KINGBRIGHT AA3528SES/J3-AMT
Specifications
Manufacturer
Kingbright
Manufacturers Part #
AA3528SES/J3-AMT
Sub-Category
LED Displays and Optoelectronics
Packaging
Tape and Reel
Factory Pack Quantity
2000
Datasheet
Extracted Text
3.5x2.8mm SURFACE MOUNT LED LAMP
Part Number: AA3528SES/J3-AMT Hyper Red
Description
The Hyper Red device is based on light emitting diode chip
Features
made from AlGaInP.
z Single color.
z Suitable for all SMT assembly and solder process.
Applications
z Available on tape and reel.
z Traffic signaling.
z Ideal for backlighting.
z Backlighting (illuminated advertising , general lighting).
z Package : 2000pcs / reel.
z Interior and exterior automotive lighting.
z Moisture sensitivity level : level 4.
z Substitution of micro incandescent lamps.
z RoHS compliant.
z Reading lamps.
z Signal and symbol luminaire for orientation.
z Marker lights (e.g. Steps, exit ways, etc).
z Decorative and entertainment lighting.
z Indoor and outdoor commercial and residential
architectural lighting.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice.
4.The device has a single mounting surface. The device must be mounted according to the specifications.
SPEC NO: DSAL3710 REV NO: V.5A DATE: OCT/21/2014 PAGE: 1 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201007116
Handling Precautions
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic
significantly reduces thermal stress, it is more susceptible to damage by external mechanical force.
As a result, special handling precautions need to be observed during assembly using silicone encapsulated
LED products. Failure to comply might lead to damage and premature failure of the LED.
1. Handle the component along the side surfaces by using forceps or appropriate tools.
2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry.
3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or
damage the internal circuitry.
4.1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4.2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4.3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup
and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H S might corrode silver plating of
2
leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such substances.
SPEC NO: DSAL3710 REV NO: V.5A DATE: OCT/21/2014 PAGE: 2 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201007116
Selection Guide
Iv (mcd) [2] Viewing
@ 20mA Angle [1]
Part No. Dice Lens Type
Code. Min. Max. 2θ1/2
V 1300 1600
W 1600 1900
X 1900 2300
Y 2300 2700
AA3528SES/J3-AMT Hyper Red (AlGaInP) Water Clear
120°
*Q *300 *400
*R *400 *500
*S *500 *700
*T *700 *1000
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity/ luminous Flux: +/-15%.
* Luminous intensity value is traceable to the CIE127-2007 compliant national standards.
Absolute Maximum Ratings at Ta=25°C
Parameter Symbol Value Unit
Power dissipation PD 196 mW
Reverse Voltage VR 5 V
Junction temperature TJ 115 °C
Operating Temperature Top -40 To +100 °C
Storage Temperature Tstg -40 To +115 °C
DC Forward Current[1] IF 70 mA
Peak Forward Current [2] IFM 150 mA
Electrostatic Discharge Threshold (HBM) 3000 V
Thermal Resistance (Junction/ambient) [1] Rth j-a 240 °C/W
Notes:
2
1. Rth(j-a) Results from mounting on PC board FR4 (pad size≥16 mm per pad),
2. 1/10 Duty Cycle, 0.1ms Pulse Width.
SPEC NO: DSAL3710 REV NO: V.5A DATE: OCT/21/2014 PAGE: 3 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201007116
Electrical / Optical Characteristics at Ta=25°C
Parameter Symbol Value Unit
Wavelength at peak emission IF=20mA [Typ.] λ peak 640 nm
Dominant Wavelength IF=20mA [Min.] λ dom [1] 610 nm
Dominant Wavelength IF=20mA [Max.] λ dom [1] 635 nm
25 nm
Spectral bandwidth at 50%Φ REL MAX IF=20mA [Typ.] Δλ
Forward Voltage IF=20mA [Min.] -
Forward Voltage IF=20mA [Typ.] VF [2] 2.2 V
Forward Voltage IF=20mA [Max.] 2.8
Reverse Current (VR = 5V) [Max.] IR 10 uA
Temperature coefficient of λ peak
TC λ peak 0.14
nm/° C
IF=20mA, -10 ° C≤ T≤100 ° C [Typ.]
Temperature coefficient of λ dom
TC λ dom 0.06
nm/° C
IF=20mA, -10 ° C≤ T≤100 ° C [Typ.]
Temperature coefficient of VF
TCV -1.8
mV/° C
IF=20mA, -10 ° C≤ T≤100 ° C [Typ.]
Notes:
1.The dominant Wavelength (λ d) above is the setup value of the sorting machine. (Tolerance λ d : ±1nm. )
2.Forward Voltage: +/-0.1V.
3. Wavelength value is traceable to the CIE127-2007 compliant national standards.
4.Excess driving current and/or operating temperature higher than recommended conditions may result in severe light degradation or
premature failure.
SPEC NO: DSAL3710 REV NO: V.5A DATE: OCT/21/2014 PAGE: 4 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201007116
Hyper Red AA3528SES/J3-AMT
SPEC NO: DSAL3710 REV NO: V.5A DATE: OCT/21/2014 PAGE: 5 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201007116
AA3528SES/J3-AMT
Reflow soldering is recommended and the soldering profile is shown below.
Other soldering methods are not recommended as they might cause damage to the product.
Recommended Soldering Pattern
(Units : mm; Tolerance: ± 0.1)
Tape Specifications
Reel Dimension
(Units : mm)
SPEC NO: DSAL3710 REV NO: V.5A DATE: OCT/21/2014 PAGE: 6 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201007116
PACKING & LABEL SPECIFICATIONS AA3528SES/J3-AMT
Terms and conditions for the usage of this document
1.The information included in this document reflects representative usage scenarios and is intended
for technical reference only.
2.The part number, type, and specifications mentioned in this document are subject to future change
and improvement without notice. Before production usage customer should refer to the latest
datasheet for the updated specifications.
3.When using the products referenced in this document, please make sure the product is being
operated within the environmental and electrical limits specified in the datasheet. If customer usage
exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4.The information in this document applies to typical usage in consumer electronics applications.
If customer's application has special reliability requirements or have life-threatening liabilities,
such as automotive or medical usage, please consult with Kingbright representative for further
assistance.
5.The contents and information of this document may not be reproduced or re-transmitted without
permission by Kingbright.
6.All design applications should refer to Kingbright application notes available at
http://www.KingbrightUSA.com/ApplicationNotes
SPEC NO: DSAL3710 REV NO: V.5A DATE: OCT/21/2014 PAGE: 7 OF 8
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1201007116
Reliability Test Items And Conditions
The reliability of products shall be satisfied with items listed below
Lot Tolerance Percent Defective (LTPD) : 10%
Test Times / Number of
No. Test Item Standards Test Condition
Cycles Damaged
1 Continuous operating test - Ta =25°C ,IF = maximum rated current* 1,000 h 0 / 22
EIAJ ED-
2 High Temp. operating test Ta = 100°C IF = derated current at 100°C 1,000 h 0 / 22
4701/100(101)
3 Low Temp. operating test - Ta = -40°C, IF = maximum rated current* 1,000 h 0 / 22
EIAJ ED-
4 High temp. storage test Ta = maximum rated storage temperature 1,000 h 0 / 22
4701/100(201)
EIAJ ED-
5 Low temp. storage test Ta = -40°C 1,000 h 0 / 22
4701/100(202)
6 High temp. & humidity storage test - Ta = 60°C, RH = 90% 500 h 0 / 22
Ta = 60°C, RH = 90%
7 High temp. & humidity operating test - 500 h 0 / 22
IF = derated current at 60°C
Moisture soak : 30°C,70% RH, 72h
EIAJ ED-
8 Soldering reliability test Preheat : 150~180°C(120s max.) 2 times 0 / 18
4701/100(301)
Soldering temp : 260°C(10s)
Ta = -40°C(15min) ~ 100°C(15min)
9 Thermal shock operating test - 1,000 cycles 0 / 22
IF = derated current at 100°C
10 Thermal shock test - Ta = -40°C(15min) ~ 100°C(15min) 1,000 cycles 0 / 22
EIAJ ED- Once each
11 Electric Static Discharge (ESD) C = 100pF , R2 = 1.5KΩ V = 3000V 0 / 22
4701/100(304) Polarity
a = 196m/s² , f = 100~2KHz ,
12 Vibration test - 4 times 0 / 22
t = 48min for all xyz axes
* : Refer to forward current vs. derating curve diagram
Failure Criteria
Items Symbols Conditions Failure Criteria
luminous Intensity lv IF = 20mA Testing Min. Value
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