HIROSE ELECTRIC USA, INC. FX11LA-68S-SV(22)

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. NEW NEW 0.5mm Pitch Connectors with Ground Plate for 2mm Board-to-Board Connections FX11L Series Cross-Section of Mating Features 1. Low Profile Design The board to board mating height of 2 mm suits smaller,thinner case designs. 2. Improved Transmission Efficiency Between Boards Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle. 3. 10 Signal:1 Ground Arrangement Signal and ground are arranged in a ratio of 10:1 with the ground plate SMT connected to the board. The ground stability achieved serves to reduce noise. 4. Reinforced Fittings for Added Solder Weld Strength Reinforced fittings provide greater adhesion to the board,protecting against peeling.The unique connector design provides a connection between the fitting and the ground plate for a stronger ground. Detailed Figure of Solder Gap 5. Suited to High-Density Applications The signal contact pitch of 0.5mm produces a smaller connector utilizing less board area for mounting. 6. Structure Prevents Solder Wicking A solder gap has been designed into the contact SMT portion to prevent solder wicking. 7. Optional Ground Plate An alternate style without the ground plate is available.The space provided by the ground plate removal has been filled with additional signal contacts. Note: The thickness of the solder paste is not included in the 2 mm board-to-board stack height. Applications Notebook computers, PDA, and other miniature electronic equipment. 2003.7 1 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. Product Specifications Rated current 0.3 A (Note 1) Operating temperature range Storage temperature range -55 to 85ç -10 to +60ç (Note 2) Rating Rated voltage 50 V AC Operating humidity range Storage humidity range Relative humidity 95% or less -40 to -70% (Note 2) (No condensation) Item Requirements Conditions 1. Insulation resistance Measured at 100 V DC 100 Mø or greater 2. Voltage proof No flashover or breakdown 150 V AC applied for one minute 3. Contact resistance 60 mø or less Measured at 100 mA No electrical discontinuity for 1µs or greater Frequency: 10 to 55 Hz, amplitude of 0.75 mm in 3 directions, 4. Vibration No damage, cracks, or parts looseness 10 cycles each 2 No electrical discontinuity for 1µs or longer Acceleration of 490 m/s , 11ms duration, sine half-wave 5. Shock No damage, cracks, or parts looseness waveform,for 3 cycles in the both directions of each of the 3 axes 6. Damp heat Contact resistance of 70 mø or less, insulation resistance of Temperature of 40ç, humidity of 90 to 95%, duration 96 h (Steady state) 100 Mø or greater, no damage, cracks, or parts looseness Temperature: -55ç15 to 35ç85ç15 to 35ç 7. Rapid change Contact resistance of 70 mø or less, insulation resistance of of temperature Time: 30 min. 2 to 3 min. 30 min. 2 to 3 min. for 5 cycles 100 Mø or greater, no damage, cracks, or parts looseness 8. Insertion/ Contact resistance of 70 mø or less 50 times Withdrawal life No damage, cracks, or parts looseness Reflow: At the recommended temperature profile 9. Resistance to No melting of resin portion which affects performance soldering heat Soldering iron temperature: 300ç for 3 seconds Note 1: Please contact us when connector application exceeds 0.3 A rated current. Note 2: The term storage refers to an unused products prior to board mounting (including packing materials) that is being kept for a long period. The operating temperature and humidity range are applied to the non-conducting condition following board assembly. Note 3: The aforementioned specifications are representative of this series. For information on specific parts, confirm with Sales Office. Materials Part Material Process UL Rating Insulator LCP resin Beige UL94V-0 Copper alloy Header Engagement Area: Gold plating of 0.1µm Contacts ---------- Phosphor bronze Receptacle Termination Area: Flash plating Ground plate Phosphor bronze Solder plating ---------- Reinforced fitting ---------- Phosphor bronze Tin plating Reinforced plate ---------- Note : The black dots on the insulater will not affect performance. Product Number Configuration Please use this information to discern the product specifications from the product number codes. To order, please select from the product number codes listed in tables on pages 3 to 6 of this catalog. - ( ) Type With Ground Plate FX 11L # #✽P - /✽- SV ✽ ✽ 1 2 3 5 6 7 4 - ( ) FX 11L # #✽P - SV ✽ ✽ Type Without Ground Plate 1 2 3 4 5 6 7 1 Series name : FX 5 Connector type 2 Series No. : 11L P : Header 3 Form Symbol A : With guide post S : Receptacle B : Without guide post 6 Contact form 4 Number of contacts Type with ground plate SV : Straight SMT Signal/Ground:60/6, 80/8, 100/10, 120/12 7 Blank: Tray packaging (Without pick-and-place tape) Type without ground (21): Embossed tape packaging (Without pick-and-place tape) (22): Embossed tape packaging (With pick-and-place tape) Signal: 68, 92, 116, 140 2 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. Headers with Ground Plate Number of Contacts HRS No. Product No. A B C D E Notes Signal Ground CL573-0002-7-✽ ✽ FX11LA-060P/06-SV (✽ ✽ ) 060 06 17.5 12 22.6 18 19.4 CL573-0003-0-✽ ✽ FX11LA-080P/08-SV (✽ ✽ ) 080 08 23.5 18 28.6 24 25.4 With guideposts CL573-0004-2-✽ ✽ FX11LA-100P/10-SV (✽ ✽ ) 30 31.4 100 10 29.5 24 34.6 CL573-0005-5-✽ ✽ FX11LA-120P/12-SV (✽ ✽ ) 120 12 35.5 30 40.6 36 37.4 CL573-0012-0-✽ ✽ FX11LB-060P/06-SV (✽ ✽ ) 060 06 17.5 12 22.6 ---------- 19.4 CL573-0013-3-✽ ✽ FX11LB-080P/08-SV (✽ ✽ ) 080 08 23.5 18 28.6 ---------- 25.4 Without guideposts CL573-0014-6-✽ ✽ FX11LB-100P/10-SV (✽ ✽ ) 100 10 29.5 24 34.6 ---------- 31.4 CL573-0015-9-✽ ✽ FX11LB-120P/12-SV (✽ ✽ ) 120 12 35.5 30 40.6 --------- -- 37.4 [Specifications number] – ✽ ✽ , (✽ ✽ ) Blank: Tray packaging (Without pick-and-place tape) (21) : Embossed tape packaging (Without pick-and-place tape) (22) : Embossed tape packaging (With pick-and-place tape) Note 1: There is no polarity in terms of board mounting for this product. Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.) BRecommended Land Pattern Dimensions (Metal Mask Dimensions) Recommended metal mask thickness: 0.15 mm Note 1 Cross-hatched portions, totaling n places, indicate the ground circuits. 2 The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. 3 Not required in products without guideposts. 3 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. Receptacles with Ground Plate Number of Contacts HRS No. Product No. A B C D E F Notes Signal Ground ✽ ✽ ✽ ✽ CL573-0102-1- FX11LA-060S/06-SV ( ) 060 06 17.5 12 25 20.8 25.4 22.2 ✽ ✽ ✽ ✽ CL573-0103-4- FX11LA-080S/08-SV ( ) 080 08 23.5 18 31 26.8 31.4 28.2 With guideposts ✽ ✽ ✽ ✽ CL573-0104-7- FX11LA-100S/10-SV ( ) 32.8 37.4 34.2 100 10 29.5 24 37 ✽ ✽ ✽ ✽ CL573-0105-7- FX11LA-120S/12-SV ( ) 120 12 35.5 30 43 38.8 43.4 40.2 ✽ ✽ ✽ ✽ CL573-0112-5- FX11LB-060S/06-SV ( ) 060 06 17.5 12 25 ---------- 25.4 22.2 ✽ ✽ ✽ ✽ CL573-0113-8- FX11LB-080S/08-SV ( ) 080 08 23.5 18 31 ---------- 31.4 28.2 Without guideposts ✽ ✽ ✽ ✽ CL573-0114-0- FX11LB-100S/10-SV ( ) 100 10 29.5 24 37 ---------- 37.4 34.2 ✽ ✽ ✽ ✽ CL573-0105-3- FX11LB-120S/12-SV ( )s 120 12 35.5 30 43 ---------- 43.4 40.2 [Specifications number] - ✽ ✽ , (✽ ✽ ) Blank: Tray packaging (Without pick-and-place tape) (21) : Embossed tape packaging (Without pick-and-place tape) (22) : Embossed tape packaging (With pick-and-place tape) Note 1: There is no polarity in terms of board mounting for this product. Note 2: The coplanarity of this product's SMT leads is 0.1mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.) BRecommended Land Pattern Dimensions (Metal Mask Dimensions) Recommended metal mask thickness: 0.15 mm 0.25 Note 1 Cross-hatched portions, totaling n places, indicate the ground circuits. 2 Cross-hatched portions, totaling 2 places, indicate the reinforced fittings. 3 The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. 4 Not required in products without guideposts. 4 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. Headers without Ground Plate Number of Contacts HRS No. Product No. A B C D Notes Signal CL573-0042-1-✽ ✽ FX11LA-068P-SV (✽ ✽ ) 068 16.5 22.6 18 19.4 CL573-0043-4-✽ ✽ FX11LA-092P-SV (✽ ✽ ) 092 22.5 28.6 24 25.4 With guideposts CL573-0044-7-✽ ✽ FX11LA-116P-SV (✽ ✽ ) 31.4 116 28.5 34.6 30 CL573-0045-0-✽ ✽ FX11LA-140P-SV (✽ ✽ ) 140 34.5 40.6 36 37.4 CL573-0052-5-✽ ✽ FX11LB-068P-SV (✽ ✽ ) 068 16.5 22.6 ---------- 19.4 CL573-0053-8-✽ ✽ FX11LB-092P-SV (✽ ✽ ) 092 22.5 28.6 ---------- 25.4 Without guideposts CL573-0054-0-✽ ✽ FX11LB-116P-SV (✽ ✽ ) 116 28.5 34.6 ---------- 31.4 CL573-0055-3-✽ ✽ FX11LB-140P-SV (✽ ✽ ) 140 34.5 40.6 ---------- 37.4 [Specifications number] - ✽ ✽ , (✽ ✽ ) Blank: Tray packaging (Without pick-and-place tape) (21) : Embossed tape packaging (Without pick-and-place tape) (22) : Embossed tape packaging (With pick-and-place tape) Note 1: There is no polarity in terms of board mounting for this product. Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.) BRecommended Land Pattern Dimensions (Metal Mask Dimensions) Recommended metal mask thickness: 0.15 mm Note 1 The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. 2 Not required in products without guideposts. 5 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. Receptacles without Ground Plate Number of Contacts HRS No. Product No. A B C D Notes Signal CL573-0142-6-✽ ✽ FX11LA-068S-SV (✽ ✽ ) 068 18 16.5 25 20.8 CL573-0143-9-✽ ✽ FX11LA-092S-SV (✽ ✽ ) 092 24 22.5 31 26.8 With guideposts CL573-0144-1-✽ ✽ FX11LA-116S-SV (✽ ✽ ) 32.8 116 30 28.5 37 CL573-0145-4-✽ ✽ FX11LA-140S-SV (✽ ✽ ) 140 36 34.5 43 38.8 CL573-0152-0-✽ ✽ FX11LB-068S-SV (✽ ✽ ) 068 18 16.5 25 ---------- CL573-0153-2-✽ ✽ FX11LB-092S-SV (✽ ✽ ) 092 24 22.5 31 ---------- Without guideposts CL573-0154-5-✽ ✽ FX11LB-116S-SV (✽ ✽ ) 116 30 28.5 37 ---------- CL573-0155-8-✽ ✽ FX11LB-140S-SV (✽ ✽ ) 140 36 34.5 43 ---------- [Specifications number] - ✽ ✽ , (✽ ✽ ) Blank: Tray packaging (Without pick-and-place tape) (21) : Embossed tape packaging (Without pick-and-place tape) (22) : Embossed tape packaging (With pick-and-place tape) Note 1: There is no polarity in terms of board mounting for this product. Note 2: The coplanarity of this product's SMT leads is 0.1 mm or less. Note 3: Please order embossed tape packaged items by the reel. (One reel holds 1,000 pieces.) BRecommended Land Pattern Dimensions (Metal Mask Dimensions) Recommended metal mask thickness: 0.15 mm Note 1 The cross-hatched area inside the SMT land may come into contact with the connector contacts and thus care should be taken that the pattern does not extend beyond the SMT land width. 2 Not required in products without guideposts. 6 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. BEmbossed Carrier Tape Dimensions Headers Insertion Connector A B C D E FX11L#-060P/06-SV 20.2 40.4 44 45.5 50.6 FX11L#-080P/08-SV FX11L#-100P/10-SV 26.2 52.4 56 59 64 FX11L#-120P/12-SV FX11L#-068P/12-SV 20.2 40.4 44 45.5 50.5 FX11L#-092P/12-SV FX11L#-116P/12-SV 26.2 52.4 56 59 64 FX11L#-140P/12-SV Note 1: There is no polarity in terms of embossed tape packaging for this product. Note 2: Left figure is representative of products withReceptacles ground plates. Insertion Connector A B C D E FX11L#-060S/06-SV 20.2 40.4 44 45.5 50.6 FX11L#-080S/08-SV FX11L#-100S/10-SV 26.2 52.4 56 59 64 FX11L#-120S/12-SV FX11L#-068S/12-SV 20.2 40.4 44 45.5 50.5 FX11L#-092S/12-SV FX11L#-116S/12-SV 26.2 52.4 56 59 64 FX11L#-140S/12-SV Note 1: There is no polarity in terms of embossed tape packaging for this product. Note 2: Left figure is representative of products withReel Packaging Dimensions ground plates. 7 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. BRecommended Temperature Profile This temperature profile is a reference for the setting conditions described below. It will differ depending on conditions and so mounting should follow verification. Applicable Conditions Reflow method : IR reflow Solder : Cream type 63Sn/37Pb (Flux component of 9wt%) Test substrate : Glass epoxy 85 x 110 x 1.6mm Metal mask thickness : 0.15mm This temperature profile is a recommendation. Conditions may change somewhat depending on the type of cream solder and the amount. BWashing Conditions Organic Solvent Washing Solvent Room temperature washing Heated washing IPA Yes Yes (Isopropyl alcohol) HCFC Yes Yes (Hydrochlorofluorocarbon) Water Type Washing When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins. Be careful that parts are not left with moisture remaining on them. Washing Precautions Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give rise to the deterioration of electrical performance. In this regard it is important to check whether a thorough washing has been performed. BConnector Handling Precautions 1. Allowable Creepage Dimensions at Time of Mating The effective coupling length of this product is 0.55 mm for the signal portion and the ground portion. The creepage of the header and receptacle at the time of mating should be within 0.18 mm of the completely coupled condition. 2. Retension of Boards Avoid the support of boards by connectors alone and adopt a board locking measure that does not rely on the connectors. 3. Solder Repair Flux may rise as far as the contact portion of the connector depending on the flux coating and other factors at the time of repair. This will cause poor contact reliability; therefore, before use, the aforementioned washing conditions should be taken into consideration prior to connector washing. 4. Miscellaneous ·Note that excessive twisting while inserting or withdrawing connectors will cause damage. ·The shade of the molded items may vary somewhat depending on the manufacturing lot; however, this does not affect performance. ® 5-23,OSAKI 5-CHOME,SHINAGAWA-KU,TOKYO 141-8587,JAPAN PHONE: 81-3-3491-9741, FAX: 81-3-3493-2933 The contents of this catalog are current as of date of publication. Contents are subject to change without notice for the purpose of improvements. 8