HIROSE ELECTRIC USA, INC. DF23C-30DS-0.5V(51)

0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors DF23 Series Low profile - 1.5 mm board-to-board distance Board-to-Board Application ● Plug Board Board Receptacle ●Board-to-FPC Application Plug FPC Board Receptacle ■Features High Contact Reliability 1. Low profile The 1.5 mm board-to-board distance makes these connectors ideal for limited space applications. 2. Large variety of number of contacts Male contact Available with 10, 12, 14, 16, 18, 20, 30, 40, 50, and 60 contacts. Connectors with 10 to 20 contacts are ideal for use in small LCD connections in cellular phones, PDA’s, video equipment, photo cameras and miniature of other devices requiring reliable connections in a small spaces. Female contact 3. Click sensation Positive click sensation when completely mated confirms correct insertion and connection of all contacts. 4. High contact reliability Although connectors are low profile, the female contacts maintain reliable spring force assuring secure electrical Large Self-alignment contact. 0.3 5. Large self-alignment The large range of alignment of 0.3 mm allows for smooth insertion. 6. Board placement with automatic equipment Flat surfaces allows placement of embossed tape packaged connectors with vacuum nozzles. 0.3 ■Applications Mobile phones, PDA’s, notebook PC’s, digital cameras and other miniature devices. A238 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. +0.2 +0.2 1.5 - 0.1 1.5 - 0.1 DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors ■Product Specifications Operating Storage Current rating 0.3A -35ç to 85ç (Note 1) -10ç to 60ç (Note 2) temperature range temperature range Ratings Operating humidity Storage humidity Voltage rating 50V AC -20% to 80% -40% to 70% (Note 2) range range Item Specification Condition 1. Insulation resistance ohms 100V DC 500M min. 2. Withstanding voltage 150V AC/1 minute No flashover or insulation breakdown 3. Contact resistance 60m ohms max. 100mA Frequency of 10 to 55 Hz, single amplitude of 0.75 mm, in 3 4. Vibration No momentary disconnections of 1 μs min directions for 2 hours Contact resistance : 60 m ohms max. 5. Humidity Temperature of 40ç±2ç, humidity of 90% to 95%, 96 hours Insulation resistance : 250 M ohms min. (-55ç : 30minutes /5 to 35ç : 10minutes /85ç : 30minutes Contact resistance : 60 m ohms max. 6. Temperature cycle Insulation resistance : 500 M ohms min. 5 to 35ç: 10minutes ) for 5 cycles / 7. Durability oh 50 cycles (mating/unmating) Contact resistance : 60m ms max. 8. Resistance to Reflow: At recommended temperature profile No deformation of the insulator parts affecting soldering heat performance Manual soldering: Soldering iron temperature 300°C, for 3 seconds Note 1: Includes temperature rise caused by the current flow. Note 2: The term “storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. Note 3: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for a specific part number shown. ■Materials Item Part Material Finish Remarks Receptacles Insulator LCP Color : Black UL94V-0 ---------- Plugs Contacts Phosphor bronze Gold plated ■Ordering information ●Receptacles/Plugs - ( ) DF23 C * DS - 0.5 V * * 1 2 3 4 5 6 7 1 Series name: DF23 5 Contact pitch: 0.5mm 2 6 Metal fitting & Locating boss type Terminal type C: Without metal fittings, without Locating boss V: Straight SMT 3 Number of contacts: 10, 12, 14, 16, 18, 20, 22, 30, 40, 50, 60 7 Packaging type 4 Connector type Receptacle(51): Embossed tape packaging (2,000 pieces per reel) DS: Double-row receptacle Receptacle(53): Embossed tape packaging (3,000 pieces per reel) DP: Double-row plug Plug(92): Embossed tape packaging (2,000 pieces per reel) Plug(91): Embossed tape packaging (3,000 pieces per reel) A239 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors ■Receptacles A±0.3 B±0.15 P=0.5±0.1 0.15±0.05 0.5±0.1 BRecommended PCB Footprints B±0.03 P=0.5±0.02 0.25±0.02 Note: Shaded area should be free of any conductive traces. [Packaging/ quantity per reel code] - * *, (* *) (51): Embossed tape packaging (2,000 pieces per reel) (53): Embossed tape packaging (3,000 pieces per reel) Unit: mm Product No. CL No. Number of Contacts A B Remarks RoHS 10 05.1 02.0 DF23C-10DS-0.5V(**) CL688-0306-9-** 12 05.6 02.5 DF23C-12DS-0.5V(**) CL688-0309-7-** (Note 2) 14 06.1 03.0 DF23C-14DS-0.5V(**) CL688-0300-2-** 16 06.6 03.5 DF23C-16DS-0.5V(**) CL688-0307-1-** (Note 1) 18 07.1 04.0 DF23C-18DS-0.5V(**) CL688-0308-4-** (Note 2) 20 07.6 04.5 DF23C-20DS-0.5V(**) CL688-0301-5-** (Note 1) YES 22 08.1 05.0 DF23C-22DS-0.5V(**) CL688-0310-6-** (Note 2) 30 10.1 07.0 DF23C-30DS-0.5V(**) CL688-0302-8-** (Note 1) 40 12.6 09.5 DF23C-40DS-0.5V(**) CL688-0303-0-** (Note 1) 50 15.1 12.0 DF23C-50DS-0.5V(**) CL688-0304-3-** (Note 1) 60 17.6 14.5 DF23C-60DS-0.5V(**) CL688-0305-6-** (Note 1) Note 1: Available in code (51) only. Note 2: Available in code (53) only. Note 3: Contact Hirose for availability. Note 4: Please order embossed tape packaging items by the reel. A240 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 4.4±0.05 1.1±0.05 0.9±0.05 1.45±0.1 6±0.2 5±0.2 0.25±0.05 DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors ■Plugs A±0.15 B±0.15 P=0.5±0.1 0.19±0.05 0.45±0.1 BRecommended PCB Footprints C B±0.03 P=0.5±0.02 Note 1: Shaded area should be free of any conductive 0.25±0.02 traces. Note 2: Do not leave any conductive traces or install components in this area. [Packaging/ quantity per reel code] - * *, (* *) (92): Embossed tape packaging (2,000 pieces per reel) (91): Embossed tape packaging (3,000 pieces per reel) Unit: mm Product No. CL No. Number of Contacts A B C Remarks RoHS DF23C-10DP-0.5V(**) CL688-0806-1-** 10 04.0 02.0 05.1 DF23C-12DP-0.5V(**) CL688-0809-0-** 12 04.5 02.5 05.6 (Note 1) DF23C-14DP-0.5V(**) CL688-0800-5-** 14 05.0 03.0 06.1 DF23C-16DP-0.5V(**) CL688-0807-4-** 16 05.5 03.5 06.6 (Note 2) DF23C-18DP-0.5V(**) CL688-0808-7-** 18 06.0 04.0 07.1 DF23C-20DP-0.5V(**) CL688-0801-8-** 20 06.5 04.5 07.6 (Note 2) YES DF23C-22DP-0.5V(**) CL688-0810-9-** 22 07.0 05.0 08.1 (Note 1) DF23C-30DP-0.5V(**) CL688-0802-0-** 30 09.0 07.0 10.1 DF23C-40DP-0.5V(**) CL688-0803-3-** 40 11.5 09.5 12.6 (Note 2) DF23C-50DP-0.5V(**) CL688-0804-6-** 50 14.0 12.0 15.1 (Note 2) DF23C-60DP-0.5V(**) CL688-0805-9-** 60 16.5 14.5 17.6 (Note 2) Note 1: Available in code (91) only. Note 2: Available in code (92) only. Note 3: Contact Hirose for availability. Note 4: Please order embossed tape packaged items by the reel. A241 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 6 2.9±0.05 1±0.05 0 1.7 -0.1 1.2±0.1 4.3±0.2 3.1±0.15 0.15±0.05 +0.1 Ø1.5 0 +0.1 R0.75 0 DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors BEmbossed Career Tape Dimensions Y-Y 12±0.1 2±0.1 1.6±0.15 ■Receptacles 4±0.1 0.3±0.1 Y XX Y (Note.1) Unreeling direction X-X (Note.2) ■Reel Dimensions Product name label Depth of 1.5 diameter G±0.5 H±1 Unit: mm Product No. D E F G H DF23C-10DS-0.5V(**) 16.0 ---- 07.5 17.5 21.5 DF23C-12DS-0.5V(**) 16.0 ---- 07.5 17.5 21.5 DF23C-14DS-0.5V(**) 16.0 ---- 07.5 17.5 21.5 DF23C-16DS-0.5V(**) 16.0 ---- 07.5 17.5 21.5 DF23C-18DS-0.5V(**) 16.0 ---- 07.5 17.5 21.5 DF23C-20DS-0.5V(**) 16.0 ---- 07.5 17.5 21.5 DF23C-22DS-0.5V(**) 24.0 ---- 11.5 25.5 29.5 DF23C-30DS-0.5V(**) 24.0 ---- 11.5 25.5 29.5 DF23C-40DS-0.5V(**) 24.0 ---- 11.5 25.5 29.5 DF23C-50DS-0.5V(**) 24.0 ---- 11.5 25.5 29.5 DF23C-60DS-0.5V(**) 32.0 28.4 14.2 33.5 37.5 Note 1: This side feed hole is added to embossed tape where the D dimension is 32.0 min. wide. Note 2: (53) packaging code embossed tape is without the bottom surface protrusion. A242 +0.1 R0.75 0 Ø13±0.2 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 0.2±0.05 PS F±0.1 1.75±0.1 E±0.1 D±0.3 Ø80±1 Ø330±2 +0.1 Ø1.5 0 DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors ■Plugs Y-Y 12±0.1 2±0.1 1.5±0.15 0.3±0.1 4±0.1 Y XX Y Unreeling direction X-X (Note.1) ■Reel Dimensions Product name label Depth of 1.5 diameter G±0.5 H±1 Unit: mm Product No. D F G H DF23C-10DP-0.5V(**) 16.0 07.5 17.5 21.5 DF23C-12DP-0.5V(**) 16.0 07.5 17.5 21.5 DF23C-14DP-0.5V(**) 16.0 07.5 17.5 21.5 DF23C-16DP-0.5V(**) 16.0 07.5 17.5 21.5 DF23C-18DP-0.5V(**) 16.0 07.5 17.5 21.5 DF23C-20DP-0.5V(**) 16.0 07.5 17.5 21.5 DF23C-22DP-0.5V(**) 24.0 11.5 25.5 29.5 DF23C-30DP-0.5V(**) 16.0 07.5 17.5 21.5 DF23C-40DP-0.5V(**) 24.0 11.5 25.5 29.5 DF23C-50DP-0.5V(**) 24.0 11.5 25.5 29.5 DF23C-60DP-0.5V(**) 24.0 11.5 25.5 29.5 Note : Code number (91) embossed tape is without the bottom surface protrusion. A243 Ø13±0.2 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. PS F±0.1 1.75±0.1 D±0.3 Ø80±1 Ø330±2 DF23 Series●0.5mm Pitch Low-Profile Board-to-Board/Board-to-FPC Connectors BUsage Precautions 1.Recommended Temperature (ç) Temperature Profile 250 250ç Temperature 220ç 200 60sec max Soldering 180ç 150ç 150 90~120sec 100 Preheating 50 Room temperature 0 50 100 150 200 250 300 Time (sec.) Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is a return to normal temperature between the first and second cycle. Note 2: The temperature profile indicates the board surface temperature at the point of contacts with the connector terminals. 2.Recommended Manual Temperature: 290ç±10ç, Soldering time: within 2 sec. Soldering Conditions 3.Recommended Screen ■ Thickness : 0.12 mm Thickness and Open Area ■ Open Area ratio: 80% Ratio (Pattern Area Ratio) 4.Board Warping ■Maximum of 0.03 mm at the connector center section, with both ends of the connector as reference points. 5.Cleaning Conditions ■Refer to the "Nylon Connector Use Handbook." 6.Use and handling precautions. ■When manually handling the connectors avoid touching any portion of exposed terminal leads. ■This may cause deformation and lead to difficulties with placement and soldering on the PCB. ■When mating/un-mating do not use excessive force or lifting of one side only. A244 Powered by TCPDF (www.tcpdf.org) Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.