Ceramic Plate Series CP08-31-06 Thermoelectric Modules The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered ‘the standard’ in the thermoelectric industry. This broad product line of high-performance and highly reliable TEMs is available in numerous heat pumping capacities, geometric shapes, and input power ranges. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the CP Series is designed for higher current and large heat-pumping applications. FEATURES APPLICATIONS • Precise temperature control • Medical lasers Americas: +1.919.597.7300 • Compact geometric sizes • Lab science instrumentation Europe: +46.31.420530 • Reliable solid state operation • Clinical diagnostics systems Asia: +86.755.2714.1166 • No sound or vibration • Photonics laser systems ets.sales@lairdtech.com • Environmentally friendly • Electronic enclosure cooling www.lairdtech.com • DC operation • Food & beverage cooling • Chillers (liquid cooling) • RoHS compliant SPECIFICATIONS TECHNICAL Hot Side Temperature (°C) 25°C 50°C Qmax (Watts) 4.5 4.9 Delta Tmax (°C) 67 75 Imax (Amps) 2.1 2.1 Vmax (Volts) 3.7 4.0 Module Resistance (Ohms) 1.54 1.74 SUFFIX THICKNESS FLATNESS & HOT FACE COLD FACE LEAD LENGTH (PRIOR TO PARALLELISM TINNING) L 0.134”±0.010” 0.0015”/0.0015” Lapped Lapped 4.5” L1 0.134”±0.001” 0.001”/0.001” Lapped Lapped 4.5” L2 0.134”±0.0005” 0.0005”/0.0005” Lapped Lapped 4.5” ML 0.138”±0.010” 0.002”/0.002” Metallized Lapped 4.5” LM 0.138”±0.010” 0.002”/0.002” Lapped Metallized 4.5” MM 0.142”±0.010” 0.002”/0.002” Metallized Metallized 4.5” SEALING OPTIONS SUFFIX SEALANT COLOR TEMP RANGE DESCRIPTION RT RTV White -60 to 204 °C Non-corrosive, silicone adhesive EP Epoxy Black -55 to 150 °C Low density syntactic foam epoxy encapsulant Page 1 of 3 CP08-31-06 Performance Curves at Th =25°C THERMO ELECTRIC Page 2 of 3 CP08-31-06 NOTES 1. Max operating temperature: 80°C 2. Do not exceed Imax or Vmax when operating module 3. Reference assembly guidelines for recommended installation 4. Solder tinning also available on metallized ceramics LAIRD-ETS-CP08-31-06-DATA-SHEET-101416 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2016 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Page 3 of 3