OptoTEC™ Series OT12-66-F0-1211 Thermoelectric Module TM The OptoTEC Series is a miniature thermoelectric module (TEM). This product series is primarily used in applications to stabilize the temperature of sensitive optical components in telecom and photonics industries. This product line is available in multiple config urations and surface finishing options. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the OptoTEC Series is designed for lower current and lower heat- pumping applications. Custom designs are available to accommodate metallization, pretinning, ceramic patterns, and solder posts, however MOQ applies. Americas: +1.919.597.7300 Europe: +46.31.420530 FEATURES APPLICATIONS Asia: +86.755.2714.1166 • Miniature geometric sizes • Laser diodes ets.sales@lairdtech.com • CCD cameras • Precise temperature control www.lairdtech.com Infrared (IR) sensors • • Reliable solid state operation • Pump lasers • No sound or vibration • Crystal oscillators • DC operation • Optical transceivers • RoHS compliant SPECIFICATIONS PERFORMANCE Hot Side Temperature (°C) 25 50 Qmax (Watts) 5.4 5.9 Delta Tmax (°C) 67 77 Imax (Amps) 1.2 1.2 Vmax (Volts) 7.5 8.5 Module resistance (ohms) 5.74 6.47 SUFFIX THICKNESS FLATNESS & HOT FACE COLD FACE LEAD PRIOR TO TINNING PARALLELISM LENGTH 11 0.106”± 0.002” 0.0002” / 0.002” Lapped Lapped 2.0” TB 0.106”± 0.0005” 0.0005” / 0.0005” Lapped Lapped 2.0” 00 0.120”± 0.005” NA / NA Metallized Metallized 2.0” 22 0.120”± 0.005” NA / NA Pre-tinned Pre-tinned 2.0” GG 0.120”± 0.005” NA / NA AuPlated AuPlated 2.0” SEALING OPTIONS SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION RT RTV White -60 to 204 °C Non-corrosive, silicone adhesive sealant EP Epoxy Black -55 to 150 °C Low density syntactic foam epoxy encapsulant Page 1 of 2 OT12-66-F0-1211 PERFORMANCE CURVES MECHANICAL DRAWING Ceramic Material: 96% Alumina Ceramics Solder Construction: 138°C BiSn OPERATING TIPS • Max operating temperature: 80°C • Do not exceed Imax or Vmax when operating module • Reference assembly guidelines for recommended installation • Solder tinning also available on metallized ceramics LAIRD-ETS-OT12-66-F0-1211-DATA-SHEET-101416 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2016 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Page 2 of 2