The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. 0.9 mm Pitch Vertical Mating Board-to-Wire Connectors DF24 Series Space-saving Double row socket Double row header (SMT) Low-profile Double row socket ■Features 11. Space saving Small contact pitch (0.9 mm) together with vertical mating direction allows high density mounting of the board components. 3.8 12. Low profile Two-level contact location and horizontal wire exits allow a low profile of 3.8 mm, when fully. 8.2 Double row header (SMT) 13. Reliable mating/un-mating Complete vertical mating, with both sides self-aligned, is confirmed with tactile “click” sensation. Long contact wipe Two-point socket contact 14. High contact reliability 2-point socket contact, with a long wipe (0.55 mm) assures highly reliable electrical and mechanical connection. 0.55mm 15. Prevention of solder wicking Despite its low-profile, solder wicking is prevented by the nickel barrier and solder collection areas. 16. Self-alignment and side-pull protection The walls of the double row socket assembly will self-align Contact - header during the mating and protect header and socket assemblies from a accidental side-pull on the wires. 17. Simplified un-mating A pull strap for double row socket version may be selected Self-alignment and side-pull protection for easier un-mating. 18. Contact deformation protection Flat contact blades on the headers are supported by the insulator’s walls, protecting them from deformation during Socket contacts handling. Wall 19. Board placement with automatic equipment Supplied on reels containing 1,000 assemblies. Contact blades 10. RoHS compliant All components and materials comply with the requirements of the EU Directive 2002/95/EC. ■Applications Notebook computers, miniature office automation devices, miniature consumer devices, cameras, recording devices and other devices requiring vertical mating reliable Contact deformation protection connectors. B297 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series●0.9 mm Pitch Vertical Mating Board-to-Wire Connectors ■Product Specifications AWG28 :1A Operating temperature range –35ç to +85ç (Note 2) Current rating Wire size AWG30 :0.5A Operating humidity range Relative humidity 20% to 80% (Note 1) Rating AWG32~36 :0.3A Storage temperature range –10ç to +60ç (Note 3) Voltage rating 80V AC Storage humidity range Relative humidity 40% to 70% (Note 3) Item Specification Conditions 1.Insulation resistance 500 M ohms min. 100V DC 2.Withstanding voltage No flashover or insulation breakdown. 250V AC/one minute 3.Contact resistance 30 mø max. 1 mA, 20 mV max. 4.Insertion-Extraction force (per contact) 0.12N min., 2N max. Measured with a steel pin of 0.15mm thickness 5.Vibration No electrical discontinuity of 1μs or more. Frequency: 10 to 55 Hz, single amplitude of 0.75mm, 2 hours, 3 axis Contact resistance: 30 mø max. 6.Humidity 96 hours at temperature of 40±2ç and humidity of 90% to 95%. Insulation resistance: 250 Mø min. Contact resistance: 30 mø max. Temperature: –55ç ➝ +5ç to +35ç ➝ +85ç ➝ +5ç to +35ç 7.Temperature cycle Insulation resistance: 500 Mø min. Time: 30 ➝ 2 to 3 ➝ 30 ➝ 2 to 3 (Minutes) 5 cycles 8.Durability (mating / un-mating) Contact resistance: 30 mø max. 30 cycles Reflow: At the recommended temperature profile 9.Resistance to soldering heat No deformation of components affecting performance. Manual soldering: 350ç for 3 seconds Note 1: Current rating for header is 1A. Note 2: Includes temperature rise caused by current flow. Note 3: The term “storage” refers to products stored for long period of time prior to mounting and use. Operating temperature range and humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation. Note 4: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for a specific part number shown. ■Materials and Finishes Product Component Material Finish Remarks Socket Insulators Polyamide Color : Black UL94V-0 Crimp contact Contact-socket Phosphor bronze Gold plated –––––––––– Insulator Polyamide Color : Black UL94V-0 Header –––––––––– Contact-blade Phosphor bronze Gold plated Pull strap Pull strap PET –––––––––––– –––––––––– ■Ordering information ●Connectors DF24 # # - * * DS - 0.9 C 1 2 3 4 5 6 1 Series Name : DF24 4 Connector type 2 Form type DS : Double-row socket Pin headers A : Standard type DP : Double-row header Sockets Blank : Standard type 5 Contact pitch : 0.9 mm A : Pull strap version Housing type 6 3 Number of contacts : 40, 50 C : Crimp housing V : Straight SMT header PTB : Pull strap (Note) Note: The pull strap is an optional. ●Contacts DF24 - 2830 SCF A 1 2 3 1 Applicable conductor 2 Packaging 2830 : AWG 28 to 30 SCF : Socket contact / reel 3234 : AWG 32 to 34 3 Plating 0036 : AWG 36 A : Gold plated B298 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. +0.05 Ø1.5 0 Ø21±0.8 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series●0.9 mm Pitch Vertical Mating Board-to-Wire Connectors ■Double-row header (SMT) A P=0.9 0.15 Contact Contact P=0.9 A B ■PCB mounting pattern A±0.05 P=0.9±0.03 0.5±0.03 Contact No.1 Specification number (51): Embossed tape packaging (1,000 pieces per reel). Contact No.2 Unit: mm Part number CL No. Number of contacts A B Packaging RoHS DF24A-40DP-0.9V(**) 687-3208-0-** 1,000 pcs. / reel 40 17.1 19.6 YES 1,000 pcs. / reel DF24A-50DP-0.9V(**) 687-3209-2-** 50 21.6 24.1 ■Packaging specifications 2±0.1 4±0.1 12±0.1 Section A-A A 2±0.5 Part number label +2 D 0 0.4±0.1 (D+6) MAX 4.55±0.15 A Unreeling direction Unit: mm Part number Number of contacts A B C D 40 32 28.4 14.2 32.4 DF24A-40DP-0.9V(**) 50 44.4 44 40.4 20.2 B299 Ø13±0.2 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 2.3±0.05 5.4±0.05 C±0.1 1.75±0.1 B±0.1 A±0.3 3.3 3.8 4.8 ( Ø80 ) ( Ø380 ) 3.4 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series●0.9 mm Pitch Vertical Mating Board-to-Wire Connectors ■Double-row socket A A No. of contacts 1 indicator B 8.2 C 6.5 P=0.9 Contact Contact 4.8 D Unit: mm Part number CL No. Number of contacts A B C D Packaging RoHS DF24B-40DS-0.9C 687-3301-5 40 22.1 18.75 17.1 21.1 100 pcs. / bag YES DF24B-50DS-0.9C 687-3302-8 50 26.2 23.25 21.6 25.2 100 pcs. / bag ■Double-row socket (Pull strap) A 0.3 A 1 No. of contacts indicator B 8.2 C 6.5 P=0.9 Contact Contact 4.8 D Unit: mm Part number CL No. Number of contacts A B C D Packaging RoHS 21.6 25.2 100 pcs. / bag YES DF24BA-50DS-0.9C 687-3304-3 50 27.4 23.25 Note: Refer to page 5 for pull strap tab. B300 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 3.05 1.2 4.5 3.05 2.85 2.85 3.45 3.45 Ø1 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series●0.9 mm Pitch Vertical Mating Board-to-Wire Connectors ■Crimp contact 1.03 Part number CL No. Applicable wire size Packaging Quantity Finish RoHS 0.85 DF24-2830SCFA 687-3001-1 28 – 30 DF24-3234SCFA 687-3004-0 32 – 34 Reel 20,000 Gold plated YES DF24-36SCFA 687-3003-7 36 ● Applicable wire (Tin plated annealed copper wire) Wire size (Stranded wire conductor) Jacket diameter AWG28 (7 / 0.127mm) AWG30 (7 / 0.107mm) 0.6mm max AWG32 (7 / 0.087mm) AWG36 (7 / 0.057mm) 0.4mm max Note: When using other than the recommended wire, contact your nearest Hirose representative. ● Tools Type Description Part number Applicable contacts CL No. AP105-DF24-2830S 901-4602-5 DF24-2830SCFA Applicator AP105-DF24-3234S DF24-3234SCFA 901-4592-3 t=0.12 AP105-DF24-36S DF24-36SCFA 901-4606-6 Press unit CM-105 –––––––––––––––––––––––– 901-0005-4 Contact extraction tool DF-C-PO(B) DF24-****SCFA 550-0179-2 ■Pull strap A Applicable socket π [DF24BA-50DS-0.9C] Seal B Unit: mm Part number CL No. Number of contacts A B Packaging RoHS 500 pcs. / bag YES DF24-50DS-PTB 687-3300-2 50 25 75 Before attachment of the pull strap Pull strap attached B301 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 3 4.6 1.95 0.55 0.8 Autmatic 4 t=0.1 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series●0.9 mm Pitch Vertical Mating Board-to-Wire Connectors ■Pull Strap Attachment Procedure 1 With the adhesive side of the pull strap facing upward, pass both ends of the strap through the elongated openings at both ends of the socket. Adhesive side Elongated opening Elongated opening Socket 2 Peel-off the protective paper on one side and place one end of the strap over exposed adhesive (as illustrated below), using the remaining paper side as the alignment guide. Protective paper 3 Peel-off the remaining protective paper and place the other end of the strap over the adhesive, using the already attached end as the alignment guide. Completed B302 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series●0.9 mm Pitch Vertical Mating Board-to-Wire Connectors ■Usage recommendations and Precautions 1. Recommended Temperature(ç) temperature profile 250 (Including Lead-free solder) 240 Reflow conditions 220 Preheating: 200 190 180±10ç 60~20sec. 170 Soldering: 150 250ç max. Preheating Soldering 240çmin. 20sec. max. 100 220çmin. 60sec. max. 50 0 50 100 150 200 250 Time(S) Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, providing that there is a return to normal temperature between the first and second cycle. Note 2: The temperature profile indicates the board surface at the point of contacts with the connector terminals. 2.Recommended manual soldering Manual soldering: 300±10ç for 3 seconds 3.Recommended screen thickness and Thickness: 0.12mm opening area ratio (Pattern area ratio) Opening area ratio: 80% 4. Board warpage Maximum of 0.03mm at the connector center, with both ends of the connector as reference points. 5. Cleaning conditions Refer to “Nylon Connector Use Handbook”. 6. Wire preparation and Refer to “Nylon Connector Use Handbook”. contact crimping The crimp contacts are of a very small form and because of this, crimping should be performed carefully based on the content of the Crimping Conditions Table and the Crimping Quality Standards Manual. 7. Precautions ■Removal of the inserted socket contacts * Using the socket contact extraction tool (DF-C-PO(B) ) carefully lift the contact retention tab on the insulator housing, as shown on the Fig.1 and pull-out the wire. * Lift the tab ONLY enough to remove the contact. Exercise caution NOT to deflect too much. * The tab should return to its original position after the contact is removed. * The tab must be in its original position before inserting the new socket contact. Contact extraction tool Contact DF-C-PO(B) retention tab Fig. 1. Contact Removal B303 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series●0.9 mm Pitch Vertical Mating Board-to-Wire Connectors 7. Precautions ■Connector Mating/Un-mating * Hold the socket at both ends (as illustrated on Fig.2) when mating or un-mating. The mating/un- mating of the connectors must be within the indicated angle of 20° on both axis. DO NOT MATE / UN-MATE HOLDING 20° 20° BY THE WIRES. Hold here Fig. 2. Mating / Un-mating ■Bundling of the Wires * To avoid wire damage or termination faults bundling of the wires should be at the distance of 20 mm min. from the socket (Fig. 3-1) * When bundling at the distance less than the recommended 20 mm, it is critical to avoid sharp bend radius (Fig. 3-2) or apply stretching or twisting forces (Fig. 3-3) Do not stretch or twist Bundling close to socket Sharp bend Fig. 3-1 Fig. 3-2 Fig. 3-3 Fig. 3. Bundling requirements * Do not mate/un-mate connectors when not mounted on the board. * Do not use connector as the only support for the board. * Do not use flux compounds when hand soldering. * Slight color shade difference of the insulator bodies will not affect the form, fit or function of the connectors. B304 Powered by TCPDF (www.tcpdf.org) Powered by TCPDF (www.tcpdf.org) Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.