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GE CRITICAL POWER PIM300F6Z

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Description

300 W, - 38 -- 75 VDC Vin, Single Output, 3.3 VDC@2.4 A DC-DC Converter

Part Number

PIM300F6Z

Price

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Manufacturer

GE CRITICAL POWER

Lead Time

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Category

Capacitors »  DC-DC Converter

Specifications

Manufacturer

GE Critical Power

Manufacturers Part #

PIM300F6Z

Industry Aliases

CC109159190, PIM300F6Z

Brand

GE Critical Power

Series

PIM300

Factory Pack Quantity

20

Cooling Method

Convection

Dimensions

2.78 x 1.45 x 0.50"

Efficiency

98%

Input Type

DC

Input Voltage Nominal

- 48 VDC

Isolation

1500 VDC

Mechanical Style

Isolated

Mounting

Through Hole

Number of Outputs

1

Operating Temperature

- 5 to + 85°C

Output Amps 1

2.4 A

Output Voltage V1 Nominal

3.3 VDC

Package Type

Open Frame

Power

300 W

Subcategory

DC-DC Converter

Datasheet

pdf file

PIM300?TNR=Data%20Sheets|PIM300|generic.pdf

640 KiB

Extracted Text

Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc; 300W Input Features RoHS Compliant  300W / -48V telecom input power distribution  8W (3.3Vdc or 5.0Vdc) of isolated Management Power for IPM or other housekeeping functions  OR’ing functionality for the A/B & RTN power feeds as well as Enable A/B signals  Inrush protection / hot swap capability  Integral EMI filter designed for the ATCA board to meet CISPR Class B  Independent 72Vdc output for charging the external holdup capacitors resulting in significant board real estate savings and bleed resistor power dissipation  A/B Feed Loss or open fuse alarm (opto-isolated)  Protection: Reverse polarity, under voltage, input transient over voltage, over current & over Applications temperature  ATCA Front Board / Blade  High efficiency : 98% @ –48V / 300W (@25C)  Central Office Telecom equipment  -5 to 85ºC ambient temperature operation  High availability server and storage applications  Compact design : 70.6 mm x 36.8 mm x 12.7 mm  Compliant to RoHS EU Directive 2011/65/EU (Z versions) Options  Compliant to RoHS EU Directive 2011/65/EU under  Choice of System Management Power: exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this produc  3.3Vdc (PIM300F) twill no longer be RoHS compliant (non-Z versions)  5.0Vdc (PIM300A)  MTBF : 1,362,480 hours per TELCORDIA  Choice of short pin lengths  ISO** 9001 & ISO 14001 certified manufacturing facilities †  UL* 60950-1 Recognized, CSA C22.2 No. 60950-1-03 ‡ Certified, EN 60950-1 (VDE 0805: 2001-12) Licensed , CE  Designed and tested for Basic Insulation (1500Vdc) Description The PIM300X-series is the higher power version of its highly successful predecessor, the PIM200X series. Besides providing higher power over extended temperature range, the module is pin compatible and retains the same form factor as the PIM200X series for ease of upgrading to higher power or thermally challenging ATCA board designs. The PIM200X/300X series are a new class of power modules designed to greatly simplify the task of implementing dual redundant, hot swap – 48Vdc power distribution with EMI filtering on an ATCA or other telecom boards. The PIM300X, when used with a variety of GE’s dc-dc converters/POLs provides for a quick, simple and elegant power architecture solution to a wide variety of complex power requirements. While providing high reliability, innovative features and compact design at a low cost, the module significantly reduces the valuable telecom board real estate compared to conventional discrete designs. Besides processing the main –48V bus, the module greatly simplifies the task of powering the IPM (for ATCA applications), system management or other housekeeping functions by providing a completely isolated auxiliary 3.3V or 5.0V power bus. † * UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards December 5, 2016 ©2012 General Electric Company. All rights reserved. Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input 300W ATCA Board Typical Application F5 Short Pin (32) ENABLE_A ENABLE_AF (5) (8) 72V_CAP F6 Short Pin (27) (6) ENABLE_B ENABLE_BF F1 R_Bleed C_HLDP C_EMI (28) VRTN_A VRTN_AF (3) F2 +12V_BUS (29) VRTN_B VRTN_BF (4) (13) Vin(+) Vo(+) VRTN_OUT ATCA ATCA U1 (25) C_FLTR Backplane Zone 1 SHELF_GND (7) (Bus Converter) Connector U2 (Optional) R1 ON/OFF PIM300X Long Pin (30) EARLY_A -48V_OUT (9) F3 Vin(-) Vo(-) LOGIC_GND (33) (1) -48V_A -48V_AF MGMT_PWR (10) F4 Vcc C_EMI (34) -48V_B -48V_BF (2) 3K3 22uF IPMC Enable (Optional) R2 (12) Payload Power (System Long Pin (31) EARLY_B -48V_ALARM Controller) (11) (26) LOGIC_GND C _HLDP(F) [Pout(W ){Tholdup(ms)1.7}]/1.9 R _Bleed() 5.485 /C _HLDP(F) Suggested Bill of Materials (Note: Customer is ultimately responsible for the selection and verification of the suggested parts). Description MFR / PN Qty Ref Des Comments (Values) (or equivalent) 2 F1, F2 Fuse, SMT, 12 Amp VRTN_A, VRTN_B Bel Fuse: SSQ Series Littelfuse 451/ 453 Series 2 F3, F4 Fuse, SMT, 10 Amp -48V_A, -48V_B (Voltage rating >/=75V) 2 F5, F6 Fuse, SMT, 1/16th Amp ENABLE_A, ENABLE_B Nippon/Chemicon; KZE Series Capacitors, Al Electrolytic 2 C_FLTR Panasonic: FK Series (SMT) C_FLTR(Max,Total) = 330 uF 100uF/100V Nichicon: UJ Series Capacitors, Al Electrolytic Nippon/Chemicon; KZE Series C_HLDP(calculated)=1737 uF 4 470uF/80V Panasonic: FK Series (SMT) (for 300W &Tholdup=9.3msecs) C_HLDP OR OR OR Snap-In Radial 1 Capacitors, Al Electrolytic Panasonic / ECEC1KP182DL 1800uF/80V 30mm(OD) X 20mm(L) 1 R_Bleed SM, 2.9Kohms, 1W For C_HLDP=1800uF 2 C_EMI SM, 4700pF, >/=1500V Novacap, Murata or Syfer Size: >/=1210 1 U1 300W/12V Bus Converter GE: QBW025A0B1 1 U2 Opto-coupler (1500V) Fairchild: HMHA2801 Safety approved High Surge Power, *Optional; See “Design Consideration” 2 R1*, R2* KOA: SG73 (Size >/=1206) 15 Ohms Section December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 2 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Absolute Maximum Ratings: Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Typ Max Unit Input Voltage (Absolute values) Continuous All V 0 -48 -75 Vdc I Transient (Pulse duration above –75V = 1ms) All Vtr -75 -100 Vdc Temperature Normal Operating Ambient Temperature o All TA -5 85 C (See Thermal Considerations section) o Storage Temperature All T -55 125 C stg Power Input Power, Maximum Allowable All Pin, max 300 W Input to Output Voltage Differential All Vdelta 0.8V V o @ -48Vin & Pin,max, TA=25 C Efficiency All η 98 % o VIN=-48V, Pin,max, TA=25 C (MGMT_PWR=0W) Power Dissipation (Internal Module Dissipation @ Pin, max All Pdiss 12 W (with MGMT_PWR = 8W) Output Power, Maximum Deliverable All Pout 288 W (Management Power + Payload Power) Management Power, Maximum Deliverable All P 8 W MGMT_PWR (MGMT_PWR) Module Standby Power All PStdby 2.0 W (@-48Vin & MGMT_PWR=0W, Pout=0W) Isolation Input to MGMT_PWR Output Voltage All 1500 Vdc Input to SHELF_GND Voltage All 1500 Vdc Input to LOGIC_GND Voltage All 1500 Vdc LOGIC_GND to SHELF_GND All 9 MOhms Insulation Resistance with 100Vdc Test Voltage CAUTION: This power module is not internally fused. Both A & B feeds and their corresponding returns must be individually fused. To preserve maximum flexibility, internal fusing is not included. However, to achieve maximum safety and system protection, the safety agencies require a fast-acting fuse with a maximum rating of 15 Amps and Voltage Rating >/= 75Vdc for the –48AF, -48BF VRTN_AF & VRTN_BF feeds. Consult Fusing and fault protection (Section 4.1.4) of PICMG 3.0 ATCA specifications for additional information. Based on the information provided in this data sheet on inrush current and maximum dc input current, the same type of fuse with a lower rating can be used. Refer to the fuse manufacturer’s data sheet for further information. Electrical Specifications: Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 3 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Parameter Device Symbol Min Typ Max Unit Main Input (-48_AF,-48_BF,VRTN_AF,VRTN_BF); (Absolute values) Operating Input Voltage (Module will operate down to –36V depending on the All VI -38 -48 -75 Vdc output power and thermal environment but may not support holdup time requirements) Input Voltage Turn-on Threshold All V -34.3 -35.3 -36.0 Vdc UVHI (Module On) Under Voltage Lockout Threshold All VUVLO -32.4 -33.7 -34.1 Vdc (Module Off) Maximum current drain if input voltage falls below All I 10 mA stdby VUVLO for > 2 seconds. Maximum Input Current All II, max 9.0 Adc (VI=0V to -75Vdc, Pin=Pin, max) Inrush Transient 20 Ipk Adc All (@ -48 V and with C_FLTR = 200F) (<50s) I Ipk Adc Duration: 0.1 to 0.9msecs (Per PICMG 3.0 specs.) 44 Duration: 0.9 to 3 ms (Per PICMG 3.0 specs.) Ipk Adc 44 to 18 (Logarithmically declining) Ipk Adc Duration: 3 to 100ms (Per PICMG 3.0 specs.) 6.25 8.8 ENABLE A/B Signal Inputs (ENABLE_A, ENABLE_B) Adc Enable A / B Signals current drain (Vin = -75Vdc) All 700 Main Output (-48V_OUT, VRTN_OUT) C_FLTR F External Output Filter Capacitance (C_FLTR) All 200* 330 72V Holdup Capacitor Output (72V_CAP) Vdc 72V_CAP Output Voltage Tolerance 68.4 72.0 74.2 All Vdc 72V_CAP ON (OR’d) Input Voltage Threshold -36.2 -37.7 -39.2 A/B Feed Loss / Fuse Alarm Output (-48V_ALARM) -48V_ALARM is an Opto-isolated open collector output with the emitter internally referenced to LOGIC_GND. Alarm Characteristics: Power Good / Fuse Good = LO (Opto conducting) A or B Feed Loss / Fuse (open) = HI (Opto off) Vdc Alarm ON Input Voltage Threshold -36.1 -37.2 -38.2 All Vceo Vdc Opto Transistor Collector to Emitter Voltage 40 Opto Transistor Collector to Emitter Dark Current Iceo nA 100 (Opto Diode current, Id = 0A) Ic mA Opto Transistor Collector Current 5 V Vdc CE(sat) Opto Transistor Collector Saturation Voltage 0.3 Note: * See “Design Considerations” section for further information. December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 4 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Electrical Specifications (continued): Output Parameter Symbol Min Typ Max Unit Voltage Management Power Output (MGMT_PWR) Operating Input Voltage 3.3V/5.0V VI -36 -48 -75 Vdc Output Voltage Set-point 3.3V/5.0V VO, set -2.0 — +2.0 % VO, set (VI = -48Vdc, IO=IO, max, TA=25°C) Output Voltage 3.3V/5.0V VO -3.0 — +3.0 % VO, set (Over all operating input voltage, resistive Load and temperature conditions until end of life) Output Regulation 3.3V/5.0V Line (VI= VI,min to VI,max) — 0.05 0.2 %, VO, set Load (IO=IO, min to IO, max) — 0.05 0.2 %, VO, set Temperature (TA = TA, min to TA, max) — — 1.00 %, VO, set 3.3V/5.0V Output Ripple and Noise Measured across 22F Tantalum/ceramic capacitor o VI = VI,nom TA = 25 C, Io = Io,max — — 25 mV rms RMS (5Hz to 20 MHz bandwidth) Peak-to-peak (5Hz to 20MHz bandwidth) — — 75 mVp-p External Load Capacitance 3.3V/5.0V C 0 — 1000 F O,max 3.3V Io 0 — 2.4 Adc Output Current 5.0V Io 0 — 1.6 Adc 3.3V Io,lim 3 — Adc Output Current-Limit Inception 5.0V Io,lim 2.5 — Adc Output Short-circuit Current (RMS) 3.3V Io,sc — 8 — Arms 5.0V Io,sc — 6 — Arms Dynamic Response (di/dt =0.1A/μs, VIin= VIn,nom, TA=25°C) Load change from IO = 50% to 75% of IO, max, 3.3V/5.0V Peak Deviation Vpk 3 5 %, VO, set Settling Time (VO<10% of peak deviation) t 800 s s Turn-On Delay and Rise Times 3.3V/5.0V Tdelay 20 50 msec (Io = 80% of Io,max, T =25°C) A Output voltage overshoot %, V O, set 3.3V/5.0V 3% (Io = 80% of Io,max, VI = 48Vdc TA=25°C) 3.3V 3.7 5.4 Output Over Voltage Protection Vo, limit V 5.0V 5.6 7.0 General Specifications Parameter Min Typ Max Unit Calculated MTBF (Pin=80% of Pin, max, TA=40°C, Vin=-48Vdc) 1,362,480 Hours (Per Telcordia SR-332 Issue 1:Method 1 Case 3) Weight 34 (1.2) g (oz.)   December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 5 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input PIM300X Internal Block Diagram ENABLE_AF (5) ENABLE_BF (6) (8) 72V_CAP Normally=OFF VRTN_AF (3) Power Loss=ON VRTN_OR VRTN_BF (4) +48OUT (13) VRTN_OUT EMI (10) MGMT_PWR SHELF_GND (7) FILTER INRUSH DC/DC PROTECTION CONVERTER -48_AF (1) (9) -48V_OUT -48OUT -48_OR -48_BF (2) (12) -48V_ALARM Alarms & Monitoring LOGIC_GND (11) PIN FUNCTIONS PIN NO. PIN NAME I/O DESCRIPTION 1 -48_AF I -48V_A Feed (Externally Fused) 2 -48_BF I -48V_B Feed (Externally Fused) 3 VRTN_AF I VRTN_A Feed (Externally Fused) 4 VRTN_BF I VRTN_B Feed (Externally Fused) ENABLE_A Feed (Externally Fused) 5 ENABLE_AF I (Short Pin, connected to VRTN_A on the back plane) ENABLE_B Feed (Externally Fused) 6 ENABLE_BF I (Short Pin, connected to VRTN_B on the back plane) 7 SHELF_GND I/O Shelf / Chassis / Safety Ground 8 72V_CAP O Holdup/Bulk capacitor output voltage 9 -48V_OUT O OR’d and Inrush Protected –48V Output Bus 10 MGMT_PWR O 3.3V / 5.0V Isolated Management Power Output ( w.r.t LOGIC_GND) 11 LOGIC_GND I/O Logic / Secondary / Isolated Ground Opto-isolated -48V A/B Feed Loss or Open Fuse Alarm 12 -48V_ALARM O (w.r.t LOGIC_GND) 13 VRTN_OUT O OR’d and Inrush Protected VRTN Output Bus December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 6 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Characteristic Curves The following figures provide typical characteristics for the PIM300X modules at 25ºC. Figure 1. Inrush Current Figure 2. Inrush Current (Expanded view of the first surge current) CH1: -48_AF, CH2: -48V_OUT, CH1: -48_AF, CH2: -48V_OUT, CH4: Iin(-48_AF) CH4: Iin(-48_AF) Test Conditions: Test Conditions: -48_AF=-48Vdc, -48V_BF=0Vdc -48_AF=-48Vdc, -48V_BF=0Vdc PIM300F @ Max Load (Pin=300W) PIM300F @ Max Load (Pin=300W) C_FLTR=200μF, C_HLDP=4X470μF C_FLTR=200μF, C_HLDP=4X470μF Figure 3. Power Up into Shorted Output Figure 4. OR’ing Functionality when Feed B is shorted CH1: -48_AF, CH3: -48V_OUT, CH1: -48V_OUT(AC), CH2: Iin(-48_AF) CH2: Iin(-48_AF) CH3: Iin(-48_BF), CH4: 3.3V Output Test Conditions: Test Conditions: -48_AF=-48Vdc, -48V_BF=-50Vdc -48_AF=-48Vdc, -48V_BF=0Vdc I(-48V_OUT) = 1A PIM300F @ No Load C_FLTR=200μF, C_HLDP=4X470μF C_FLTR=200μF, C_HLDP=4X470μF December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 7 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Characteristic Curves (continued) The following figures provide typical characteristics for the PIM300X modules at 25ºC. Figure 5. Input Voltage Turn-On Threshold Figure 6. Input Voltage Turn-Off Threshold CH1: -48_AF, CH2: -48V_OUT, CH1: -48_AF, CH2: -48V_OUT, CH4: Iin(-48_AF) CH4: Iin(-48_AF) Test Conditions: Test Conditions: -48_AF=-48Vdc, -48V_BF=0Vdc -48_AF=-48Vdc, -48V_BF=0Vdc I(-48V_OUT)=1A, I(MGMT_PWR)=0A I(-48V_OUT)=1A, I(MGMT_PWR)=0A C_FLTR=200μF, C_HLDP=0μF C_FLTR=200μF, C_HLDP=0μF Figure 7. Loss of Feed A; Switchover to Feed B Figure 8. Holdup Performance; Loss of Feed A (with Feed B=0Vdc); Load=QBW CH1: Iin(-48V_AF), CH2: 48_AF, CH1: MGMT_PWR, CH2: -48V_OUT, CH3: 48V_OUT, CH4: 12Vout CH3: Iin(-48_AF), CH4: Iin(-48V_BF) Test Conditions: Test Conditions: 1. 48_AF= 43Vdc; 48V_BF=0 Vdc 1. Feed A (-48V_AF=60V) > Feed B (-48V_BF=48V) 2. Pin=300W; 12Vout=22.5A; 3.3V=2.42A 2. Fast Loss of Feed A; Switchover to Feed B 3. C_FLTR=200μF, C_HLDP=Qty4 X 470μF 3. PIM300F @ Max Load (Pin=300W) 4. C_FLTR=200μF, C_HLDP=4X470μF December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 8 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Characteristic Curves (continued) The following figures provide typical characteristics for the PIM300X modules at 25ºC (unless specified otherwise). Figure 9. Typical Start-Up of MGMT_PWR(3.3Vdc) with Figure 10. –48V_ALARM with Loss of Feed application of –48Vin. CH1: -48V_AF CH1: -48_AF CH2: -48_ALARM CH2: MGMT_PWR (3.3Vdc) Output Test Conditions: Test Conditions: 1. –48_AF=-48_BF= -48Vdc ; 1. –48_AF=-48Vdc; 2. PIM300F @ Max Load (Pin=300W) 2. PIM300F @ Max Load (Pin=300W) 3. C_FLTR=200μF, C_HLDP=4X470μF 3. C_FLTR=200μF, C_HLDP=4X470μF Figure 11. Input Transient Over voltage Protection Figure 12. Feeds Switchover Test from -48V_Feed A to - for 100V/1ms transient 75V_Feed B via Knife Switch CH1: -48_AF, CH3: -48V_OUT, CH4: +12V Out CH1: -48_BF, CH2: -48V_OUT, CH3: +12V Out CH2: MGMT_PWR (3.3Vdc) Output CH4: MGMT_PWR (3.3Vdc) Output Test Conditions: Test Conditions: 1. –48_AF=-48Vdc to -100V for 1msec 1. –48_AF=-48Vdc 2. -48V_OUT Load: QBW025A0B1 Bus Converter 2. -48_BF= 0 to -75Vdc via Knife Switch 3. MGMT_PWR Load = 3.3V @ 2.5 Ohms 3. -48V_OUT Load: QBW025A0B1 Bus Converter December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 9 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Thermal Derating Curves O O AMBIENT TEMPERATURE, TA C AMBIENT TEMPERATURE, TA C Figure 13-1. PIM300F Derating Output Current versus Local Figure 13-2. PIM300F Derating Output Current versus Ambient Temperature and Airflow Local Ambient Temperature and Airflow (Vin = -48Vdc; MGMT_PWR, 3.3V = 0W) (Vin = -48Vdc; MGMT_PWR, 3.3V=4W) O O AMBIENT TEMPERATURE, TA C AMBIENT TEMPERATURE, TA C Figure 13-3. PIM300F Derating Output Current versus Figure 13-4. PIM300F Derating Output Current versus Local Ambient Temperature and Airflow Local Ambient Temperature and Airflow (Vin = -48Vdc; MGMT_PWR, 3.3V=6W) (Vin = -48Vdc; MGMT_PWR, 3.3V = 8W) O O AMBIENT TEMPERATURE, T C AMBIENT TEMPERATURE, T C A A Figure 14-1. PIM300A Derating Output Current versus Figure 14-2. PIM300A Derating Output Current versus Local Ambient Temperature and Airflow Local Ambient Temperature and Airflow (Vin = -48Vdc; MGMT_PWR, 5.0V=0W) (Vin = -48Vdc; MGMT_PWR, 5.0V=4W) December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 10 OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Thermal Derating Curves (continued), Hot Spot & OTP Component Locations O O AMBIENT TEMPERATURE, TA C AMBIENT TEMPERATURE, TA C Figure 14-3. PIM300A Derating Output Current versus Local Figure 14-4. PIM300A Derating Output Current versus Ambient Temperature and Airflow Local Ambient Temperature and Airflow (Vin = -48Vdc; MGMT_PWR, 5.0V = 6W) (Vin = -48Vdc; MGMT_PWR, 5.0V=8W) T 1 ref Tref2 Tref3 o o o Tmax=125 C T =110 C T =120 C max max Top View Bottom View Figure 15. Thermal Reference Point,T locations ref Top View Bottom View o o Figure 16. Location of Over Temperature Protection thermal sensors, T (Trip Point = 125 C +/- 5 C) OTP December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 11 OUTPUT CURRENT, Io (A) OUTPUT CURRENT, Io (A) Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input connects the ENABLE_A to VRTN_A, ENABLE_B to Design Considerations VRTN_B, EARLY_A to -48V_A and EARLY_B to -48V_B. Introduction Optional EARLY_A & EARLY_B Connections: During hot insertion of the ATCA board, the Inrush Control circuit The PIM300X module is designed to support the limits the surge current to the C_FLTR capacitor. Advanced Telecommunications Computing Architecture However, due to the presence of internal EMI filter (ATCA) power entry distribution requirements for the capacitance (located before the Inrush Control circuit), Front Board / Blade per the PICMG 3.0 specifications. there is a possibility of a surge current that results in a The PICMG 3.0 specification defines the Mechanical, voltage sag for 5 to 10 microseconds. In most cases this Shelf Management Interface, Power Distribution, should not be of concern because all the ATCA Boards Thermal, Data I/O and Regulatory requirements for the and FRU’s on the -48V bus should be able to ride thru a next generation of modular telecom architecture 5msec/0Volt transient event per the PICMG 3.0 platform for use in Central Office telecom environments. specifications. In case this is undesirable, it is recommended that Precharge resistors, R1 & R2 (15 Ohms, with high surge capability) should be connected Input Pin Connections as shown in the Typical Application circuit. The ATCA board is specified to accept up to a maximum of 300W of input power via dual, redundant -48Vdc Output Pin Connections Feeds through the Zone 1 (Power and Management) connector, designated P10. The out pin connections of the PIM300X to the system The power connector provides board to backplane board is described below: engagement via pins of varying lengths. Please consult From To the PICMG 3.0 specifications for details. PIM200X Board The following are the design considerations of the input Notes Pin Pin pin connections of the PIM300X to the ATCA power Terminal Component connector. # Designation DC/DC 9 -48V_OUT Vin(-) (1) From Converter To ATCA DC/DC Connection PIM300X 13 VRTN_OUT Vin(+) (1) (P10 Connector) Converter Requirement Pin Pin Pin Pin 8 72V_CAP +ve C_HLDP (2) # Designation # Designation 10 MGMT_PWR Vcc (3) IPM/ 33 -48V_A Via Fuse(F3) 1 -48V_AF System Controller 12 -48V_ALARM (4) 34 -48V_B Via Fuse(F4) 2 -48V_BF 28 VRTN_A Via Fuse(F1) 3 VRTN_AF Notes: 29 VRTN_B Via Fuse(F2) 4 VRTN_BF (1) -48V Main Output Bus: 30 EARLY_A* Via Resistor(R1) 1 -48V_AF (Signal Names: -48V_OUT & VRTN_OUT) 31 EARLY_B* Via Resistor(R2) 2 -48V_BF This is the main -48V output bus that provides the 32 ENABLE_A Via Fuse(F5) 5 ENABLE_AF payload power to the downstream (one or more) DC/DC 27 ENABLE_B Via Fuse(F6) 6 ENABLE_BF converters. The PIM300X module does not regulate or 26 LOGIC_GND Direct 11 LOGIC_GND provide isolation from the input -48V A/B feeds. 25 SHELF_GND Direct 7 SHELF_GND The main functionality of the module is to provide -48V A/B Feeds OR’ing, inrush protection for hot swap * Optional capability and EMI filtering to attenuate the noise generated by the downstream DC/DC converters. The first pins to mate in the ATCA power connector are  The -48V_OUT pin connects to the Vin(-) pin the EARLY_A, EARLY_B, the two grounds (LOGIC_GND, and the VRTN_OUT pin connects to the Vin(+) SHELF_GND) and the two returns (VRTN_A, VRTN_B); pin of the DC/DC converter(s). followed by staggered connections of -48V_A and -  The -48V_OUT bus may require a fuse 48V_B power Feeds. The last pins to engage are the two short pins, ENABLE_A & ENABLE_B. The ATCA backplane depending on the power and fusing requirements of the DC/DC converter. December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 12 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input  Input filtering of the DC/DC converter is  The R_Bleed is connected across the 72V_CAP provided by C_FLTR close to the input pins of and VRTN_OUT pins of the PIM300X. the DC/DC converter(s); additional high frequency decoupling ceramic capacitors (0.01 (3) Management Power to 0.1μF are recommended for improved EMI (MGMT_PWR) performance. The MGMT_PWR output is an isolated secondary voltage  The maximum C_FLTR capacitance across all (3.3V for PIM300F or 5.0V for PIM300A) referenced to the downstream DC/DC converters should not LOGIC_GND that provides 8W(maximum) power to the exceed 330μF. The recommended capacitor IPM Controller for the ATCA board or to the power up voltage rating should be >/= 100Vdc. system controller for other applications.  The minimum C_FLTR capacitance (200μF)  Per PICMG 3.0 Specs, the ATCA board shall not recommendation is based on meeting the EMI consume more than 10W of input power; this requirements. Based on end systems test, the includes the standby power of PIM300X capacitance may be lowered if real estate is an (typically 1.7W) as well as all the on board issue. As a minimum, 50 μF to 100 μF is DC/DC power converters. It is the responsibility strongly recommended to stabilize the line of the board designer to insure that this impedance for proper startup of the DC/DC requirement is met prior to power-up rights converter. Refer to the DC/DC converter’s data have been negotiated with the Shelf Manager. sheet for the recommended capacitor.  The management power is available even when the input voltage is down to –36Vdc. (2) Holdup / Bulk Capacitor Output (72V_CAP)  No additional output capacitors are required, This output provides the high voltage (nominal 72Vdc) to but a 22μF tantalum/ceramic and a 0.01 to charge the C_BULK capacitor(s) to allow the ATCA board 0.1μF ceramic capacitors are highly to meet the 5ms, 0Volts transient requirements. recommended to contain the switching ripple  The 72V_CAP connects to the +ve terminals of and noise. the C_HLDP capacitors while the –ve terminals  Higher output capacitance may be required in of the C_HLDP connects to the -48V_OUT bus. case of large input line or output load transient  Since the 72V_CAP output is regulated to conditions. 72Vdc (+3%/-5%) and the capacitors are off (4) -48V Feed Loss or Open Fuse Alarm line during normal operation, the capacitors (-48V_ALARM) may be selected with voltage rating of >/= 80V to minimize the real estate on the board. The -48V_ALARM output is an opto-isolated signal internally referenced to the LOGIC_GND. The signal is an  The C_HLDP capacitance is dependent on the open collector output that requires an external pull up system power and the holdup time resistor. A 3.3K pull up resistor to 3.3V, MGMT_PWR (for requirements based on the following formula PIM300F) should suffice. During normal operation, the C _HLDP(F) [Pout(W ){Tholdup(ms)1.7}]/1.9 signal is LO (opto conducting). During fault condition, the opto shall stop conducting and the alarm signal shall  Bleed Resistor (R_Bleed) : The PICMG 3.0 assume a HI state. specifications requires a discharge mechanism (e.g. bleed resistor) to discharge the Safety Considerations holdup/bulk capacitance to less than -60Vdc and less than 20 joules within one second of For the system safety agency approval the power disconnection from the backplane. This module must be installed in compliance with the spacing requirement is fulfilled by installing R_Bleed and separation requirements of the end-use safety resistor that is selected based on the C_HLDP agency standards, i.e., UL 60950-1, CSA C22.2 No. selected in the previous step. The formula for 60950-1-03, and VDE 0850:2001-12 (EN60950-1) selecting the resistor is : Licensed. The power input to these units is to be provided with a R _Bleed () 5.485 /C _HLDP(F) maximum of 15 Amps fuses with a voltage rating of at least 75Vdc. For 300W and 9.3 ms holdup requirements, this Refer to “Thermal Consideration” section for additional results in a 2.9 Kohm resistor with 1W rating. safety considerations. Worst case power dissipation of R_Bleed (=2.9Kohms) @ -36V is 0.45W. December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 13 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Figure 17. Typical Class B EMC signature of PIM300F Feature Description with QBW025A0B1 module. A/B Feed OR’ing The module provides dedicated OR’ing functionality to For Safety and noise considerations, copper traces must both Feeds A & B and their corresponding returns. The not be routed directly beneath the power module (PWB following pairs of signals are OR’d within the module: top layer). C_EMI capacitors must make direct connections (preferably without vias) to the DC/DC -48V_AF / -48_BF, VRTN_AF / VRTN_BF, and ENABLE_AF/ module pins with as much copper width as possible. In ENABLE_B. case vias are necessary, allow for multiple connections The -48V A/B feeds and their corresponding returns are to the inner plane with vias placed outside the footprint OR’d via N-channel MOSFET power devices resulting in a of the module. For additional layout guide-lines, refer to highly efficient system compared to conventional diode GE’s FLT007A0 Input Filter Module data sheet. OR’ing scheme. Inrush Current Control / Hot Plug Functionality EMI Filtering The module provides inrush current control / hot plug The module incorporates an EMI filter that is designed capability. The peak value of the inrush current and the for the ATCA board to help meet the conducted duration complies with the PICMG 3.0’s Inrush Transient emissions requirements of CISPR 22 Class B when used specifications. The specifications shall be met with the in conjunction with GE DC/DC converters approved for external C_HLDP and C_FLTR capacitances as specified ATCA applications. The following insertion loss table is in the previous sections. provided as filter performance guidelines. The unique design of the module where the large energy Parameter Typical Unit storage capacitors are segregated from the input filter Common-Mode Insertion Loss capacitors allows the module to meet the stringent PICMG’s inrush transient specifications. In conventional 50 Ohms circuit, 200kHz 24 dB designs where the energy storage capacitors and the 50 Ohms circuit, 500kHz 32 dB filter capacitors are in parallel, it is extremely difficult to 50 Ohms circuit, 1MHz 39 dB meet the inrush transient specifications without over sizing the inrush control power FET. Differential-mode Insertion Loss 50 Ohms circuit, 200kHz 75 dB A/B Feed / Fuse Alarm (-48V_ALARM) 50 Ohms circuit, 500kHz 66 dB The module monitors the A & B feeds as well as the 50 Ohms circuit, 1MHz 61 dB status of the A&B feed fuses and provides an opto- isolated signal in case of loss of a feed or the opening of any of the fuses. The response time of the fault condition The following Figure 17 depicts the Class B EMI is < 100 μsec. The alarm signal indicates normal performance of PIM300F when tested with operation when the opto coupler transistor is conducting QBW025A0B1 on a stand alone basis (ATCA form factor and a fault condition by an off state. load board with resistive loads and only power, return and chassis connections to the backplane). The external Holdup Capacitor Charging Current (72V_CAP) filtering components are identified in the Typical The module employs a unique feature to charge and Application circuit. recharge the external energy storage holdup/bulk capacitors (C_HLDP) within seconds from the application of power to a nominal voltage of 72Vdc (+3%/-5%) resulting in significant reduction in the real estate on the board in order to comply with the PICMG 3.0’s 0 volt/5msec transient requirements. Since the 72V_CAP is also regulated, there is further reduction in real estate board because now 80V capacitors with higher capacitance can be used instead of the >/= 100Vdc caps required in conventional designs. The maximum rate of input voltage change (dv/dt) shall not exceed 5V/ms when the -72V_CAP output is switched on the - 48V_OUT/VRTN_OUT bus. December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 14 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input The holdup capacitors are switched on automatically the downstream DC/DC converters from input voltage when there is a loss of power on both feeds A & B or transients exceeding -75Vdc. The TVS is rated for 1500W both feeds have dropped below –38V (typical). of Peak Pulse Power with the Breakdown Voltage (VBR) of 77.8V to 86.0V. Upon restoration of normal power on either or both feeds, the holdup capacitors automatically go off line Input Reverse Polarity Protection and are recharged for the next power loss event. The module shall not be damaged from reverse polarity Note 1: The holdup capacitors and the bleed resistor are connection in the event of miswiring of either input feeds installed external to the module. at the shelf input terminals. Note 2: The PICMG 3.0’s requirements for the 0 Vdc transient for 5ms is normally interpreted as the holdup Over Temperature Protection time requirement by many. In actuality, when one To provide over temperature protection in a fault considers the additional specification of 50V/ms fall time condition, the unit will shutdown if any thermal sensor and 12.5 V/ms rise time to and from the 0Vdc condition, reference point TOTP (identified in Figure 16), exceeds the this leads to a 9.3ms of total hold up time requirement o o trip point of 125 C (+/- 5 C). The thermal shutdown is not when power is interrupted at -43Vdc. The 72V_CAP intended as a guarantee that the unit will survive output provided by the module to charge the bulk temperatures beyond its rating. The module will capacitors provides a tremendous advantage over automatically restart after it cools down. conventional designs in terms of real estate During thermal design verification, it is recommended requirements on the board with the added benefit of the usage of 80V capacitor rating vs >/=100V. that these temperatures be monitored by IR Thermal imaging camera. In case thermocouples are used, the The holdup time, Tholdup, is defined for power loss at - thermocouple contacts should be attached as close as 43Vdc input and the C_HLDP maintaining -48V_OUT bus possible to the thermal sensors (thermistors) on the PWB to at least –36Vdc (which is the minimum operating but not directly on the thermistors themselves. Attaching voltage of the downstream DC/DC bus converter). the contacts directly to the thermocouple is not Note 3: Bleed Resistor (R_Bleed): Normally, the bleed recommended as this will result in false temperature resistor is not required as there is sufficient standby measurements due to the heat sink effect of the current drain within the module to bleed the holdup thermocouple wires. capacitors from 75V to 60V in 1 second as specified in the PICMG 3.0. Again, due to the PIM300X’s unique Management Power (MGMT_PWR) design, the placement of the bleed resistor results in  The module provides up to 8W of 3.3V significantly less power dissipation compared with (PIM300F) or 5.0V (PIM300A) of isolated output conventional designs where the bleed resistor is sized for power referred to LOGIC_GND. -75Vdc continuous maximum voltage and -100V transients.  The management power is available automatically as soon as the input voltage Over Current Protection (- 48V_OUT Bus) levels are within –36Vdc to –75Vdc. To provide protection in a fault (output overload or short  The output is short circuit and over voltage circuit) condition, the unit is equipped with internal protected with low ripple and noise. current-limiting circuitry. The unit can endure current overload conditions continuously or shutdown due to Thermal Considerations thermal protection depending on operating ambient Power modules operate in a variety of thermal temperature conditions. The unit will restart environments; however, sufficient cooling should be automatically once the overload condition is removed. provided to help ensure reliable operation. Input Under Voltage Lockout Considerations include ambient temperature, airflow, At input voltages below the input under voltage lockout module power dissipation, and the need for increased threshold limit (VUVLO), the module operation is disabled. reliability. A reduction in the operating temperature of The module will begin to operate at an input voltage the module will result in an increase in reliability. The above the under voltage lockout turn-on threshold(VUVHI). thermal data presented here is based on physical Please see the Electrical Specifications Table for the measurements taken in a wind tunnel. The test set-up is specified trip points. shown below in Figure 18. Transient Over Voltage Protection The module incorporates a Transient Voltage Suppressor. This feature helps protect the module and December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 15 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input through single or dual wave soldering machines. The pins have an RoHS-compliant finish that is compatible 25.4_ W in d Tu n n e l (1.0) with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave PW Bs Po w e r M o d u le preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. If additional information is needed, please consult with your Sales 76.2_ (3.0) representative for more details. x Reflow Lead-Free Soldering Information Pro b e Lo c a tio n fo r m e a su rin g The RoHS-compliant through-hole products can be 5.97_ airflo w a n d (0.235) am bient processed with Pb-free reflow process. However, since te m p e ra ture the modules are not packed in vacuum sealed Moisture A ir Barrier Bags (MBB), the modules need to be baked to flo w prevent any printed wiring board (PWB) delamination. The modules should be baked at 125C for 4 hours prior to use. The recommended reflow profile is described Figure 18. Thermal Test Set-up below. Max. sustain temperature : 245C (J-STD-020C Table 4-2: Packaging The thermal derating curves were generated with the 3 Thickness>=2.5mm / Volume > 2000mm ), airflow parallel to the long axis of the module (input to Peak temperature over 245C is not suggested due to output). the potential reliability risk of components under The thermal reference points, T 1 to T 3 are identified ref ref continuous high-temperature. in Figure 15. For reliable operation and to comply with Min. sustain duration above 217C: 90 seconds the module’s safety requirements, these temperatures Min. sustain duration above 180C: 150 seconds should not exceed the limits specified in the figure. Max. heat up rate: 3C/sec Exceeding these temperatures may or may not trigger Max. cool down rate: 4C/sec the over temperature shutdown. The output power of In compliance with JEDEC J-STD-020C spec for 2 times the module should not exceed the rated input power of reflow requirement. the module i.e. 300W. Pb-free Reflow Profile Please refer to the Application Note “Thermal Characterization Process For Open-Frame Board- BMP module will comply with J-STD-020 Rev. C Mounted Power Modules” for a detailed discussion of (Moisture/Reflow Sensitivity Classification for thermal aspects including maximum device Nonhermetic Solid State Surface Mount Devices) for both temperatures. Pb-free solder profiles and MSL classification procedures. BMP will comply with JEDEC J-STD-020C specification for 3 times reflow requirement. The Heat Transfer via Convection suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The recommended linear reflow profile using Sn/Ag/Cu Increased airflow over the module enhances the heat solder is shown in Figure 19. transfer via convection. Thermal derating curves showing the maximum output current that can be delivered by the module versus local ambient temperature (TA) are shown in the Thermal derating curves, Figs 13-1 to 13-4 for PIM300F and Figs 14-1 to 14-4 for PIM300A. Manufacturing Considerations Through-Hole Lead Free Soldering Information The RoHS-compliant through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 16 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Figure 19. Recommended linear reflow profile using Sn/Ag/Cu solder. Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to GE’s Electronics Board Mounted Power Modules: Soldering and Cleaning Application Note (AP01-056EPS) December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 17 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Mechanical Outline Dimensions are in millimeters and (inches). Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated] x.xx mm  0.25 mm (x.xxx in  0.010 in.) TOP VIEW SIDE VIEW BOTTOM VIEW December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 18 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Recommended Pad Layout Dimensions are in millimeters and (inches). Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated] x.xx mm  0.25 mm (x.xxx in  0.010 in.) NOTES: 1. For the pins, use 1.27(mm) / 0.050(in) diameter Plated Trough Hole December 5, 2016 ©2012 General Electric Company. All rights reserved. Page 19 Data Sheet GE PIM300X Series; ATCA Board Power Input Modules -38 to -75Vdc ; 300W Input Ordering Information Please contact your GE’s Sales Representative for pricing, availability and optional features. Table 1. Device Code Auxiliary Auxiliary Connector Type Power Input Voltage Output Output & Product codes Comcodes Rating Voltage Current Options Thru Hole/RoHS -38 to -75 Vdc 300W 3.3Vdc 2.4A PIM300FZ CC109113858 Thru Hole/RoHS -38 to -75 Vdc 300W 5.0Vdc 1.6A PIM300AZ CC109122322 Thru Hole/RoHS -38 to -75 Vdc 300W 3.3Vdc 2.4A PIM300F6Z CC109159190 Thru Hole/RoHS -38 to -75 Vdc 300W 5.0Vdc 2.4A PIM300A6Z 150038129 Table 2. Device Options Option Device Code Suffix Short pins: 3.68mm ± 0.25mm 6 (0.145 in. ± 0.010 in.) Short pins: 2.79mm ± 0.25mm 8 (0.110 in. ± 0.010 in.) Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. December 5, 2016 ©2012 General Electric Company. All International rights reserved. Version 1.6

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