High Speed, Matched-Impedance, Parallel Board-to-board Connector IT1 Series Receptacle (2 required) IT1 Series Outline High-speed matched-impedance parallel board-to-board connector designed for applications requiring board-to- board spacing with transmission speeds exceeding 1GHz. The connection system has matched impedance Transmission Module of 50 ohm or can be customized. Contacts are on 0.5mm pitch. ●Connection Cross-Sectional Diagram ■Features 1. Impedance Matching using a 4-Layer Board The innovative transmission module uses PC boards with a strip line design of transmission lines, providing Receptacle matched impedance of 50 ohms, for standard product. 2. Supports Multiple Connectors per board Designed with a tolerance of +/- 0.2mm for both the X 2-Point contact and Y-axis. The three-piece structure and the +/- 0.2mm tolerance allows 3 or more IT1’s to be mounted on a 4-Layer board (Impedance matching) single board. 3. Customized Board-to-Board Distance Board-to-board distance can be customized, from 16mm Transmission Module to 40mm. Ground lines or additional traces can be added to support high level, high speed transmission or mixed 2-Point contact power/signal applications. 4. Signal to Ground Ratio Receptacle The standard signal-to-ground ratio is 10:2, which makes reliable matching of the characteristic impedance of each transmission line. This ratio also can be customized. 5. Contact Reliability Use of double contact points on each of the contacts ■Applications assures highly reliable performance. Routers, servers, base stations and other telecommunication equipment. A294 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. (0.65) : Wipe IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System ■Product Specifications Current Operation Temperature Storage Temperature + + -55ç to 85ç -10ç to 60ç (Note 2) 0.4 A (Note 1) Range rating Range Rating Storage Humidity Voltage Operation Humidity Relative humidity 95% max. 50V AC 40% to 70% (Note 2) rating Range (No condensation) Range Item Specification Conditions 1. Insulation resistance 100 M ohms min. Measured at 100V DC 2. Withstanding voltage No flashover or insulation breakdown 150 V AC/one minute 3. Contact resistance 100 m ohms max. Measured at 100 mA No electrical discontinuity of 1 μs or more. Frequency of 10 to 55 Hz, 0.75mm single amplitude, for 10 4. Vibration No damage, cracks, or parts dislocation. cycles in each of 3 directions 2 No electrical discontinuity of 1 μs. min. Acceleration of 490 m/s , 11 ms duration, sine half-wave 5. Shock No damage, cracks, or parts dislocation waveform, 3 cycles in each of the 3 axis. Contact resistance: 110 m ohms max. 6. Humidity Insulation resistance: 100 M ohms min. 96 hours/40ç/ humidity of 90% to 95% No damage, cracks, or parts dislocation - + + + + + Contact resistance: 110 m ohms max. Temperature: 55ç/ 15ç to 35ç/ 85ç/ 15ç to 35ç 7. Temperature cycle Insulation resistance: 100 M ohms min. Duration: 30 2 to 3 30 2 to 3 (Minutes) / / / No damage, cracks, or parts dislocation 5 cycles Contact resistance: 110 m ohms max. 8. Durability 20 cycles (insertion/ withdrawal) No damage, cracks, or parts dislocation. 9. Resistance to Reflow: At the recommended temperature profile No deformation of components affecting performance. 9. Soldering Heat Manual soldering: 350ç for 3 seconds Note1: If the connector is going to be used at a current in excess of the 0.4 A, please contact your Sales Representative. Note2: The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. Note3: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for a specific part number shown. ■Material Receptacles Part Material Finish Remarks Insulator LCP Color : Beige UL94V-0 ---------- Contacts Phosphor bronze Gold plating ---------- Metal fittings Phosphor bronze Tin plating Transmission Module Part Material Finish Remarks Insulator PBT Color : Black UL94V-0 ---------- Board FR-4 Contact portion : Gold plating ■Ordering information Receptacles ( ) IT 1 # - * S - SV * * 1 2 3 4 5 6 Transmission Module IT 1 - * P / * - *H 1 3 4 7 8 1 Series name : IT1 5 Lead 2 Locating Post type Blank : With Locating Post SV : Straight SMT A : Without Locating Post 6 Packaging Blank : Tray Number of contacts : 168, 252 3 (25) : Tray(connectors with attached tape 4 Connector S : Receptacle Socket for a vacuum board placement) P: Transmission Plug Module 7 Number of ground contacts : 28, 44 8 Board-to-board Distance: 19mm,23mm,30mm A295 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System ■Receptacles - 168 Contacts (=0.5∞41) 20.5 (=0.5∞41) 1.5 1.5 20.5 ∞168 0.5 0.5 0.2 ±0.05 A b2 b1 0.2 b84 A b1 1 a1 a84 a2 a1 A 60.7 ±0.5 (52) (3.55) 60.7±0.5 2-(Ø1.5 mm): Locating Post Part Number CL No. Locating Post Type RoHS IT1-168S-SV 641-0002-0 With Locating Post YES IT1A-168S-SV 641-0012-4 Without Locating Post BRecommended PCB mounting pattern +0.1 61.7 0 0 56.9 -0.1 52 ±0.05 20.5 ( =0.5∞41) 1.5 1.5 20.5 ( =0.5∞41) 0.5 0.5 ∞168 0.3 ±0.02 0.06 A b 2 b 1 b 84 A a 2 a 84 a 1 1 2-Ø1.7±0.05 1 Not required for products without Locating Post. A296 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. +0.1 3 0 2±0.2 ( 0.6) 6±0.5 8.8 ±0.5 3.55 ±0.05 0 -0.1 6.6 +0.1 9.4 0 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System ■Receptacles - 252 Contacts 20.5 (=0.5∞41) (=0.5∞41) 3 20.5 (=0.5∞41) 1.5 1.5 20.5 ∞252 0.5 0.5 0.2 ±0.05 b2 b126 b1 0.2 A A b1 a1 A a126 a2 a1 84.2 ±0.5 ( 75.5 ) ( 3.55 ) 84.2 ±0.5 2-(Ø1.5 mm): Locating Post CL No. Part Number Locating Post Type RoHS IT1-252S-SV 641-0003-3 With Locating Post YES IT1A-252S-SV 641-0013-7 Without Locating Post BRecommended PCB mounting pattern +0.1 85.2 0 0 80.4 -0.1 49.5 26 ( =0.5∞41) (=0.5∞41) 20.5 (=0.5∞41) 20.5 3 20.5 1.5 1.5 . ∞252 0.3 ±0.02 0.5 0.5 0.06 A b 2 b 1 b 126 B 1 2- Ø1.7 ±0.05 a 126 a 2 A 0.1 A.B a 1 1 Not required for products without locating Post. A297 C1.5 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. +0.1 3 0 ( 0.6 ) 6±0.5 2±0.2 8.8 ±0.5 3.55 0 6.6 -0.1 +0.1 9.4 0 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System ■Transmission Module - 168 Contacts b row a row (4.2) 57±0.5 55±0.3 Mating side 168 A 1 1 19 Board Mounting side Locking Protrusion 56±0.3 (2 Sides) Part Number CL No. Board-to-board Distance A B C RoHS IT1-168P/28-19H 641-0192-8 19mm 18.4 18.4 16.6 YES IT1-168P/28-30H 641-0303-7 30mm 13.9 13.9 17.6 ■Connection Table The connection table indicates contact numbers in the mated condition,as illustrated in Fig. 1. a row b row α - β α - β α - β α - β a01 - a84 a44 - a41 b01 - b84 b44 - b41 a02 - a83 ıı b02 - b83 ıı ıı ıı a03 - a82 b03 - b82 Signal Signal ıı Signal Signal ıı ıı ıı a04 - a81 b04 - b81 ıı ıı a05 - a80 a53 - a32 b05 - b80 b53 - b32 a06 - a79 a54 - a31 b06 - b79 b54 - b31 Ground Ground Ground Ground a07 - a78 a55 - a30 b07 - b78 b55 - b30 Fig. 1 a08 - a77 a56 - a29 b08 - b77 b56 - b29 ıı ıı ıı ıı ıı ıı ıı ıı Signal ıı Signal ıı Signal ıı Signal ıı ıı ıı ıı ıı ıı ıı ıı ıı a17 - a68 a65 - a20 b17 - b68 b65 - b20 a18 - a67 a66 - a19 b18 - b67 b66 - b19 Ground Ground Ground Ground a19 - a66 a67 - a18 b19 - b66 b67 - b18 a20 - a65 a68 - a17 b20 - b65 b68 - b17 ıı ıı ıı ıı ıı ıı ıı ıı Signal ıı Signal ıı Signal ıı Signal ıı ıı ıı ıı ıı ıı ıı ıı ıı a29 - a56 a77 - a08 b29 - b56 b77 - b08 a30 - a55 a78 - a07 b30 - b55 b78 - b07 Ground Ground Ground Ground a31 - a54 a79 - a06 b31 - b54 b79 - b06 a32 - a53 a80 - a05 b32 - b53 b80 - b05 ıı a81 - a04 ıı b81 - b04 ıı ıı a82 - a03 b82 - b03 Signal ıı Signal Signal ıı Signal ıı ıı a83 - a02 b83 - b02 ıı ıı a41 - a44 a84 - a01 b41 - b44 b84 - b01 a42 - a43 b42 - b43 Ground Ground a43 - a42 b43 - b42 A298 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 8.4 ±0.3 8.4 ±0.3 7.8 ±0.5 5.8 ±0.3 6.6 ±0.5 5.8 ±0.3 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System ■Transmission Module - 252 Contacts ●2-row type b row a row (4.2) 80.5 ±0.5 78.5 ±0.3 Mating side 252 A 2 1 23 Board Mounting side Locking Protrusion 79.5 ±0.3 (2 Sides) Part Number CL No. Board-to-board Distance A B C RoHS IT1-252P/44-23H 641-0231-8 23mm 10.4 10.4 10.6 YES IT1-252P/44-30H 641-0304-0 30mm 13.9 13.9 17.6 ■Connection Table The connection table indicates contact numbers in the mated condition,as illustrated in Fig. 1. a row b row α - β α - β α - β α - β α - β α - β a01 - a126 a44 - a83 a86 - a41 b01 - b126 b44 - b83 b86 - b41 ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı Signalıı Signalıı Signalıı Signalıı Signalıı Signalıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı a05 - a122 a53 - a74 a95 - a32 b05 - b122 b53 - b74 b95 - b32 a06 - a121 a54 - a73 a96 - a31 b06 - b121 b54 - b73 b96 - b31 Ground Ground Ground Ground Ground Ground a07 - a120 a55 - a72 a97 - a30 b07 - b120 b55 - b72 b97 - b30 a08 - a119 a56 - a71 a98 - a29 b08 - b119 b56 - b71 b98 - b29 ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı Signalıı Signalıı Signalıı Signalıı Signalıı Signalıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı Fig.1 a17 - a110 a62 - a65 a107 - a20 b17 - b110 b62 - b65 b107 - b20 a18 - a109 a63 - a64 a108 - a19 b18 - b109 b63 - b64 b108 - b19 Ground Ground Ground Ground Ground Ground a19 - a108 a64 - a63 a109 - a18 b19 - b108 b64 - b63 b109 - b18 a20 - a107 a65 - a62 a110 - a17 b20 - b107 b65 - b62 b110 - b17 ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı Signal Signal Signal Signal Signal Signal ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı a29 - a98 a71 - a56 a119 - a08 b29 - b98 b71 - b56 b119 - b08 a30 - a97 a72 - a55 a120 - a07 b30 - b97 b72 - b55 b120 - b07 Ground Ground Ground Ground Ground Ground a31 - a96 a73 - a54 a121 - a06 b31 - b96 b73 - b54 b121 - b06 a32 - a95 a74 - a53 a122 - a05 b32 - b95 b74 - b53 b122 - b05 ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı Signalıı Signalıı Signalıı Signalıı Signalıı Signalıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı ıı a41 - a86 a83 - a44 a126 - a01 b41 - b86 b83 - b44 b126 - b01 a42 - a85 a84 - a43 b42 - b85 b84 - b43 Ground Ground Ground Ground a43 - a84 a85 - a42 b43 - b84 b85 - b42 A299 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 10.4 ±0.3 10.4 ±0.3 7.8±0.5 5.8±0.3 10.6 ±0.5 5.8±0.3 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System BIT1 Series Extraction Tool (6) Part Number CL No. Remarks RoHS ( ) IT1-PICKER 1 641-1001-3 2-piece Package YES (Ø2.5) A300 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. (42) (1.25) (6) (3) IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System Installation and Use Instruction Manual Table of Contents 1. System Components .......................................................... A302 ¡Receptacles ¡Transmission Module Assembly ¡Extraction Tool 2. Recommended Design Guidelines ................................ A303 2-1 Recommended Solder Land Pattern 2-2 Board-to-Board Spacer Heights 3. Connector Placement ......................................................... A304 3-1 Receptacle Packaging Types 3-2 Receptacle Vacuum Pick-and-Place Areas 3-3 Receptacle Board Placement 3-4 Recommended Reflow Conditions 3-5 Solder Repairs 4. Mating Procedure ................................................................ A307 5. Un-mating of Connectors .................................................. A308 6. Removal of the Transmission Module from the stationary side. ..A309 7. Precautions When Mounting Multiple Connectors .. A310 ¡Allowable Amount of Misalignment ¡Recommended Positional Location A301 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System BConnector Handling Precautions 1. System components ■Receptacles ¡Contacts Insulator body ¡Row A and row B contacts are arranged alternately starting with No.1 in row B. Placement on board is polarized. ¡Metal Fittings ¡Permanently inserted to provide lock with the Transmission Module and additional solder areas with the PCB. ¡Insulator body. Even numbered row: A contacts ¡Injection molded single unit provides protection and correct self-alignment of all components. Odd numbered row: B contacts Metal fittings Guide frame ■Transmission Module Assembly ¡Each Module has stationary side and a mating/un-mating side. ¡When mounting multiple connectors, please keep uniform orientation of the stationary side. Mating/ ¡Transmission printed circuit boards used in the module are un-mating based on JIS standards and quality standards applicable to side memory modules. (Short) Transmission boards. Stationary side (Longer) ■Extraction Tool ¡Used to release the transmission module from the Extraction Tool stationary receptacle. (2 required) Fully Connected Condition The interconnection package consists of 3 main sub-assemblies: Two receptacles and the Transmission Module. The transmission module, held securely by the guide frame has a mating/un-mating side and a stationary side. Once the stationary side is inserted in the receptacle, it can not be removed without the use of extraction tool. The mating/un-mating side allows repeated re-insertion of the receptacle on this side only. Receptacles Mating/ un- mating side Transmission module assembly Stationary side A302 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 2. Recommended Design Guidelines 2-1 Solder Land Pattern When placing the receptacles on the Printed Circuit Boards using automatic mounting equipment or manually, assure that the correct diameters of the holes (Fig. 1) are through the entire thickness of the board. SLocating post hole diameterS The contacts of receptacle assembly are exposed on the bottom surfaces. The exposed areas of the contacts are a distance of 0.25 mm minimum from the surface of the Printed Circuit Board, on which the receptacle assembly is placed (Fig.2). Consideration should be taken not to place or assure insulation of conductive traces under the receptacle assemblies. Refer to the separate drawings for recommended solder land pattern dimensions of the receptacle, and signals and ground connection diagram of the transmission module. (mm) Automatic placement / (Locating post hole diameter) C dimension: 1.7 mm Manual placement / (Locating post hole diameter) C dimension: 1.6 mm + / A position accuracy of 0.03 should be exercised from the - center of the hole to contact Number 84. Fig. 1 IT1-168S-SV Recommended Solder Land Pattern Contact_A Contact_B Fig. 2 Cross section of IT1 receptacle 2-2 Board-to-Board Spacer heights The two parallel boards connected by the IT1 connectors should be fastened to additional spacers between them. Fig. 3 indicates the connector height tolerance and the spacer’s height. When designing the spacer’s height, consideration should be given to the solder paste thickness and any other features, which may affect the full mating of the connector. Fig. 3 indicates design dimensions for the 19 mm board-to-board distance. (mm) Fig. 3 A303 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 3. Connector Placement 3-1 Packaging Types ¡Two types of packaging are available: semi-hard tray and hard tray. Customers may specify a packaging type suitable for their automatic placement machines. * Refer to the separate drawings for the detailed dimensions of the trays. ¡Semi-hard tray packaging ¡Hard tray packaging 168 contacts receptacle: 40 pieces per tray 168 contacts receptacle: 24 pieces per tray 252 contacts receptacle: 30 pieces per tray 252 contacts receptacle: 16 pieces per tray (mm) 3-2 Automatic placement - Vacuum Pick-and-Place Areas ¡Specify "Vacuum Pick-up Tape Specification". ¡The area and position of the pick-and-place surface are indicated in the diagrams below. (mm) A304 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 3-3 Receptacle Board Placement ¡When using automatic placement equipment, verify the packaging type and the Pick-and-place areas. ¡When placing manually, pay attention to the possibility of positional shift. Ref. Fig. 4. * When placing multiple connectors, to assure positional accuracy, it is advised to use automatic placement equipment. SPrecautions for Manual PlacementS The orientation posts serve as a prevention measure to avoid incorrect placement of the receptacle assemblies on the board. The contact terminals must be placed correctly over the corresponding solder pad as shown on Fig. 4-1. Fig. 4-2 = Incorrect Fig. 4-3 = Incorrect Fig. 4-1 = Correct 3-4 Recommended Reflow Conditions A305 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 3-5 Solder Repairs Assure that flux is not reaching the contact areas of the connector. Wash the assembly as recommended below. SCleaning ConditionsS When using water based cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the documentation issued by the various manufacturers, which describes its effects on metals and resins. Care should be taken not to leave moisture on the connectors. Residual flux or cleaning agent remaining on the connectors when cleaning with organic solvents or water based cleaners may cause deterioration of the electrical performance. It is important to check that a thorough washing has been performed. A306 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 4. Mating Procedure Follow the procedure described below. Note:¡The transmission module must be fully inserted into receptacle assembly already placed and soldered to a board. ¡The Transmission Module cannot be exposed to heat temperatures of the soldering process. Step 1 Receptacle Placement on the board – stationary side Assure that the orientation posts are aligned with the holes on the board. When specifying receptacle assemblies without the orientation posts exercise extra caution to assure correct orientation and connection with the solder pads. Step 2 Insertion of the Transmission Module Fully insert the Transmission Module in the board-installed receptacle assembly. It is critical that the insertion is done straight and uniformly. Step 3 Mating/un-mating Assure that the receptacle assembly is correctly aligned with the Transmission Module. Fully insert the receptacle assembly on the Transmission Module. It is critical that the insertion is done straight and uniformly. Connection completed Step 4 A307 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 5. Un-mating of Connectors Recommended Method ¡Pull uniformly straight up. Prohibited un-mating Methods A308 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 6. Removal of the Transmission Module - stationary side ¡Requires use of dedicated extraction tool. Two are required. Step 1 ¡Fully insert the tools into each end of the receptacle assembly (Fig. 1) assuring that they will be over the hold areas of the Transmission Module frame. Ref. Fig. 2 Fig. 1 Step 2 Pull out the transmission module holding the tools straight. Fig. 2 extraction tool Insertion Area Insertion area Inappropriate area A309 Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 7. Precautions When Mounting Multiple Connectors Note: Observe the requirements as listed in paragraph 7-1 and 7-2. The mating/un-mating forces will increase with use of multiple assemblies. It is recommended that a dedicated tooling is used for mating / un-mating of multiple connector assemblies in a single operation. 7-1 Allowable Amount of Misalignment Maximum allowable misalignment in X and Y directions is ±0.2 mm total. Refer to the drawings below. + + Length Orientation X1-X2= 0.2 Width Orientation Y1-Y2= 0.2 - - 7-2 Recommended Connector Placement It is recommended to leave min. of 30 mm space between the adjacent connector assemblies. 7-3 Examples of Prohibited Placement Positions To assure reliability of solder joints and mating/ un-mating without damage, DO NOT PLACE MULTIPLE CONNECTORS as illustrated below. A310 Powered by TCPDF (www.tcpdf.org) Jun.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.