5.0mm x 6.0mm SURFACE MOUNT LED LAMP Part Number: AAAF5060QBFSEEZGS ATTENTION Blue OBSERVE PRECAUTIONS Hyper Red FOR HANDLING Green ELECTROSTATIC DISCHARGE SENSITIVE DEVICES Features Description z Chips can be controlled separately. The Blue source color devices are made with InGaN Light z Suitable for all SMT assembly and solder process. Emitting Diode. z Available on tape and reel. The Hyper Red source color devices are made with Al- z Package: 500pcs / reel. GaInP on GaAs substrate Light Emitting Diode. z Moisture sensitivity level : level 3. The Green source color devices are made with InGaN z RoHS compliant. on Sapphire Light Emitting Diode. Static electricity and surge damage the LEDS. It is recommended to use a wrist band or anti-electrostatic glove when handling the LEDs. All devices, equipment and machinery must be electrically grounded. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4. The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAL0956 REV NO: V.1 DATE: OCT/06/2010 PAGE: 1 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.F.Zhou ERP: 1201006760 Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools. 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. 3. Do not stack together assembled PCBs containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. SPEC NO: DSAL0956 REV NO: V.1 DATE: OCT/06/2010 PAGE: 2 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.F.Zhou ERP: 1201006760 Selection Guide Iv (mcd) [2] Viewing @ 30mA *50mA Angle [1] Part No. Dice Lens Type Min. Typ. 2θ1/2 Blue (InGaN) 280 400 AAAF5060QBFSEEZGS Water Clear Hyper Red (AlGaInP) *700 *1300 100° Green (InGaN) 500 1000 Notes: 1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value. 2. *Luminous intensity with asterisk is measured at 50mA; Luminous intensity/ luminous Flux: +/-15%. Electrical / Optical Characteristics at TA=25°C Symbol Parameter Device Typ. Max. Units Test Conditions Blue 461 λpeak Peak Wavelength Hyper Red 630 nm IF=20mA Green 515 Blue 465 λD [1] Dominant Wavelength Hyper Red 621 nm IF=20mA Green 525 Blue 25 Δλ1/2 Spectral Line Half-width Hyper Red 20 nm IF=20mA Green 30 Blue 100 C Capacitance Hyper Red 25 pF VF=0V;f=1MHz Green 45 Blue 3.3 4 VF [2] Forward Voltage Hyper Red 2 2.5 V IF=20mA Green 3.3 4.1 Blue 50 IR Reverse Current Hyper Red 10 uA VR=5V Green 50 Notes: 1.Wavelength: +/-1nm. 2. Forward Voltage: +/-0.1V. Absolute Maximum Ratings at TA=25°C Parameter Blue Hyper Red Green Units Power dissipation[2] 350 mW DC Forward Current 30 50 30 mA Peak Forward Current [1] 150 195 150 mA Reverse Voltage 5 V Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C Notes: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. 2. Within 350mW at all chips are lightened. SPEC NO: DSAL0956 REV NO: V.1 DATE: OCT/06/2010 PAGE: 3 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.F.Zhou ERP: 1201006760 AAAF5060QBFSEEZGS Blue SPEC NO: DSAL0956 REV NO: V.1 DATE: OCT/06/2010 PAGE: 4 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.F.Zhou ERP: 1201006760 Hyper Red SPEC NO: DSAL0956 REV NO: V.1 DATE: OCT/06/2010 PAGE: 5 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.F.Zhou ERP: 1201006760 Green SPEC NO: DSAL0956 REV NO: V.1 DATE: OCT/06/2010 PAGE: 6 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.F.Zhou ERP: 1201006760 AAAF5060QBFSEEZGS Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern Reel Dimension (Units : mm; Tolerance: ± 0.1) Tape Dimensions (Units : mm) SPEC NO: DSAL0956 REV NO: V.1 DATE: OCT/06/2010 PAGE: 7 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.F.Zhou ERP: 1201006760 PACKING & LABEL SPECIFICATIONS AAAF5060QBFSEEZGS SPEC NO: DSAL0956 REV NO: V.1 DATE: OCT/06/2010 PAGE: 8 OF 8 APPROVED: WYNEC CHECKED: Allen Liu DRAWN: F.F.Zhou ERP: 1201006760