1.6X0.8mm PHOTOTRANSISTOR Part Number: AP1608P1C Description Features Made with silicon phototransistor chips. z 1.6mmX0.8mm SMD LED, 1.1mm thickness. z Mechanically and spectrally matched to the infrared emitting LED lamp. z Package: 2000pcs / reel. z Moisture sensitivity level : level 3. z RoHS compliant. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.1(0.004") unless otherwise noted. 3.The specifications, characteristics and technical data described in the datasheet are subject to change without prior notice. 4.The device has a single mounting surface. The device must be mounted according to the specifications. SPEC NO: DSAD1375 REV NO: V.12 DATE: OCT/07/2016 PAGE: 1 OF 4 APPROVED: Wynec CHECKED: Allen Liu DRAWN: L.T.Zhang ERP: 1203000037 Electrical / Optical Characteristics at TA=25°C Symbol Parameter Min. Typ. Max. Units Test Conditions IC=100uA VBR CEO Collector-to-Emitter Breakdown Voltage 30 V 2 Ee=0mW/cm IE=100uA VBR ECO Emitter-to-Collector Breakdown Voltage 5 V 2 Ee=0mW/cm IC=2mA VCE (SAT) Collector-to-Emitter Saturation Voltage 0.8 V 2 Ee=20mW/cm VCE=10V I CEO Collector Dark Current 100 nA 2 Ee=0mW/cm TR Rise Time (10％ to 90％ ) 15 us VCE = 5V IC=1mA RL=1000Ω TF Fall Time (90％ to 10％ ) 15 us VCE = 5V 2 I (ON) On State Collector Current 0.1 0.3 mA Ee=1mW/cm λ=940nm λ0.1 Range of spectral bandwidth 420 1120 nm λp Wavelength of peak sensitivity 940 nm 2θ1/2 Angle of half sensitivity 150 deg Absolute Maximum Ratings at TA=25°C Parameter Max.Ratings Collector-to-Emitter Voltage 30V Emitter-to-Collector Voltage 5V Power Dissipation at (or below) 25°C Free Air Temperature 100mW Operating Temperature -40°C To +85°C Storage Temperature -40°C To +85°C Note: 1. Relative humidity levels maintained between 40% and 60% in production area are recommended to avoid the build-up of static electricity – Ref JEDEC/JESD625-A and JEDEC/J-STD-033. SPEC NO: DSAD1375 REV NO: V.12 DATE: OCT/07/2016 PAGE: 2 OF 4 APPROVED: Wynec CHECKED: Allen Liu DRAWN: L.T.Zhang ERP: 1203000037 AP1608P1C Reflow soldering is recommended and the soldering profile is shown below. Other soldering methods are not recommended as they might cause damage to the product. Recommended Soldering Pattern Reel Dimension (Units : mm; Tolerance: ± 0.1) Tape Specifications (Units : mm) SPEC NO: DSAD1375 REV NO: V.12 DATE: OCT/07/2016 PAGE: 3 OF 4 APPROVED: Wynec CHECKED: Allen Liu DRAWN: L.T.Zhang ERP: 1203000037 PACKING & LABEL SPECIFICATIONS AP1608P1C Terms and conditions for the usage of this document 1. The information included in this document reflects representative usage scenarios and is intended for technical reference only. 2. The part number, type, and specifications mentioned in this document are subject to future change and improvement without notice. Before production usage customer should refer to the latest datasheet for the updated specifications. 3. When using the products referenced in this document, please make sure the product is being operated within the environmental and electrical limits specified in the datasheet. If customer usage exceeds the specified limits, Kingbright will not be responsible for any subsequent issues. 4. The information in this document applies to typical usage in consumer electronics applications. If customer's application has special reliability requirements or have life-threatening liabilities, such as automotive or medical usage, please consult with Kingbright representative for further assistance. 5. The contents and information of this document may not be reproduced or re-transmitted without permission by Kingbright. 6. All design applications should refer to Kingbright application notes available at http://www.KingbrightUSA.com/ApplicationNotes SPEC NO: DSAD1375 REV NO: V.12 DATE: OCT/07/2016 PAGE: 4 OF 4 APPROVED: Wynec CHECKED: Allen Liu DRAWN: L.T.Zhang ERP: 1203000037