SD Memory Card Connectors DM1 Series Withstands higher force of card insertion. Card Standard type Metal cover extends over the back of the connector. ■Features Card 1. Withstands higher force of card insertion Metal cover extends over the back of the connector allowing it to withstand force of up to 400N (static load) Reverse type when dropped or accidentally hit. (Fig.1) Metal cover extends over the back of the connector. 2. No damage to the card when accidentally pulled-out Fig.1 The connectors will release the card when a moderate No damage to the card when pull-out force of about 4N is applied. There will be no accidentally pulled-out. damage to the lock components and all connector functions will not be affected. (Fig.2) 3. Accidental card fall-out prevention Built-in lock feature holds the card securely in place. (Fig.3) 4. Reliable Card Insertion and Withdrawal Built-in Push-in / Push-out ejection mechanism assures simple and reliable card insertion and withdrawal. 5. Designed to accept Secure Digital I/O card Fig.2 (Built-in Ground Contact) The connector allows use of various expansion Accidental card modules, including the Bluetooth communication fall-out prevention modules. Fig.3 C39 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. ■Product Specifications Current rating 0.5A DC Operating temperature range : -25ç to +85ç (Note 1) Operating humidity range : Relative humidity 95% Rating Voltage rating 125V AC Storage temperature range : -40ç to +85ç (Note 2) max. (No condensation) Item Specification Conditions 1. Insulation resistance 1000Mø min. (Initial value) 500V DC 2. Withstanding voltage No flashover or insulation breakdown 500V AC / one minute 3. Contact resistance 100mø max. (Initial value) 100mA DC 4. Vibration No electrical discontinuity of 100ns or more Frequency : 10 to 55Hz, single amplitude of 0.75mm, 2 hours / 3 axis Contact resistance : 40mø max. from initial value 96 hours at temperature of 40ç ± 2ç and 5. Humidity Insulation resistance : 100Mø min. humidity of 90% to 95% Contact resistance : 40mø max. from initial value Temperature : -55 +5 to +35 +85 +5 to +35 ç/ ç ç/ ç/ ç ç 6. Temperature cycle Insulation resistance : 100Mø min. Duration : 30 5 30 5 (Minutes) 5 cycles / / / 7. Durability (mating/un-mating) Contact resistance : 40mø max. from initial value 10000 cycles at 400 to 600 cycles per hour Reflow : At the recommended temperature profile 8. Resistance to soldering heat No deformation of components affecting performance. Manual soldering : 350ç for 3 seconds Note1 : Includes temperature rise caused by current flow. Note2 : The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. ■Materials / Finish Component Material Finish Remarks Insulator Heat resistant thermoplastic compound Color: Black UL94V-0 Contact area: Gold plating Contacts Phosphor bronze -------------------- Termination area: Tinned copper plating Cover Stainless steel Termination area: Tinned copper plating -------------------- Stainless steel -------------------- Others -------------------- Piano wire Nickel plating ■Product Number Structure DM1 AA - SF - PEJ 1 2 3 4 1 Series name : DM1 3 Terminal type 2 Connector type : AA : Standard receptacle SF : Right angle surface mount : B : Reverse receptacle DSF : Reverse right angle surface mount 4 Eject mechanism codes PEJ : Card Push insert/Push withdraw C40 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. ■Standard type BPCB mounting pattern +0.1 2 25.4±0.05 0 22.4±0.05 4.125±0.05 15±0.05 1.7±0.05 P=2.5±0.05 1.35±0.05 9-1.1±0.05 +0.1 2 0 1.6±0.05 2 Card detection switch 2 Write protection switch Part No. HRS No. DM1AA-SF-PEJ(82) 609-0004-8 82 +0.1 2 0 1.2±0.05 C 1 L 1 1 28 13.2 9.75 No.4 8.05 2.9 No.6 t=0.2,W=0.6 15 No.2 No.5 No.3 No.7 5.625 P2.5 No.1 No.8 No.9 1 C L 1 C L 1 24.15 (Card slot dimension) C indicates the center line of card slot. 1 L Card detection switch Write protection switch When card is inserted When card When card When card 1 C is ejected is inserted is ejected L WRITE PROTECT WRITE ENABLE 2-Ø1.2 22.4 OPEN CLOSE OPEN OPEN CLOSE Weight:2.2g BCard insertion/withdrawal dimensions SD Card SD Card SD Card Card pushed-in for insertion Card fully inserted Card ejected (Card ejected dimension) C41 +0.1 2-Ø1.3 0 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 30.5 5 6 0.55 23.2 2.5 4.55 4-1.5 1 20.75±0.05 18.15±0.05 9.2±0.05 11 +0.1 3-1 0 3-0.5 9.2 18.15 5 20.75 +0.1 4-2 0 2±0.05 4.55±0.05 1.2±0.05 23.2±0.05 (R0.4) (R0.4) (R0.4) (R0.6) (R0.6) (R0.6) ■Reverse type BPCB mounting pattern 9.47±0.05 12.8±0.05 11.2±0.05 9.75±0.05 8.05±0.05 12.5±0.05 0.8±0.05 P=2.5±0.05 5.625±0.05 1.4±0.05 CARD DETECT 1.25±0.05 COMMON FOR CD & WP A A 8-1.1±0.05 3 5.62 2.03±0.05 12.57±0.05 11.23±0.05 14.13±0.05 Part No. HRS No. WP 14.25±0.05 11.93±0.05 DM1B-DSF-PEJ(82) 609-0003-5 82 C B 3 Center of Card dimension A(5:1) B(5:1) C(5:1) +0.1 1.2 (Land) +0.1 0 +0.1 1.2 (Land) 0 1.2 (Land) 0 +0.1 0.8 (Through hole) +0.1 0 0.8 (Through hole) +0.1 0 0.8 (Through hole) 0 2 8.63 2 18.68 2 16.85 2 2 6.95 7.65 5.62 2 1 C L 28 No.5 No.4 No.3 No.6 No.7 (14.35) No.2 No.8 No.1 1 C L 2.9 No.9 1 C L (0.25) 1 C indicates the center line of the card slot. L SD Card 2 indicates the dimension of DIP terminals. Card detection switch Write protection switch When card When card When card is ejected When card is ejected is ejected is ejected WRITE PROTECT WRITE ENABLE C 1 OPEN CLOSE OPEN OPEN CLOSE L Weight:2.1g C42 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 29.9 10:Card ejected(Card ejected dimension) (6):Card fully inserted (5):Card pushed for insertion +0.1 1.7 (Land) 0 +0.1 1.3 (Through hole) 0 6-0.65 29 1.5 2 2 27.45 1.85 +0.1 1.9 (Land) -0.1 2 28.25±0.05 2 0.35 1.05 +0.1 1.5 (Through hole) 0 1.05±0.05 11-2.5±0.05 (1.77) 0.8±0.05 +0.1 2.4 (Land) -0.1 +0.1 2 (Through hole) 0 27.2 2 1.4±0.05 23.48±0.05 26.98±0.05 28.5±0.05 +0.1 Ø1.5 0 +0.1 Ø1.5 0 +2 44.4 0 BPackaging specifications ●Embossed Carrier Tape Dimensions (Standard type) 450 pcs/reel 4.35±0.3 36±0.1 4±0.1 3.4±0.3 2±0.15 Unreeling direction ●Embossed Carrier Tape Dimensions(Reverse type) 450 pcs/reel 4±0.1 36±0.1 4.6±0.3 3.4±0.3 2±0.15 Unreeling direction ●Reel dimensions Unreeling direction D End section Mounting section(450) Lead section (400mm min.) Blank section(160mm min.) Blank section (100mm min.) Embossed carrier tape Top cover tape C43 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 44±0.3 44±0.3 40.4±0.1 40.4±0.1 20.2±0.1 1.75±0.1 20.2±0.1 1.75±0.1 (Ø150) (Ø380) BRecommended Temperature Profile HRS test condition (ç) Peak : 250ç MAX Solder method : Reflow, IR/hot air 250 Environment : Room air 230ç min. 50 Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu 200 seconds 200ç (Senju Metal Industry, Co., Ltd.'s Soldering 150 Part Number:M705-GRN360-K2-V) 150ç Test board : Glass epoxy 60mm∞100mm∞1.0mm thick 90 to 120 seconds 100 Metal mask : 0.15mm thick Preheating Number of reflow cycles : 2cycles max. 50 The temperature profiles shown are based on the above conditions. Time (Seconds) In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. C44 Powered by TCPDF (www.tcpdf.org) Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Temperature