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GE CRITICAL POWER UVT020A0X43-SRZ

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Description

NON-ISOLATED DC/DC CONVERTERS 3-14.4VIN .6-5.5VOUT POSITIVE LOGIC

Part Number

UVT020A0X43-SRZ

Price

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Manufacturer

GE CRITICAL POWER

Lead Time

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Category

Capacitors »  DC-DC Converter

Specifications

Manufacturer

GE Critical Power

Manufacturers Part #

UVT020A0X43-SRZ

Industry Aliases

CC109159752, UVT020A0X43-SRZ

Brand

GE Critical Power

Packaging

Tape and Reel

Series

MicroDLynx

Factory Pack Quantity

200

Cooling Method

Air-Cooled

Dimensions

0.80 x 0.45 x 0.33"

Efficiency

95.2%

Industry

Industrial

Input Type

DC

Mechanical Style

Non-Isolated / POL

Mounting

SMD/SMT

Operating Temperature

- 40 to + 85°C

Output Amps 1

20 A

Package Type

Open Frame

Subcategory

DC-DC Converter

Datasheet

pdf file

Data%20Sheets%7CUVT020A0X%7Cgeneric.pdf

785 KiB

Extracted Text

Data Sheet GE TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Features ▪ Compliant to RoHS EU Directive 2011/65/EU (Z versions) ▪ Compliant to RoHS EU Directive 2011/65/EU under exemption 7b (Lead solder exemption). Exemption 7b will expire after June 1, 2016 at which time this produc twill no longer be RoHS compliant (non-Z versions) ▪ Compliant to IPC-9592 (September 2008), Category 2, Class II ▪ DOSA based ▪ Wide Input voltage range (3Vdc-14.4Vdc) ▪ Output voltage programmable from 0.6Vdc to 5.5Vdc via external resistor TM ▪ Tunable Loop to optimize dynamic output voltage response ▪ Flexible output voltage sequencing EZ-SEQUENCE RoHS Compliant ▪ Power Good signal Applications ▪ Fixed switching frequency with capability of external synchronization ▪ Distributed power architectures ▪ Output over current protection (non-latching) ▪ Intermediate bus voltage applications ▪ Over temperature protection ▪ Telecommunications equipment ▪ Remote On/Off ▪ Servers and storage applications ▪ Ability to sink and source current ▪ Networking equipment ▪ Cost efficient open frame design ▪ Industrial equipment ▪ Small size: 20.32 mm x 11.43 mm x 8.5 mm (0.8 in x 0.45 in x 0.334 in) Vin+ Vout+ VIN VOUT ▪ Wide operating temperature range [-40°C to 105°C VS+ PGOOD (Ruggedized: -D), 85°C(Regular)] RTUNE MODULE nd † SEQ ▪ UL* 60950-1 2 Ed. Recognized, CSA C22.2 No. 60950-1- CTUNE ‡ nd 07 Certified, and VDE (EN60950-1 2 Ed.) Licensed Cin TRIM Co ▪ ISO** 9001 and ISO 14001 certified manufacturing RTrim facilities ON/OFF SIG_GND SYNC GND VS- GND Description TM The 20A Analog MicroDLynx power modules are non-isolated dc-dc converters that can deliver up to 20A of output current. These modules operate over a wide range of input voltage (VIN = 3Vdc-14.4Vdc) and provide a precisely regulated output voltage from 0.6Vdc to 5.5Vdc, programmable via an external resistor. Features include remote On/Off, adjustable output voltage, over TM current and over temperature protection. The module also includes the Tunable Loop feature that allows the user to optimize the dynamic response of the converter to match the load with reduced amount of output capacitance leading to savings on cost and PWB area. * UL is a registered trademark of Underwriters Laboratories, Inc. † CSA is a registered trademark of Canadian Standards Association. ‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V. ** ISO is a registered trademark of the International Organization of Standards September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 1 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Device Symbol Min Max Unit Input Voltage All V -0.3 15 V IN Continuous SEQ, SYNC, VS+ All 7 V Operating Ambient Temperature All T -40 85 °C A (see Thermal Considerations section) Storage Temperature All T -55 125 °C stg Electrical Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit Operating Input Voltage All VIN 3  14.4 Vdc Maximum Input Current All IIN,max 19 Adc (VIN=3V to 14V, IO=IO, max ) VO,set = 0.6 I 69 mA IN,No load Input No Load Current Vdc (VIN = 12Vdc, IO = 0, module enabled) VO,set = IIN,No load 134 mA 5Vdc Input Stand-by Current All IIN,stand-by 16.4 mA (V = 12Vdc, module disabled) IN 2 2 Inrush Transient All I t 1 A s Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 1μH source impedance; VIN =0 to 14V, IO= IOmax ; All 50 mAp-p See Test Configurations) Input Ripple Rejection (120Hz) All -64 dB September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 2 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Output Voltage Set-point (with 0.1% tolerance for external All VO, set -1.0 +1.0 % VO, set resistor used to set output voltage) Output Voltage (Over all operating input voltage, resistive All V -3.0  +3.0 % V O, set O, set load, and temperature conditions until end of life) Adjustment Range (selected by an external resistor) (Some output voltages may not be possible depending on the All VO 0.6 5.5 Vdc input voltage – see Feature Descriptions Section) Remote Sense Range All 0.5 Vdc Output Regulation (for V ≥ 2.5Vdc) O Line (V =V to V ) All +0.4 % V IN IN, min IN, max  O, set Load (IO=IO, min to IO, max) All  10 mV Output Regulation (for VO < 2.5Vdc) Line (V =V to V ) All 5 mV IN IN, min IN, max  Load (IO=IO, min to IO, max) All  10 mV Temperature (Tref=TA, min to TA, max) All  0.4 % VO, set Output Ripple and Noise on nominal output (V =V and I =I to I Co = 0.1μF // 22 μF ceramic IN IN, nom O O, min O, max capacitors) Peak-to-Peak (5Hz to 20MHz bandwidth) All 50 100 mV  pk-pk RMS (5Hz to 20MHz bandwidth) All 20 38 mV rms 1 External Capacitance TM Without the Tunable Loop ESR ≥ 1 mΩ All CO, max 2x47  2x47 μF TM With the Tunable Loop ESR ≥ 0.15 mΩ All C 2x47  1000 μF O, max ESR ≥ 10 mΩ All CO, max 2x47  10000 μF Output Current (in either sink or source mode) All Io 0 20 Adc Output Current Limit Inception (Hiccup Mode) All IO, lim 130 % Io,max (current limit does not operate in sink mode) Output Short-Circuit Current All I 1.4 Arms O, s/c (V ≤250mV) ( Hiccup Mode ) O Efficiency V = 0.6Vdc η 79.2 % O,set VIN= 12Vdc, TA=25°C VO, set = 1.2Vdc η 87.1 % IO=IO, max , VO= VO,set VO,set = 1.8Vdc η 90.4 % V = 2.5Vdc η 92.6 % O,set V = 3.3Vdc η 93.8 % O,set VO,set = 5.0Vdc η 95.2 % Switching Frequency All fsw  500  kHz 1 TM External capacitors may require using the new Tunable Loop feature to ensure that the module is stable as well as getting the best TM transient response. See the Tunable Loop section for details. September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 3 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Electrical Specifications (continued) Parameter Device Symbol Min Typ Max Unit Frequency Synchronization All Synchronization Frequency Range All 425 600 kHz High-Level Input Voltage All V 2.0 V IH Low-Level Input Voltage All V 0.4 V IL Input Current, SYNC All I 100 nA SYNC Minimum Pulse Width, SYNC All t 100 ns SYNC Maximum SYNC rise time All t 100 ns SYNC_SH General Specifications Parameter Device Min Typ Max Unit Calculated MTBF (I =0.8I , T =40°C) Telecordia Issue 2 15,45 O O, max A All Hours Method 1 Case 3 5,614 4.54 Weight g (oz.)   (0.16) Feature Specifications Unless otherwise indicated, specifications apply overall operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to GND) Device code with suffix “4” – Positive Logic (See Ordering Information) Logic High (Module ON) Input High Current All IIH  1 mA Input High Voltage All VIH 2 V V  IN,max Logic Low (Module OFF) Input Low Current All IIL   1 mA Input Low Voltage All VIL -0.2 0.6 V  Device Code with no suffix – Negative Logic (See Ordering Information) (On/OFF pin is open collector/drain logic input with external pull-up resistor; signal referenced to GND) Logic High (Module OFF) Input High Current All IIH ― ― 1 mA Input High Voltage All VIH 2 ― V Vdc IN, max Logic Low (Module ON) Input low Current All IIL ― ― 10 μA Input Low Voltage All VIL -0.2 ― 0.6 Vdc September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 4 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Feature Specifications (cont.) Parameter Device Symbol Min Typ Max Units Turn-On Delay and Rise Times (V =V , I =I V to within ±1% of steady state) IN IN, nom O O, max , O Case 1: On/Off input is enabled and then input power is applied (delay from instant at which V = V until Vo = All Tdelay ― 1.2 ― msec IN IN, min 10% of Vo, set) Case 2: Input power is applied for at least one second and then the On/Off input is enabled (delay from instant at All Tdelay ― 0.8 ― msec which Von/Off is enabled until Vo = 10% of Vo, set) Output voltage Rise time (time for Vo to rise from All Trise ― 2.7 ― msec 10% of Vo, set to 90% of Vo, set) o Output voltage overshoot (T = 25 C A VIN= VIN, min to VIN, max,IO = IO, min to IO, max) 3.0 % VO, set With or without maximum external capacitance Over Temperature Protection All Tref 120 °C (See Thermal Considerations section) Tracking Accuracy (Power-Up: 2V/ms) All VSEQ –Vo 100 mV (Power-Down: 2V/ms) All VSEQ –Vo 100 mV (VIN, min to VIN, max; IO, min to IO, max VSEQ < Vo) Input Undervoltage Lockout Turn-on Threshold All 3.25 Vdc Turn-off Threshold All 2.6 Vdc Hysteresis All 0.25 Vdc Resolution of Adjustable Input Under Voltage Threshold All 500 mV PGOOD (Power Good) Signal Interface Open Drain, V  5VDC supply Overvoltage threshold for PGOOD ON All 108 %VO, set Overvoltage threshold for PGOOD OFF All 110 %V O, set Undervoltage threshold for PGOOD ON All 92 %V O, set Undervoltage threshold for PGOOD OFF All 90 %VO, set Pulldown resistance of PGOOD pin All 50  Sink current capability into PGOOD pin All 5 mA * Over temperature Warning – Warning may not activate before alarm and unit may shutdown before warning September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 5 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Characteristic Curves TM o The following figures provide typical characteristics for the 20A Analog MicroDLynx at 0.6Vo and 25 C. 90 22 85 18 80 0.5m/s (100LFM) Vin=3.3V 75 14 NC 70 Vin=14V 1m/s Vin=12V 10 65 (200LFM) 2m/s 60 (400LFM) 1.5m/s 6 (300LFM) 55 50 2 0 5 10 15 20 55 65 75 85 95 105 O OUTPUT CURRENT, I (A) AMBIENT TEMPERATURE, T C O A Figure 2. Derating Output Current versus Ambient Figure 1. Converter Efficiency versus Output Current. Temperature and Airflow. TIME, t (1s/div) TIME, t (20s /div) Figure 4. Transient Response to Dynamic Load Change from Figure 3. Typical output ripple and noise (CO=2x47μF 50% to 100% at 12Vin, Cout= 1x47uF +11x330uF CTune=47nF, ceramic, VIN = 12V, Io = Io,max, ). RTune=178 ohms TIME, t (2ms/div) TIME, t (2ms/div) Figure 6. Typical Start-up Using Input Voltage (VIN = 12V, Io = Figure 5. Typical Start-up Using On/Off Voltage (Io = Io,max). Io,max). September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 6 OUTPUT VOLTAGE ON/OFF VOLTAGE OUTPUT VOLTAGE V (V) (200mV/div) V (V) (5V/div) V (V) (10mV/div) EFFICIENCY,  (%) O ON/OFF O OUTPUT VOLTAGE INPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE V (V) (200mV/div) V (V) (5V/div) I (A) (10Adiv) V (V) (10mV/div) OUTPUT CURRENT, Io (A) O IN O O GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Characteristic Curves TM o The following figures provide typical characteristics for the 20A Analogl MicroDLynx at 1.2Vo and 25 C. 95 22 90 18 85 Vin=3.3V NC 80 Vin=14V 14 75 0.5m/s Vin=12V (100LFM) 70 10 65 2m/s 1.5m/s (400LFM) (300LFM) 60 6 55 1m/s (200LFM) 50 2 0 5 10 15 20 55 65 75 85 95 105 O OUTPUT CURRENT, I (A) AMBIENT TEMPERATURE, T C O A Figure 8. Derating Output Current versus Ambient Figure 7. Converter Efficiency versus Output Current. Temperature and Airflow. TIME, t (1s/div) TIME, t (20s /div) Figure 10. Transient Response to Dynamic Load Change from Figure 9. Typical output ripple and noise (CO=2x47μF 50% to 100% at 12Vin, Cout= 1x47uF +5x330uF, CTune=10nF ceramic, VIN = 12V, Io = Io,max, ). & RTune=178 ohms TIME, t (2ms/div) TIME, t (2ms/div) Figure 12. Typical Start-up Using Input Voltage (VIN = 12V, Io = Figure 1. Typical Start-up Using On/Off Voltage (Io = Io,max). Io,max). September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 7 OUTPUT VOLTAGE ON/OFF VOLTAGE OUTPUT VOLTAGE V (V) (500mV/div) V (V) (5V/div) V (V) (20mV/div) EFFICIENCY,  (%) O ON/OFF O OUTPUT VOLTAGE INPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE V (V) (500mV/div) V (V) (5V/div) I (A) (10Adiv) V (V) (20mV/div) OUTPUT CURRENT, Io (A) O IN O O GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Characteristic Curves TM o The following figures provide typical characteristics for the 20A Analog MicroDLynx at 1.8Vo and 25 C. 95 22 90 18 Vin=3.3V NC 85 14 Vin=14V 1m/s Vin=12V (200LFM) 0.5m/s 80 10 (100LFM) 1.5m/s (300LFM) 75 6 2m/s (400LFM) 70 2 0 5 10 15 20 55 65 75 85 95 105 O OUTPUT CURRENT, I (A) AMBIENT TEMPERATURE, T C O A Figure 14. Derating Output Current versus Ambient Figure 13. Converter Efficiency versus Output Current. Temperature and Airflow. TIME, t (1s/div) TIME, t (20s /div) Figure 16. Transient Response to Dynamic Load Change from Figure 15. Typical output ripple and noise (C =2X47μF O 50% to 100% at 12Vin, Cout= 2x47uF +3x330uF, ceramic, VIN = 12V, Io = Io,max, ). CTune=5600pF & RTune=220 ohms TIME, t (2ms/div) TIME, t (2ms/div) Figure 18. Typical Start-up Using Input Voltage (VIN = 12V, Io = Figure 17. Typical Start-up Using On/Off Voltage (Io = Io,max). Io,max). September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 8 OUTPUT VOLTAGE ON/OFF VOLTAGE OUTPUT VOLTAGE V (V) (500mV/div) V (V) (5V/div) V (V) (20mV/div) EFFICIENCY,  (%) O ON/OFF O OUTPUT VOLTAGE INPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE V (V) (500mV/div) V (V) (5V/div) I (A) (10Adiv) V (V) (20mV/div) OUTPUT CURRENT, Io (A) O IN O O GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Characteristic Curves TM o The following figures provide typical characteristics for the 20A Analog MicroDLynx at 2.5Vo and 25 C. 100 22 Vin=12V 95 18 NC 0.5m/s 90 (100LFM) 14 1m/s Vin=4.5V (200LFM) 85 Vin=14V 10 1.5m/s 80 (300LFM) 6 2m/s 75 (400LFM) 70 2 0 5 10 15 20 55 65 75 85 95 105 O OUTPUT CURRENT, I (A) AMBIENT TEMPERATURE, T C O A Figure 20. Derating Output Current versus Ambient Figure 19. Converter Efficiency versus Output Current. Temperature and Airflow. TIME, t (1s/div) TIME, t (20s /div) Figure 22. Transient Response to Dynamic Load Change from Figure 21. Typical output ripple and noise (C =2x47μF O 50% to 100% at 12Vin, Cout= 2x47uF +2x330uF, ceramic, VIN = 12V, Io = Io,max, ). CTune=3300pF & RTune=220 ohms TIME, t (2ms/div) TIME, t (2ms/div) Figure 24. Typical Start-up Using Input Voltage (VIN = 12V, Io = Figure 23. Typical Start-up Using On/Off Voltage (Io = Io,max). Io,max). September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 9 OUTPUT VOLTAGE ON/OFF VOLTAGE OUTPUT VOLTAGE V (V) (1V/div) V (V) (5V/div) V (V) (20mV/div) EFFICIENCY,  (%) O ON/OFF O OUTPUT VOLTAGE INPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE V (V) (1V/div) V (V) (5V/div) I (A) (10Adiv) V (V) (20mV/div) OUTPUT CURRENT, Io (A) O IN O O GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Characteristic Curves TM o The following figures provide typical characteristics for the 20A Analog MicroDLynx at 3.3Vo and 25 C. 100 22 Vin=12V 95 18 NC NC 90 0 0..5 5m m//s s 14 ( (1 10 00 0L LF FM M) ) Vin=14V 1 1m m//s s 85 Vin=4.5V ( (2 20 00 0L LF FM M) ) 1 1..5 5m m//s s 10 80 ( (3 30 00 0L LF FM M) ) 6 75 2 2m m//s s ( (4 40 00 0L LF FM M) ) 70 2 0 5 10 15 20 55 65 75 85 95 105 O OUTPUT CURRENT, I (A) AMBIENT TEMPERATURE, T C O A Figure 26. Derating Output Current versus Ambient Figure 25. Converter Efficiency versus Output Current. Temperature and Airflow. TIME, t (1s/div) TIME, t (20s /div) Figure 28 Transient Response to Dynamic Load Change from Figure 27. Typical output ripple and noise (C =2x47μF O 50% to 100% at 12Vin, Cout= 5x47uF +1x330uF, ceramic, VIN = 12V, Io = Io,max, ). CTune=2200pF & RTune=220 ohms TIME, t (2ms/div) TIME, t (2ms/div) Figure 30. Typical Start-up Using Input Voltage (VIN = 12V, Io = Figure 29. Typical Start-up Using On/Off Voltage (Io = Io,max). Io,max). September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 10 OUTPUT VOLTAGE ON/OFF VOLTAGE OUTPUT VOLTAGE V (V) (1V/div) V (V) (5V/div) V (V) (50mV/div) EFFICIENCY,  (%) O ON/OFF O OUTPUT VOLTAGE INPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE V (V) (1V/div) V (V) (5V/div) I (A) (10Adiv) V (V) (50mV/div) OUTPUT CURRENT, Io (A) O IN O O GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Characteristic Curves TM o The following figures provide typical characteristics for the 20A Analog MicroDLynx at 5Vo and 25 C. 100 22 Vin=12V 95 18 NC 90 0.5m/s (100LFM) 14 1m/s Vin=7V (200LFM) Vin=14V 85 1.5m/s (300LFM) 10 80 2m/s (400LFM) 6 75 70 2 0 5 10 15 20 55 65 75 85 95 105 O OUTPUT CURRENT, I (A) AMBIENT TEMPERATURE, T C O A Figure 32. Derating Output Current versus Ambient Figure 31. Converter Efficiency versus Output Current. Temperature and Airflow. TIME, t (1s/div) TIME, t (20s /div) Figure 34. Transient Response to Dynamic Load Change from Figure 33. Typical output ripple and noise (C =2x47μF O 50% to 100% at 12Vin, Cout= 8x47uF, CTune=1500pF & ceramic, VIN = 12V, Io = Io,max, ). RTune=220 ohms TIME, t (2ms/div) TIME, t (2ms/div) Figure 36. Typical Start-up Using Input Voltage (VIN = 12V, Io = Figure 35. Typical Start-up Using On/Off Voltage (Io = Io,max). Io,max). September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 11 OUTPUT VOLTAGE ON/OFF VOLTAGE OUTPUT VOLTAGE V (V) (2V/div) V (V) (5V/div) V (V) (50mV/div) EFFICIENCY,  (%) O ON/OFF O OUTPUT VOLTAGE INPUT VOLTAGE OUTPUT CURRENT, OUTPUT VOLTAGE V (V) (2V/div) V (V) (5V/div) I (A) (10Adiv) V (V) (50mV/div) OUTPUT CURRENT, Io (A) O IN O O GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current 70 Design Considerations 2x47uF Ext Cap 4x47uF Ext Cap 60 Input Filtering 6x47uF Ext Cap 8x47uF Ext Cap TM The 20A Analog MicroDLynx module should be 50 connected to a low ac-impedance source. A highly 40 inductive source can affect the stability of the module. An input capacitance must be placed directly adjacent to the 30 input pin of the module, to minimize input ripple voltage and ensure module stability. 20 To minimize input voltage ripple, ceramic capacitors are 10 recommended at the input of the module. Figure 37 shows the input ripple voltage for various output voltages at 20A 0 of load current with 2x22 µF or 3x22 µF ceramic capacitors 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 and an input of 12V. Output Voltage(Volts) 450 Figure 38. Output ripple voltage for various output 400 2x22uF voltages with external 2x47 µF, 4x47 µF or 6x47 µF 350 ceramic capacitors at the output (20A load). Input voltage 3x22 uF is 12V. 300 250 200 Safety Considerations 150 For safety agency approval the power module must be 100 installed in compliance with the spacing and separation 50 requirements of the end-use safety agency standards, i.e., 0 UL 60950-1 2nd, CSA C22.2 No. 60950-1-07, DIN EN 60950- 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 1:2006 + A11 (VDE0805 Teil 1 + A11):2009-11; EN 60950- 1:2006 + A11:2009-03. Output Voltage (Vdc) For the converter output to be considered meeting the Figure 37. Input ripple voltage for various output requirements of safety extra-low voltage (SELV), the input voltages with 2x22 µF or 3x22 µF ceramic capacitors at must meet SELV requirements. The power module has the input (20A load). Input voltage is 12V. extra-low voltage (ELV) outputs when all inputs are ELV. The UVT040A0X series were tested using an external Output Filtering Littelfuse 456 series fast-acting fuse rated at 30 A, 100 Vdc These modules are designed for low output ripple voltage in the ungrounded input. and will meet the maximum output ripple specification with 0.1 µF ceramic and 2x47 µF ceramic capacitors at the output of the module. However, additional output filtering may be required by the system designer for a number of reasons. First, there may be a need to further reduce the output ripple and noise of the module. Second, the dynamic response characteristics may need to be customized to a particular load step change. To reduce the output ripple and improve the dynamic response to a step load change, additional capacitance at the output can be used. Low ESR polymer and ceramic capacitors are recommended to improve the dynamic response of the module. Figure 38 provides output ripple information for different external capacitance values at various Vo and a full load current of 20A. For stable operation of the module, limit the capacitance to less than the maximum output capacitance as specified in the electrical specification table. Optimal performance of the TM module can be achieved by using the Tunable Loop feature described later in this data sheet. September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 12 Input Ripple Voltage (mVp-p) Ripple (mVp-p) GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Analog Feature Descriptions Monotonic Start-up and Shutdown Remote On/Off TM The module has monotonic start-up and shutdown behavior The 20A Analog MicroDLynx power modules feature an for any combination of rated input voltage, output current On/Off pin for remote On/Off operation. Two On/Off logic and operating temperature range. options are available. In the Positive Logic On/Off option, (device code suffix “4” – see Ordering Information), the Startup into Pre-biased Output module turns ON during a logic High on the On/Off pin and The module can start into a prebiased output as long as the turns OFF during a logic Low. With the Negative Logic On/Off prebias voltage is 0.5V less than the set output voltage. option, (no device code suffix, see Ordering Information), the module turns OFF during logic High and ON during logic Low. Analog Output Voltage Programming The On/Off signal should be always referenced to ground. For either On/Off logic option, leaving the On/Off pin The output voltage of the module is programmable to any disconnected will turn the module ON when input voltage is voltage from 0.6dc to 5.5Vdc by connecting a resistor present. between the Trim and SIG_GND pins of the module. Certain restrictions apply on the output voltage set point depending For positive logic modules, the circuit configuration for using on the input voltage. These are shown in the Output Voltage the On/Off pin is shown in Figure 39. When the external vs. Input Voltage Set Point Area plot in Fig. 41. The Upper transistor Q2 is in the OFF state, the internal transistor Q7 is Limit curve shows that for output voltages lower than 1V, turned ON, which turn Q3 OFF which keeps Q6 OFF and Q5 the input voltage must be lower than the maximum of OFF. This allows the internal PWM #Enable signal to be pulled 14.4V. The Lower Limit curve shows that for output voltages up by the internal 3.3V, thus turning the module ON. When higher than 0.6V, the input voltage needs to be larger than transistor Q2 is turned ON, the On/Off pin is pulled low, which the minimum of 3V. . turns Q7 OFF which turns Q3, Q6 and Q5 ON and the internal 16 PWM #Enable signal is pulled low and the module is OFF. A suggested value for Rpullup is 20k. 14 For negative logic On/Off modules, the circuit configuration is 12 Upper shown in Fig. 40. The On/Off pin should be pulled high with an 10 external pull-up resistor (suggested value for the 3V to 14V 8 input range is 20Kohms). When transistor Q2 is in the OFF state, the On/Off pin is pulled high, transistor Q3 is turned ON. 6 This turns Q6 ON, followed by Q5 turning ON which pulls the 4 internal ENABLE low and the module is OFF. To turn the Lower 2 module ON, Q2 is turned ON pulling the On/Off pin low, turning transistor Q3 OFF, which keeps Q6 and Q5 OFF 0 resulting in the PWM Enable pin going high. 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 Output Voltage (V) 3.3V DLYNX MODULE ENABLE +VIN VIN 47K 470 20K Figure 41. Output Voltage vs. Input Voltage Set Point Area 100pF Rpullup 20K Q6 4.7K plot showing limits where the output voltage can be set I Q3 100K Q5 ON/OFF 20K 20K 20K for different input voltages. Q7 2K + 20K 20K Q2 20K V ON/OFF _ GND V (+) V (+) IN O VS+ Figure 39. Circuit configuration for using positive On/Off ON/OFF logic. LOAD TRIM DLYNX MODULE 3.3V +VIN ENABLE R trim 47K Rpullup 470 100pF Q6 I SIG_GND ON/OFF 20K 4.7K Q3 Q5 100K + VS─ 20K Q2 2K 20K V 20K ON/OFF Caution – Do not connect SIG_GND to GND elsewhere in the _ GND layout Figure 42. Circuit configuration for programming output Figure 40. Circuit configuration for using negative On/Off voltage using an external resistor. logic. September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 13 Input Voltage (v) GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Without an external resistor between Trim and SIG_GND pins, Vo the output of the module will be 0.6Vdc. To calculate the Rmargin-down value of the trim resistor, Rtrim for a desired output voltage, should be as per the following equation: MODULE  12  Q2 Rtr im  k    Vo 0.6 Trim   Rmargin-up Rtrim is the external resistor in kΩ Rtrim Vo is the desired output voltage. Table 1 provides Rtrim values required for some common Q1 output voltages. SIG_GND Table 1 VO, set (V) Rtrim (KΩ) Figure 43. Circuit Configuration for margining Output 0.6 Open voltage. 0.9 40 Output Voltage Sequencing 1.0 30 1.2 20 The power module includes a sequencing feature, EZ- 1.5 13.33 SEQUENCE that enables users to implement various types of output voltage sequencing in their applications. This is 1.8 10 accomplished via an additional sequencing pin. When not 2.5 6.316 using the sequencing feature, leave it unconnected. 3.3 4.444 5.0 2.727 The voltage applied to the SEQ pin should be scaled down by the same ratio as used to scale the output voltage down Remote Sense to the reference voltage of the module. This is accomplished The power module has a Remote Sense feature to minimize by an external resistive divider connected across the the effects of distribution losses by regulating the voltage sequencing voltage before it is fed to the SEQ pin as shown between the sense pins (VS+ and VS-). The voltage drop in Fig. 44. In addition, a small capacitor (suggested value between the sense pins and the VOUT and GND pins of the 100pF) should be connected across the lower resistor R1. module should not exceed 0.5V. For all DLynx modules, the minimum recommended delay Analog Voltage Margining between the ON/OFF signal and the sequencing signal is 10ms to ensure that the module output is ramped up Output voltage margining can be implemented in the module according to the sequencing signal. This ensures that the by connecting a resistor, R , from the Trim pin to the margin-up module soft-start routine is completed before the ground pin for margining-up the output voltage and by sequencing signal is allowed to ramp up. connecting a resistor, Rmargin-down, from the Trim pin to output pin for margining-down. Figure 43 shows the circuit DLynx Module configuration for output voltage margining. The POL V Programming Tool, available at www.GEpower.com under the SEQ Downloads section, also calculates the values of Rmargin-up and R for a specific output voltage and % margin. Please margin-down 20K consult your local GE technical representative for additional details. SEQ R1=Rtrim SIG_GND 100 pF Figure 44. Circuit showing connection of the sequencing signal to the SEQ pin. When the scaled down sequencing voltage is applied to the SEQ pin, the output voltage tracks this voltage until the output reaches the set-point voltage. The final value of the sequencing voltage must be set higher than the set-point voltage of the module. The output voltage follows the sequencing voltage on a one-to-one basis. By connecting September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 14 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current multiple modules together, multiple modules can track their Synchronization output voltages to the voltage applied on the SEQ pin. The module switching frequency can be synchronized to a To initiate simultaneous shutdown of the modules, the SEQ signal with an external frequency within a specified range. pin voltage is lowered in a controlled manner. The output Synchronization can be done by using the external signal voltage of the modules tracks the voltages below their set- applied to the SYNC pin of the module as shown in Fig. 45, point voltages on a one-to-one basis. A valid input voltage with the converter being synchronized by the rising edge of must be maintained until the tracking and output voltages the external signal. The Electrical Specifications table reach ground potential. specifies the requirements of the external SYNC signal. If the SYNC pin is not used, the module should free run at the Overcurrent Protection default switching frequency. If synchronization is not being To provide protection in a fault (output overload) condition, used, connect the SYNC pin to GND. the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of MODULE current-limit inception, the unit enters hiccup mode. The unit operates normally once the output current is brought back into its specified range. SYNC + Overtemperature Protection ─ To provide protection in a fault condition, the unit is equipped GND with a thermal shutdown circuit. The unit will shut down if the o overtemperature threshold of 120 C(typ) is exceeded at the Figure 45. External source connections to synchronize thermal reference point Tref .Once the unit goes into thermal switching frequency of the module. shutdown it will then wait to cool before attempting to Dual Layout restart. Identical dimensions and pin layout of Analog and Digital Input Undervoltage Lockout MicroDLynx modules permit migration from one to the other At input voltages below the input undervoltage lockout limit, without needing to change the layout. In both cases the trim the module operation is disabled. The module will begin to resistor is connected between trim and signal ground. The operate at an input voltage above the undervoltage lockout output of the analog module cannot be trimmed down to turn-on threshold. 0.45V Power Good The module provides a Power Good (PGOOD) signal that is implemented with an open-drain output to indicate that the output voltage is within the regulation limits of the power module. The PGOOD signal will be de-asserted to a low state if any condition such as overtemperature, overcurrent or loss of regulation occurs that would result in the output voltage going ±10% outside the setpoint value. The PGOOD terminal can be connected through a pullup resistor (suggested value 100K) to a source of 5VDC or lower. September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 15 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current TM different values of ceramic output capacitors up to 1000uF Tunable Loop that might be needed for an application to meet output ripple The module has a feature that optimizes transient response and noise requirements. Selecting R and C according TUNE TUNE TM of the module called Tunable Loop . to Table 3 will ensure stable operation of the module. In applications with tight output voltage limits in the presence External capacitors are usually added to the output of the of dynamic current loading, additional output capacitance module for two reasons: to reduce output ripple and noise will be required. Table 3 lists recommended values of R TUNE (see Figure 38) and to reduce output voltage deviations from and CTUNE in order to meet 2% output voltage deviation limits the steady-state value in the presence of dynamic load for some common output voltages in the presence of a 10A current changes. Adding external capacitance however to 20A step change (50% of full load), with an input voltage of affects the voltage control loop of the module, typically 12V. causing the loop to slow down with sluggish response. Larger values of external capacitance could also cause the Please contact your GE technical representative to obtain module to become unstable. more details of this feature as well as for guidelines on how TM to select the right value of external R-C to tune the module The Tunable Loop allows the user to externally adjust the for best transient performance and stable operation for other voltage control loop to match the filter network connected to TM output capacitance values. the output of the module. The Tunable Loop is implemented by connecting a series R-C between the VS+ and TRIM pins of the module, as shown in Fig. 46. This R-C allows the user to Table 2. General recommended values of of R and TUNE externally adjust the voltage loop feedback compensation of CTUNE for Vin=12V and various external ceramic capacitor the module. combinations. Co 2x47F 4x47F 6x47F 10x47F 20x47F VOUT R TUNE 330 330 270 220 180 VS+ CTUNE 47pF 560pF 1200pF 2200pF 4700pF RTune Table 3. Recommended values of R and C to obtain TUNE TUNE CO MODULE transient deviation of 2% of Vout for a 10A step load with CTune Vin=12V. TRIM Vo 5V 3.3V 2.5V 1.8V 1.2V 0.6V 2x47F 2x47F 1x47F 1x47F RTrim 5x47F + + + + + Co 8x47F 1x330F 2x330F 3x330F 5x330F 11x330F Polymer SIG_GND Polymer Polymer Polymer Polymer GND R TUNE 220 220 220 220 180 180 C TUNE 1500pF 2200pF 3300pF 5600pF 10nF 47nF V Figure. 46. Circuit diagram showing connection of R 100mV 64mV 49mV 36mV 24mV 12mV TUME and CTUNE to tune the control loop of the module. Note: The capacitors used in the Tunable Loop tables are 47 μF/3 mΩ ESR ceramic and 330 μF/12 mΩ ESR polymer Recommended values of R and C for different output TUNE TUNE capacitors. capacitor combinations are given in Tables 2 and 3. Table 3 shows the recommended values of R and C for TUNE TUNE September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 16 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Thermal Considerations The thermal reference points, Tref used in the specifications Power modules operate in a variety of thermal environments; are also shown in Figure 49. For reliable operation the however, sufficient cooling should always be provided to help o temperatures at these points should not exceed 130 C. The ensure reliable operation. output power of the module should not exceed the rated Considerations include ambient temperature, airflow, module power of the module (Vo,set x Io,max). power dissipation, and the need for increased reliability. A Please refer to the Application Note “Thermal reduction in the operating temperature of the module will Characterization Process For Open-Frame Board-Mounted result in an increase in reliability. The thermal data presented Power Modules” for a detailed discussion of thermal here is based on physical measurements taken in a wind aspects including maximum device temperatures. tunnel. The test set-up is shown in Figure 48. The preferred airflow direction for the module is in Figure 49. 25.4_ Wind Tunnel (1.0) PWBs Power Module Figure 49. Preferred airflow direction and location of hot- spot of the module (Tref). 76.2_ (3.0) x Probe Location for measuring 12.7_ airflow and (0.50) ambient temperature Air flow Figure 48. Thermal Test Setup. September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 17 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current subjected to three shocks in each direction along three axes Shock and Vibration for a total of eighteen shocks. The ruggedized (-D version) of the modules are designed to withstand elevated levels of shock and vibration to be able to Operating vibration per Mil Std 810F, Method 514.5 operate in harsh environments. The ruggedized modules Procedure I: have been successfully tested to the following conditions: The ruggedized (-D version) modules are designed and tested to vibration levels as outlined in MIL-STD-810F, Non operating random vibration: Method 514.5, and Procedure 1, using the Power Spectral Random vibration tests conducted at 25C, 10 to 2000Hz, for Density (PSD) profiles as shown in Table 7 and Table 8 for all 30 minutes each level, starting from 30Grms (Z axis) and up to axes. Full compliance with performance specifications was 50Grms (Z axis). The units were then subjected to two more required during the performance test. No damage was tests of 50Grms at 30 minutes each for a total of 90 minutes. allowed to the module and full compliance to performance specifications was required when the endurance Operating shock to 40G per Mil Std. 810F, Method 516.4 environment was removed. The module was tested per MIL- Procedure I: STD-810, Method 514.5, Procedure I, for functional The modules were tested in opposing directions along each (performance) and endurance random vibration using the of three orthogonal axes, with waveform and amplitude of performance and endurance levels shown in Table 7 and the shock impulse characteristics as follows: Table 8 for all axes. The performance test has been split, with one half accomplished before the endurance test and All shocks were half sine pulses, 11 milliseconds (ms) in one half after the endurance test (in each axis). The duration duration in all 3 axes. of the performance test was at least 16 minutes total per axis and at least 120 minutes total per axis for the Units were tested to the Functional Shock Test of MIL-STD- endurance test. The endurance test period was 2 hours 810, Method 516.4, Procedure I - Figure 516.4-4. A shock minimum per axis. magnitude of 40G was utilized. The operational units were Table 7: Performance Vibration Qualification - All Axes PSD Level PSD Level PSD Level Frequency (Hz) Frequency (Hz) Frequency (Hz) (G2/Hz) (G2/Hz) (G2/Hz) 10 1.14E-03 170 2.54E-03 690 1.03E-03 30 5.96E-03 230 3.70E-03 800 7.29E-03 40 9.53E-04 290 7.99E-04 890 1.00E-03 50 2.08E-03 340 1.12E-02 1070 2.67E-03 90 2.08E-03 370 1.12E-02 1240 1.08E-03 110 7.05E-04 430 8.84E-04 1550 2.54E-03 130 5.00E-03 490 1.54E-03 1780 2.88E-03 140 8.20E-04 560 5.62E-04 2000 5.62E-04 Table 8: Endurance Vibration Qualification - All Axes PSD Level PSD Level PSD Level Frequency (Hz) Frequency (Hz) Frequency (Hz) (G2/Hz) (G2/Hz) (G2/Hz) 10 0.00803 170 0.01795 690 0.00727 30 0.04216 230 0.02616 800 0.05155 40 0.00674 290 0.00565 890 0.00709 50 0.01468 340 0.07901 1070 0.01887 90 0.01468 370 0.07901 1240 0.00764 110 0.00498 430 0.00625 1550 0.01795 130 0.03536 490 0.01086 1780 0.02035 140 0.0058 560 0.00398 2000 0.00398 September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 18 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Example Application Circuit Requirements: Vin: 12V Vout: 1.8V Iout: 15A max., worst case load transient is from 10A to 15A Vout: 1.5% of Vout (27mV) for worst case load transient Vin, ripple 1.5% of Vin (180mV, p-p) Vin+ Vout+ VIN VOUT VS+ PGOOD RTUNE MODULE SEQ CTUNE TRIM CI3 CI2 CI1 CO3 CO1 CO2 RTrim ON/OFF SIG_GND GND VS- SYNC GND CI1 Decoupling cap - 1x0.047F/16V ceramic capacitor (e.g. Murata LLL185R71C473MA01) CI2 3x22F/16V ceramic capacitor (e.g. Murata GRM32ER61C226KE20) CI3 470F/16V bulk electrolytic CO1 Decoupling cap - 1x0.047F/16V ceramic capacitor (e.g. Murata LLL185R71C473MA01) CO2 N.A. CO3 3 x 330F/6.3V Polymer (e.g. Sanyo Poscap) CTune 4700pF ceramic capacitor (can be 1206, 0805 or 0603 size) RTune 330 ohms SMT resistor (can be 1206, 0805 or 0603 size) RTrim 10k SMT resistor (can be 1206, 0805 or 0603 size, recommended tolerance of 0.1%) September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 19 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Mechanical Outline Dimensions are in millimeters and (inches). Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated] x.xx mm  0.25 mm (x.xxx in  0.010 in.) NC NC NC NC NC PIN FUNCTION PIN FUNCTION 1 1 ON/OFF 10 SYNC 2 VIN 11 NC 3 SEQ 12 NC 4 GND 13 NC 5 TRIM 14 SIG_GND 6 VOUT 15 NC 7 VS+ 16 NC 8 VS- 9 PG 1 If unused, connect to Ground. September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 20 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Recommended Pad Layout Dimensions are in millimeters and (inches). Tolerances: x.x mm  0.5 mm (x.xx in.  0.02 in.) [unless otherwise indicated] x.xx mm  0.25 mm (x.xxx in  0.010 in.) NC NC NC NC NC PIN FUNCTION PIN FUNCTION 2 1 ON/OFF 10 SYNC 2 VIN 11 NC 3 SEQ 12 NC 4 GND 13 NC 5 TRIM 14 SIG_GND 6 VOUT 15 NC 7 VS+ 16 NC 8 VS- 9 PG 2 If unused, connect to Ground. September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 21 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Packaging Details TM The 12V Analog MicroDLynx 20A modules are supplied in tape & reel as standard. Modules are shipped in quantities of 200 modules per reel. All Dimensions are in millimeters and (in inches). Reel Dimensions: Outside Dimensions: 330.2 mm (13.00) Inside Dimensions: 177.8 mm (7.00”) Tape Width: 44.00 mm (1.732”) September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 22 GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Moisture barrier bags (MBB) with desiccant are required for Surface Mount Information MSL ratings of 2 or greater. These sealed packages should not be broken until time of use. Once the original package is Pick and Place broken, the floor life of the product at conditions of  30°C TM and 60% relative humidity varies according to the MSL rating The 20A Analog MicroDLynx modules use an open frame (see J-STD-033A). The shelf life for dry packed SMT packages construction and are designed for a fully automated will be a minimum of 12 months from the bag seal date, assembly process. The modules are fitted with a label when stored at the following conditions: < 40° C, < 90% designed to provide a large surface area for pick and place relative humidity. operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to 300 Per J-STD-020 Rev. C o withstand reflow temperatures of up to 300 C. The label also Peak Temp 260°C carries product information such as product code, serial 250 number and the location of manufacture. Cooling 200 Zone * Min. Time Above 235°C Nozzle Recommendations 15 Seconds 150 The module weight has been kept to a minimum by using Heating Zone *Time Above 217°C 1°C/Second 60 Seconds open frame construction. Variables such as nozzle size, tip 100 style, vacuum pressure and placement speed should be considered to optimize this process. The minimum 50 recommended inside nozzle diameter for reliable operation is 3mm. The maximum nozzle outer diameter, which will safely 0 Reflow Time (Seconds) fit within the allowable component spacing, is 7 mm. Figure 50. Recommended linear reflow profile using Bottom Side / First Side Assembly Sn/Ag/Cu solder. This module is not recommended for assembly on the bottom side of a customer board. If such an assembly is attempted, Post Solder Cleaning and Drying Considerations components may fall off the module during the second reflow Post solder cleaning is usually the final circuit-board process. assembly process prior to electrical board testing. The result Lead Free Soldering of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the The modules are lead-free (Pb-free) and RoHS compliant and finished circuit-board assembly. For guidance on fully compatible in a Pb-free soldering process. Failure to appropriate soldering, cleaning and drying procedures, refer observe the instructions below may result in the failure of or to Board Mounted Power Modules: Soldering and Cleaning cause damage to the modules and can adversely affect long- Application Note (AN04-001). term reliability. Pb-free Reflow Profile Power Systems will comply with J-STD-020 Rev. C (Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices) for both Pb-free solder profiles and MSL classification procedures. This standard provides a recommended forced-air-convection reflow profile based on the volume and thickness of the package (table 4- 2). The suggested Pb-free solder paste is Sn/Ag/Cu (SAC). For questions regarding Land grid array(LGA) soldering, solder volume; please contact GE for special manufacturing process instructions. The recommended linear reflow profile using Sn/Ag/Cu solder is shown in Fig. 50. Soldering outside of the recommended profile requires testing to verify results and performance. MSL Rating TM The 20A Analog MicroDLynx modules have a MSL rating of 2a. Storage and Handling The recommended storage environment and handling procedures for moisture-sensitive surface mount packages is detailed in J-STD-033 Rev. A (Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices). September 7, 2017 ©2017 General Electric Company. All rights reserved. Page 23 Reflow Temp (°C) GE Data Sheet TM 20A Analog MicroDLynx : Non-Isolated DC-DC Power Modules 3Vdc –14.4Vdc input; 0.6Vdc to 5.5Vdc output; 20A Output Current Ordering Information Please contact your GE Sales Representative for pricing, availability and optional features. Table 9. Device Codes Input Output Output On/Off Device Code Sequencing Comcodes Voltage Range Voltage Current Logic UVT020A0X3-SRZ 3 – 14.4Vdc 0.6 – 5.5Vdc 20A Negative Yes CC109159744 UVT020A0X3-SRDZ 3 – 14.4Vdc 0.6 – 5.5Vdc 20A Negative Yes CC109168753 UVT020A0X43-SRZ 3 – 14.4Vdc 0.6 – 5.5Vdc 20A Positive Yes CC109159752 -Z refers to RoHS compliant parts Table 10. Coding Scheme Package Family Sequencing Output Output voltage On/Off logic Remot ROHS Identifier Option current e Options Compliance Sense U V T 020A0 X 3 -SR -D Z P=Pico D=Dlynx T=with EZ 20A X = 4 = positive 3 = S = D = 105°C Z = ROHS6 U=Micro Digital Sequence programmable No entry = Remote Surface operating M=Mega V = DLynx X=without output negative Sense Mount ambient, G=Giga Analog. sequencing R = 40G Tape & operating Reel shock as per MIL Std 810F Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. September 7, 2017 ©2017 General Electric Company. All International rights reserved. Version 1.5

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One of our top priorities is maintaining our business with precision, and we are constantly looking for affiliates that can help us achieve our goal. With the aid of GID Industrial, our obsolete product management has never been more efficient. They have been a great resource to our company, and have quickly become a go-to supplier on our list!

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