feature Specifications table: latches in the event of over voltage across the output. [VO(+) – VO(–)] – [SENSE(+) – SENSE(–)]  0.5 V Cycling the on/off pin or input voltage resets the latching Although the output voltage can be increased by both protection feature. If the auto-restart option (4) is the remote sense and by the trim, the maximum ordered, the module will automatically restart upon an increase for the output voltage is not the sum of both. internally programmed time elapsing. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the Overcurrent Protection module is defined as the voltage at the output terminals multiplied by the output current. When using remote To provide protection in a fault (output overload) sense and trim, the output voltage of the module can be condition, the unit is equipped with internal increased, which at the same output current would current-limiting circuitry and can endure current increase the power output of the module. Care should be limiting continuously. At the point of current-limit taken to ensure that the maximum output power of the inception, the unit enters hiccup mode. If the unit is module remains at or below the maximum rated power not configured with auto–restart, then it will latch off (Maximum rated power = Vo,set x Io,max). following the over current condition. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. The average output current during hiccup is 10% I . O, max September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 7 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current output voltage set point. The following equation Pre-Bias Startup determines the required external resistor value to obtain The module starts up monotonically into pre-biased load a percentage output voltage change of ∆%: from 0.0Vdc up to Vout - 0.6Vdc. 5.11V  (100%)  511  o,set Output Reverse Current with Pre-Bias Output R   10.22 trimup   1.225% %   Voltage   The module does not sink appreciable current (current V V Where desired o,set   %  100 flow into the module) that can compromise the reliability   V o,set   of the product. This condition is valid for either during startup or shutdown over the output pre-bias voltage For example, to trim-up the output voltage of the module range of 0.0Vdc up to V -0.6Vdc. The test conditions for by 5% to 12.6V, Rtrim-up is calculated is as follows: out startup or shutdown are applicable for application and  % 5 removal of input voltage, Vin or by enabling and disabling  5.1112 .0 (100 5) 511  the module via remote On/Off. R    10 .22  trimup   1.225 5 5   Output Voltage Programming R  938 .8 trimup Trimming allows the output voltage set point to be The voltage between the V (+) and V (–) terminals must O O increased or decreased, this is accomplished by not exceed the minimum output overvoltage protection connecting an external resistor between the TRIM pin value shown in the Feature Specifications table. This limit and either the V (+) pin or the V (-) pin. O O includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim. V (+) V (+) IN O Although the output voltage can be increased by both the remote sense and by the trim, the maximum R trim-up increase for the output voltage is not the sum of both. ON/OFF The maximum increase is the larger of either the remote LOAD sense or the trim. The amount of power delivered by the V TRIM O module is defined as the voltage at the output terminals multiplied by the output current. When using remote R trim-down sense and trim, the output voltage of the module can be increased, which at the same output current would V (-) V (-) IN O increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = V x I ). O,set O,max Figure 12. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (Rtrim-down) between the Thermal Considerations TRIM pin and the VO(-) (or Sense(-)) pin decreases the The power modules operate in a variety of thermal output voltage set point. To maintain set point accuracy, environments; however, sufficient cooling should be the trim resistor tolerance should be ±1.0%. provided to help ensure reliable operation. The following equation determines the required external Considerations include ambient temperature, airflow, resistor value to obtain a percentage output voltage module power dissipation, and the need for increased change of ∆% reliability. A reduction in the operating temperature of 511   the module will result in an increase in reliability. The R   10 .22  trimdown   % thermal data presented here is based on physical   measurements taken in a wind tunnel. V V  Where o,set desired   %  100   V o,set   The thermal reference point, Tref, used in the specifications for open frame modules is shown in Figure For example, to trim-down the output voltage of the 13. For reliable operation this temperature should not module by 8% to 11.04V, Rtrim-down is calculated as o exceed 125 C. follows: % 8 511   R  10.22 trimdown   8   R  53 .655 trimdown Connecting an external resistor (R ) between the trim-up TRIM pin and the V (+) (or Sense (+)) pin increases the O September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 8 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current o AMBIENT TEMEPERATURE, T ( C) A Figure 13. T Temperature Measurement Location ref for Open frame Module. Figure 15. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction The thermal reference point, Tref, used in the from Vout(+) to Vout(-); Vin =48V. specifications for modules with heatplate is shown in Figure 14. For reliable operation this temperature should o not exceed 110 C. o AMBIENT TEMEPERATURE, T ( C) A Figure 16a. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction Figure 14. T Temperature Measurement Location ref from Vout(+) to Vout(-); Vin =48V. for Module with Heatplate. Heat Sink Attachment The heatplate used on the module does not have tapped Heat Transfer via Convection holes for heat sink attachment. A heat sink can be Increased airflow over the module enhances the heat attached using adhesives made for this purpose. When transfer via convection. Derating curves showing the curing these types of adhesives, do not exceed the maximum output current that can be delivered by o maximum storage temperature of 125 C. each module versus local ambient temperature (TA) for natural convection and up to 2m/s (400 LFM) forced airflow are shown in Figures 15 & 16a. Heat Transfer via Conduction Modules with heat plate option (-H) can also be used in Please refer to the Application Note “Thermal cold wall applications for heat transfer via conduction Characterization Process For Open-Frame Board- cooling. Fig 16b shows the derating curve for this Mounted Power Modules” for a detailed discussion of application. thermal aspects including maximum device temperatures. o COLDPLATE TEMEPERATURE, TA ( C) Figure 16b. Output Current Derating for the Module with Heatplate in a cold wall application; Vin =48V. September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 9 OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) OUTPUT CURRENT, I (A) O O O Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current of convection/IR. For reliable soldering the solder reflow Surface Mount Information profile should be established by accurately measuring Pick and Place the modules CP connector temperatures. The modules use an open frame construction and are 300 designed for a fully automated assembly process. The o P eak Temp 235 C modules are fitted with a label designed to provide a 250 Cooling large surface area for pick and place operations. The zone Heat zo ne label meets all the requirements for surface mount 200 o -1 o -1 1-4 Cs max 4 Cs processing, as well as safety standards, and is able to o withstand reflow temperatures of up to 300 C. The label 150 also carries product information such as product code, serial number and the location of manufacture. Soak zone T above 10 0 30-240s lim o 205 C 50 P reheat zo ne o -1 max 4 Cs 0 REFLOW TIME (S) Figure 18. Reflow Profile for Tin/Lead (Sn/Pb) process 240 235 230 Figure 17. Pick and Place Location. 225 220 Nozzle Recommendations 215 210 The module weight has been kept to a minimum by using open frame construction. Even so, these modules 205 have a relatively large mass when compared to 200 conventional SMT components. Variables such as nozzle 0 10 203040 5060 size, tip style, vacuum pressure and placement speed o should be considered to optimize this process. The Figure 19. Time Limit Curve Above 205 C for Tin/Lead (Sn/Pb) process minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Lead Free Soldering Oblong or oval nozzles up to 11 x 9 mm may also be The –Z version of the modules are lead-free (Pb-free) and used within the space available. RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Tin Lead Soldering Failure to observe the instructions below may result in The power modules are lead free modules and can be the failure of or cause damage to the modules and can soldered either in a lead-free solder process or in a adversely affect long-term reliability. conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each Pb-free Reflow Profile application board assembly. The following instructions must be observed when soldering these units. Failure to Power Modules (with the exception of modules that observe these instructions may result in the failure of or come with heat plate option –H) will comply with J-STD- cause damage to the modules, and can adversely affect 020 Rev. C (Moisture/Reflow Sensitivity Classification for long-term reliability. Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. In a conventional Tin/Lead (Sn/Pb) solder process peak This standard provides a recommended forced-air- o reflow temperatures are limited to less than 235 C (see convection reflow profile based on the volume and Figs 18 and 19). Typically, the eutectic solder melts at thickness of the package (Table 4-2). The suggested Pb- o 183 C, wets the land, and subsequently wicks the device free solder paste is Sn/Ag/Cu (SAC). The recommended connection. Sufficient time must be allowed to fuse the linear reflow profile using Sn/Ag/Cu solder is shown in plating on the connection to ensure a reliable solder Figure 20. joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 10 MAX TEMP SOLDER (C) REFLOW TEMP (C) Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Figure 21. Peak Temp. 240-245°C Ramp down max. 4°C/Sec 217°C 200°C Time Limited 90 Sec. above 217°C 150°C Figure 20. Recommended linear reflow profile using Preheat time 100-150 Sec. Sn/Ag/Cu solder. Ramp up max. 3°C/Sec 25°C MSL Rating Time Figure 21. Recommended linear reflow profile using The modules have a MSL rating as indicated in the Sn/Ag/Cu solder. Device Codes table, last page of this document.. Through-Hole Lead-Free Soldering Storage and Handling Information The recommended storage environment and handling The RoHS-compliant, Z option, through-hole products procedures for moisture-sensitive surface mount use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS- packages is detailed in J-STD-033 Rev. A (Handling, compliant components. They are designed to be Packing, Shipping and Use of Moisture/Reflow Sensitive processed through single or dual wave soldering Surface Mount Devices). Moisture Barrier Bags (MBB) machines. The pins have a RoHS-compliant, pure tin with desiccant are required for MSL ratings of 2 or finish that is compatible with both Pb and Pb-free wave greater. These sealed packages should not be broken soldering processes. A maximum preheat rate of 3C/s is until time of use. Once the original package is broken, suggested. The wave preheat process should be such the floor life of the product at conditions of  30°C and that the temperature of the power module board is kept 60% relative humidity varies according to the MSL rating below 210C. For Pb solder, the recommended pot (see J-STD-033A). The shelf life for dry packed SMT temperature is 260C, while the Pb-free solder pot is packages will be a minimum of 12 months from the bag 270C max. seal date, when stored at the following conditions: < 40° C, < 90% relative humidity. Reflow Lead-Free Soldering Information Post Solder Cleaning and Drying The RoHS-compliant through-hole products (with the exception of modules that come with heat plate option – Considerations H) can be processed with the following paste-through- Post solder cleaning is usually the final circuit-board hole Pb or Pb-free reflow process. assembly process prior to electrical board testing. The Max. sustain temperature: result of inadequate cleaning and drying can affect both 245C (J-STD-020C Table 4-2: Packaging the reliability of a power module and the testability of 3 Thickness>=2.5mm / Volume > 2000mm ), the finished circuit-board assembly. For guidance on Peak temperature over 245C is not suggested due to appropriate soldering, cleaning and drying procedures, the potential reliability risk of components under refer to GE Power Board continuous high-temperature. Mounted Power Modules: Soldering and Cleaning Min. sustain duration above 217C: 90 seconds Application Note (AN04-001) Min. sustain duration above 180C: 150 seconds Max. heat up rate: 3C/sec Max. cool down rate: 4C/sec In compliance with JEDEC J-STD-020C spec for 2 times reflow requirement. Pb-free Reflow Profile BMP module (with the exception of modules that come with heat plate option –H) will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. BMP will comply with JEDEC J-STD-020C specification for 3 times reflow requirement. The September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 11 Temp Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current EMC Considerations The circuit and plots in Figure 22 show a suggested configuration to meet the conducted emission limits of EN55022 Class B. Note: Customer is ultimately responsible for the proper layout, component selection, rating and verification of the suggeted parts based on end application. Reference Description MPN C1 X7R 2.2uf 100V 1210 SIZE C1210X225K101TX C2 100uF 100V UPW2A101MPD C3 2pcs 15nF 1500V in parallel C1210X153K152TX C4 2pcs 15nF 1500V in parallel C1210X153K152TX C5 1000pF 50V GRM155R71H102KA01D C6 10uF 25V TAJD106K025ESA C7 2pcs 15nF 1500V in parallel C1210X153K152TX C8 2pcs 15nF 1500V in parallel C1210X153K152TX C9 X7R 2.2uf 100V 1210 SIZE C1210X225K101TX C10 X7R 2.2uf 100V 1210 SIZE C1210X225K101TX Filter Two stage EMI filter FLT007A0 Without Filter With Filter Figure 22. EMC Considerations For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028). September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 12 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Mechanical Outline for Surface Mount Module (-S Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] PIN FUNCTION 1 VIN(+) 2 On/Off 3 VIN(-) 4 Vo(-) 5 Sense(-) 6 Trim 7 Sense(+) 8 Vo(+) September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 13 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Mechanical Outline for Through-Hole Module Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] PIN FUNCTION 1 VIN(+) 2 On/Off 3 VIN(-) 4 Vo(-) 5 Sense(-) 6 Trim 7 Sense(+) 8 Vo(+) September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 14 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Mechanical Outline for Through-Hole Module with Heat Plate (-H Option) Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] PIN FUNCTION 1 VIN(+) 2 On/Off 3 VIN(-) 4 Vo(-) 5 Sense(-) 6 Trim 7 Sense(+) 8 Vo(+) September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 15 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Recommended Pad Layout Dimensions are in millimeters and [inches]. Tolerances: x.x mm  0.5 mm [x.xx in.  0.02 in.] (Unless otherwise indicated) x.xx mm  0.25 mm [x.xxx in  0.010 in.] Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) SMT Recommended Pad Layout (Component Side View) Pin Function 1 Vi(+) 2 ON/OFF 3 Vi(-) 4 Vo(-) 5 SENSE(-) 6 TRIM 7 SENSE(+) 8 Vo(+) NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER TH Recommended Pad Layout (Component Side View) September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 16 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Packaging Details: The SMT modules are supplied in tape & reel as standard. Details of tape dimensions are shown below. Modules are shipped in quantities of 140 modules per reel. Tape Dimensions Dimensions are in millimeters. Surface Mount Module Tape & Reel Package September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 17 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Packaging Details (continued): The packaging details of the Through-Hole modules and modules with heat plate are shown below. Tape Dimensions Dimensions are in millimeters. Package Tray for Through-Hole Modules Package Tray for Modules with Heat Plate September 4, 2015 ©2014 General Electric Company. All rights reserved. Page 18 Data Sheet GE KBVW006A0B Series Sixteenth-Brick Power Modules 36–75Vdc Input; 12.0Vdc Output; 6A Output Current Ordering Information Please contact your GE Power Sales Representative for pricing, availability and optional features. Table 1. Device Codes Output Output On/Off Connector MSL Product Codes Input Voltage Comcodes Voltage Current Logic Type Rating KBVW006A0B41Z 48V (36-75Vdc) 12.0V 6A Negative Through hole 2a CC109170544 KBVW006A0B641Z 48V (36-75Vdc) 12.0V 6A Negative Through hole 2a 150024448 KBVW006A0B841Z 48V (36-75Vdc) 12.0V 6A Negative Through hole 2a 150024014 KBVW006A0B1-21Z 48V (36-75Vdc) 12.0V 6A Negative Through hole 2a 150037121 KBVW006A0B41-HZ 48V (36-75Vdc) 12.0V 6A Negative Through hole n/a 150021662 KBVW006A0B41-SRZ 48V (36-75Vdc) 12.0V 6A Negative Surface mount 2a 150021663 Table 2. Device Coding Scheme and Options Character and Position Characteristic Definition Form Factor K = Sixteenthth Brick K Family Designator BV Series BV = BARRACUDA Input Voltage W = Wide Range, 36V-75V W Output Current 006A0 = 006.0 Amps Maximum Output Current 006A0 Output Voltage B = 12.0V nominal B Omit = Default Pin Length shown in Mechanical Outline Figures Pin Length 6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.) 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.) 8 Action following Omit = Latching Mode Protective Shutdown 4 = Auto-restart following shutdown (Overcurrent/Overvoltage) 4 Omit = Positive Logic On/Off Logic 1 = Negative Logic 1 = Customer Specific Modified Code, Omit for Standard Code XY XY Customer Specific 21 = Meets 100us Vin dropout test with minimal external Cin 21 Omit = Standard open Frame Module Mechanical Features SR SR = Surface mount connections & tape/reel package H = Heat plate, for use with heat sinks H Omit = RoHS 5/6, Lead Based Solder Used RoHS Z = RoHS 6/6 Compliant, Lead free Z Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.ge.com/powerelectronics GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. September 4, 2015 ©2014 General Electric Company. All rights reserved. Version 1.95 Options Ratings