5.0mm x 5.0mm FULL-COLOR SURFACE MOUNT LED LAMP Part Number: AAAF5051-02 PRELIMINARY SPEC Blue ATTENTION Reddish-Orange OBSERVE PRECAUTIONS Green FOR HANDLING ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description z Chips can be controlled separately. The Blue source color devices are made with AlGaInN z Suitable for all SMT assembly and solder process. Vertical Light Emitting Diode. z Available on tape and reel. This devices are made with AlGaInP. z White SMD package, silicone resin. The Green source color devices are made with AlGaInN z Package: 500pcs / reel. Vertical Light Emitting Diode. z Moisture sensitivity level : level 3. Static electricity and surge damage the LEDS. z RoHS compliant. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.15[±0.006]unless otherwise noted. 3. Specifications are subject to change without notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAH9800 REV NO: V.3 DATE: MAR/17/2009 PAGE: 1 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: S.P.Chen ERP: 1201003347 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might leads to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. SPEC NO: DSAH9800 REV NO: V.3 DATE: MAR/17/2009 PAGE: 2 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: S.P.Chen ERP: 1201003347 Selection Guide Iv (mcd) [2] Φ v (mlm) [2] Viewing @ 120mA @ 120mA Angle [1] Part No. Dice Lens Type Min. Typ. Min. Typ. 2θ1/2 Blue (AlGaInN) 900 1450 5000 6300 AAAF5051-02 Reddish-Orange (AlGaInP) WATER CLEAR 2500 4000 8000 9000 120° Green (AlGaInN) 3800 4900 12500 17000 Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. 2. Luminous intensity/ luminous Flux: +/-15%. Absolute Maximum Ratings at Ta=25°C Parameter Symbol Device Value Unit Blue 0.432 Power dissipation Pt Reddish-Orange 0.336 W Green 0.444 Blue 110 Junction temperature TJ Reddish-Orange 110 °C Green 110 Blue Operating Temperature Top Reddish-Orange -40 To +85 °C Green Blue Storage Temperature Tstg Reddish-Orange -40 To +85 °C Green Blue 120 DC Forward Current [1] IF Reddish-Orange 120 mA Green 120 Blue 300 Reddish-Orange 300 Peak Forward Current [2] IFM mA Green 300 Blue 220 Thermal resistance Rth j-a Reddish-Orange 270 °C/W Green 200 Blue Electrostatic Discharge Threshold (HBM) Reddish-Orange 8000 V Green Notes: 2 1. Results from mounting on PC board FR4(pad size ≥ 100mm ),mounted on pc board-metal core PCB is recommend for lowest thermal resistance. 2. 1/10 Duty Cycle, 0.1ms Pulse Width. SPEC NO: DSAH9800 REV NO: V.3 DATE: MAR/17/2009 PAGE: 3 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: S.P.Chen ERP: 1201003347 Electrical / Optical Characteristics at Ta=25°C Value Parameter Symbol Device Unit Min. Typ. Max. Blue 450 Wavelength at peak emission Reddish-Orange 633 nm λ peak IF=120mA Green 515 Blue 457 Dominant Wavelength λ dom [1] Reddish-Orange 624 nm IF=120mA Green 525 Blue 20 Spectral Line Half-width Δλ1/2 Reddish-Orange 30 nm IF=120mA Green 30 Blue 2.6 3.1 3.6 Forward Voltage IF=120mA VF [2] Reddish-Orange 1.8 2.3 2.8 V Green 2.6 3.2 3.7 Blue 0.12 Temperature coefficient of λ peak TCλ peak Reddish-Orange 0.09 nm/° C IF=120mA, -10° C≤ T≤100° C Green 0.13 Blue 0.1 Temperature coefficient of λ dom TCλ dom Reddish-Orange 0.03 nm/° C IF=120mA, -10° C≤ T≤100° C Green 0.11 Blue -2.3 Temperature coefficient of VF TCV Reddish-Orange -2.7 mV/° C IF=120mA, -10° C≤ T≤100° C Green -3.9 Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. SPEC NO: DSAH9800 REV NO: V.3 DATE: MAR/17/2009 PAGE: 4 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: S.P.Chen ERP: 1201003347 AAAF5051-02 Blue SPEC NO: DSAH9800 REV NO: V.3 DATE: MAR/17/2009 PAGE: 5 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: S.P.Chen ERP: 1201003347 Reddish-Orange SPEC NO: DSAH9800 REV NO: V.3 DATE: MAR/17/2009 PAGE: 6 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: S.P.Chen ERP: 1201003347 Green SPEC NO: DSAH9800 REV NO: V.3 DATE: MAR/17/2009 PAGE: 7 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: S.P.Chen ERP: 1201003347 AAAF5051-02 Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern (Units : mm; Tolerance: ± 0.1) Tape Specifications (Units : mm) SPEC NO: DSAH9800 REV NO: V.3 DATE: MAR/17/2009 PAGE: 8 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: S.P.Chen ERP: 1201003347 PACKING & LABEL SPECIFICATIONS AAAF5051-02 SPEC NO: DSAH9800 REV NO: V.3 DATE: MAR/17/2009 PAGE: 9 OF 9 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: S.P.Chen ERP: 1201003347